JP2005057297A - ディスク状の物体用の保持装置 - Google Patents
ディスク状の物体用の保持装置 Download PDFInfo
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- JP2005057297A JP2005057297A JP2004232027A JP2004232027A JP2005057297A JP 2005057297 A JP2005057297 A JP 2005057297A JP 2004232027 A JP2004232027 A JP 2004232027A JP 2004232027 A JP2004232027 A JP 2004232027A JP 2005057297 A JP2005057297 A JP 2005057297A
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- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims description 79
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 description 15
- 238000007906 compression Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/12—Chucks or sockets with fluid-pressure actuator
- Y10T279/1274—Radially reciprocating jaws
- Y10T279/1291—Fluid pressure moves jaws via mechanical connection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/18—Pivoted jaw
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
- Y10T279/1961—Lever actuated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/19—Radially reciprocating jaws
- Y10T279/1961—Lever actuated
- Y10T279/1966—Internal cone
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/33—Member applies axial force component
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】少なくとも1つの開口機構(100)及び少なくとも1つの事前緊張要素(12)は、中央の保持アーム取付手段(2)及び/又は保持アーム(7)に組み込まれている。
【選択図】 図2
Description
開口機構が、保持アームに沿って可動でありかつスイベルジョイントと結合されている少なくとも1つのプッシュロッドを、有することは好ましい。
2 中央の保持アーム取付手段
3 支持面
4 グリッパフィンガ
5 真空パイプ
6 シールドディスク
7 保持アーム
8 ハウジング
9 旋回軸
10 連結要素
10a 旋回点
10b 旋回点
11 ラジアルピストン
12 圧縮ばね
13 ブシュ
14 真空供給手段
15 支持要素
16 ウエハ
17 プッシュロッド
18 プッシュロッド
19 リニアガイド
20 保磁子
21 磁気コイル
22 本体
23 開口部
24 ハブ
41 第1の脚部
42 第2の脚部
43 接触面
44 弾性の部分
45 ローラ
46 剛性の部分
70 フレーム要素
71 開口部
100 開口機構
Claims (20)
- 物体用の支持面及び旋回自在なグリッパフィンガを有する、少なくとも2つの、中央で取着された保持アームを具備し、前記グリッパフィンガは旋回軸を中心として保持位置から開き位置へ及びその逆に旋回されることができ、夫々、保持位置で、少なくとも1つの事前緊張要素によって事前に緊張されており、少なくとも1つの開口機構によって作動される、ディスク状の物体、特にウエハ用の保持装置において、
前記少なくとも1つの開口機構(100)及び前記少なくとも1つの事前緊張要素(12)は、前記中央の保持アーム取付手段(2)及び/又は前記保持アーム(7)に組み込まれていることを特徴とする保持装置。 - 1つ又は複数の開口機構(100)が磁気的に作動されることを特徴とする請求項1に記載の保持装置。
- 1つ又は複数の開口機構(100)が圧縮空気で作動されることを特徴とする請求項1に記載の保持装置。
- 1つ又は複数の開口機構(100)が真空で作動されることを特徴とする請求項1に記載の保持装置。
- 前記グリッパフィンガ(4)は、該グリッパフィンガ(4)が保持位置でディスク面に対し垂直方向に前記物体(16)に作用するように、旋回自在に取り付けられていることを特徴とする請求項1乃至4のいずれか1に記載の保持装置。
- 前記グリッパフィンガ(4)は第1の脚部(41)及び第2の脚部(42)を有し、前記第1の脚部(41)には、前記物体を把持するための接触面(43)が設けられていることを特徴とする請求項1乃至5のいずれか1に記載の保持装置。
- 前記接触面(43)は前記保持アーム(7)から離れた方向に向いていること、及び前記旋回軸(9)は前記グリッパフィンガ(4)の前記2つの脚部(41,42)の結合領域に設けられていることを特徴とする請求項6に記載の保持装置。
- 前記旋回軸(9)は前記支持面(3)によって形成されている面に位置していることを特徴とする請求項1乃至7のいずれか1に記載の保持装置。
