JP2005001867A - Handling device of chip type electronic part and handling method of chip type electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a handling device of a chip type electronic part and a handling method of a chip type electronic part, obtaining a wide vacant space above the forward end of a feeder, and handling the chip type electronic parts at high speed and at good efficiency. <P>SOLUTION: A parts feeder 60 is composed of a vibrating part 60a for applying vibration to the chip type electronic parts 70 to be aligned in a line, and a non-vibrating part 60b for stopping the vibration to make the part at rest and stabilizing the attitude of the chip type electronic part 70. A CCD camera 65 with a ring illuminator 66 is disposed above the non-vibrating part 60b. In a transport drum 10, the principal plane 10b is inclined relatively to the transport surface 62 of the parts feeder 60 at an angle θ=5 to 85 degrees. The transport drum 10 is disposed at a predetermined space between the outer peripheral surface 10a and the forward end of the parts feeder 60 (the non-vibrating part 60b). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type electronic component handling apparatus and a chip-type electronic component handling method.
[0002]
[Prior art]
For example, devices described in Patent Document 1 and Patent Document 2 are known as devices that perform electrical measurement and appearance inspection of chip-type electronic components such as chip-type capacitors and sort out non-defective products and defective products based on the results. ing.
[0003]
The devices of Patent Document 1 and Patent Document 2 align the chip-type electronic components conveyed from the feeder and carry them by airflow while separating them one by one, and image the chip-type electronic components with a camera during the airflow conveyance. Then, after inspecting the external scratches and dimensions of the chip-type electronic component from the imaging data, the non-defective product and the defective product are selected based on the inspection result.
[0004]
FIG. 8 is a schematic configuration diagram showing the inspection apparatus of Patent Document 1. In FIG. The inspection device 100 includes a feeder 101, a rotary table 102, a fixed table 103, a motor 104 for rotating the rotary table 102, a camera 105, a guide nozzle 108, and a suction device 109.
[0005]
The feeder 101 includes a vibration unit 101a that vibrates and aligns the chip-type electronic component 70, and a non-vibration unit 101b that stabilizes the posture of the chip-type electronic component 70 by stopping the vibration.
[0006]
The main surface of the rotary table 102 is parallel to the vertical surface, and is in contact with the tip of the feeder 101 via a guide nozzle 108 provided on the fixed table 103. A plurality of V-shaped pockets (not shown) are formed on the turntable 102 from the outer peripheral surface toward the center with a predetermined interval in the rotation direction.
[0007]
The fixed table 103 is fixedly arranged on the back side of the rotary table 102. The camera 105 with the ring illumination 106 is provided above the non-vibrating portion 101 b of the feeder 101 in order to image the upper surface of the chip-type electronic component 70.
[0008]
The chip-type electronic component 70 conveyed by the feeder 101 is detected by the imaging timing sensor 107 and the upper surface is imaged by the camera 105. Thereafter, the chip-type electronic component 70 is sent to the forefront portion of the non-vibrating portion 101b of the feeder 101, and is sucked and held in the pocket of the rotary table 102 through the guide nozzle 108 that is in the suction state by the suction device 109. .
[0009]
[Patent Document 1]
JP 2002-326059 A [Patent Document 2]
Japanese Patent Laid-Open No. 2002-243654
[Problems to be solved by the invention]
The inspection apparatus 100 of Patent Document 1 performs an appearance inspection of the upper surface of the chip-type electronic component 70 conveyed by the feeder 101 by taking an image with the camera 105. Therefore, it is necessary to dispose the camera 105 above the non-vibrating portion 101b of the feeder 101. However, the size of the camera 105 is relatively large, and in order not to collide with the rotary table 102 (so as not to interfere), the camera 105 is rotated from the imaging position (indicated by the alternate long and short dash line A in FIG. 8). It is necessary to increase the distance to the table 102. Therefore, a guide nozzle 108 for rapidly accelerating the chip-type electronic component 70 and transferring it to the rotary table 102 is necessary.
