JPH04198271A - Conductive paste composition - Google Patents

Conductive paste composition

Info

Publication number
JPH04198271A
JPH04198271A JP2320650A JP32065090A JPH04198271A JP H04198271 A JPH04198271 A JP H04198271A JP 2320650 A JP2320650 A JP 2320650A JP 32065090 A JP32065090 A JP 32065090A JP H04198271 A JPH04198271 A JP H04198271A
Authority
JP
Japan
Prior art keywords
conductive
carbon
carbon black
paste
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2320650A
Other languages
Japanese (ja)
Inventor
Koji Sakawaki
坂脇 弘二
Yuji Kimoto
寄元 祐二
Keiichiro Kiba
木庭 敬一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining Co Ltd
Original Assignee
Mitsui Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining Co Ltd filed Critical Mitsui Mining Co Ltd
Priority to JP2320650A priority Critical patent/JPH04198271A/en
Publication of JPH04198271A publication Critical patent/JPH04198271A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To obtain the title composition which has good adhesiveness to various substrate and high conductivity without the necessity for the addition of any metallic filter by using specified fine flaky graphite particles or their mixture with carbon black as conductive carbon as a principal component. CONSTITUTION:A carbonaceous conductive paste for forming a conductive circuit and resistance, made by using conductive carbon and a binder resin as principal components, adding a conductive filler thereto if necessary, and mixing them with a solvent, wherein fine flaky graphite particles having a particle diameter of 1-100mum, a thickness of 1mum or less, and an aspect ratio of 10 to 5,000 or their mixture with carbon black is used as the conductive carbon. This composition has such a high conductivity as compared with conventional carbonaceous paste that it does not need the addition of any metallic filler, such as silver, good adhesiveness to various substrate, and resistance with no frequency dependence; therefore, it is useful as the material of conductor, resistor, contact, etc., on a printed wiring board (flexible wiring board), a hybrid substrate (ceramic substrate), etc.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、プリント配線基板やハイブリッド基板に用い
られる導電回路及び抵抗形成用、あるいはブラウン管帯
電防止用及び電子ビーム加速用に用いられる導電性ペー
スト組成物に関する。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a conductive paste used for forming conductive circuits and resistors used in printed wiring boards and hybrid boards, or for preventing static electricity on cathode ray tubes and accelerating electron beams. Regarding the composition.

〈従来の技術〉 従来、プリント配線基板やハイブリッド基板等における
導体回路や接点の形成あるいは抵抗素子形成用としてカ
ーボン系の導電性ペーストが用いられている。これらの
カーボン系導電性ペーストは、天然ガス、石炭や石油か
ら得られる炭化水素油などの不完全燃焼又は熱分解によ
って得られる不定形の微粉状炭素であるカーボンブラッ
クを、ポリエステル、アクリル樹脂等の熱可塑性樹脂あ
るいはフェノール樹脂、メラミン樹脂等の熱硬化樹脂を
バインダーとして溶媒と共に混合することによって製造
されている。
<Prior Art> Conventionally, carbon-based conductive pastes have been used for forming conductive circuits and contacts in printed wiring boards, hybrid boards, etc., and for forming resistive elements. These carbon-based conductive pastes combine carbon black, which is amorphous fine powder carbon obtained by incomplete combustion or thermal decomposition of hydrocarbon oils obtained from natural gas, coal, and petroleum, with polyester, acrylic resin, etc. It is manufactured by mixing a thermoplastic resin or a thermosetting resin such as a phenol resin or a melamine resin as a binder with a solvent.

これらの導電性ペーストのうち、導電回路や接点の形成
用としては、高い導電性が、また、抵抗素子形成用とし
ては使用目的に応じた抵抗率を有するものが要求される
。カーボン系ペーストの導電性は、添加するカーボンブ
ラックの種類やカーボンブラックとバインダーの混合比
率を変えることによって調整されるが、さらに導電性を
高めるためには、カーボンブラックより高い導電性を有
する銀粉等を混入する方法なども知られている。
Among these conductive pastes, those for forming conductive circuits and contacts are required to have high conductivity, and those for forming resistive elements are required to have resistivity depending on the purpose of use. The conductivity of carbon-based paste can be adjusted by changing the type of carbon black added and the mixing ratio of carbon black and binder, but in order to further increase the conductivity, it is necessary to use silver powder, etc., which has higher conductivity than carbon black. A method of mixing is also known.

