JP2005072446A5 - - Google Patents

Download PDF

Info

Publication number
JP2005072446A5
JP2005072446A5 JP2003302815A JP2003302815A JP2005072446A5 JP 2005072446 A5 JP2005072446 A5 JP 2005072446A5 JP 2003302815 A JP2003302815 A JP 2003302815A JP 2003302815 A JP2003302815 A JP 2003302815A JP 2005072446 A5 JP2005072446 A5 JP 2005072446A5
Authority
JP
Japan
Prior art keywords
plasma
chamber
gas
organic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003302815A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005072446A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003302815A priority Critical patent/JP2005072446A/ja
Priority claimed from JP2003302815A external-priority patent/JP2005072446A/ja
Priority to TW093119536A priority patent/TWI246712B/zh
Priority to US10/926,262 priority patent/US20050045275A1/en
Priority to CNB2004100579769A priority patent/CN100348077C/zh
Publication of JP2005072446A publication Critical patent/JP2005072446A/ja
Publication of JP2005072446A5 publication Critical patent/JP2005072446A5/ja
Pending legal-status Critical Current

Links

JP2003302815A 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置 Pending JP2005072446A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003302815A JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置
TW093119536A TWI246712B (en) 2003-08-27 2004-06-30 Plasma treatment device and substrate surface treatment device
US10/926,262 US20050045275A1 (en) 2003-08-27 2004-08-25 Plasma treatment apparatus and surface treatment apparatus of substrate
CNB2004100579769A CN100348077C (zh) 2003-08-27 2004-08-27 等离子处理装置与基板表面处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302815A JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置

Publications (2)

Publication Number Publication Date
JP2005072446A JP2005072446A (ja) 2005-03-17
JP2005072446A5 true JP2005072446A5 (enExample) 2006-03-30

Family

ID=34213973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003302815A Pending JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置

Country Status (4)

Country Link
US (1) US20050045275A1 (enExample)
JP (1) JP2005072446A (enExample)
CN (1) CN100348077C (enExample)
TW (1) TWI246712B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100724571B1 (ko) 2006-02-13 2007-06-04 삼성전자주식회사 인시투 클리닝 기능을 갖는 플라즈마 처리장치 및 그사용방법
JP4884320B2 (ja) * 2007-06-29 2012-02-29 京セラ株式会社 画像表示装置
US7699935B2 (en) 2008-06-19 2010-04-20 Applied Materials, Inc. Method and system for supplying a cleaning gas into a process chamber
CN112349854A (zh) * 2019-12-25 2021-02-09 广东聚华印刷显示技术有限公司 显示器件及其制备方法和显示面板
CN120001727B (zh) * 2025-01-17 2025-07-22 国测量子科技(浙江)有限公司 一种等离子体发生容器的清洗系统和清洗方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3310171B2 (ja) * 1996-07-17 2002-07-29 松下電器産業株式会社 プラズマ処理装置
US6706334B1 (en) * 1997-06-04 2004-03-16 Tokyo Electron Limited Processing method and apparatus for removing oxide film
US6230651B1 (en) * 1998-12-30 2001-05-15 Lam Research Corporation Gas injection system for plasma processing
US6287643B1 (en) * 1999-09-30 2001-09-11 Novellus Systems, Inc. Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor
KR20010062209A (ko) * 1999-12-10 2001-07-07 히가시 데쓰로 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치
US6299692B1 (en) * 2000-07-21 2001-10-09 Applied Materials, Inc. Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition
DE10115241A1 (de) * 2001-03-28 2002-10-24 Aurion Anlagentechnik Gmbh Vorrichtung und Verfahren zur atmosphärischen Plasmabehandlung
JP2003115474A (ja) * 2001-10-03 2003-04-18 Ebara Corp 基板処理装置及び方法
KR100446619B1 (ko) * 2001-12-14 2004-09-04 삼성전자주식회사 유도 결합 플라즈마 장치

Similar Documents

Publication Publication Date Title
TW200741027A (en) Method and apparatus for growing plasma atomic layer
US7842356B2 (en) Substrate processing methods
WO2005097484A1 (ja) 透明導電性フィルム、透明導電性フィルムの製造方法及び有機エレクトロルミネッセンス素子
JP2011506758A5 (enExample)
KR20140002539A (ko) 성막 방법, 성막 장치 및 기억 매체
TW200608447A (en) Method for manufacturing a quantum-dot element
US20200150526A1 (en) Method for making microstructures and photolithography mask plate
JP2003173871A (ja) 有機電界発光素子の製造装置
US20190048469A1 (en) Vapor deposition apparatus and method of manufacturing organic light-emitting display apparatus
WO2005038873A3 (en) System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing
US11947255B2 (en) Method for making photolithography mask plate
EP1638377A4 (en) PLASMA GENERATING ELECTRODE, PLASMA PRODUCTION DEVICE AND CLEANING DEVICE FOR EXHAUST GASES
TW201806750A (zh) 積層膜及其製造方法、以及積層膜的分析方法
JP2005072446A5 (enExample)
US10372031B2 (en) Method for making microstructures
CN1961095A (zh) 用以沉积低温无机膜层至大型塑胶基板上的方法及其设备
JP2002246381A5 (enExample)
CN1210764C (zh) Cvd方法
CN1912179A (zh) 制膜装置、制膜方法、图案化方法、光学装置的制造方法
JPS6039832A (ja) プラズマ処理装置
CN106935530B (zh) 一种等离子体刻蚀光刻胶装置
JP2008098128A (ja) 大気圧プラズマ発生照射装置
CN100348077C (zh) 等离子处理装置与基板表面处理装置
JP2001185491A (ja) 雛壇形シャワーヘッド、及びそのシャワーヘッドを用いた真空処理装置
US11747730B2 (en) Method for making photolithography mask plate