FR2867178B1 - Composant micromecanique et procede de fabrication de ce composant - Google Patents

Composant micromecanique et procede de fabrication de ce composant

Info

Publication number
FR2867178B1
FR2867178B1 FR0550536A FR0550536A FR2867178B1 FR 2867178 B1 FR2867178 B1 FR 2867178B1 FR 0550536 A FR0550536 A FR 0550536A FR 0550536 A FR0550536 A FR 0550536A FR 2867178 B1 FR2867178 B1 FR 2867178B1
Authority
FR
France
Prior art keywords
component
manufacturing
micromechanical
micromechanical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0550536A
Other languages
English (en)
Other versions
FR2867178A1 (fr
Inventor
Frank Fischer
Arnim Hoechst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2867178A1 publication Critical patent/FR2867178A1/fr
Application granted granted Critical
Publication of FR2867178B1 publication Critical patent/FR2867178B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
FR0550536A 2004-03-03 2005-03-01 Composant micromecanique et procede de fabrication de ce composant Expired - Fee Related FR2867178B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004010295A DE102004010295A1 (de) 2004-03-03 2004-03-03 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren

Publications (2)

Publication Number Publication Date
FR2867178A1 FR2867178A1 (fr) 2005-09-09
FR2867178B1 true FR2867178B1 (fr) 2007-06-22

Family

ID=34853923

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0550536A Expired - Fee Related FR2867178B1 (fr) 2004-03-03 2005-03-01 Composant micromecanique et procede de fabrication de ce composant

Country Status (4)

Country Link
US (1) US7243551B2 (fr)
JP (1) JP2005246601A (fr)
DE (1) DE102004010295A1 (fr)
FR (1) FR2867178B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149139A1 (de) * 2001-10-05 2003-04-24 Bosch Gmbh Robert Verfahren zum Erzeugen von Hohlräumen mit einer optisch transparenten Wandung
DE102005027365A1 (de) * 2005-06-14 2006-12-21 Robert Bosch Gmbh Hochdrucksensoreinrichtung und Verfahren zu ihrer Herstellung
EP1953516B1 (fr) * 2007-01-31 2011-03-09 Infineon Technologies AG Capteur de pression micromécanique
DE502007002037D1 (de) * 2007-04-11 2009-12-31 Pari Gmbh Aerosoltherapievorrichtung
DE102007029911A1 (de) * 2007-06-28 2009-01-02 Robert Bosch Gmbh Akustisches Sensorelement
KR100964971B1 (ko) 2007-12-05 2010-06-21 한국전자통신연구원 초소형 압저항형 압력 센서 및 그 제조 방법
WO2009114818A2 (fr) * 2008-03-13 2009-09-17 University Of Utah Research Foundation Procédés de formation d’une cavité incorporée pour capteurs
US9499423B2 (en) 2008-06-30 2016-11-22 D. Jack Adams Electrobiochemical reactor and related method to enhance microbial/enzyme function in transforming or removing contaminants from a liquid
DE102010006769A1 (de) * 2010-02-04 2014-10-30 Dominik Mösch Verfahren zur Herstellung von kleinen Hohlräumen oder Maskierungen/Strukturen in der Halbleiterindustrie, Mikroelektronik, Mikrosystemtechnik o.ä. anhand von Substanzen mit einem geringen Schmelz- und Siedepunkt
JP5471640B2 (ja) * 2010-03-12 2014-04-16 富士通株式会社 Ｍｅｍｓデバイスの製造方法および基板
US9321630B2 (en) 2013-02-20 2016-04-26 Pgs Geophysical As Sensor with vacuum-sealed cavity
US20150247879A1 (en) * 2014-03-03 2015-09-03 Infineon Technologies Ag Acceleration sensor
DE102014210988A1 (de) * 2014-06-10 2015-12-17 Robert Bosch Gmbh Mikromechanische Struktur
CN108147361A (zh) * 2017-12-22 2018-06-12 中国科学院半导体研究所 浓硼掺杂硅纳米线压阻式mems压力传感器的制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276784A (ja) * 1985-09-30 1987-04-08 Toyota Central Res & Dev Lab Inc 半導体圧力センサの製造方法
JPS6276783A (ja) * 1985-09-30 1987-04-08 Toyota Central Res & Dev Lab Inc 半導体圧力センサ及びその製造方法
JP2508070B2 (ja) * 1987-04-08 1996-06-19 日本電装株式会社 圧力検出素子及びその製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
GB9225898D0 (en) * 1992-12-11 1993-02-03 Univ Strathclyde Ultrasonic transducer
US5417115A (en) * 1993-07-23 1995-05-23 Honeywell Inc. Dielectrically isolated resonant microsensors
US6156585A (en) * 1998-02-02 2000-12-05 Motorola, Inc. Semiconductor component and method of manufacture
US6278167B1 (en) * 1998-08-14 2001-08-21 Infineon Technologies Ag Semiconductor sensor with a base element and at least one deformation element
JP2000124469A (ja) * 1998-10-13 2000-04-28 Toyota Central Res & Dev Lab Inc 微小密閉容器及びその製造方法
JP2000138381A (ja) * 1998-11-02 2000-05-16 Toyota Central Res & Dev Lab Inc 密閉容器及びその製造方法
DE19961578A1 (de) * 1999-12-21 2001-06-28 Bosch Gmbh Robert Sensor mit zumindest einer mikromechanischen Struktur und Verfahren zur Herstellung
US6523392B2 (en) * 2000-01-25 2003-02-25 Arizona Board Of Regents Microcantilever sensor
DE10053326A1 (de) 2000-10-27 2002-05-08 Bosch Gmbh Robert Mikromechanisches Bauelement und Herstellungsverfahren
DE10117486A1 (de) 2001-04-07 2002-10-17 Bosch Gmbh Robert Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
US6912759B2 (en) * 2001-07-20 2005-07-05 Rosemount Aerospace Inc. Method of manufacturing a thin piezo resistive pressure sensor
JP3902023B2 (ja) * 2002-02-19 2007-04-04 セイコーエプソン株式会社 圧電アクチュエータ、液滴噴射ヘッド、およびそれを用いた液滴噴射装置
US7178403B2 (en) * 2004-12-03 2007-02-20 Kulite Semiconductor Products, Inc. Transducer responsive to pressure, vibration/acceleration and temperature and methods of fabricating the same

Also Published As

Publication number Publication date
FR2867178A1 (fr) 2005-09-09
JP2005246601A (ja) 2005-09-15
DE102004010295A1 (de) 2005-09-22
US20050193827A1 (en) 2005-09-08
US7243551B2 (en) 2007-07-17

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20151130