JP2005101529A - 半導体装置の製造方法および半導体装置 - Google Patents
半導体装置の製造方法および半導体装置 Download PDFInfo
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- JP2005101529A JP2005101529A JP2004187217A JP2004187217A JP2005101529A JP 2005101529 A JP2005101529 A JP 2005101529A JP 2004187217 A JP2004187217 A JP 2004187217A JP 2004187217 A JP2004187217 A JP 2004187217A JP 2005101529 A JP2005101529 A JP 2005101529A
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- 239000004065 semiconductor Substances 0.000 title claims description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 238000010926 purge Methods 0.000 claims abstract description 149
- 230000001590 oxidative effect Effects 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000007789 gas Substances 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 77
- 239000002994 raw material Substances 0.000 claims description 75
- 239000011261 inert gas Substances 0.000 claims description 45
- 238000007599 discharging Methods 0.000 claims description 40
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 abstract description 41
- 239000012535 impurity Substances 0.000 abstract description 39
- 230000008021 deposition Effects 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 416
- 239000010410 layer Substances 0.000 description 17
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 14
- 125000004429 atom Chemical group 0.000 description 12
- 238000000231 atomic layer deposition Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 239000000460 chlorine Substances 0.000 description 5
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 229910003855 HfAlO Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- -1 Pr 2 O 3 Inorganic materials 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 2
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NPEOKFBCHNGLJD-UHFFFAOYSA-N ethyl(methyl)azanide;hafnium(4+) Chemical compound [Hf+4].CC[N-]C.CC[N-]C.CC[N-]C.CC[N-]C NPEOKFBCHNGLJD-UHFFFAOYSA-N 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910004129 HfSiO Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/3141—Deposition using atomic layer deposition techniques [ALD]
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- H01L21/31604—Deposition from a gas or vapour
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- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31645—Deposition of Hafnium oxides, e.g. HfO2
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- H01L28/56—Capacitors with a dielectric comprising a perovskite structure material the dielectric comprising two or more layers, e.g. comprising buffer layers, seed layers, gradient layers
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Abstract