抵抗素子形成用としては、カーボンブラックの配合量を
減少させればよいが、導電性フィラーの添加量が少なく
なりすぎると、導電性のばらつきの幅が大きくなり、抵
抗値を精度よくコントロールするのが難しくなるので、
導電性フィラーの添加量はあまり減少させず、カオリナ
イト、デフカイト、水酸化マグネシウム、バーミキュラ
イトなどの非導電性無機フィラーを添加する方法(特開
昭61−93506 、特開昭61−93505など)
あるいは架橋ポリスチレンビーズやベンゾグアナミン樹
脂粉末などの有機フィラーを配合する方法(vF開昭6
1−163601など)などにより導電性のコントロー
ルが行われている。
For forming resistance elements, it is possible to reduce the amount of carbon black added, but if the amount of conductive filler added is too small, the range of conductivity variation will increase, making it difficult to accurately control the resistance value. becomes difficult, so
A method of adding non-conductive inorganic fillers such as kaolinite, defkite, magnesium hydroxide, vermiculite, etc. without reducing the amount of conductive filler (Japanese Patent Application Laid-open No. 61-93506, Japanese Patent Application Laid-Open No. 61-93505, etc.)
Alternatively, a method of blending organic fillers such as cross-linked polystyrene beads or benzoguanamine resin powder (vF Kaisho 6
1-163601, etc.) to control conductivity.

〈発明が解決しようとする課題) 前記のカーボン系導電性ペーストにおいて、これを導電
回路形成用として用いる場合には、導電性を向上させる
ためカーボンブラックの量を増加させるが、この際ペー
ストの基板や基材への密着性が低下したり、ペーストの
チクソトロピー性が増して塗布、印刷が難しくなるので
、良好な密着性や流動性を保持した状態で到達できる抵
抗値はたかだか数十Ω/口程度までである。また、カー
ボンブラックに銀粉を併用すれば、数Ω/口程度の低い
抵抗値を有するペーストを得ることができるが、コスト
が高くなるとともに使用する銀がマイグレーションを起
こし易いという大きな問題がある。また、抵抗素子形成
用に使用する場合は、カーボンブラックの使用量を少な
くすると抵抗値のばらつきや不安定性が生じ、非導電性
フィラーを充填して導電性を調整した場合には、基板と
の接着性が悪くなるなどの問題点があった。
<Problems to be Solved by the Invention> When using the carbon-based conductive paste for forming a conductive circuit, the amount of carbon black is increased in order to improve the conductivity. The adhesion to the paste and substrate may deteriorate, and the thixotropic properties of the paste may increase, making coating and printing difficult. To a certain extent. Further, if silver powder is used in combination with carbon black, it is possible to obtain a paste having a low resistance value of several Ω/mouth, but there are major problems in that the cost increases and the silver used tends to migrate. In addition, when using carbon black to form a resistance element, reducing the amount of carbon black used will cause variation and instability in the resistance value, and if the conductivity is adjusted by filling with a non-conductive filler, the There were problems such as poor adhesion.

本発明の目的は、前記従来技術の問題点を解決し、銀等
の金属系フィラーを使用することなく、基板や基材に対
し優れた密着性を有し、しかも高い導電性を有する導電
性ペースト組成物及び基板や基材に対し優れた密着性を
有し、かつ、安定した抵抗値を示す導電性ペースト組成
物を提供することにある。
An object of the present invention is to solve the problems of the prior art, and to provide a conductive material that has excellent adhesion to a substrate or base material and has high conductivity without using a metal filler such as silver. An object of the present invention is to provide a conductive paste composition that has excellent adhesion to a paste composition and a substrate or base material, and exhibits a stable resistance value.

〈課題を解決するための手段) 本発明は、導電性カーボン及びバインダー樹脂を主成分
とし、必要により非導電性フィラーを添加して溶媒と混
合した導電回路及び抵抗形成用のカーボン系導電性ペー
ストにおいて、導電性カーボンとして粒子径が1〜10
0μm1厚さが1μm以下でアスペクト比がlO〜s、
 oooO葉片状黒鉛微粒子又は該葉片状黒鉛微粒子と
カーボンブラックの混合物を使用することを特徴とする
導電性ペースト組成物である。
<Means for Solving the Problems> The present invention provides a carbon-based conductive paste for forming conductive circuits and resistances, which contains conductive carbon and a binder resin as main components, and optionally contains a non-conductive filler and is mixed with a solvent. , the conductive carbon has a particle size of 1 to 10
0 μm 1 thickness is 1 μm or less, aspect ratio is lO~s,
oooO A conductive paste composition characterized by using leafy graphite fine particles or a mixture of the leafy graphite fine particles and carbon black.

