JP2005108956A - Chip-type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-type electronic component which does not generate any failure in the heat treatment for diffusing solder, such as generation of a hole in the nickel-plated layer and solder- or tin-plated layer and spattering of solder and is suitable for mass-productive system. <P>SOLUTION: The chip-type electronic component is provided with a substrate 11 and an end surface electrode layer 15 provided to the end surface of the substrate 11. The end surface electrode layer 15 is constituted with a mixed material of conductive particles, nonconducting inorganic filler and a resin. Moreover, as the conductive particles, the mixed powder including carbon, whisker type inorganic filler covered with a conductive film at the surface thereof or whisker type carbon is used. In addition, as the resin, the epoxy resin is used. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a chip-shaped electronic component used in various electronic devices, and particularly to a minute chip-shaped electronic component.

  In recent years, the demand for lighter, thinner, and smaller electronic devices has been increasing, and in order to increase the wiring density of circuit boards, very small chip-shaped electronic components are often used as electronic components. Particularly in recent years, a very small chip-shaped electronic component having a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.25 mm is becoming mainstream.

  Next, a conventional chip-shaped electronic component will be described using a square chip resistor as an example.

  FIG. 3 is a perspective view showing the structure of a conventional square chip resistor, and FIG. 4 is a cross-sectional view of the square chip resistor.

  3 and 4, 1 is a substrate made of a 96 alumina substrate, 2 is a pair of upper surface electrode layers formed on both ends of the upper surface of the substrate 1, and the pair of upper surface electrode layers 2 are silver-based thick film electrodes. It is comprised by. Reference numeral 3 denotes a resistor layer formed so as to be electrically connected to the pair of upper surface electrode layers 2, and the resistor layer 3 is constituted by a ruthenium-based thick film resistor. Reference numeral 4 denotes a protective layer formed so as to completely cover the resistor layer 3, and this protective layer 4 is made of an epoxy resin. Reference numeral 5 denotes a pair of end face electrode layers provided on both end faces of the substrate 1 so as to be electrically connected to the pair of upper face electrode layers 2. The pair of end face electrode layers 5 are made of a mixed material of conductive particles and resin. It is configured. 6 is a nickel plating layer provided so as to cover the exposed portions of the end face electrode layer 5 and the upper electrode layer 2, and 7 is a solder or tin plating layer provided so as to cover the nickel plating layer 6. The layer 6 forms an external electrode.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-7-283004

  When a chip-shaped electronic component typified by the square chip resistor described above is mounted on a glass epoxy substrate or the like, the chip-shaped electronic component is exposed to a temperature atmosphere of about 250 ° C. for several seconds in order to melt the solder. In this case, in the chip-shaped electronic component typified by the above-described rectangular chip resistor, the nickel plating layer 6 or the solder or tin formed on the end face electrode layer 5 made of a mixed material of conductive particles and resin. Problems such as holes in the plating layer 7 and scattering of solder occurred. In particular, as the mounting interval between chip-like electronic components is reduced with the recent high density mounting, many of the above-mentioned problems have caused poor conduction.

  Therefore, the present inventors have made various studies in order to solve the above problems. As a result, it was found that the holes generated in the nickel plating layer 6 and the solder or tin plating layer 7 or the solder scattering was caused by the gas generated from the end face electrode layer 5. In this case, the generated gas may be caused by residual moisture, heat decomposition gas, or the like, but it is difficult to specify the generated gas and a plurality of factors are mixed.

  The present invention has been made to solve the above-mentioned problems, and in the heating at the time of melting the solder, there is no problem such as a hole in the nickel plating layer, solder or tin plating layer, or the occurrence of solder scattering. An object of the present invention is to provide a chip-like electronic component that is excellent in performance.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a substrate and an end surface electrode layer provided on an end surface of the substrate, and the end surface electrode layer is made of a mixed material of conductive particles, a nonconductive inorganic filler, and a resin. And using a mixed powder containing at least carbon and a whisker-like inorganic filler whose surface is covered with a conductive film as the conductive particles, and using an epoxy resin as the resin, Since an epoxy resin is used as the resin, there is no weight loss of 0.1% or more when heated to 200 ° C. As a result, the solder melting process when mounting this chip-shaped electronic component on the mounting board However, there are no problems such as holes in the nickel plating layer, solder or tin plating layer, or solder scattering. The Rukoto, since processes such as part replacement is unnecessary, thereby improving the mass productivity. In addition, by adding a whisker-like inorganic filler whose surface is covered with a conductive film and a non-conductive inorganic filler in the mixed material, the fracture toughness strength of the mixed material is improved, so that the strength of the end face electrode layer can be improved. The effect of being able to be obtained is obtained.

  The invention according to claim 2 of the present invention includes a substrate and an end surface electrode layer provided on an end surface of the substrate, and the end surface electrode layer is made of a mixed material of conductive particles, a nonconductive inorganic filler, and a resin. And a mixture powder containing at least carbon and whisker-like graphite whose surface is coated with a conductive film as the conductive particles, and an epoxy resin as the resin. According to this configuration, the resin As the epoxy resin is used, the weight loss of 0.1% or more is not caused when heated to 200 ° C. As a result, in the solder melting process when mounting this chip-shaped electronic component on the mounting board However, there will be no defects such as holes in the nickel plating layer, solder or tin plating layer, or solder scattering, and this defect will be reduced. More, since the process such as component replacement is not required, thereby improving the mass productivity. Moreover, since the fracture toughness strength of the mixed material is improved by adding whisker-like graphite whose surface is covered with a conductive film and a non-conductive inorganic filler in the mixed material, the strength of the end face electrode layer can be improved. The following effects can be obtained.

  In the invention according to claim 3 of the present invention, in particular, silica is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is improved by adding silica. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention described in claim 4 of the present invention is particularly one in which wollastonite is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is obtained by adding wollastonite. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 5 of the present invention is particularly one in which sepiolite is added as a whisker-like inorganic filler. According to this configuration, the addition of sepiolite improves the fracture toughness strength of the mixed material. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention described in claim 6 of the present invention is particularly one in which zinc oxide is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is improved by adding zinc oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 7 of the present invention is the addition of calcium carbonate as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding calcium carbonate. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 8 of the present invention is the addition of titanium oxide as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is improved by adding titanium oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 9 of the present invention is particularly one in which barium sulfate is added as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding barium sulfate. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  In the invention according to claim 10 of the present invention, in particular, aluminum hydroxide is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is obtained by adding aluminum hydroxide. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 11 of the present invention is the one in which aluminum oxide is added as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding aluminum oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 12 of the present invention is one in which magnesium hydroxide is added as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is obtained by adding magnesium hydroxide. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 13 of the present invention is the one in which zonotlite is added as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding zonotrite, The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  In the invention according to claim 14 of the present invention, in particular, potassium titanate is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material can be increased by adding potassium titanate. In order to improve, the effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  In the invention according to claim 15 of the present invention, in particular, aluminum borate is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material can be increased by adding aluminum borate. In order to improve, the effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  In the invention described in claim 16 of the present invention, in particular, magnesium sulfate is added as a whisker-like inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding magnesium sulfate. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to the seventeenth aspect of the present invention is particularly one in which calcium silicate is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material can be increased by adding calcium silicate. In order to improve, the effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  In the invention described in claim 18 of the present invention, in particular, silicon nitride is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is improved by adding silicon nitride. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  According to the nineteenth aspect of the present invention, in particular, silicon carbide is added as a whisker-like inorganic filler. According to this configuration, the fracture toughness strength of the mixed material is improved by adding silicon carbide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 20 of the present invention uses silver as a conductive film for covering the surface of whisker-like inorganic filler or whisker-like graphite, and according to this configuration, whisker whose surface is coated with silver. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  The invention according to claim 21 of the present invention uses nickel as the conductive film for covering the surface of the whisker-like inorganic filler or whisker-like graphite. According to this structure, the whisker whose surface is covered with nickel is used. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  According to the twenty-second aspect of the present invention, in particular, gold is used as the conductive film for covering the surface of the whisker-like inorganic filler or whisker-like graphite. According to this structure, the whisker whose surface is covered with gold is used. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  The invention described in claim 23 of the present invention uses tin as a conductive film for covering the surface of whisker-like inorganic filler or whisker-like graphite, and according to this configuration, whisker whose surface is coated with tin. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  The invention described in claim 24 of the present invention uses copper as the conductive film for covering the surface of the whisker-like inorganic filler or whisker-like graphite. According to this configuration, the whisker whose surface is covered with copper is used. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  The invention described in claim 25 of the present invention is one in which platinum is used as a conductive film that covers the surface of a whisker-like inorganic filler or whisker-like graphite. According to this configuration, the whisker whose surface is covered with platinum is used. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  The invention described in claim 26 of the present invention uses solder as the conductive film for covering the surface of the whisker-like inorganic filler or whisker-like graphite, and according to this configuration, the whisker whose surface is covered with solder. Since the inorganic filler powder or whisker-like graphite powder improves the conductivity of the mixed material, the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film. It is