【解決手段】 下層基板に、第1の絶縁膜を形成し、第1の絶縁膜上に、第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する。その後、第2の絶縁膜上に、ゲート電極を形成する。ここで、第2の絶縁膜形成の際、成膜装置内への第2の絶縁膜の成膜原料の供給、成膜装置内に供給された前記成膜原料のパージ、成膜原料を酸化させる酸化剤の供給、酸化剤をパージ、還元ガスプラズマの発生により生成した活性種の供給、過剰の活性種をパージの6工程からなるサイクルを繰り返し行う。
【選択図】 図2
Description
本実施の形態における半導体装置の製造方法は、半導体基板の上に第1の絶縁膜を形成する工程と、この第1の絶縁膜の上に、第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、この第2の絶縁膜の上にゲート電極を形成する工程とを備える。
以下、図1〜図8を参照して、この発明の実施の形態1におけるトランジスタの製造方法について説明する。
本実施の形態は、実施の形態1における第1の工程から第6の工程までをn(nは10以下の整数)回繰り返した後に、第2の絶縁膜が所定の膜厚に達するまで、第1の工程から第4の工程までをさらに繰り返して行うことを特徴とする。
実施の形態2におけるトランジスタは、構造上は、実施の形態1において説明したトランジスタと同様のものである。
その他は、実施の形態1と同様であるから説明を省略する。
本実施の形態における半導体装置の製造方法は、半導体基板の上に第1の絶縁膜を形成する工程と、この第1の絶縁膜の上に、2種類以上の絶縁膜の混合膜からなり、この2種類以上の絶縁膜のうちいずれか1種類が第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、第2の絶縁膜の上にゲート電極を形成する工程とを備える。
実施の形態3におけるトランジスタは、実施の形態1において説明したトランジスタとほぼ同様である。しかし、実施の形態1においては、第2のゲート絶縁膜8として、HfO2膜を用いているが、実施の形態3において、第2のゲート絶縁膜8は、HfO2膜と、Al2O3膜の混合膜で構成されている。
その後、再び、第1の成膜原料供給(ステップS302)に戻る。
その後、実施の形態1に説明したのと同様の方法により、ゲート電極10、SDエクステンション14、サイドウォール12、ソース/ドレイン16の形成等(ステップS122〜S132)を行うことにより、実施の形態3におけるトランジスタを得ることができる。
その他は、実施の形態1、2と同様であるから説明を省略する。
また、例えば、実施の形態3において、HfO2膜とAl2O3膜との混合膜が、この発明の2種以上の絶縁膜の混合膜に該当する。
1 Si基板
2 拡散層
4 素子分離領域
6 第1のゲート絶縁膜
8 第2のゲート絶縁膜
10 ゲート電極
12 サイドウォール
14 SDエクステンション
16 ソース/ドレイン
20 層間絶縁膜
22 コンタクトプラグ
24 配線層
30 成膜原料
Claims (9)
- 半導体基板の上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜の上に、前記第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、
前記第2の絶縁膜の上にゲート電極を形成する工程とを備え、
前記第2の絶縁膜を形成する工程は、成膜装置内に原料ガスを供給して、前記第1の絶縁膜の表面に原料を吸着させる第1の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記原料ガスを排出する第2の工程と、
前記成膜装置内に酸化性ガスを供給して、前記第1の絶縁膜の表面に吸着した前記原料を酸化する第3の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記酸化性ガスを排出する第4の工程と、
前記成膜装置内に還元ガスプラズマを発生させることにより生成した活性種を前記第1の絶縁膜の表面に吸着している前記原料の未酸化部分と反応させる第5の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記活性種を排出する第6の工程とを有し、
前記第1の工程から前記第6の工程までを繰り返し行うことを特徴とする半導体装置の製造方法。 - 前記第1の工程から前記第6の工程までを行った後に、前記第3の工程から前記第6の工程までをさらにn(nは10以下の整数)回繰り返して行い、これを1サイクルとして、前記第2の絶縁膜が所定の膜厚に達するまで前記サイクルを繰り返す請求項1に記載の半導体装置の製造方法。
- 前記第1の工程から前記第6の工程までを行った後に、前記第5の工程から前記第6の工程までをさらにn(nは10以下の整数)回繰り返して行い、これを1サイクルとして、前記第2の絶縁膜が所定の膜厚に達するまで前記サイクルを繰り返す請求項1に記載の半導体装置の製造方法。
- 半導体基板の上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜の上に、前記第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、
前記第2の絶縁膜の上にゲート電極を形成する工程とを備え、
前記第2の絶縁膜を形成する工程は、成膜装置内に原料ガスを供給して、前記第1の絶縁膜の表面に原料を吸着させる第1の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記原料ガスを排出する第2の工程と、
前記成膜装置内に酸化性ガスを供給して、前記第1の絶縁膜の表面に吸着した前記原料を酸化する第3の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記酸化性ガスを排出する第4の工程と、
前記成膜装置内に還元ガスプラズマを発生させることにより生成した活性種を前記第1の絶縁膜の表面に吸着している前記原料の未酸化部分と反応させる第5の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記活性種を排出する第6の工程とを有し、