[0011]
However, there is a concern that the posture of the chip-type electronic component 70 in the guide nozzle 108 is not stable, and a holding error of the rotary table 102 is likely to occur. Note that the apparatus of Patent Document 2 does not include a guide nozzle. However, the posture at the time of transferring the chip-type electronic component from the supply feeder to the rotating body is not stable like the inspection apparatus 100, and there is a concern that a holding error of the rotating body is likely to occur.
[0012]
Further, since the chip electronic component 70 is rapidly accelerated by the guide nozzle 108 of the inspection apparatus 100, a strong impact force is applied to the chip electronic component 70 when the pocket of the rotary table 102 receives the chip electronic component 70. In addition, the chip-type electronic component 70 may be cracked or chipped.
[0013]
The guide nozzle 108 also has a function of separating one chip-type electronic component 70 by suction. The separated chip-type electronic component 70 is imaged by the camera 105 before the entrance of the guide nozzle 108 and then sucked into the pocket of the rotary table 102. After confirming that the chip-type electronic component 70 is sucked and held in the pocket, the rotary table 102 moves by one pitch. Thereafter, the next chip-type electronic component 70 is sucked by the guide nozzle 108 and separated by one.
[0014]
However, this suction separation system is a major obstacle to high-speed processing of the chip-type electronic component 70. That is, when a series of timings of the suction separation method is shifted (for example, the next chip-type electronic component 70 is guided by the guide nozzle while the previous chip-type electronic component 70 is sucked and held in the pocket and the rotary table 102 does not move by one pitch. If it is transported before the entrance 108), the inspection apparatus 100 stops. For this reason, it is necessary to increase the transfer interval of the chip-type electronic component 70, and the upper limit of the processing speed is about 1000 pieces / minute.
[0015]
When the appearance inspection is performed with the camera 105, it is necessary to illuminate the entire circumference of the chip-type electronic component 70 with the ring illumination 106. However, since the empty space above the non-vibrating portion 101b of the feeder 101 is narrow, there is a problem that it is difficult to arrange the ring illumination 106 at an optimal position.
[0016]
Accordingly, an object of the present invention is to provide a chip-type electronic component handling apparatus and a chip-type electronic component capable of processing a chip-type electronic component at high speed and efficiently by providing a wide empty space above the tip of the supply feeder. It is to provide a handling method.
[0017]
[Means and Actions for Solving the Problems]
In order to achieve the above object, a chip-type electronic component handling apparatus according to the present invention comprises:
(A) a transport drum for transporting the chip-type electronic component while being held on the outer peripheral surface;
(B) a supply feeder that moves the chip-type electronic component on the transfer surface and supplies the chip-type electronic component to the transfer drum;
(C) the main surface of the transport drum is inclined relative to the transport surface;
It is characterized by.
[0018]
Alternatively, the chip type electronic component handling apparatus according to the present invention is:
(D) a transport drum for transporting the chip-type electronic component while holding it on the outer peripheral surface;
(E) a supply feeder that moves the chip-type electronic component on the transfer surface and supplies the chip-type electronic component to the transfer drum;
(F) The conveying surface of the supply feeder has an inclined surface that is relatively inclined in the vicinity of the conveying drum, and the main surface of the conveying drum is substantially orthogonal to the inclined surface.
It is characterized by.
[0019]
With the above configuration, since the main surface of the transfer drum is inclined relative to the transfer surface, a wide empty space is formed above the front end of the supply feeder. Therefore, a first imaging means (specifically, a CCD camera or the like) for imaging the upper surface of a chip-type electronic component that has been moved by the supply feeder, for example, and performing an appearance inspection on the upper surface is provided above the tip of the supply feeder. Even if it arrange | positions, a 1st imaging means and a drum for conveyance do not interfere, and it is not necessary to leave | separate a drum for conveyance far from the front-end | tip part of a supply feeder. As a result, the transfer distance of the chip-type electronic component from the imaging position by the first imaging means to the transfer drum is the shortest. At this time, by inclining the outer peripheral surface of the transfer drum with respect to the main surface, the upper surface of the chip-type electronic component moved from the supply feeder can be smoothly sucked and held on the outer peripheral surface of the transfer drum.