本発明の導電性ペースト組成物において、導電性フィラ
ーとして添加される葉片状黒鉛微粒子は粒子径が1〜1
00μ園、厚さがlμm以下であって、かつ、アスペク
ト比が10〜s、 oooと非常に特殊な形状を有する
黒鉛微粒子である。 この葉片状黒鉛微粒子は、膨張黒
鉛から製造され、発達した黒鉛結晶構造を有しており、
電気比抵抗が約5X 10”Ω・1であり通常のカーボ
ンブラックの3〜5X10−3Ω・1より1桁低く、熱
伝導度もカーボンブラックの1.5−・ll−1・l、
 −1と比較して200 w・−1・k−1と著しく大
きいという特徴がある。このような葉片状黒鉛微粒子は
、例えば天然黒鉛を酸処理、熱処理等により膨張させて
得られる膨張黒鉛を、水系溶媒中に分散させておき超音
波を付与して破砕するなどの方法によって製造すること
ができる。この葉片状黒鉛微粒子は、天然黒鉛等の原料
黒鉛がその結晶形態を保持したまま、層間が剥離したよ
うな状態で粉末化されたもので、前記のような特殊な形
状と高い結晶性を示すものである0例えば、中国産天然
黒鉛から得られた葉片状黒鉛は、六方晶系の黒鉛結晶の
発達した、格子定数6.70人で結晶子の厚み約700
人、結晶の広がり 1,000人程度の高い結晶性を有
する葉片状黒鉛である。
In the conductive paste composition of the present invention, the leaf-shaped graphite fine particles added as a conductive filler have a particle size of 1 to 1
These are graphite fine particles having a very special shape, with a thickness of 1 μm or less and an aspect ratio of 10 to 100 μm. These flaky graphite particles are manufactured from expanded graphite and have a developed graphite crystal structure.
The electrical resistivity is approximately 5×10”Ω・1, which is an order of magnitude lower than the 3~5×10−3Ω・1 of ordinary carbon black, and the thermal conductivity is 1.5×10”Ω・1 of carbon black.
It has the characteristic that it is significantly larger than -1 at 200 w·-1·k−1. Such flaky graphite fine particles are produced by, for example, dispersing expanded graphite obtained by expanding natural graphite through acid treatment, heat treatment, etc. in an aqueous solvent, and then crushing it by applying ultrasonic waves. can do. These flaky graphite fine particles are made by powdering raw material graphite such as natural graphite in a state where the layers are separated while retaining its crystalline form, and have the special shape and high crystallinity mentioned above. For example, flaky graphite obtained from natural graphite produced in China has developed hexagonal graphite crystals, a lattice constant of 6.70, and a crystallite thickness of approximately 700 mm.
Spread of people and crystals It is flaky graphite with a high crystallinity of about 1,000 people.

本発明の導電性ペースト組成物は、例えば次のような方
法によって製造される。すなわち、前記のような特性を
有する葉片状黒鉛微粒子あるいはこの葉片状黒鉛微粒子
とファーネスブラックやアセチレンブラックとして知ら
れているカーボンブラックを組み合わせた導電性フィラ
ーをバインダーと混合し、必要により溶媒を添加して三
本ロールミル等の混練機を用いて混練し、さらに必要に
応じて溶媒を追加して粘度を調整する。また、抵抗素子
形成用ペーストとする場合には、さらにカオリン、タル
ク、シリカ、アルミナ、炭酸カルシウム等の非導電性フ
ィラーの微粉末を添加する。
The conductive paste composition of the present invention is manufactured, for example, by the following method. That is, a conductive filler that is a combination of flaky graphite fine particles having the above characteristics or a combination of these flaky graphite fine particles and carbon black known as furnace black or acetylene black is mixed with a binder, and a solvent is added if necessary. The mixture is added and kneaded using a kneader such as a three-roll mill, and if necessary, a solvent is added to adjust the viscosity. Further, in the case of making a paste for forming a resistance element, fine powder of a non-conductive filler such as kaolin, talc, silica, alumina, calcium carbonate, etc. is added.

