JP2005039242A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2005039242A JP2005039242A JP2004186041A JP2004186041A JP2005039242A JP 2005039242 A JP2005039242 A JP 2005039242A JP 2004186041 A JP2004186041 A JP 2004186041A JP 2004186041 A JP2004186041 A JP 2004186041A JP 2005039242 A JP2005039242 A JP 2005039242A
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Abstract
【解決手段】 配線基板1に一面側を接合して電気的に接続される複数の半導体素子9〜12と、これら複数の半導体素子9〜12の他面側に一端部側が接合するとともに、他端部側を配線基板1に接合して両者を電気的に接続する複数の金属板5〜8と、これら金属板5〜8の半導体素子9〜12と接合する面と反対側の面が外部に露出するように金属板5〜8を封止して一体化する熱可塑性樹脂3と、この熱可塑性樹脂3の外周部、及び半導体素子9〜12を封止する熱硬化性樹脂2とを具備する。
【選択図】 図1
Description
図8は半導体装置を示す平面図で、図9は図8中のC―C′線に沿って示す断面図である。
図1(a)は本発明の一実施の形態である半導体装置を示す平面図で、図1(b)は図1(a)中A−A′線に沿って示す断面図である。
なお、上記した第1の実施の形態で示した部分と同一部分については、同一番号を付してその説明を省略する。
図3〜図6に示す工程は、それぞれ種類の異なる3個の半導体素子32をモジュール化するときの例を示すものである。
まず、図3(a)に示すように、複数の金属板(放熱部材)34を形成した金属フレーム37を図3(b)に示すように、デプレスして金属板34に傾斜部34aを形成する。金属フレーム37には厚さが200μmの銅が使用されている。
最後に熱硬化性樹脂43を硬化させるため、図6(j)に示すように半導体装置をオーブンに入れる。熱硬化性樹脂43の硬化条件は、150℃で90分程度である。樹脂の封止は、半導体装置を金型に入れ、モールド材を充填してもよい。
Claims (9)
- 配線基板に一面側を接合して電気的に接続される複数の半導体素子と、
これら複数の半導体素子の他面側に一端部側が接合するとともに、他端部側を前記配線基板に接合して両者を電気的に接続する複数の放熱部材と、
これら放熱部材の前記半導体素子と接合する面と反対側の面が外部に露出するように前記複数の放熱部材を封止して一体化する第1の封止材と、
この第1の封止材の外周部、及び前記半導体素子を封止する第2の封止材と
を具備することを特徴とする半導体装置。 - 前記第1の封止材は熱可塑性樹脂で、前記第2の封止材は熱硬化性樹脂であることを特徴とする請求項1記載の半導体装置。
- 複数の放熱部材をその一端部側が露出するように第1の封止材で封止して一体化しキャップを形成する工程と、
この工程により一体化された前記複数の放熱部材の一端部側にそれぞれ半導体素子をマウントする工程と、
この工程によりマウントされた前記半導体素子及び前記放熱部材の他端部側を配線基板に接合する工程と、
この工程によって前記配線基板に接合された前記半導体素子、及び前記第1の封止材の外周部を第2の封止材によって封止する工程と
を具備することを特徴とする半導体装置の製造方法。 - 前記複数の放熱部材は、一枚の金属フレームに形成されて供給され、前記第1の封止材により封止されて前記半導体素子をマウントしたのち、前記金属フレームからカットされることを特徴とする請求項3記載の半導体装置の製造方法。
- 前記放熱部材に最初に搭載する半導体素子は、前記放熱部材を認識することにより位置合わせを行ってマウントし、その後の半導体素子の搭載は、既にマウントされた半導体素子を認識することにより位置合せすることを特徴とする請求項3記載の半導体装置の製造方法。
- 前記キャップは前記放熱部材にマウントされた半導体素子の位置確認に基づいて前記配線基板に対する位置決めを行うことを特徴とする請求項3記載の半導体装置の製造方法。
- 前記放熱部材の一端部と前記半導体素子とは第1の接合材により接合し、前記放熱部材の他端部と前記配線基板、及び前記半導体素子と前記配線基板とはそれぞれ第2の接合材により接合し、前記第2の接合材の融点は前記第1の接合材の融点よりも低いことを特徴とする請求項3記載の半導体装置の製造方法。
- 前記キャップは加熱により前記配線基板に接合し、その加熱時におけるピーク温度は、前記第1の接合材の融点よりも低いことを特徴とする請求項7記載の半導体装置の製造方法。
- 前記第2の封止材は、前記配線基板に設けられた少なくとも1つの供給穴から供給して充填、もしくは、前記キャップに設けた少なくとも1つの供給穴から供給して充填することを特徴とする請求項7記載の半導体装置の製造方法。
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JP2012235014A (ja) * | 2011-05-06 | 2012-11-29 | Toyota Motor Corp | 半導体装置の製造方法 |
JP2013069942A (ja) * | 2011-09-24 | 2013-04-18 | Denso Corp | 半導体装置及びその製造方法 |
JP2021034710A (ja) * | 2019-08-14 | 2021-03-01 | 朋程科技股▲ふん▼有限公司 | パワー・デバイス用のパッケージ構造 |
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JP7247053B2 (ja) * | 2019-08-02 | 2023-03-28 | 株式会社東芝 | 半導体装置 |
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