JP2005018983A - 半導体不揮発性記憶装置およびメモリシステム - Google Patents
半導体不揮発性記憶装置およびメモリシステム Download PDFInfo
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- JP2005018983A JP2005018983A JP2004281465A JP2004281465A JP2005018983A JP 2005018983 A JP2005018983 A JP 2005018983A JP 2004281465 A JP2004281465 A JP 2004281465A JP 2004281465 A JP2004281465 A JP 2004281465A JP 2005018983 A JP2005018983 A JP 2005018983A
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- memory cells
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- memory
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- 230000015654 memory Effects 0.000 title claims abstract description 229
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000012937 correction Methods 0.000 claims description 43
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 10
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 22
- 238000001514 detection method Methods 0.000 description 21
- LZIAMMQBHJIZAG-UHFFFAOYSA-N 2-[di(propan-2-yl)amino]ethyl carbamimidothioate Chemical compound CC(C)N(C(C)C)CCSC(N)=N LZIAMMQBHJIZAG-UHFFFAOYSA-N 0.000 description 5
- 101150110971 CIN7 gene Proteins 0.000 description 5
- 101150110298 INV1 gene Proteins 0.000 description 5
- 101100397044 Xenopus laevis invs-a gene Proteins 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 101100286980 Daucus carota INV2 gene Proteins 0.000 description 2
- 101100397045 Xenopus laevis invs-b gene Proteins 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 1
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- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004281465A JP2005018983A (ja) | 1996-12-03 | 2004-09-28 | 半導体不揮発性記憶装置およびメモリシステム |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32301196 | 1996-12-03 | ||
JP32429396 | 1996-12-04 | ||
JP2004281465A JP2005018983A (ja) | 1996-12-03 | 2004-09-28 | 半導体不揮発性記憶装置およびメモリシステム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP05576997A Division JP3941149B2 (ja) | 1995-12-04 | 1997-03-11 | 半導体不揮発性記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005018983A true JP2005018983A (ja) | 2005-01-20 |
JP2005018983A5 JP2005018983A5 (enrdf_load_stackoverflow) | 2007-07-26 |
Family
ID=34198632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004281465A Pending JP2005018983A (ja) | 1996-12-03 | 2004-09-28 | 半導体不揮発性記憶装置およびメモリシステム |
Country Status (1)
Country | Link |
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JP (1) | JP2005018983A (enrdf_load_stackoverflow) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008041171A (ja) * | 2006-08-07 | 2008-02-21 | Fujitsu Ltd | Eccのコード長が変更可能な半導体メモリ装置 |
US7352630B2 (en) | 2005-07-26 | 2008-04-01 | Samsung Electronics Co., Ltd. | Non-volatile memory device having improved program speed and associated programming method |
US7746703B2 (en) | 2007-05-25 | 2010-06-29 | Samsung Electronics Co., Ltd. | Flash memory device and method of programming flash memory device |
JP2011170927A (ja) * | 2010-02-19 | 2011-09-01 | Toshiba Corp | 半導体記憶装置 |
JP2012069180A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 半導体記憶装置 |
US8661294B2 (en) | 2010-01-19 | 2014-02-25 | Samsung Electronics Co., Ltd. | Nonvolatile memory device and related program verification circuit |
CN108932964A (zh) * | 2017-05-23 | 2018-12-04 | 三星电子株式会社 | 存储设备和操作存储设备的方法 |
CN112116944A (zh) * | 2020-09-24 | 2020-12-22 | 深圳市芯天下技术有限公司 | 可减少难编程的存储单元编程干扰的编程方法 |
-
2004
- 2004-09-28 JP JP2004281465A patent/JP2005018983A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7352630B2 (en) | 2005-07-26 | 2008-04-01 | Samsung Electronics Co., Ltd. | Non-volatile memory device having improved program speed and associated programming method |
JP2008041171A (ja) * | 2006-08-07 | 2008-02-21 | Fujitsu Ltd | Eccのコード長が変更可能な半導体メモリ装置 |
US7746703B2 (en) | 2007-05-25 | 2010-06-29 | Samsung Electronics Co., Ltd. | Flash memory device and method of programming flash memory device |
US8661294B2 (en) | 2010-01-19 | 2014-02-25 | Samsung Electronics Co., Ltd. | Nonvolatile memory device and related program verification circuit |
JP2011170927A (ja) * | 2010-02-19 | 2011-09-01 | Toshiba Corp | 半導体記憶装置 |
JP2012069180A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 半導体記憶装置 |
CN108932964A (zh) * | 2017-05-23 | 2018-12-04 | 三星电子株式会社 | 存储设备和操作存储设备的方法 |
CN112116944A (zh) * | 2020-09-24 | 2020-12-22 | 深圳市芯天下技术有限公司 | 可减少难编程的存储单元编程干扰的编程方法 |
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