本発明のペーストにおいて、バインダーとしては、通常
のカーボン系ペーストのバインダーとして用いられてい
るポリエステル、ポリビニルブチラール、アクリル樹脂
等の熱可塑性樹脂やエポキシ樹脂、メラミン樹脂、フェ
ノール樹脂等の熱硬化性樹脂を使用することができる。
In the paste of the present invention, as a binder, thermoplastic resins such as polyester, polyvinyl butyral, and acrylic resins, which are used as binders for ordinary carbon pastes, and thermosetting resins such as epoxy resins, melamine resins, and phenolic resins are used. can be used.

これらのバインダー成分は、通常、液状あるいは溶液の
形で使用するのがよい。
These binder components are usually preferably used in liquid or solution form.

ペーストの液状成分として用いられる溶剤としては、ト
ルエン、キシレンなどの芳香族油類、酢酸メチル、酢酸
エチル、酢酸ブチル、などのエステル類、メタノール、
エタノール、ブチルカルピトール、ブチルカルピトール
アセテート、α−テルピネオールなどのアルコール類、
ジメチルケトン、メチルエチルケトンなどのケトン類、
ジエチルエーテル、メチルプロピルエーテルなどのエー
テル類、メチルセロソルブ、エチルセロソルブなどのセ
ロソルブ類などを挙げることができ、これらの中から、
バインダーの溶解性、製品のペーストに要求される性状
、基板等に塗布あるいは印刷した際の乾燥状態等に応じ
て適宜選択し、組み合わせて使用すればよい。
Solvents used as liquid components of the paste include aromatic oils such as toluene and xylene, esters such as methyl acetate, ethyl acetate, and butyl acetate, methanol,
Alcohols such as ethanol, butylcarpitol, butylcarpitol acetate, α-terpineol,
Ketones such as dimethyl ketone and methyl ethyl ketone,
Examples include ethers such as diethyl ether and methylpropyl ether, and cellosolves such as methyl cellosolve and ethyl cellosolve.
They may be appropriately selected and used in combination depending on the solubility of the binder, the properties required for the paste of the product, the drying state when applied or printed on a substrate, etc.

本発明の導電性ペースト組成物における各成分の配合割
合は、使用する各原料の性状、得られる製品の使用目的
、要求される性状などにより異なるが、バインダー成分
100  重量部に対し導電性カーボンフィラーが10
〜250 ffi量部置部るようにするのが好ましい、
また、導電性カーボンフィラー中の葉片状黒鉛微粒子と
カーボンブラックの比率は葉片状黒鉛微粒子100  
重量部に対し900重量部までのカーボンブラックを含
んでいてもよい0葉片状黒鉛微粒子に適量のカーボンブ
ラックを配合することにより、導電性付与効果が相乗的
に向上する。
The blending ratio of each component in the conductive paste composition of the present invention varies depending on the properties of each raw material used, the purpose of use of the resulting product, the required properties, etc., but the ratio of conductive carbon filler to 100 parts by weight of the binder component is 10
Preferably, the amount of ffi is ~250 parts.
In addition, the ratio of leafy graphite fine particles and carbon black in the conductive carbon filler is 100 times the leafy graphite fine particles and carbon black.
By blending an appropriate amount of carbon black into the flaky graphite particles, which may contain up to 900 parts by weight of carbon black, the effect of imparting electrical conductivity is synergistically improved.

導電性調整のために添加する非導電性フィラーの添加量
は、バインダー100  重量部に対し80重量部以下
とする。
The amount of the non-conductive filler added to adjust the conductivity is 80 parts by weight or less per 100 parts by weight of the binder.

また、溶媒の使用量は、混練時の損失等を考慮し、最終
製品の導電性ペースト組成物中の溶媒量が約10〜50
重量%となるようにするのが好ましい。
In addition, the amount of solvent to be used is approximately 10 to 50% in the conductive paste composition of the final product, taking into account losses during kneading.
It is preferable to adjust the amount to % by weight.