[0020]
Further, the upper surface of the chip-type electronic component that has been moved by the supply feeder is held on the outer peripheral surface of the transfer drum, and the second imaging means is provided in the vicinity of the transfer path of the chip-type electronic component by the transfer drum, and the movement by the supply feeder In this case, the bottom surface of the chip-type electronic component that is in contact with the supply feeder is imaged by the second imaging means, and the appearance of the bottom surface is inspected. Thereby, it is possible to inspect the bottom surface of the chip-type electronic component that is hidden during the movement by the supply feeder or the transfer drum.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a chip-type electronic component handling apparatus and a chip-type electronic component handling method according to the present invention will be described below with reference to the accompanying drawings. In each of the embodiments, a product inspection apparatus will be described as an example of a chip-type electronic component handling apparatus, but a conveyance apparatus or the like may be used.
[0022]
As shown in FIG. 1, the product inspection apparatus 1 includes a roughly disc-shaped transfer drum 10, a parts feeder 60, a CCD camera 65, and a suction device 68.
[0023]
The parts feeder 60 includes a vibration unit 60a that vibrates the chip-type electronic components 70 and aligns them in a row, and a non-vibration portion 60b that stabilizes the posture of the chip-type electronic components 70 by stopping the vibrations. A CCD camera 65 with ring illumination 66 is disposed above the non-vibrating portion 60b.
[0024]
The main surface 10b of the transfer drum 10 is inclined by θ = 5 degrees to 85 degrees relative to the transfer surface 62 of the parts feeder 60 (horizontal plane in the case of FIG. 1). The transport drum 10 is disposed with a predetermined gap between the outer peripheral surface 10a and the tip portion (non-vibration portion 60b) of the parts feeder 60. Accordingly, since a wide empty space is formed above the non-vibrating portion 60b, even if the imaging position by the CCD camera 65 (indicated by the alternate long and short dash line A in FIG. 1) is close to the transfer drum 10, the CCD camera 65 There is no interference between the transport drum 10 (including the ring illumination 66). As a result, the transfer distance of the chip-type electronic component 70 from the imaging position A by the CCD camera 65 to the transfer drum 10 can be minimized.
[0025]
As shown in FIGS. 2 and 3, a disc-shaped fixed base 30, a drive motor 40 that rotationally drives the transport drum 10, and a housing 50 are disposed on the rear surface side of the transport drum 10. ing.
[0026]
A driving motor 40 is fixed to the right end surface 50 a of the cylindrical housing 50 with a bolt 51. A rotation shaft 41 of the drive motor 40 is connected to a shaft 43 via a relay member 42. The relay member 42 and the rotation shaft 41, and the relay member 42 and the shaft 43 are fixed by bolts 45, respectively. The shaft 43 is supported in the housing 50 by two ball bearings 46 in a rotatable state. The distal end portion 43 a of the shaft 43 passes through a hole 30 a provided in the central portion of the fixed base 30 and is joined to the central portion of the transport drum 10.
[0027]
Suction holding holes 11 for sucking and holding the chip-type electronic component 70 are formed on the outer peripheral surface 10a of the transfer drum 10 at a desired interval, for example, at equal intervals. A decompression source side hole 13 is formed on the rear surface side of the transfer drum 10. Further, a hollow buffer portion 12 that communicates and connects the decompression source side hole 13 and the suction holding hole 11 is formed in the conveying drum 10 so as to extend in the radial direction of the conveying drum 10.
[0028]
The outer peripheral surface 10a of the transfer drum 10 is inclined with respect to the main surface 10b. Thereby, the upper surface of the chip-type electronic component 70 transferred from the parts feeder 60 and the outer peripheral surface 10a are substantially parallel, and the upper surface of the chip-type electronic component 70 can be smoothly sucked and held by the suction holding hole 11. .