前記第1の工程から前記第6の工程までをn(nは10以下の整数)回繰り返した後に、前記第2の絶縁膜が所定の膜厚に達するまで、前記第1の工程から前記第4の工程までをさらに繰り返して行うことを特徴とする半導体装置の製造方法。 - 前記第1の工程から前記第6の工程までを行った後に、前記第3の工程から前記第6の工程までをさらにn´(n´は10以下の整数)回繰り返して行い、これを1サイクルとして該サイクルをn回繰り返した後に、前記第1の工程から前記第4の工程までを繰り返して行う請求項4に記載の半導体装置の製造方法。
- 前記第1の工程から前記第6の工程までを行った後に、前記第5の工程から前記第6の工程までをさらにn´(n´は10以下の整数)回繰り返して行い、これを1サイクルとして該サイクルをn回繰り返した後に、前記第1の工程から前記第4の工程までを繰り返して行う請求項4に記載の半導体装置の製造方法。
- 半導体基板の上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜の上に、2種類以上の絶縁膜の混合膜からなり、該2種類以上の絶縁膜のうちいずれか1種類が前記第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、
前記第2の絶縁膜の上にゲート電極を形成する工程とを備え、
前記第2の絶縁膜を形成する工程は、成膜装置内に第1の原料ガスを供給して、前記第1の絶縁膜の表面に第1の原料を吸着させる第1の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の原料ガスを排出する第2の工程と、
前記成膜装置内に第1の酸化性ガスを供給して、前記第1の絶縁膜の表面に吸着した前記第1の原料を酸化する第3の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の酸化性ガスを排出する第4の工程と、
前記成膜装置内に第1の還元ガスプラズマを発生させることにより生成した第1の活性種を前記第1の絶縁膜の表面に吸着している前記第1の原料の未酸化部分と反応させる第5の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の活性種を排出する第6の工程と、
前記成膜装置内に第2の原料ガスを供給して、酸化された前記第1の原料の表面に第2の原料を吸着させる第7の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の原料ガスを排出する第8の工程と、
前記成膜装置内に第2の酸化性ガスを供給して、前記第1の原料の表面に吸着した前記第2の原料を酸化する第9の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の酸化性ガスを排出する第10の工程と、
前記成膜装置内に第2の還元ガスプラズマを発生させることにより生成した第2の活性種を前記第1の原料の表面に吸着している前記第2の原料の未酸化部分と反応させる第11の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の活性種を排出する第12の工程とを有し、
前記第1の工程から前記第12の工程までを繰り返し行うことを特徴とする半導体装置の製造方法。 - 半導体基板の上に第1の絶縁膜を形成する工程と、
前記第1の絶縁膜の上に、2種類以上の絶縁膜の混合膜からなり、該2種類以上の絶縁膜のうちいずれか1種類が前記第1の絶縁膜より比誘電率の高い第2の絶縁膜を形成する工程と、
前記第2の絶縁膜の上にゲート電極を形成する工程とを備え、
前記第2の絶縁膜を形成する工程は、成膜装置内に第1の原料ガスを供給して、前記第1の絶縁膜の表面に第1の原料を吸着させる第1の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の原料ガスを排出する第2の工程と、
前記成膜装置内に第1の酸化性ガスを供給して、前記第1の絶縁膜の表面に吸着した前記第1の原料を酸化する第3の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の酸化性ガスを排出する第4の工程と、
前記成膜装置内に第1の還元ガスプラズマを発生させることにより生成した第1の活性種を前記第1の絶縁膜の表面に吸着している前記第1の原料の未酸化部分と反応させる第5の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第1の活性種を排出する第6の工程と、
前記成膜装置内に第2の原料ガスを供給して、酸化された前記第1の原料の表面に第2の原料を吸着させる第7の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の原料ガスを排出する第8の工程と、
前記成膜装置内に第2の酸化性ガスを供給して、前記第1の原料の表面に吸着した前記第2の原料を酸化する第9の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の酸化性ガスを排出する第10の工程と、
前記成膜装置内に第2の還元ガスプラズマを発生させることにより生成した第2の活性種を前記第1の原料の表面に吸着している前記第2の原料の未酸化部分と反応させる第11の工程と、
前記成膜装置内を不活性ガスでパージして、過剰の前記第2の活性種を排出する第12の工程とを有し、
前記第1の工程から前記第6の工程までを繰り返して行った後に、前記第7の工程から前記第12の工程までをさらに繰り返して行うことを特徴とする半導体装置の製造方法。 - 半導体基板上に形成された第1の絶縁膜と、
前記第1の絶縁膜上に形成されて、前記第1の絶縁膜より比誘電率の高い第2の絶縁膜と、
前記第2の絶縁膜上に形成されたゲート電極と、
前記ゲート電極の側壁部に形成された第3の絶縁膜と、
前記半導体基板に形成されたソース・ドレイン拡散層とを有し、
前記第2の絶縁膜に含まれる炭素の濃度は、前記第2の絶縁膜に含まれる窒素の濃度より低いことを特徴とする半導体装置。
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