本発明の導電性ペースト組成物は、ガラスエポキシ積層
板、紙フエノール樹脂積層板、アルミナ等のセラミック
ス基板、合成樹脂フィルムなど任意の基板あるいは基体
上に、塗布、展着あるいはスクリーン印刷などの印刷手
段により、任意のパターンを形成し、熱処理等の適当な
後処理により硬化させることによって導電回路や抵抗素
子を形成することができる。また、ペースト中に予め硬
化剤あるいは硬化触媒を添加しておくことによって常温
で硬化させることも可能である。
The conductive paste composition of the present invention can be applied onto any substrate or substrate such as a glass epoxy laminate, a paper phenolic resin laminate, a ceramic substrate such as alumina, or a synthetic resin film by coating, spreading, or printing methods such as screen printing. Accordingly, a conductive circuit or a resistive element can be formed by forming an arbitrary pattern and curing it by appropriate post-treatment such as heat treatment. Further, by adding a curing agent or a curing catalyst to the paste in advance, it is possible to cure the paste at room temperature.

本発明の導電性ペース)&ll成物酸物導電性フィラー
としてカーボン系材料のみを使用し、表面抵抗が10Ω
/口という低抵抗が達成され、従来のカーボン系ペース
トの10Ω/口をはるかに上回る高い導電性を有してい
る。また、バインダーと導電性フィラー及び非導電性フ
ィラーとの添加剤合を制御することにより、lO〜10
  Ω/口の範囲で導電性を任意の値に調整することが
でる。しかも、基板、基材との接着性も良好で、形成さ
れた導電回路や抵抗素子は均一かつ安定した抵抗値を示
すので、プリント配線基板やハイブリッド基板に用いら
れる導電回路や抵抗素子形成用の導電性ペースト組成物
として極めて良好な特性を有しており、さらにブラウン
管帯電防止用及び電子ビーム加速用導電性ペースト組成
物としても有用なものである。
Conductive paste of the present invention) Only carbon-based material is used as the composite oxide conductive filler, and the surface resistance is 10Ω.
A low resistance of 10Ω/mm has been achieved, and it has high conductivity far exceeding the 10Ω/mm of conventional carbon-based pastes. In addition, by controlling the additive mixture of the binder, conductive filler, and non-conductive filler, it is possible to
The conductivity can be adjusted to any value within the range of Ω/mouth. In addition, it has good adhesion to substrates and base materials, and the formed conductive circuits and resistance elements exhibit uniform and stable resistance values, making it ideal for forming conductive circuits and resistance elements used in printed wiring boards and hybrid boards. It has extremely good properties as a conductive paste composition, and is also useful as a conductive paste composition for antistatic use in cathode ray tubes and for accelerating electron beams.

〈実施例〉 以下、実施例により本発明をさらに具体的に説明する。<Example> Hereinafter, the present invention will be explained in more detail with reference to Examples.

実施例1 平均粒径2θμm、厚さ約0.1μmでアスペクト比約
200の葉片状黒鉛微粒子をボールミルで300時間処
理したちの100重量部に、バインダーとしてエポキシ
樹脂(油化シェル社製、商品名エピコート 11001
) 60重量部とメラミン樹脂(日立化成社製、商品名
メラン27) 40重量部とを混合、混練し、α−テル
ピネオール85重量%とブチル・カルピトールアセテー
ト15重量%からなる混合溶媒133重量部を加えてさ
らに混合、混練して本発明の導電性ペースト組成物を得
た。このペースト中の(導電性フィラー+バインダー樹
脂)/溶媒の比率は約1.5となっており、以下の実施
例、比較例においても全てこの比率に合せてペーストの
調整を行った。 このペーストをガラスエポキシ基板に
印刷し、150℃で30分間処理して硬化させ、表面が
2×2閣で厚さ20usの硬化塗膜を形成し、抵抗値を
測定したところ、表面抵抗は175Ω/口であった。
Example 1 Leaf-like graphite fine particles having an average particle diameter of 2θ μm, a thickness of about 0.1 μm, and an aspect ratio of about 200 were processed in a ball mill for 300 hours, and 100 parts by weight of the resultant was added with an epoxy resin (manufactured by Yuka Shell Co., Ltd.) as a binder. Product name Epicote 11001
) and 40 parts by weight of melamine resin (manufactured by Hitachi Chemical Co., Ltd., trade name Melan 27) were mixed and kneaded to obtain 133 parts by weight of a mixed solvent consisting of 85% by weight of α-terpineol and 15% by weight of butyl carpitol acetate. was further mixed and kneaded to obtain a conductive paste composition of the present invention. The ratio of (conductive filler + binder resin)/solvent in this paste was approximately 1.5, and the pastes were adjusted to this ratio in all of the following Examples and Comparative Examples. This paste was printed on a glass epoxy substrate and cured by treating it at 150℃ for 30 minutes to form a cured coating film with a thickness of 20us on the surface of 2 x 2 layers.When the resistance value was measured, the surface resistance was 175Ω. /It was a mouth.