  In the invention described in claim 27 of the present invention, in particular, the whisker-like inorganic filler has an average fiber diameter of 0.01 to 1 μm, an average fiber length of 1 to 100 μm, and an aspect ratio of 10 or more. According to this, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 28 of the present invention has an average fiber diameter of 0.01 to 1 μm, an average fiber length of 1 to 100 μm, and an aspect ratio of 10 or more. For example, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention described in claim 29 of the present invention uses an epoxy resin having a molecular weight of 1000 to 30000 as the resin. According to this configuration, when the chip-like electronic component is formed, the chip-like electronic component is used. Since the coverage of the board edge portion of the substrate becomes high, it becomes difficult to cause defects such as end face electrode breakage at the board edge portion. As a result, this defect is reduced, and a process such as component replacement becomes unnecessary. Therefore, the effect that mass productivity can be improved is obtained.

  The invention described in claim 30 of the present invention uses an epoxy resin that dissolves in a solvent having a boiling point of 200 ° C. or more as the resin, and according to this configuration, in the mixed material of conductive particles and resin. Since the volatilization of the solvent is reduced and the viscosity of the mixed material is stabilized, it is possible to apply in a stable shape, thereby obtaining the effect that the dimensional accuracy of the chip-like electronic component can be improved. Is.

  The invention described in claim 31 of the present invention uses an epoxy resin having a solvent content of 60% or more as the resin, and according to this configuration, the conductive particles, the non-conductive inorganic filler, When the epoxy resin mixed material is applied to the end face of the substrate and cured, the volume of the mixed material is reduced and the variation in shape at the time of application can be reduced, so that the dimensional accuracy of the chip-like electronic component can be improved. The following effects can be obtained.

  The invention according to the thirty-second aspect of the present invention uses carbon having a surface area per gram of 1000 square meters or more as carbon, and according to this configuration, the conductive particles constituting the end face electrode layer and non-carbon are used. Even if the amount of solvent added to the mixed material of conductive inorganic filler and resin is increased, the solvent will be wetted on the surface of the carbon, and as a result, the resin in the mixed material generated when the mixed material is applied and cured. The effect of suppressing the bleeding phenomenon of the component onto the substrate can be obtained.

  In the invention according to claim 33 of the present invention, in particular, the blending ratio (volume ratio) of conductive particles and (nonconductive inorganic filler + epoxy resin) is 10:90 to 25:75, and the carbon and the surface are The compounding ratio (volume ratio) of the whisker-like inorganic filler coated with the conductive film is 1:10 to 10: 1, and according to this configuration, the area resistance value of the end face electrode layer can be lowered. The effect that the nickel plating layer formed by the electroplating method after forming the end face electrode layer can be formed as a stable and uniform film is obtained, and the opposite effect is obtained that the electrode strength of the end face electrode layer can be increased. It is

  In the invention according to claim 34 of the present invention, in particular, the blending ratio (volume ratio) of the conductive particles and (non-conductive inorganic filler + epoxy resin) is 10:90 to 25:75, and the carbon and the surface are mixed. The blending ratio (volume ratio) of whisker-like graphite coated with the conductive film is 1:10 to 10: 1. According to this configuration, the area resistance value of the end face electrode layer can be lowered. The effect that the nickel plating layer formed by the electroplating method after forming the electrode layer can be formed as a stable and uniform film is obtained, and the opposite effect is obtained that the electrode strength of the end face electrode layer can be increased. Is.

  The invention according to claim 35 of the present invention uses a mixed material obtained by adding a coupling agent to conductive particles, a non-conductive inorganic filler, and a resin, in particular, as a mixed material. Since the adhesion between the substrate and the end face electrode layer can be improved, the effect of increasing the electrode strength of the end face electrode layer can be obtained.

  In the invention according to claim 36 of the present invention, in particular, the end face electrode layer is formed by applying and curing a mixed material having a viscosity at a shear rate of 0.006 (l / s) of 1000 Pa · s or more. Thus, according to this configuration, since the flow of the mixed material onto the substrate immediately after application of the mixed material and before curing can be suppressed, the dimensional accuracy of the end face electrode layer can be improved. An effect is obtained.

  In the invention according to claim 37 of the present invention, in particular, the volume content of the solvent in the mixed material is set to 70% or more. According to this configuration, carbon, whisker-like inorganic filler, and non-conductive inorganic filler are used. When the mixed material of epoxy resin and epoxy resin is applied to the end face of the substrate and cured, the volume of the mixed material is reduced and the variation in shape at the time of application can be reduced, so that the dimensional accuracy of the chip-like electronic component can be improved. The effect of being able to be obtained is obtained.

  The invention described in claim 38 of the present invention uses silica as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding silica. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention described in claim 39 of the present invention uses kaolin as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding kaolin. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention according to claim 40 of the present invention uses talc as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding talc. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention according to claim 41 of the present invention uses zinc oxide as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding zinc oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 42 of the present invention uses calcium carbonate as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding calcium carbonate. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 43 of the present invention uses titanium oxide as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding titanium oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 44 of the present invention uses barium sulfate as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding barium sulfate. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 45 of the present invention uses aluminum hydroxide as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material can be increased by adding aluminum hydroxide. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 46 of the present invention uses aluminum oxide as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding aluminum oxide. Therefore, the effect that the strength of the end face electrode layer can be improved is obtained.

  The invention according to claim 47 of the present invention uses magnesium hydroxide as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material can be increased by adding magnesium hydroxide. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 48 of the present invention uses mica as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is improved by adding mica. The effect that the intensity | strength of an end surface electrode layer can be improved is acquired.

  The invention according to claim 49 of the present invention uses potassium titanate as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is obtained by adding potassium titanate. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  The invention according to claim 50 of the present invention uses aluminum borate as the non-conductive inorganic filler, and according to this configuration, the fracture toughness strength of the mixed material is obtained by adding aluminum borate. Therefore, the effect that the strength of the end face electrode layer can be improved can be obtained.