- 前記グリッパフィンガ(4)は、各々のグリッパフィンガ(4)が保持位置で実質的に上から圧力を前記物体(16)に加えるように、形成されていることを特徴とする請求項1乃至8のいずれか1に記載の保持装置。
- 前記グリッパフィンガ(4)は、前記旋回軸(9)によって、前記保持アーム(7)の最も外側の端部に設けられていることを特徴とする請求項1乃至9のいずれか1に記載の保持装置。
- 前記開口機構(100)は、前記保持アーム(7)に沿って可動でありかつスイベルジョイントと結合されている少なくとも1つのプッシュロッドを有することを特徴とする請求項1乃至10のいずれか1に記載の保持装置。
- 前記スイベルジョイントは前記グリッパフィンガ(4)の前記第2の脚部(42)の自由端に関節式に結合されている連結要素(10)であることを特徴とする請求項11に記載の保持装置。
- 前記接触面は前記保持アームへ向いていること、及び前記旋回軸(9)は前記第2の脚部(42)に設けられていることを特徴とする請求項1乃至6のいずれか1に記載の保持装置。
- 前記旋回軸(9)は前記脚部の中央と前記第2の脚部(42)の内端との間の領域に設けられていることを特徴とする請求項13に記載の保持装置。
- 前記第2の脚部(42)の部分(44)は、前記旋回軸(9)と前記第1の脚部(41)との間で弾性的に形成されていることを特徴とする請求項13又は14に記載の保持装置。
- 前記第1の脚部(41)は傾斜した接触面(43)を有するピンであることを特徴とする請求項13乃至15のいずれか1に記載の保持装置。
- 前記保持アーム(7)は前記物体の上方に設けられていることを特徴とする請求項13乃至16のいずれか1に記載の保持装置。
- 前記物体と前記保持アーム(7)との間にはシールドディスク(6)が設けられていることを特徴とする請求項1乃至17のいずれか1に記載の保持装置。
- 前記シールドディスク(6)の直径は前記物体の直径の1/3よりも小さいかそれと等しいことを特徴とする請求項1乃至18のいずれか1に記載の保持装置。
- 前記少なくとも1つの開口機構(100)及び/又は前記少なくとも1つの事前緊張要素(12)は前記中央の保持アーム取付手段(2)及び/又は前記保持アーム(7)に封入されていることを特徴とする請求項1乃至19のいずれか1に記載の保持装置。
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Application Number | Priority Date | Filing Date | Title |
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DE10336205 | 2003-08-07 |
Publications (2)
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JP2005057297A true JP2005057297A (ja) | 2005-03-03 |
JP4401894B2 JP4401894B2 (ja) | 2010-01-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004232027A Expired - Lifetime JP4401894B2 (ja) | 2003-08-07 | 2004-08-09 | ディスク状の物体用の保持装置 |
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Country | Link |
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US (1) | US7284760B2 (ja) |
JP (1) | JP4401894B2 (ja) |
DE (1) | DE102004036435B4 (ja) |
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2004
- 2004-07-27 DE DE102004036435A patent/DE102004036435B4/de not_active Expired - Lifetime
- 2004-08-06 US US10/913,891 patent/US7284760B2/en active Active
- 2004-08-09 JP JP2004232027A patent/JP4401894B2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006312225A (ja) * | 2005-05-09 | 2006-11-16 | Tatsumo Kk | 基板把持機構 |
CN106356326A (zh) * | 2015-07-17 | 2017-01-25 | 沈阳芯源微电子设备有限公司 | 一种掩膜板夹持机构 |
JP2020520105A (ja) * | 2017-05-12 | 2020-07-02 | ケーエルエー コーポレイション | 浮遊式ウェハチャック |
JP7014817B2 (ja) | 2017-05-12 | 2022-02-01 | ケーエルエー コーポレイション | 浮遊式ウェハチャック |
Also Published As
Publication number | Publication date |
---|---|
JP4401894B2 (ja) | 2010-01-20 |
US7284760B2 (en) | 2007-10-23 |
DE102004036435B4 (de) | 2007-08-30 |
DE102004036435A1 (de) | 2005-03-03 |
US20050031497A1 (en) | 2005-02-10 |
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