[0029]
On the other hand, the fixed base 30 is fixed to the left end surface 50 b of the housing 50 with bolts 52. An arc-shaped decompression groove 31 is formed in an annular shape in the fixed base 30. The decompression groove 31 is disposed at a position that matches the trajectory along which the decompression source side hole 13 moves as the transport drum 10 rotates. The decompression groove 31 is connected to a decompression device (such as a vacuum pump) that sucks air inside the adapter 39 via the adapter 39.
[0030]
As shown in FIG. 4, a slight gap T is secured between the front surface of the fixed base 30 and the rear surface of the transport drum 10, and the front surface of the decompression groove 31 is sealed in a substantially airtight manner at the rear surface of the transport drum 10. Has been. Therefore, in the formation range of the decompression groove 31, the air inside each of the decompression source side hole 13, the cavity buffer portion 12 and the suction holding hole 11 is sucked, and the chip-type electronic component 70 is sucked into the opening of the suction holding hole 11. Retained.
[0031]
Here, the volume of the cavity buffer unit 12 is set larger than the volume of the decompression source side hole 13 and the volume of the suction holding hole 11. Therefore, when the transfer drum 10 is rotated, the dimension of the gap T changes due to processing accuracy of the transfer drum 10 and vibration during rotation, and the reduced pressure state of the reduced pressure source side hole 13 is changed. Even if the reduced pressure state of the reduced pressure source side hole 13 changes as the reduced pressure source side hole 13 passes through the joint portion P, the change is alleviated by the cavity buffer 12. Accordingly, the suction holding force of the suction holding hole 11 is less susceptible to fluctuations in the reduced pressure state of the reduced pressure source side hole 13. As a result, the chip-type electronic component 70 can be sucked and held stably and reliably by the suction holding hole 11.
[0032]
As shown in FIG. 3, the fixed base 30 is formed with air supply grooves 32 and 33 that are adjacent to the pressure reduction groove 31 and that can block the supply of the pressure reduction air. A decompression device (vacuum pump) is connected to the air supply grooves 32 and 33 via adapters and solenoid valves, respectively.
[0033]
For example, when the chip-type electronic component 70 that has become non-defective in the inspection has been transported to a position corresponding to the air supply groove 32, the electromagnetic valve is driven and the supply of the reduced pressure air to the air supply groove 32 is blocked. Then, the suction holding force of the transfer drum 10 is reduced. As a result, the non-defective chip-type electronic component 70 is discharged to the non-defective tray of the take-out mechanism section by its own weight. On the other hand, when the chip-type electronic component 70 that has become defective in the inspection has been conveyed, the electromagnetic valve is driven to supply the reduced pressure air to the air supply groove 32, and the position corresponding to the air supply groove 33. To be transferred. In the air supply groove 33, the supply of the reduced pressure air is cut off by driving the electromagnetic valve, and the defective chip-type electronic component 70 is discharged to the defective product tray of the take-out mechanism.
[0034]
As a method for removing these chip-type electronic components 70 from the conveying drum 10, in addition to the above-described method of shutting off the supply of reduced-pressure air, a method of mechanically removing by means of an arm or the like having a suction pad or compression There is a method of supplying air.
[0035]
Further, the thickness of the transport drum 10 is set to be thinner than the outer dimension L in the transport drum thickness direction of the chip-type electronic component 70 sucked and held by the transport drum 10. Specifically, the transport drum 10 has a thickness of 0.7 to 1.8 mm (representative value: 1.8 mm) and a diameter of 50 to 170 mm (representative value: 100 mm). The size of the chip-type electronic component 70 is, for example, L: 2.0 mm × W: 1.2 mm × T: 0.85 to 0.95 mm.
[0036]
As a result, the chip-type electronic component 70 being conveyed has both ends in the thickness direction of the conveyance drum, that is, the external terminals protrude from the edge of the conveyance drum 10. It is possible to inspect the both end faces of 70 and to inspect electrical characteristics with a measurement probe. In particular, in the case of the present embodiment, the outer peripheral surface 30a of the fixed base 30 is located on the inner side of the outer peripheral surface 10a of the transfer drum 10, so that the measurement probe is connected to the external terminal of the chip-type electronic component 70 from the fixed base 30 side. It becomes possible to make it contact.