  In the invention according to claim 51 of the present invention, in particular, the average particle size of the non-conductive inorganic filler is set in the range of 1 nm to 50 μm. According to this configuration, the average particle size of the non-conductive inorganic filler is set. Is set in the range of 1 nm to 50 μm, the effect is obtained that the strength of the end face electrode layer can be improved.

  The chip-shaped electronic component of the present invention includes a substrate and an end surface electrode layer provided on the end surface of the substrate, and the end surface electrode layer is composed of a mixed material of conductive particles, a nonconductive inorganic filler, and a resin. In addition, since a mixed powder containing at least carbon and a whisker-like inorganic filler whose surface is covered with a conductive film is used as the conductive particles, and an epoxy resin is used as the resin, 0.1% when heated to 200 ° C. As a result, even in the solder melting process when mounting this chip-shaped electronic component on a mounting board, a hole is formed in the nickel plating layer, solder or tin plating layer, and solder is not formed. Problems such as scattering will not occur, and this problem will be reduced, so parts replacement and other processes will be unnecessary, improving mass productivity. It can be. In addition, by adding a whisker-like inorganic filler whose surface is covered with a conductive film and a non-conductive inorganic filler in the mixed material, the fracture toughness strength of the mixed material is improved, so that the strength of the end face electrode layer can be improved. It has the effect of being able to do it.

(Embodiment 1)
Hereinafter, the rectangular chip resistor according to the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a square chip resistor according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of the square chip resistor.

  1 and 2, 11 is a substrate made of a 96 alumina substrate, 12 is a pair of upper surface electrode layers formed on both ends of the upper surface of the substrate 11, and the pair of upper surface electrode layers 12 are silver-based thick film electrodes. It is comprised by. Reference numeral 13 denotes a resistor layer formed so as to be electrically connected to the pair of upper surface electrode layers 12, and the resistor layer 13 is constituted by a ruthenium-based thick film resistor. A protective layer 14 is formed so as to completely cover the resistor layer 13, and the protective layer 14 is made of an epoxy resin. Reference numeral 15 denotes a pair of end face electrode layers provided on both end faces of the substrate 11 so as to be electrically connected to the pair of upper face electrode layers 12, and the pair of end face electrode layers 15 is a mixed material of conductive particles and resin. It is comprised by. 16 is a nickel plating layer provided so as to cover the exposed portions of the end face electrode layer 15 and the upper surface electrode layer 12, and 17 is a solder or tin plating layer provided so as to cover the nickel plating layer 16. The layer 16 forms an external electrode.

  Next, a method for manufacturing the rectangular chip resistor having the above configuration will be described.

  First, a sheet-like substrate made of a 96 alumina substrate excellent in heat resistance and insulation is received. In order to divide the sheet-like substrate into strips and individual pieces, grooves for dividing (mold forming at the time of green sheets) are formed in advance.

  Next, a thick film silver paste is screen-printed on the upper surface of the sheet-like substrate, dried, and fired in a belt-type continuous firing furnace at a temperature of 850 ° C. with a peak time of 6 minutes and an IN-OUT time of 45 minutes. Thus, the upper surface electrode layer 12 is formed.

  Next, a thick film resistance paste mainly composed of ruthenium oxide is screen-printed and dried on the upper surface of the sheet-like substrate so as to be electrically connected to the upper electrode layer 12, and is then dried by a belt-type continuous firing furnace. The resistor layer 13 is formed by baking at a temperature of 850 ° C. with a profile of a peak time of 6 minutes and an IN-OUT time of 45 minutes.

  Next, in order to make the resistance value of the resistor layer 13 between the upper electrode layers 12 uniform, a part of the resistor layer 13 is cut by laser light to correct the resistance value (L cut, 30 mm / sec, 12 KHz, 5 W). )I do.

  Next, an epoxy resin paste is screen-printed so as to completely cover at least the resistor layer 13, and is cured at a temperature of 200 ° C. in a belt type continuous curing furnace at a peak time of 30 minutes and an IN-OUT time of 50 minutes. Then, the protective layer 14 is formed by curing.

  Next, as a preparation step for forming the end face electrode layer 15, the sheet-like substrate is divided into strips, and the end face portion on which the end face electrode layer 15 is formed is exposed.

  Next, the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal.

  Next, a whisker-like carbon powder having a surface area of 800 square meters per gram so as to cover at least the upper electrode layer 12 and a surface covered with silver (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) Whisker-like inorganic filler made of potassium titanate, non-conductive inorganic filler made of silica with an average particle diameter of 5 μm, and an epoxy resin having a molecular weight of 800 (the content of methyl carbitol having a boiling point of about 194 ° C. as a solvent is 55%) ) Is mixed at a ratio of 15: 5: 5: 75, and an appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 0.006 (l / s) is 800 Pa · s (solvent) The end face electrode paste kneaded with a three-roll mill with a film thickness of about 50 μm in advance is uniformly made of stainless steel. -By rotating the stainless steel roller and moving the concave and convex holding jig, the end face electrode paste on the stainless steel roller is applied in contact with the end face electrode forming surface of the strip substrate. The application state is confirmed using a recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  Finally, as a preparatory step for electroplating, the strip-shaped substrate is divided into individual pieces, and the nickel plating layer 16 and the solder or the upper electrode layer 12 and the end surface electrode layer 15 are exposed on the individual substrate. A square chip resistor was manufactured by forming the tin plating layer 17 by barrel-type electroplating.

  In the end face electrode layer 15 of the rectangular chip resistor according to Embodiment 1 of the present invention described above, the weight reduction rate when heated at 200 ° C. was 0.08%, and the rate of occurrence of solder explosion was 0%. Other characteristics are summarized in (Table 1) described later.

(Embodiment 2)
Next, a rectangular chip resistor according to Embodiment 2 of the present invention will be described.

  The structure of the rectangular chip resistor in the second embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereafter, the manufacturing process of the square chip resistor in Embodiment 2 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 800 (content ratio of methylcarbitol having a boiling point of about 194 ° C. as a solvent is 55%) are mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / S) A mixed material (volume content of solvent: 65%) to which an appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of 800 Pa · s was obtained. The end face electrode paste kneaded by this roll mill is uniformly formed in advance on a stainless steel roller with a film thickness of about 50 μm, and the end face on the stainless steel roller is moved by rotating the stainless steel roller and moving the uneven holding jig. The electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 2 of the present invention described above, whisker-like inorganic material comprising carbon powder and whisker-like potassium titanate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver on the surface. Filler, non-conductive inorganic filler made of silica, and epoxy resin (55% content of methyl carbitol having a boiling point of about 194 ° C. as a solvent) are mixed at a ratio of 11: 3: 5: 81 Compared with Embodiment 1 of the present invention, the effect that the electrode strength can be improved is obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 3)
Next, a rectangular chip resistor according to Embodiment 3 of the present invention will be described.

  The structure of the rectangular chip resistor according to the third embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 3 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 1000 (content ratio of methyl carbitol having a boiling point of about 194 ° C. as a solvent is 60%) are mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / S) A mixed material to which an appropriate amount of butyl carbitol acetate is added so that the shear rate viscosity is 800 Pa · s (volume ratio of solvent: 70%) An end face electrode paste kneaded by a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and this stainless steel roller is rotated and an uneven holding jig is moved to thereby move the electrode on the stainless steel roller. The end face electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition apparatus. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described third embodiment of the present invention, the molecular weight of the epoxy resin constituting the end face electrode layer 15 is 1000 (may be in the range of 1000 to 30000), so the solvent content is 60% (60% or more). As a result, the effect of improving the coverage of the substrate edge portion can be obtained as compared with the second embodiment of the present invention. Other characteristics are summarized in (Table 1) described later.