比較例1 葉片状黒鉛微粒子の替わりに、市販の高導電性カーボン
ブラック(ファーネスブラック)を用いた他は実施例1
と同様に混合、混練を行ったところフィラーとバインダ
ーを混合した時点でパサパサの状態となり、ペーストを
得ることはできなかった。そこでカーボンブラックの使
用量を減らしていき、カーボンブラックの量を11重量
部まで減らしたところで混合可能となり、さらに溶媒を
加えて混練し、印刷可能なペーストを得ることができた
(溶媒量74重量部)、このペーストを実施例1と同様
にして基板に印刷、硬化させ、表面抵抗を測定したとこ
ろ113にΩ/口であった。
Comparative Example 1 Example 1 except that commercially available highly conductive carbon black (furnace black) was used instead of the flaky graphite fine particles.
When mixing and kneading were carried out in the same manner as above, the filler and binder became dry at the time they were mixed, and a paste could not be obtained. Therefore, we reduced the amount of carbon black used, and when we reduced the amount of carbon black to 11 parts by weight, we were able to mix it, and by adding a solvent and kneading, we were able to obtain a printable paste (solvent amount: 74 parts by weight). The paste was printed and cured on a substrate in the same manner as in Example 1, and the surface resistance was measured to be 113 Ω/mm.

実施例1と比較例Iの結果から、葉片状黒鉛のカーボン
系導電性フィラーとしての導電性付与効果は、カーボン
ブラック系に比較して著しく大きいことがわかる。
From the results of Example 1 and Comparative Example I, it can be seen that the conductivity imparting effect of flaky graphite as a carbon-based conductive filler is significantly greater than that of carbon black-based filler.

実施例2 葉片状黒鉛微粒子の使用量を43重量部、溶媒使用量を
95重量部とした他は実施例1と同様に操作して得た硬
化塗fi(2X2■、厚さ20μm)の表面抵抗は、1
,490Ω/口で、基板との接着性も良好で、抵抗値の
安定した抵抗ペーストとして有用なものであった。
Example 2 A cured coating fi (2×2■, thickness 20 μm) obtained by the same procedure as in Example 1 except that the amount of flaky graphite fine particles used was 43 parts by weight and the amount of solvent used was 95 parts by weight. The surface resistance is 1
, 490Ω/hole, and had good adhesion to the substrate, making it useful as a resistance paste with stable resistance value.

実施例3 導電性フィラーとして葉片状黒鉛微粒子100重量部の
替わりに、葉片状黒鉛微粒子60重量部と平均粒径76
■μ■の導電性カーボンブラック(旭カーボン社製、商
品名)1s500) 40重量部との混合物を使用した
他は実施例1と同様に操作して得られた硬化塗膜(2×
2閣、厚さ20μ蘭)の表面抵抗を測定したところ7Ω
/口であった。また、この塗膜は基板上によく接着して
いた。この結果から、導電性フィラーとして、葉片状黒
鉛微粒子に適量のカーボンブラックを配合すると、得ら
れるペーストの導電性が著しく向上することがわかる。
Example 3 As a conductive filler, instead of 100 parts by weight of leafy graphite fine particles, 60 parts by weight of leafy graphite fine particles and an average particle size of 76
A cured coating film (2×
When I measured the surface resistance of 2 cabinets (20μ thick), it was 7Ω.
/It was a mouth. Moreover, this coating film adhered well to the substrate. This result shows that when an appropriate amount of carbon black is added to the flaky graphite fine particles as a conductive filler, the conductivity of the resulting paste is significantly improved.

比較例2 導電性フィラーとして葉片状黒鉛微粒子100重量部の
替わりに高結晶人造黒鉛微粒子(平均粒径0.5μ閣)
194重量部を使用し、溶媒量を196重量部とした他
は実施例1と同様に操作し、硬化塗膜の表面抵抗を測定
したところ、44Ω/口であった。このものは、従来の
カーボン径フィラーを使用したものとしては、最高の部
類に属する値であり、これに比較して本発明の導電性フ
ィラーが極めてすぐれた性能を有することがわかる。
Comparative Example 2 Highly crystalline artificial graphite fine particles (average particle size 0.5 μm) were used instead of 100 parts by weight of flaky graphite fine particles as a conductive filler.
The same procedure as in Example 1 was carried out except that 194 parts by weight was used and the amount of solvent was changed to 196 parts by weight, and the surface resistance of the cured coating film was measured and found to be 44 Ω/mouth. This value belongs to the highest class among those using conventional carbon diameter fillers, and it can be seen that the conductive filler of the present invention has extremely superior performance in comparison.

