FR2856517B1 - Procede de fabrication de composant semi-conducteur et composant semi-conducteur - Google Patents

Procede de fabrication de composant semi-conducteur et composant semi-conducteur

Info

Publication number
FR2856517B1
FR2856517B1 FR0307250A FR0307250A FR2856517B1 FR 2856517 B1 FR2856517 B1 FR 2856517B1 FR 0307250 A FR0307250 A FR 0307250A FR 0307250 A FR0307250 A FR 0307250A FR 2856517 B1 FR2856517 B1 FR 2856517B1
Authority
FR
France
Prior art keywords
semiconductor component
manufacturing
manufacturing semiconductor
component
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0307250A
Other languages
English (en)
Other versions
FR2856517A1 (fr
Inventor
Jerome Teysseyre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0307250A priority Critical patent/FR2856517B1/fr
Priority to US10/867,382 priority patent/US7005322B2/en
Publication of FR2856517A1 publication Critical patent/FR2856517A1/fr
Application granted granted Critical
Publication of FR2856517B1 publication Critical patent/FR2856517B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR0307250A 2003-06-17 2003-06-17 Procede de fabrication de composant semi-conducteur et composant semi-conducteur Expired - Fee Related FR2856517B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0307250A FR2856517B1 (fr) 2003-06-17 2003-06-17 Procede de fabrication de composant semi-conducteur et composant semi-conducteur
US10/867,382 US7005322B2 (en) 2003-06-17 2004-06-14 Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0307250A FR2856517B1 (fr) 2003-06-17 2003-06-17 Procede de fabrication de composant semi-conducteur et composant semi-conducteur

Publications (2)

Publication Number Publication Date
FR2856517A1 FR2856517A1 (fr) 2004-12-24
FR2856517B1 true FR2856517B1 (fr) 2005-09-23

Family

ID=33484488

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0307250A Expired - Fee Related FR2856517B1 (fr) 2003-06-17 2003-06-17 Procede de fabrication de composant semi-conducteur et composant semi-conducteur

Country Status (2)

Country Link
US (1) US7005322B2 (fr)
FR (1) FR2856517B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008137511A1 (fr) 2007-05-04 2008-11-13 Crossfire Technologies, Inc. Accès ou interconnexion de circuits intégrés
EP2709183B1 (fr) * 2011-05-13 2019-02-06 Joled Inc. Dispositif électroluminescent organique d'émission de lumière à couleurs multiples
DE102017212796A1 (de) * 2017-07-26 2019-01-31 Robert Bosch Gmbh Elektrische Baugruppe

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US125561A (en) * 1872-04-09 Improvement in car-couplings
US173069A (en) * 1876-02-01 Improvement in governors for steam-engines
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5663106A (en) * 1994-05-19 1997-09-02 Tessera, Inc. Method of encapsulating die and chip carrier
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
US5697148A (en) * 1995-08-22 1997-12-16 Motorola, Inc. Flip underfill injection technique
US5766982A (en) * 1996-03-07 1998-06-16 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
CA2198305A1 (fr) * 1996-05-01 1997-11-02 Yinon Degani Methode et appareil de soudage de circuits integres
EP1443555A3 (fr) * 1997-01-23 2005-02-23 Seiko Epson Corporation Dispositif semi-conducteur et méthode de fabrication associée
US6329224B1 (en) * 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
JP2001044226A (ja) * 1999-07-27 2001-02-16 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置
JP2001217354A (ja) * 2000-02-07 2001-08-10 Rohm Co Ltd 半導体チップの実装構造、および半導体装置
US6617682B1 (en) * 2000-09-28 2003-09-09 Intel Corporation Structure for reducing die corner and edge stresses in microelectronic packages
US6743069B2 (en) * 2001-07-12 2004-06-01 Intel Corporation Facilitating the spread of encapsulant between surfaces of electronic devices
US6809337B2 (en) * 2002-04-22 2004-10-26 Intel Corporation Liquid crystal display devices having fill holes and electrical contacts on the back side of the die
JP4559777B2 (ja) * 2003-06-26 2010-10-13 株式会社東芝 半導体装置及びその製造方法
JP3759131B2 (ja) * 2003-07-31 2006-03-22 Ｎｅｃエレクトロニクス株式会社 リードレスパッケージ型半導体装置とその製造方法

Also Published As

Publication number Publication date
US20050026417A1 (en) 2005-02-03
FR2856517A1 (fr) 2004-12-24
US7005322B2 (en) 2006-02-28

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Legal Events

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Effective date: 20140228