(Embodiment 4)
Next, a rectangular chip resistor according to Embodiment 4 of the present invention will be described.

  The structure of the rectangular chip resistor according to the fourth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 4 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (a content of 66% methylcarbitol having a boiling point of about 194 ° C. as a solvent) were mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / s) mixed material with an appropriate amount of butyl carbitol acetate added so that the shear rate viscosity is 800 Pa · s (volume content of solvent: 74%) An end face electrode paste kneaded by a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and this stainless steel roller is rotated and an uneven holding jig is moved to thereby move the electrode on the stainless steel roller. The end face electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition apparatus. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described fourth embodiment of the present invention, the molecular weight of the epoxy resin constituting the end face electrode layer 15 is set to 12,500 (which may be in the range of 1000 to 30000), so the solvent content in the epoxy resin is 66%. As long as it is 60% or more, it is possible to obtain an effect that the coverage of the substrate edge portion is improved as compared with the second embodiment of the present invention. Other characteristics are summarized in (Table 1) described later.

(Embodiment 5)
Next, a rectangular chip resistor according to Embodiment 5 of the present invention will be described.

  The structure of the rectangular chip resistor in the fifth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 5 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 30,000 (a content of 75% methylcarbitol having a boiling point of about 194 ° C. as a solvent) are mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / S) mixed material with an appropriate amount of butyl carbitol acetate added so that the shear rate viscosity is 800 Pa · s (volume ratio of solvent: 84% An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is moved by rotating the stainless steel roller and moving the uneven holding jig. The end face electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described fifth embodiment of the present invention, since the molecular weight of the epoxy resin constituting the end face electrode layer 15 is 30000 (may be in the range of 1000 to 30000), the solvent content in the epoxy resin is 75%. As long as it is 60% or more, it is possible to obtain an effect that the coverage of the substrate edge portion is improved as compared with the second embodiment of the present invention. Other characteristics are summarized in (Table 1) described later.

(Embodiment 6)
Next, a rectangular chip resistor according to the sixth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the sixth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 6 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 32000 (content ratio of methylcarbitol having a boiling point of about 194 ° C. as a solvent is 80%) are mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / S) mixed material with an appropriate amount of butyl carbitol acetate added so that the shear rate viscosity is 800 Pa · s (volume ratio of solvent 89% An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is moved by rotating the stainless steel roller and moving the uneven holding jig. The end face electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 6 of the present invention described above, since the molecular weight of the epoxy resin constituting the end face electrode layer 15 is 32000, the solvent content in the epoxy resin is set to 80% (60% or more is sufficient). However, since the molecular weight of the epoxy resin is too large, such as 32000, the film thickness becomes thin as a whole. As in the second embodiment of the present invention, the coverage of the substrate edge is not so good. There is nothing. Other characteristics are summarized in (Table 1) described later.

(Embodiment 7)
Next, a rectangular chip resistor according to Embodiment 7 of the present invention will be described.

  The structure of the rectangular chip resistor according to the seventh embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 7 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of ethyl carbitol having a boiling point of about 202 ° C. as a solvent is 66%) are mixed at a ratio of 11: 3: 5: 81, and 0.006 (l / S) mixed material with an appropriate amount of butyl carbitol acetate added so that the shear rate viscosity is 800 Pa · s (volume ratio of solvent: 74% An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is moved by rotating the stainless steel roller and moving the uneven holding jig. The end face electrode paste is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 7 of the present invention described above, the solvent in the epoxy resin constituting the end face electrode layer 15 is ethyl carbitol having a boiling point of about 202 ° C. (the boiling point may be a solvent having a boiling point of 200 ° C. or higher). In addition, since the volatilization of the solvent in the end face electrode is reduced, and thus the change in viscosity during the operation of the end face electrode paste can be reduced, the shape is stable compared to Embodiments 3 to 6 of the present invention. The effect that application | coating becomes possible is acquired. Other characteristics are summarized in (Table 1) described later.

(Embodiment 8)
Next, a rectangular chip resistor according to the eighth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the eighth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the eighth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 11: 3: 5: 81, and 0.006 ( l / s) A mixed material to which an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 800 Pa · s (including the volume of the solvent). An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is rotated and the uneven holding jig is moved. Then, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described eighth embodiment of the present invention, the solvent in the epoxy resin constituting the end face electrode layer 15 is butyl carbitol acetate having a boiling point of about 247 ° C. (the boiling point may be a solvent having a boiling point of 200 ° C. or higher). For this reason, the volatilization of the solvent in the end face electrode is reduced, and this makes it possible to reduce the viscosity change during the work of the end face electrode paste, so that it has a stable shape as compared with the first to sixth embodiments of the present invention. The effect that it becomes possible to apply is obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 9)
Next, a rectangular chip resistor according to the ninth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the ninth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the ninth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 11: 4: 5: 80, and 0.006 ( l / s) A mixed material to which an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 800 Pa · s (including the volume of the solvent). An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is rotated and the uneven holding jig is moved. Then, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. And what was able to confirm that the end face electrode paste was applied all over the side surface of the strip-shaped substrate was a peak time of 160 ° C. for 30 minutes and an IN-OUT time of 40 minutes using a belt-type continuous far-infrared curing furnace. By performing heat treatment according to the temperature profile, the end face electrode layer 15 having an end face portion thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 9 of the present invention described above, whisker-like inorganic material comprising carbon powder and whisker-like potassium titanate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver on the surface. 11: 4: 5: a filler, a non-conductive inorganic filler made of silica having an average particle size of 5 μm, and an epoxy resin having a molecular weight of 12500 (the content of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%). Since mixing is performed at a ratio of 80, the area resistance value is lower than in the seventh and eighth embodiments of the present invention, thereby improving the plating adhesion and the electrode strength. It is obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 10)
Next, a rectangular chip resistor according to Embodiment 10 of the present invention will be described.

  The structure of the rectangular chip resistor according to the tenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the tenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) whisker-like inorganic filler coated with silver on the surface, and silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) A mixed material to which an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 800 Pa · s (including the volume of the solvent). An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller in a film thickness of about 50 μm in advance, and the stainless steel roller is rotated and the uneven holding jig is moved. The end face electrode paste on the stainless steel roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition apparatus. And what was able to confirm that the end face electrode paste was applied all over the side surface of the strip-shaped substrate was a belt type continuous far-infrared curing furnace with a peak time of 160 ° C. for 30 minutes and an IN-OUT time of 40 minutes. By performing heat treatment according to the temperature profile, the end face electrode layer 15 having an end face portion thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 10 of the present invention described above, whisker-like inorganic material comprising carbon powder and potassium titanate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver on the surface. 5: 15: 5: a filler, a nonconductive inorganic filler made of silica having an average particle diameter of 5 μm, and an epoxy resin having a molecular weight of 12500 (the content of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%). Since the mixing is performed at a ratio of 75, the sheet resistance value is reduced as compared with the seventh and eighth embodiments of the present invention, thereby improving the plating adhesion and the electrode strength. It is obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 11)
Next, a rectangular chip resistor according to Embodiment 11 of the present invention will be described.