実施例4 実施例1及び3で作成した硬化!!!膜の交流インピー
ダンス(横河ヒューレントバッカード社製、プレシジョ
ンLCRメーターにて測定)は、周波数10011z 
−IMllzの間で変化はなく一定であった。これに対
し、比較例1で作成した硬化塗膜の交流インピーダンス
は、10 KHz付近から低下し、I Mllzでは最
初の値の1710まで低下した6本発明の導電性ペース
ト組成物は、周波数依存性がな(、回路素子用としてす
ぐれた特性を有することがわかる。
Example 4 Curing made in Examples 1 and 3! ! ! The AC impedance of the membrane (measured with a precision LCR meter manufactured by Yokogawa Hurent-Baccard) is at a frequency of 10011z.
- IMllz, there was no change and it was constant. On the other hand, the AC impedance of the cured coating film prepared in Comparative Example 1 decreased from around 10 KHz, and decreased to the initial value of 1710 at I Mllz.6 The conductive paste composition of the present invention has frequency dependence. It can be seen that it has excellent characteristics for use in circuit elements.

〈発明の効果〉 本発明の導電性ペース)&11成物は、従来のカーボン
系ペーストに比較し高い導電性を有し、特に銀等の金属
系フィラーの添加も必要なく、また、各種の被着基板に
対する密着性が良く、かつ、抵抗の周波数依存性がなく
プリント配vA基板(フレキシブル配線基板)、ハイブ
リッド基板(セラミックス基板)などの導体、抵抗体及
び接点などの材料として有用である。また、非常に低抵
抗のしベルが達成でき、EMIシールド塗料としても利
用できる。
<Effects of the Invention> The conductive paste) & 11 composition of the present invention has higher conductivity than conventional carbon-based pastes, does not require the addition of metallic fillers such as silver, and is compatible with various coatings. It has good adhesion to the mounting substrate and has no frequency dependence of resistance, making it useful as a material for conductors, resistors, contacts, etc. of printed wiring boards (flexible wiring boards), hybrid boards (ceramic boards), etc. In addition, it is possible to achieve a shield with extremely low resistance, and it can also be used as an EMI shielding paint.

Claims (1)

【特許請求の範囲】[Claims] 1.導電性カーボン及びバインダー樹脂を主成分とし、
必要により非導電性フィラーを添加して溶媒と混合した
導電回路及び抵抗形成用のカーボン系導電性ペーストに
おいて、導電性カーボンとして粒子径が1〜100μm
、厚さが1μm以下でアスペクト比が10〜5,000
の葉片状黒鉛微粒子又は該葉片状黒鉛微粒子とカーボン
ブラックの混合物を使用することを特徴とする導電性ペ
ースト組成物。
1. Main ingredients are conductive carbon and binder resin,
In a carbon-based conductive paste for forming conductive circuits and resistances, in which a non-conductive filler is added as necessary and mixed with a solvent, the conductive carbon has a particle size of 1 to 100 μm.
, the thickness is 1 μm or less and the aspect ratio is 10 to 5,000.
A conductive paste composition characterized in that it uses leaf-like graphite fine particles or a mixture of leaf-like graphite fine particles and carbon black.
JP2320650A 1990-11-27 1990-11-27 Conductive paste composition Pending JPH04198271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2320650A JPH04198271A (en) 1990-11-27 1990-11-27 Conductive paste composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2320650A JPH04198271A (en) 1990-11-27 1990-11-27 Conductive paste composition

Publications (1)

Publication Number Publication Date
JPH04198271A true JPH04198271A (en) 1992-07-17

Family

ID=18123785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2320650A Pending JPH04198271A (en) 1990-11-27 1990-11-27 Conductive paste composition

Country Status (1)

Country Link
JP (1) JPH04198271A (en)

Cited By (15)