[0037]
Next, the operation of the product inspection apparatus 1 having the above configuration will be described.
As shown in FIG. 1, the chip-type electronic component 70 is sequentially conveyed in the horizontal direction (arrow K direction) by the vibrating portion 60 a of the parts feeder 60. When it reaches the non-vibrating portion 60b, it is detected by the imaging timing sensor 61, the upper surface is imaged by the CCD camera 65, and the upper surface is inspected. At this time, the entire circumference of the chip-type electronic component 70 is illuminated by the ring illumination 66. However, since the empty space above the non-vibration part 60b is wide, the ring illumination 66 can be disposed at an optimal position.
[0038]
The chip-type electronic component 70 that has passed through the imaging position A is air-flowed to the tip (delivery area) of the non-vibrating portion 60b by the suction device 68 that is in the intake state, and is separated from the subsequent chip-type electronic component 70. Since the distance between the suction device 68 and the imaging position A can be shortened, the chip-type electronic component 70 can be sucked by the suction device 68 without using the guide nozzle 108 shown in FIG. The suction device 68 also serves as a positioning stopper for the chip-type electronic component 70. The separated chip-type electronic component 70 is close to the outer peripheral surface 10 a of the transfer drum 10. The suction holding hole 11 at a position facing the non-vibrating portion 60b of the transport drum 10 is decompressed by a vacuum pump in accordance with the proximity timing, and the upper surface of the chip-type electronic component 70 is sucked and held by the suction holding hole 11. .
[0039]
The chip-type electronic component 70 delivered to the transfer drum 10 is chip-typed by CCD cameras 81, 82 and the like disposed in the vicinity of the annular transfer path by the transfer drum 10 while being continuously positioned and transferred. The appearance inspection of the end face, the side surface, and the ridge line of the electronic component 70 is performed, or the electrical characteristic measurement inspection is performed. At this time, since the bottom surface of the chip-type electronic component 70 that has been hidden during the movement by the parts feeder 60 appears, the bottom surface can also be visually inspected. That is, the inspection apparatus 1 can perform an appearance inspection on all six surfaces of the chip-type electronic component 70.
[0040]
The chip-type electronic component 70 that has been inspected is conveyed to a discharge area. The chip-type electronic component 70 that has come to the position facing the take-out mechanism section is separated from the transfer drum 10 into a non-defective product and a defective product by an arm with a suction pad or the like.
[0041]
By the above method, inspection and measurement can be performed while efficiently and smoothly transporting the chip-type electronic component 70. That is, since the product inspection apparatus 1 can minimize the transfer distance of the chip-type electronic component 70 from the imaging position A by the CCD camera 65 to the transfer drum 10, the chip-type electronic component 70 when transferring to the transfer drum 10. Is stable, and the holding drum 10 can be prevented from being mistakenly held.
[0042]
Further, since the product inspection apparatus 1 does not need to provide the guide nozzle 108 shown in FIG. 8, the time required for the transfer of the chip-type electronic component 70 in the delivery area can be shortened, so the upper limit of the processing speed is about 2000. Can be raised to pieces / minute.
[0043]
Further, a product inspection device 1A shown in FIG. 5 is devised to widen the empty area above the non-vibrating portion 60b. This product inspection apparatus 1A has a structure in which the tip portion of the non-vibration portion 60b is inclined, and the chip-type electronic component 70 after imaging the inclined surface 62a slides down. The main surface 10b of the transfer drum 10 is substantially orthogonal to the inclined surface 62a, and the outer peripheral surface 10a is substantially orthogonal to the main surface 10b.
[0044]
Thereby, a sufficient empty area for the CCD cameras 81 and 83 with ring illumination can be secured. Further, the suction force of the suction device 68 may be small by sliding the chip-type electronic component 70 in front of the transfer drum 10, the posture of the chip-type electronic component 70 is stable, and the mechanical impact force is small. Transfer is possible.