  The structure of the rectangular chip resistor according to the eleventh embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the eleventh embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per gram is 800 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 7: 18: 5: 75, and 0.006 ( l / s) A mixed material to which an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 800 Pa · s (including the volume of the solvent). An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is rotated and the uneven holding jig is moved. Then, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. And what was able to confirm that the end face electrode paste was applied all over the side surface of the strip-shaped substrate was a peak time of 160 ° C. for 30 minutes and an IN-OUT time of 40 minutes using a belt-type continuous far-infrared curing furnace. By performing heat treatment according to the temperature profile, the end face electrode layer 15 having an end face portion thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 11 of the present invention described above, carbon powder and whisker-like inorganic filler made of silver-coated whisker-like (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) potassium titanate, A non-conductive inorganic filler made of silica having an average particle size of 5 μm and an epoxy resin having a molecular weight of 12500 (content of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) of 7: 18: 5: 75 Since they are mixed at a ratio, the area resistance value is reduced as compared with the seventh and eighth embodiments of the present invention, and thereby, the effect of improving the plating adhesion and the electrode strength is obtained. Is. Other characteristics are summarized in (Table 1) described later.

(Embodiment 12)
Next, a rectangular chip resistor according to Embodiment 12 of the present invention will be described.

  The structure of the rectangular chip resistor according to the twelfth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twelfth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end surface electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 1000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) Mixed material (solvent body) with an appropriate amount of butyl carbitol acetate added so that the viscosity at a shear rate of 1000 Pa · s An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller in advance with a film thickness of about 50 μm, and the stainless steel roller is rotated and the uneven holding jig is moved. Thus, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition apparatus. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 12 of the present invention described above, since the surface area per 1 g of carbon is 1000 square meters (or more than 1000 square meters), the viscosity at a shear rate of 0.006 (l / s) is 1000 Pa ·. s (1000 Pa · s or more is sufficient), and as a result, an effect that the flow onto the substrate can be suppressed as compared with the ninth to eleventh embodiments of the present invention can be obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 13)
Next, a rectangular chip resistor according to the thirteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the thirteenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) Mixed material (solvent body) to which an appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste kneaded with a three-roll mill is uniformly formed on a stainless steel roller in advance with a film thickness of about 50 μm, and the stainless steel roller is rotated and the uneven holding jig is moved. Thus, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition apparatus. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the thirteenth embodiment of the present invention, since the surface area per 1 g of carbon is 2000 square meters (or more than 1000 square meters), the viscosity at a shear rate of 0.006 (l / s) is 2000 Pa · s (1000 Pa · s or more is sufficient), and as a result, an effect that the flow onto the substrate can be suppressed as compared with the ninth to eleventh embodiments of the present invention can be obtained. Other characteristics are summarized in (Table 1) described later.

(Embodiment 14)
Next, a rectangular chip resistor according to the fourteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the fourteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 14 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, an average fiber length of 30 μm, and an aspect ratio of 60) that is coated with silver, whisker-like inorganic filler, and silica that has an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described fourteenth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 15)
Next, a rectangular chip resistor according to the fifteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the fifteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the fifteenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of whisker-like silica (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm An inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / a suitable amount of butyl carbitol acetate is added so that the viscosity at the shear rate of s) is 2000 Pa · s, and further a silane coupling agent An end face electrode paste obtained by kneading a mixed material (volume content of solvent 80%) added with 1% by a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and the stainless steel roller is rotated. By moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the fifteenth embodiment of the present invention described above, since 1% of the silane coupling agent is further added compared to the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 16)
Next, a rectangular chip resistor according to the sixteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the sixteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the sixteenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler composed of wollastonite (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with silver on the surface, and silica having an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described sixteenth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of a silane coupling agent is added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 17)
Next, a rectangular chip resistor according to Embodiment 17 of the present invention will be described.

  The structure of the rectangular chip resistor in the seventeenth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 17 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of whipker-shaped (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica with an average particle diameter of 5 μm An inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / Add an appropriate amount of butyl carbitol acetate so that the viscosity at the shear rate of s) is 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of an adhesive agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described seventeenth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 18)
Next, a rectangular chip resistor according to the eighteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the eighteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the eighteenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of whisker-like zinc oxide (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S) Add an appropriate amount of butyl carbitol acetate so that the shear rate viscosity is 2000 Pa · s, and then silane coupling An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) with 1 roll of 3% by a three-roll mill is uniformly formed on a stainless roller in advance with a film thickness of about 50 μm, and the stainless roller is rotated. At the same time, by moving the concave and convex holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described eighteenth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 19)
Next, a rectangular chip resistor according to the nineteenth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the nineteenth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the nineteenth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of whisker-like calcium carbonate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica with an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S) Add an appropriate amount of butyl carbitol acetate so that the shear rate viscosity is 2000 Pa · s, and then add a silane cup. An end electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a polishing agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the nineteenth embodiment of the present invention described above, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 20)
Next, a rectangular chip resistor according to the twentieth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor in the twentieth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twentieth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of titanium oxide coated with silver on the surface (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and silica, average particle diameter 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 2000 Pa · s, and silane-based coupling An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) containing 1% of the agent with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and this stainless steel roller is rotated. In addition, by moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the twentieth embodiment of the present invention described above, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 21)
Next, a rectangular chip resistor according to the twenty-first embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-first embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twenty-first embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of whisker-shaped barium sulfate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 2000 Pa · s, and the silane coupling agent is added. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of an adhesive agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-first embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 22)
Next, a rectangular chip resistor according to the twenty-second embodiment of the present invention will be described.

  The structure of the rectangular chip resistor in the twenty-second embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twenty-second embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of whisker-like (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with silver on the surface, and silica having an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-second embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 23)
Next, a rectangular chip resistor according to the twenty-third embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-third embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twenty-third embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of aluminum oxide in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the shear rate viscosity is 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-third embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 24)
Next, a rectangular chip resistor according to the twenty-fourth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor in the twenty-fourth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twenty-fourth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of magnesium hydroxide in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and non-particles made of silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-fourth embodiment of the present invention, since 1% of a silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 25)
Next, a rectangular chip resistor according to a twenty-fifth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor in the twenty-fifth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the twenty-fifth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-shaped inorganic filler made of whisker-shaped (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica with an average particle diameter of 5 μm An inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / Add an appropriate amount of butyl carbitol acetate so that the viscosity at the shear rate of s) is 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of an adhesive agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-fifth embodiment of the present invention, since 1% of a silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 26)
Next, a rectangular chip resistor according to the twenty-sixth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-sixth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the twenty-sixth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (both average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) whisker-like inorganic filler coated with silver on the surface, and silica non-particles having an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-sixth embodiment of the present invention, since 1% of a silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 27)
Next, a rectangular chip resistor according to Embodiment 27 of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-seventh embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the twenty-seventh embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of magnesium sulfate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the shear rate viscosity is 2000 Pa · s, An end face electrode paste obtained by kneading a mixed material (solvent volume content: 82%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-seventh embodiment of the present invention, since 1% of a silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 28)
Next, a rectangular chip resistor according to the twenty-eighth embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-eighth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the twenty-eighth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like calcium filler silicate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver on the surface, silica non-average particle diameter 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content: 78%) added with 1% of a ring agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described twenty-eighth embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 29)
Next, a rectangular chip resistor according to Embodiment 29 of the present invention will be described.