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WO1994022174A1 (en) * 1993-03-17 1994-09-29 Nisshin Steel Co., Ltd. Coated metal plate for positive electrode can of dry cell and positive electrode can made thereof
JPH09255900A (en) * 1996-03-21 1997-09-30 Hitachi Powdered Metals Co Ltd Thermosetting type carbon-based electroconductive coating material
EP0798748A1 (en) * 1996-03-28 1997-10-01 Lexmark International, Inc. Electrical contact material for flexible doctor blade
JP2001019891A (en) * 1999-07-07 2001-01-23 Matsushita Electric Ind Co Ltd Carbon paste
GB2363120A (en) * 2000-06-07 2001-12-12 Graftech Inc Process for providing increased conductivity to a material
US6558738B1 (en) * 1999-11-19 2003-05-06 Yazaki Corporation Circuit forming method
JP2004288957A (en) * 2003-03-24 2004-10-14 Matsushita Electric Ind Co Ltd Chip electronic component
JP2004288956A (en) * 2003-03-24 2004-10-14 Matsushita Electric Ind Co Ltd Chip electronic component
JP2005108956A (en) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd Chip-type electronic component
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JP2014201676A (en) * 2013-04-05 2014-10-27 積水化学工業株式会社 Method for producing resin composite material
WO2016088436A1 (en) * 2014-12-03 2016-06-09 日立化成株式会社 Electrically conductive resin composition for resistance-type pressure sensor, resistance-type pressure sensor, resistance-type pressure sensor array, and pressure-sensor measurement system
JP2019012630A (en) * 2017-06-30 2019-01-24 東洋インキScホールディングス株式会社 Conductive composition and method for producing conductor film
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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994022174A1 (en) * 1993-03-17 1994-09-29 Nisshin Steel Co., Ltd. Coated metal plate for positive electrode can of dry cell and positive electrode can made thereof
JPH09255900A (en) * 1996-03-21 1997-09-30 Hitachi Powdered Metals Co Ltd Thermosetting type carbon-based electroconductive coating material
EP0798748A1 (en) * 1996-03-28 1997-10-01 Lexmark International, Inc. Electrical contact material for flexible doctor blade
JP2001019891A (en) * 1999-07-07 2001-01-23 Matsushita Electric Ind Co Ltd Carbon paste
US6558738B1 (en) * 1999-11-19 2003-05-06 Yazaki Corporation Circuit forming method
GB2363120A (en) * 2000-06-07 2001-12-12 Graftech Inc Process for providing increased conductivity to a material
US6395199B1 (en) 2000-06-07 2002-05-28 Graftech Inc. Process for providing increased conductivity to a material
JP2008027919A (en) * 2000-06-21 2008-02-07 E I Du Pont De Nemours & Co Paste for manufacturing electron electric field emitter and usage thereof
US8011990B2 (en) 2000-06-21 2011-09-06 E.I. Du Pont De Nemours And Company Process for improving the emission of electron field emitters
US8070906B2 (en) 2000-06-21 2011-12-06 E. I. Du Pont De Nemours And Company Process for improving the emission of electron field emitters
US8529798B2 (en) 2000-06-21 2013-09-10 E I Du Pont De Nemours And Company Process for improving the emission of electron field emitters
JP2004288956A (en) * 2003-03-24 2004-10-14 Matsushita Electric Ind Co Ltd Chip electronic component
JP2004288957A (en) * 2003-03-24 2004-10-14 Matsushita Electric Ind Co Ltd Chip electronic component
JP2005108956A (en) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd Chip-type electronic component
JP2014201676A (en) * 2013-04-05 2014-10-27 積水化学工業株式会社 Method for producing resin composite material
WO2016088436A1 (en) * 2014-12-03 2016-06-09 日立化成株式会社 Electrically conductive resin composition for resistance-type pressure sensor, resistance-type pressure sensor, resistance-type pressure sensor array, and pressure-sensor measurement system
JP2019012630A (en) * 2017-06-30 2019-01-24 東洋インキScホールディングス株式会社 Conductive composition and method for producing conductor film
JP2019012663A (en) * 2017-06-30 2019-01-24 東洋インキScホールディングス株式会社 Conductive composition and method for producing conductor film
CN112071466A (en) * 2020-08-12 2020-12-11 江苏国瓷泓源光电科技有限公司 Silver paste suitable for spraying ceramic filter and preparation method and spraying film forming method thereof
CN112071466B (en) * 2020-08-12 2022-03-18 江苏国瓷泓源光电科技有限公司 Silver paste suitable for spraying ceramic filter and preparation method and spraying film forming method thereof

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