[0045]
Note that the chip-type electronic component handling apparatus and the chip-type electronic component handling method according to the present invention are not limited to the above embodiments. Various modifications can be made within the scope of the gist. For example, the inclination of the outer peripheral surface 10a of the transfer drum 10 is arbitrary, and may be inclined in the reverse direction as shown in FIG. Moreover, as shown in FIG. 7, the cross-sectional shape may be a right-triangular groove shape. In this case, the chip-type electronic component 70 is sucked and held in the suction holding hole 11 so that the length direction of the chip-type electronic component 70 is parallel to the thickness direction of the transfer drum 10.
[0046]
【The invention's effect】
As apparent from the above description, according to the present invention, the main surface of the transport drum is inclined relative to the transport surface, so that a wide empty space is formed above the front end of the supply feeder. Therefore, a first imaging means (specifically, a CCD camera or the like) for imaging the upper surface of a chip-type electronic component that has been moved by the supply feeder, for example, and performing an appearance inspection on the upper surface is provided above the tip of the supply feeder. Even if it arrange | positions, a 1st imaging means and a drum for conveyance do not interfere, and it is not necessary to leave | separate a drum for conveyance far from the front-end | tip part of a supply feeder. As a result, the transfer distance of the chip-type electronic component from the imaging position by the first imaging means to the transfer drum can be minimized. As a result, chip-type electronic components can be processed at high speed and efficiency.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an embodiment of a chip-type electronic component handling apparatus according to the present invention.
FIG. 2 is a partial horizontal sectional view of the transfer drum shown in FIG.
FIG. 3 is a partially cutaway front view of the transfer drum shown in FIG. 1;
4 is an enlarged cross-sectional view of a portion A shown in FIG.
5 is a schematic configuration diagram showing a modified example of the chip-type electronic component handling apparatus shown in FIG. 1. FIG.
FIG. 6 is a schematic configuration diagram showing another embodiment.
FIG. 7 is an enlarged cross-sectional view of an outer peripheral portion of a transfer drum showing another embodiment.
FIG. 8 is a schematic configuration diagram showing a conventional chip-type electronic component handling apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Conveying drum 10a ... Outer peripheral surface 60 ... Parts feeder 65 ... CCD camera (1st imaging means)
82. CCD camera (second imaging means)

Claims (6)

A transfer drum for holding and transporting chip-type electronic components on the outer peripheral surface;
A supply feeder for moving the chip-type electronic component on the transfer surface and supplying the chip-type electronic component to the transfer drum;
The main surface of the transfer drum is inclined relative to the transfer surface;
A device for handling chip-type electronic components. A transfer drum for holding and transporting chip-type electronic components on the outer peripheral surface;
A supply feeder for moving the chip-type electronic component on the transfer surface and supplying the chip-type electronic component to the transfer drum;
The conveying surface of the supply feeder has an inclined surface that is relatively inclined in the vicinity of the conveying drum, and the main surface of the conveying drum is substantially orthogonal to the inclined surface;
A device for handling chip-type electronic components. 3. The chip-type electronic component handling apparatus according to claim 1, wherein an outer peripheral surface of the transfer drum is inclined with respect to a main surface. A first imaging unit is provided above a conveyance surface of the chip-type electronic component by the supply feeder, and an upper surface appearance inspection is performed by imaging the upper surface of the chip-type electronic component moved by the supply feeder by the first imaging unit. The chip-type electronic component handling apparatus according to any one of claims 1 to 3. The upper surface of the chip-type electronic component moved by the supply feeder is held on the outer peripheral surface of the transfer drum, and a second imaging unit is provided in the vicinity of the transfer path of the chip-type electronic component by the transfer drum, and the supply feeder 5. The chip-type electronic component according to claim 4, wherein an image of the bottom surface of the chip-type electronic component that has been in contact with the supply feeder during the movement is picked up by the second image pickup means, and the appearance of the bottom surface is inspected. Handling equipment. Using the electronic component handling apparatus according to any one of claims 1 to 5, an appearance inspection or electrical property measurement of a chip-type electronic component is performed on the conveyance surface of the supply feeder or the conveyance path of the conveyance drum. A method of handling a chip-type electronic component, characterized in that:

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