  The structure of the rectangular chip resistor according to the twenty-ninth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the twenty-ninth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of silicon nitride in a whisker-like shape (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and silica having an average particle diameter of 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 2000 Pa · s, and silane-based coupling An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) containing 1% of the agent with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and this stainless steel roller is rotated. In addition, by moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 29 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

Embodiment 30
Next, a rectangular chip resistor according to Embodiment 30 of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirtieth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in Embodiment 30 of this invention is demonstrated.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of silicon carbide coated with silver on the surface (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and silica, average particle diameter 5 μm The inorganic inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / S), an appropriate amount of butyl carbitol acetate is added so that the viscosity at the shear rate is 2000 Pa · s, and silane-based coupling An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) containing 1% of the agent with a three-roll mill is uniformly formed on a stainless steel roller with a film thickness of about 50 μm in advance, and this stainless steel roller is rotated. In addition, by moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-third embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth-embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 31)
Next, a rectangular chip resistor according to Embodiment 31 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 31 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the thirty-first embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of whisker-like (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with nickel, and silica having an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a coupling agent with a three-roll mill is uniformly formed on a stainless steel roller in a film thickness of about 50 μm in advance. Rotate and move the concave and convex holding jig to apply the end face electrode paste on the stainless steel roller in contact with the end face electrode forming surface of the strip substrate, and check the application state using the image recognition device To do. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 31 of the present invention described above, since 1% of the silane coupling agent is further added as compared with Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 32)
Next, a rectangular chip resistor according to the thirty-second embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-second embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the thirty-second embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) whisker-like inorganic filler whose surface is coated with gold, and silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-second embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 33)
Next, a rectangular chip resistor according to the thirty-third embodiment of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-third embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in the thirty-third embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) whisker-like inorganic filler coated with tin, and silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-third embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 34)
Next, a rectangular chip resistor according to Embodiment 34 of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-fourth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the thirty-fourth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler composed of potassium titanate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with copper, and non-particles made of silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-fourth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of the silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 35)
Next, a rectangular chip resistor according to Embodiment 35 of the present invention will be described.

  The structure of the rectangular chip resistor in the thirty-fifth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  A manufacturing process for the rectangular chip resistor according to the thirty-fifth embodiment of the present invention will be described below.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of whisker-like (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with platinum, and silica having an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the 35th embodiment of the present invention described above, since 1% of the silane coupling agent is further added as compared with the 12th and 13th embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

Embodiment 36
Next, a rectangular chip resistor according to Embodiment 36 of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-sixth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the thirty-sixth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler composed of potassium titanate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with solder, and non-particles made of silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-sixth embodiment of the present invention, as compared with the twelfth and thirteenth embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 37)
Next, a rectangular chip resistor according to Embodiment 37 of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-seventh embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the thirty-seventh embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate (average fiber diameter 0.01 μm, average fiber length 1 μm, aspect ratio 100) coated with silver on the surface, and non-particles made of silica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 37 of the present invention described above, since 1% of a silane coupling agent is further added compared to Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Thirty-eighth embodiment)
Next, a rectangular chip resistor according to Embodiment 38 of the present invention will be described.

  The structure of the rectangular chip resistor according to the thirty-eighth embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in the thirty-eighth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler made of potassium titanate with a surface coated with silver (average fiber diameter 1 μm, average fiber length 100 μm, aspect ratio 100), and silica, average particle diameter 5 μm An inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / Add an appropriate amount of butyl carbitol acetate so that the viscosity at the shear rate of s) is 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described thirty-eighth embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the twelfth and thirteenth embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 39)
Next, a rectangular chip resistor according to Embodiment 39 of the present invention will be described.

  The structure of the rectangular chip resistor according to the 39th embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the thirty-ninth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Non-conductive carbon powder, whisker-like inorganic filler composed of whisker-like (average fiber diameter of 1 μm, average fiber length of 10 μm, aspect ratio of 10) coated with silver, and silica having an average particle diameter of 5 μm An inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / Add an appropriate amount of butyl carbitol acetate so that the viscosity at the shear rate of s) is 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of an adhesive agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the 39th embodiment of the present invention described above, since 1% of the silane coupling agent is further added as compared with the 12th and 13th embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 40)
Next, a rectangular chip resistor according to Embodiment 40 of the present invention will be described.

  The structure of the rectangular chip resistor in the fortieth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the fortieth embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like graphite made of whisker-like graphite (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with silver, and non-conductive inorganic substance made of silica and having an average particle diameter of 5 μm The filler and an epoxy resin having a molecular weight of 12500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 (l / s ) Add an appropriate amount of butyl carbitol acetate so that the shear rate viscosity is 2000 Pa · s, and then add 1% of a silane coupling agent. An end face electrode paste in which the mixed material (solvent volume content 80%) was kneaded with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By moving the holding jig, the end face electrode paste on the stainless steel roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the 40th embodiment of the present invention described above, since 1% of the silane coupling agent is further added as compared with the 12th and 13th embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 41)
Next, a rectangular chip resistor according to Embodiment 41 of the present invention will be described.

  The structure of the rectangular chip resistor in the forty-first embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 41 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate with a surface covered with silver (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and non-particles made of kaolin with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 41 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 42)
Next, a rectangular chip resistor according to Embodiment 42 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 42 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in the embodiment 42 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) whisker-like inorganic filler coated with silver on the surface, and non-particles with an average particle diameter of 5 μm made of talc A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 42 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 43)
Next, a rectangular chip resistor according to Embodiment 43 of the present invention will be described.

  The structure of the rectangular chip resistor in the forty-third embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 43 of the invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. A carbon powder, whisker-like inorganic filler composed of potassium titanate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and an average particle diameter of 5 μm composed of zinc oxide A non-conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of (l / s) was 2000 Pa · s, and a silane-based catalyst was further added. An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 43 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 44)
Next, a rectangular chip resistor according to Embodiment 44 of the present invention will be described.

  The structure of the rectangular chip resistor according to the 44th embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 44 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. A carbon powder, whisker-like inorganic filler made of potassium titanate in a whisker-like shape (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) coated with silver, and an average particle diameter of 5 μm made of calcium carbonate A non-conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 Add an appropriate amount of butyl carbitol acetate so that the viscosity at a shear rate of (l / s) is 2000 Pa · s, and An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a coupling agent with a three-roll mill is uniformly formed on a stainless steel roller in a thickness of about 50 μm in advance. By rotating the roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip substrate, and the application state is changed using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 44 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 45)
Next, a rectangular chip resistor according to Embodiment 45 of the present invention will be described.

  The structure of the rectangular chip resistor in the forty-fifth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 45 of the invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. A carbon powder, whisker-like (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) whisker-like inorganic filler coated with silver on the surface, and an average particle diameter of 5 μm made of titanium oxide A non-conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of (l / s) was 2000 Pa · s, and a silane system An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 45 of the present invention described above, since 1% of a silane coupling agent is further added as compared to Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 46)
Next, a rectangular chip resistor according to Embodiment 46 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 46 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIG. 1 and FIG. 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 46 of the invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) whisker-like inorganic filler coated with silver on the surface, and an average particle diameter of 5 μm consisting of barium sulfate A non-conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of (l / s) was 2000 Pa · s, and silane An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a coupling agent with a three-roll mill is uniformly formed on a stainless steel roller in a film thickness of about 50 μm in advance. Rotate and move the concave and convex holding jig to apply the end face electrode paste on the stainless steel roller in contact with the end face electrode forming surface of the strip substrate, and check the application state using the image recognition device To do. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 46 of the present invention, as compared with Embodiments 12 and 13 of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 47)
Next, a rectangular chip resistor according to Embodiment 47 of the present invention will be described.

