JP2005072446A - プラズマ処理装置及び基板の表面処理装置 - Google Patents

プラズマ処理装置及び基板の表面処理装置 Download PDF

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Publication number
JP2005072446A
JP2005072446A JP2003302815A JP2003302815A JP2005072446A JP 2005072446 A JP2005072446 A JP 2005072446A JP 2003302815 A JP2003302815 A JP 2003302815A JP 2003302815 A JP2003302815 A JP 2003302815A JP 2005072446 A JP2005072446 A JP 2005072446A
Authority
JP
Japan
Prior art keywords
plasma
substrate
chamber
decompression chamber
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003302815A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005072446A5 (enExample
Inventor
Koji Murayama
浩二 村山
Hiroki Fujimoto
浩樹 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Chi Mei Optoelectronics Corp
Original Assignee
Kyocera Corp
Chi Mei Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, Chi Mei Electronics Corp filed Critical Kyocera Corp
Priority to JP2003302815A priority Critical patent/JP2005072446A/ja
Priority to TW093119536A priority patent/TWI246712B/zh
Priority to US10/926,262 priority patent/US20050045275A1/en
Priority to CNB2004100579769A priority patent/CN100348077C/zh
Publication of JP2005072446A publication Critical patent/JP2005072446A/ja
Publication of JP2005072446A5 publication Critical patent/JP2005072446A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80518—Reflective anodes, e.g. ITO combined with thick metallic layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Plasma Technology (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2003302815A 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置 Pending JP2005072446A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003302815A JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置
TW093119536A TWI246712B (en) 2003-08-27 2004-06-30 Plasma treatment device and substrate surface treatment device
US10/926,262 US20050045275A1 (en) 2003-08-27 2004-08-25 Plasma treatment apparatus and surface treatment apparatus of substrate
CNB2004100579769A CN100348077C (zh) 2003-08-27 2004-08-27 等离子处理装置与基板表面处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302815A JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置

Publications (2)

Publication Number Publication Date
JP2005072446A true JP2005072446A (ja) 2005-03-17
JP2005072446A5 JP2005072446A5 (enExample) 2006-03-30

Family

ID=34213973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003302815A Pending JP2005072446A (ja) 2003-08-27 2003-08-27 プラズマ処理装置及び基板の表面処理装置

Country Status (4)

Country Link
US (1) US20050045275A1 (enExample)
JP (1) JP2005072446A (enExample)
CN (1) CN100348077C (enExample)
TW (1) TWI246712B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100724571B1 (ko) 2006-02-13 2007-06-04 삼성전자주식회사 인시투 클리닝 기능을 갖는 플라즈마 처리장치 및 그사용방법
JP2009010258A (ja) * 2007-06-29 2009-01-15 Kyocera Corp 画像表示装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7699935B2 (en) 2008-06-19 2010-04-20 Applied Materials, Inc. Method and system for supplying a cleaning gas into a process chamber
CN112349854A (zh) * 2019-12-25 2021-02-09 广东聚华印刷显示技术有限公司 显示器件及其制备方法和显示面板
CN120001727B (zh) * 2025-01-17 2025-07-22 国测量子科技(浙江)有限公司 一种等离子体发生容器的清洗系统和清洗方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3310171B2 (ja) * 1996-07-17 2002-07-29 松下電器産業株式会社 プラズマ処理装置
US6706334B1 (en) * 1997-06-04 2004-03-16 Tokyo Electron Limited Processing method and apparatus for removing oxide film
US6230651B1 (en) * 1998-12-30 2001-05-15 Lam Research Corporation Gas injection system for plasma processing
US6287643B1 (en) * 1999-09-30 2001-09-11 Novellus Systems, Inc. Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor
KR20010062209A (ko) * 1999-12-10 2001-07-07 히가시 데쓰로 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치
US6299692B1 (en) * 2000-07-21 2001-10-09 Applied Materials, Inc. Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition
DE10115241A1 (de) * 2001-03-28 2002-10-24 Aurion Anlagentechnik Gmbh Vorrichtung und Verfahren zur atmosphärischen Plasmabehandlung
JP2003115474A (ja) * 2001-10-03 2003-04-18 Ebara Corp 基板処理装置及び方法
KR100446619B1 (ko) * 2001-12-14 2004-09-04 삼성전자주식회사 유도 결합 플라즈마 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100724571B1 (ko) 2006-02-13 2007-06-04 삼성전자주식회사 인시투 클리닝 기능을 갖는 플라즈마 처리장치 및 그사용방법
JP2009010258A (ja) * 2007-06-29 2009-01-15 Kyocera Corp 画像表示装置

Also Published As

Publication number Publication date
TW200509189A (en) 2005-03-01
TWI246712B (en) 2006-01-01
US20050045275A1 (en) 2005-03-03
CN1638598A (zh) 2005-07-13
CN100348077C (zh) 2007-11-07

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