  The structure of the rectangular chip resistor according to the 47th embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in the embodiment 47 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate with a surface covered with silver (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and average particle diameter 5 μm made of aluminum hydroxide The non-conductive inorganic filler was mixed with an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) at a ratio of 5: 15: 5: 75, and An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of 006 (l / s) was 2000 Pa · s, and An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a run coupling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating the stainless steel roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip-shaped substrate and applied using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described 47th embodiment of the present invention, as compared with the 12th and 13th embodiments of the present invention, since 1% of the silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 48)
Next, a rectangular chip resistor according to Embodiment 48 of the present invention will be described.

  The structure of the rectangular chip resistor in the 48th embodiment of the present invention is the same as that of the rectangular chip resistor in the 1st embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor in the 48th embodiment of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like potassium titanate (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver on the surface, and an average particle diameter of 5 μm made of aluminum oxide A non-conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content of butyl carbitol acetate having a boiling point of about 247 ° C., which is a solvent, 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 Add an appropriate amount of butyl carbitol acetate so that the viscosity at a shear rate of (l / s) is 2000 Pa · s, and An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% copper coupling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating the stainless steel roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip-shaped substrate and applied using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described 48th embodiment of the present invention, as compared with the 12th and 13th embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 49)
Next, a rectangular chip resistor according to Embodiment 49 of the present invention will be described.

  The structure of the rectangular chip resistor in the forty-ninth embodiment of the present invention is the same as that of the rectangular chip resistor in the first embodiment of the present invention shown in FIGS. 1 and 2, but the end electrode paste used for the end electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the embodiment 49 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate with a surface coated with silver (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60), and average particle diameter of magnesium hydroxide of 5 μm The non-conductive inorganic filler was mixed with an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) at a ratio of 5: 15: 5: 75, and An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of 006 (l / s) was 2000 Pa · s, and An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a run coupling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating the stainless steel roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip-shaped substrate and applied using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described 49th embodiment of the present invention, since 1% of the silane coupling agent is further added as compared with the 12th and 13th embodiments of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 50)
Next, a rectangular chip resistor according to Embodiment 50 of the present invention will be described.

  The structure of the rectangular chip resistor according to the 50th embodiment of the present invention is the same as that of the rectangular chip resistor according to the first embodiment of the present invention shown in FIGS. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 50 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate with a surface coated with silver (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and non-particles made of mica with an average particle diameter of 5 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% of a ring agent with a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described 50th embodiment of the present invention, as compared with the 12th and 13th embodiments of the present invention, since 1% of a silane coupling agent is further added, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 51)
Next, a rectangular chip resistor according to Embodiment 51 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 51 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIG. 1 and FIG. Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 51 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler composed of potassium titanate with a surface coated with silver (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60), and average particle diameter 5 μm composed of potassium titanate The non-conductive inorganic filler was mixed with an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) at a ratio of 5: 15: 5: 75, and An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of 006 (l / s) was 2000 Pa · s. An end face electrode paste obtained by kneading a mixed material (solvent volume content 80%) added with 1% copper coupling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating the stainless steel roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip-shaped substrate and applied using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 51 of the present invention, since 1% of the silane coupling agent is further added as compared with Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 52)
Next, a rectangular chip resistor according to Embodiment 52 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 52 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIG. 1 and FIG. 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor in the embodiment 52 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like (with an average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60) whisker-like inorganic filler coated with silver, and an average particle diameter of 5 μm made of aluminum borate The non-conductive inorganic filler was mixed with an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) at a ratio of 5: 15: 5: 75, and An appropriate amount of butyl carbitol acetate was added so that the viscosity at a shear rate of 006 (l / s) was 2000 Pa · s, and An end face electrode paste prepared by kneading a mixed material (solvent volume content 80%) added with 1% of a run coupling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating the stainless steel roller and moving the concave and convex holding jig, the end surface electrode paste on the stainless steel roller is applied in contact with the end surface electrode forming surface of the strip-shaped substrate and applied using an image recognition device. Confirm. Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In the above-described Embodiment 52 of the present invention, since 1% of a silane coupling agent is further added as compared with Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 53)
Next, a rectangular chip resistor according to Embodiment 53 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 53 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, a manufacturing process of the rectangular chip resistor according to the embodiment 53 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler composed of potassium titanate in the form of whisker (average fiber diameter 0.5 μm, average fiber length 30 μm, aspect ratio 60) coated with silver, and non-particles having an average particle diameter of 1 nm made of silica A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material (solvent volume content 85%) added with 1% of a pulling agent with a three-roll mill was previously formed uniformly on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 53 of the present invention described above, since 1% of the silane coupling agent is further added as compared with Embodiments 12 and 13 of the present invention, the adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

(Embodiment 54)
Next, a rectangular chip resistor according to Embodiment 54 of the present invention will be described.

  The structure of the rectangular chip resistor in the embodiment 54 of the present invention is the same as that of the rectangular chip resistor in the embodiment 1 of the present invention shown in FIGS. 1 and 2, but the end surface electrode paste used for the end surface electrode layer 15 Are different in composition and production method.

  Hereinafter, the manufacturing process of the square chip resistor according to the embodiment 54 of the present invention will be described.

  The process until the strip-shaped substrate is fixed using an uneven holding jig so that the end surface electrode forming surface is horizontal is exactly the same as in the first embodiment of the present invention.

  That is, after fixing the strip-shaped substrate so that the end face electrode forming surface is horizontal using an uneven holding jig, the surface area per 1 g is 2000 square meters so as to cover at least the upper surface electrode layer 12. Carbon powder, whisker-like inorganic filler made of potassium titanate in which the surface is coated with silver (average fiber diameter of 0.5 μm, average fiber length of 30 μm, aspect ratio of 60), and silica having an average particle diameter of 50 μm A conductive inorganic filler and an epoxy resin having a molecular weight of 12,500 (content ratio of butyl carbitol acetate having a boiling point of about 247 ° C. as a solvent is 66%) are mixed at a ratio of 5: 15: 5: 75, and 0.006 ( l / s) An appropriate amount of butyl carbitol acetate is added so that the viscosity at a shear rate of 2000 Pa · s is obtained. An end face electrode paste obtained by kneading a mixed material added with 1% of a pulling agent (volume content of solvent: 76%) by a three-roll mill was previously uniformly formed on a stainless steel roller with a film thickness of about 50 μm. By rotating and moving the uneven holding jig, the end face electrode paste on the stainless roller is applied in contact with the end face electrode forming surface of the strip-shaped substrate, and the application state is confirmed using an image recognition device. . Then, it was confirmed that the end face electrode paste was applied all over the end face electrode forming surface of the strip-shaped substrate. The peak time was 160 ° C. for 30 minutes in the belt type continuous far infrared curing furnace, and the IN-OUT time. By performing heat treatment with a temperature profile of 40 minutes, an end face electrode layer 15 having an end face thickness of about 5 to 10 μm was formed.

  The final electroplating process is exactly the same as in the first embodiment of the present invention.

  In Embodiment 54 of the present invention described above, since 1% of a silane coupling agent is further added as compared with Embodiments 12 and 13 of the present invention, adhesion between the substrate and the mixed material is increased. As a result, the electrode strength can be improved to 350N. The other characteristics are summarized in the following (Table 1).

  As apparent from (Table 1), in Embodiments 1 to 54 of the present invention, the weight loss when heated to 200 ° C., which is the main object of the present invention, is 0.1% or less. The number of explosion failures was 0 out of n = 1000. It was also confirmed that a very strong strength of 230N to 350N was obtained by adding a whisker-like inorganic filler whose surface was coated with a conductive material or graphite.

  As Comparative Example 1, a square chip resistor was manufactured by replacing the epoxy resin in Embodiment 1 of the present invention with an epoxy-modified phenol resin. In Comparative Example 1, the weight reduction rate when heated to 200 ° C. was about 0.3%, or the number of defects of nudging was 12 out of 1000.

  As Comparative Example 2, a mixed material (carbon 5: flake silver 15: epoxy resin 80) in which the whisker-like inorganic filler whose surface was coated with a conductive material in Embodiment 14 of the present invention was replaced with flake silver was used. A square chip resistor was fabricated. In Comparative Example 2, since the whisker-like inorganic filler whose surface was coated with a conductive material or graphite was not blended, the electrode strength was 200 N, and a decrease in electrode strength was observed.

  In Embodiments 1 to 54 of the present invention, a square chip resistor has been described as an example of a chip-shaped electronic component. However, the present invention is not limited to this, and a chip-shaped chip having other end face electrodes. Even when applied to an electronic component, the same effects as those of Embodiments 1 to 54 of the present invention can be obtained.

  In Embodiments 1 to 54 of the present invention, a mixed powder of whisker-like inorganic filler whose carbon and the surface are coated with a conductive film or a mixed powder of carbon and whisker-like graphite is used as the mixed powder of conductive particles. However, a suitable amount of single powder or mixed powder of silver, copper, nickel, gold, platinum, tin, solder, etc. may be added to this mixed powder. In this case, the conductor resistance value of the end face electrode layer Can be further lowered.

  In Embodiments 1 to 54 of the present invention, an epoxy resin is used as the resin, but this may be a phenol-modified epoxy resin, an imide-modified epoxy resin, or an epoxy resin modified with another resin.

  Since the chip-shaped electronic component according to the present invention uses an epoxy resin as a resin constituting the end face electrode layer, it does not cause a weight loss of 0.1% or more when heated to 200 ° C., Even in the solder melting process when mounting this chip-shaped electronic component on the mounting board, there will be no defects such as holes in the nickel plating layer or solder plating layer, or solder scattering, and this defect will be reduced. This eliminates the need for parts replacement and the like, and thus has the effect of improving mass productivity. Also, whisker-like inorganic filler or whisker-like graphite whose surface is coated with a conductive film in a mixed material is provided. In addition to the inclusion of a non-conductive inorganic filler, the fracture toughness strength of the mixed material is improved and the strength of the end face electrode layer is improved. Those that can be.

The perspective view of the square chip resistor in Embodiment 1 of this invention AA line sectional view in FIG. A perspective view of a conventional chip resistor BB sectional view in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Board | substrate 12 Upper surface electrode layer 13 Resistor layer 14 Protective layer 15 End surface electrode layer 16 Nickel plating layer 17 Solder or tin plating layer

Claims (51)

A substrate and an end surface electrode layer provided on the end surface of the substrate, wherein the end surface electrode layer is composed of a mixed material of conductive particles, a non-conductive inorganic filler, and a resin, and at least carbon as the conductive particles A chip-shaped electronic component using a mixed powder containing a whisker-like inorganic filler whose surface is covered with a conductive film, and using an epoxy resin as the resin. A substrate and an end surface electrode layer provided on the end surface of the substrate, wherein the end surface electrode layer is composed of a mixed material of conductive particles, a non-conductive inorganic filler, and a resin, and at least carbon as the conductive particles A chip-shaped electronic component using a mixed powder containing whisker-like graphite whose surface is covered with a conductive film, and using an epoxy resin as the resin. The chip-shaped electronic component according to claim 1, wherein silica is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein wollastonite is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein sepiolite is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein zinc oxide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein calcium carbonate is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein titanium oxide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein barium sulfate is used as the whisker-like inorganic filler. The chip-like electronic component according to claim 1, wherein aluminum hydroxide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein aluminum oxide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein magnesium hydroxide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein zonotolite is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein potassium titanate is used as the whisker-like inorganic filler. The chip-like electronic component according to claim 1, wherein aluminum borate is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein magnesium sulfate is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein calcium silicate is used as the whisker-like inorganic filler. The chip-like electronic component according to claim 1, wherein silicon nitride is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein silicon carbide is used as the whisker-like inorganic filler. The chip-shaped electronic component according to claim 1, wherein silver is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein nickel is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein gold is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein tin is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein copper is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein platinum is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein solder is used as the conductive film. The chip-shaped electronic component according to claim 1, wherein the whisker-like inorganic filler has an average fiber diameter of 0.01 to 1 μm, an average fiber length of 1 to 100 μm, and an aspect ratio of 10 or more. The chip-shaped electronic component according to claim 2, wherein the whisker-like graphite has an average fiber diameter of 0.01 to 1 µm, an average fiber length of 1 to 100 µm, and an aspect ratio of 10 or more. The chip-shaped electronic component according to claim 1 or 2, wherein an epoxy resin having a molecular weight of 1000 to 30000 is used as the resin. The chip-shaped electronic component according to claim 1 or 2, wherein an epoxy resin that dissolves in a solvent having a boiling point of 200 ° C or higher is used as the resin. The chip-shaped electronic component according to claim 1 or 2, wherein an epoxy resin having a solvent content of 60% or more is used as the resin. The chip-shaped electronic component according to claim 1 or 2, wherein carbon having a surface area per gram of 1000 square meters or more is used as carbon. The blending ratio (volume) of the whisker-like inorganic filler in which the blending ratio (volume ratio) of the conductive particles and (non-conductive inorganic filler + epoxy resin) is 10:90 to 25:75 and the carbon and the surface are covered with the conductive film. The chip-like electronic component according to claim 1, wherein the ratio) is 1:10 to 10: 1. The blending ratio (volume ratio) of whisker-like graphite in which the blending ratio (volume ratio) of conductive particles and (non-conductive inorganic filler + epoxy resin) is 10:90 to 25:75, and the carbon and the surface are coated with a conductive film. The chip-shaped electronic component according to claim 2, wherein the ratio is set to 1:10 to 10: 1. The chip-shaped electronic component according to claim 1 or 2, wherein a mixed material obtained by adding a coupling agent to conductive particles, a nonconductive inorganic filler, and a resin is used as the mixed material. 3. The chip-shaped electronic component according to claim 1, wherein the end face electrode layer is formed by applying and curing a mixed material having a viscosity at a shear rate of 0.006 (l / s) of 1000 Pa · s or more. The chip-shaped electronic component according to claim 1 or 2, wherein a volume content of the solvent in the mixed material is 70% or more. The chip-shaped electronic component according to claim 1, wherein silica is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1 or 2, wherein kaolin is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein talc is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein zinc oxide is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1 or 2, wherein calcium carbonate is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein titanium oxide is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein barium sulfate is used as the nonconductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein aluminum hydroxide is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein aluminum oxide is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1 or 2, wherein magnesium hydroxide is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein mica is used as the non-conductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein potassium titanate is used as the nonconductive inorganic filler. The chip-shaped electronic component according to claim 1, wherein aluminum borate is used as the nonconductive inorganic filler. The chip-shaped electronic component according to claim 1 or 2, wherein an average particle diameter of the non-conductive inorganic filler is set in a range of 1 nm to 50 µm.

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