JP2005022769A - Handling device for chip electronic component and handling method for chip electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip electronic component handling device and a chip electronic component handling method having fewer restrictions of operation at the time of delivery of chip electronic components and enabling high-speed and effective processing of the chip electronic components. <P>SOLUTION: A product inspecting device is provided with a disciform drum 10 for conveyance, a disciform disc 55 for conveyance, a parts feeder 60 comprised of a ball feeder 61 and a linear feeder 62, a delivery mechanism part 63 and takeout mechanism parts 64, 65. Outermost peripheries of the disciform drum 10 for conveyance and the disciform disc 55 for conveyance have a structure preventing them from invading into the other's rotating region (from interfering with each other). Regrading the disc 55 for conveyance, a position for gripping or sucking and holding the chip electric components 70 is not predetermined, and the chip electronic components 70 may be properly placed on arbitrary positions of an outer peripheral edge part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type electronic component handling apparatus and a chip-type electronic component handling method.
[0002]
[Prior art]
For example, devices described in Patent Documents 1 to 3 are known as devices that perform electrical measurement and appearance inspection of chip-type electronic components such as chip-type capacitors and sort out non-defective products and defective products based on the results. ing.
[0003]
The devices of Patent Literature 1 and Patent Literature 2 include a first rotary table and a second rotary table in which a gripping mechanism and a suction holding port for holding a chip-type electronic component are formed on the outer peripheral surface, respectively. FIG. 5 is a diagram illustrating an arrangement state of the first rotary table 1 and the second rotary table 2 of the apparatus of Patent Document 1. The turntable 1 and the turntable 2 are arranged orthogonally with the suction holding ports 3 overlapping each other. When the chip-type electronic component held and conveyed by the suction holding port 3 of the first turntable 1 reaches the delivery position, the suction force at the suction holding port 3 is reduced. Then, the chip-type electronic component moves smoothly to the suction holding port 3 of the second rotary table 2 and is sucked and held.
[0004]
Further, as shown in FIG. 6, the apparatus of Patent Document 3 includes a parts feeder 5 including a ball feeder 6 and a linear feeder 7, and a transparent disk 8 that continuously rotates on a horizontal plane. The chip-type electronic components 70 in the ball feeder 6 pass through the linear feeder 7 and are dropped and placed one by one on the upper surface edge of the transparent disk 8 from its tip. The chip-type electronic component 70 placed on the transparent disk 8 is conveyed as the transparent disk 8 rotates.
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 9-315566 [Patent Document 2]
JP 2002-19957 A [Patent Document 3]
JP-A-4-107000 [0006]
[Problems to be solved by the invention]
However, the devices of Patent Literature 1 and Patent Literature 2 align the gripping mechanisms and suction holding ports 3 formed on the first rotary table 1 and the second rotary table 2 with each other, and the first rotary table 1 and the second rotary table 2 respectively. It is necessary to rotate the two-rotation table 2 in synchronization.
[0007]
Further, as shown in FIG. 5, the rotary tables 1 and 2 have their outermost circumferences mutually entering the rotary area of another rotary table, so that one of the rotary tables is always provided at the delivery position of the chip-type electronic component. The suction holding port 3 must be open. Accordingly, the first rotary table 1 that has passed the chip-type electronic component is moved to the position until the second empty table 2 to which the chip-type electronic component has been passed rotates and the next empty suction holding port 3 reaches the delivery position. The operation had to be limited.
[0008]
Further, when the chip-type electronic component is mechanically gripped as in the device of Patent Document 2, there is a concern that problems such as delivery mistakes and chipping of components are likely to occur. Further, this gripping mechanism is not suitable for high-speed conveyance because it involves operations such as insertion and withdrawal of an opening / closing pin during delivery.
[0009]
In addition, the apparatus of Patent Document 3 shown in FIG. 6 has a rotational speed of the transparent disk 8 larger than the conveying speed of the parts feeder 5 in order to sufficiently leave the chip-type electronic components 70 on the transparent disk 8. is doing. However, the number of chip-type electronic components 70 discharged by the parts feeder 5 in one minute varies, and there may be a variation in the number of discharged components, for example, 100 pieces / minute or more. Therefore, the actual rotational speed of the transparent disk 8 has to be set in accordance with the maximum number of parts discharged from the parts feeder 5. As a result, when the number of parts discharged from the parts feeder 5 is small, the mutual distance between the chip-type electronic components 70 is larger than necessary, and there is a problem that the number of processing is small with respect to the rotational speed of the transparent disk 8. .
[0010]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip-type electronic component handling apparatus and a chip-type electronic component capable of processing the chip-type electronic component at high speed and efficiently, with less restrictions on the operation during delivery of the chip-type electronic component. It is to provide a handling method.
[0011]
[Means and Actions for Solving the Problems]
In order to achieve the above object, a chip-type electronic component handling apparatus according to the present invention comprises:
(A) a transport drum for transporting the chip-type electronic component while being held on the outer peripheral surface;
(B) a chip-type electronic component is provided on the main surface arranged substantially horizontally, and a transfer disk for transferring the chip-type electronic component;
(C) The transport drum and the transport disk are arranged at a desired interval, and the chip-type electronic component is transferred between the outer peripheral surface of the transport drum and the main surface of the transport disk. thing,
It is characterized by.
[0012]
With the above configuration, the chip-type electronic component is transferred between the outer peripheral surface of the transport drum and the main surface of the transport disk at a desired time interval. Here, for example, by appropriately setting the rotation speed of the transfer disk based on the time interval of the chip-type electronic parts transferred from the transfer drum, the mutual distance between the chip-type electronic parts on the transfer disk is optimal. Value. As a result, the mutual distance between the chip-type electronic components on the transfer disk is not increased more than necessary, and the chip-type electronic components can be processed efficiently.
[0013]
Further, when the chip-type electronic component is transferred from the outer peripheral surface of the transfer drum to the main surface of the transfer disk in this way, it can be independently rotated without being synchronized with the transfer drum.
[0014]
In addition, by making the transport disk transparent, the bottom surface of the chip-type electronic component placed on the transport disk can be inspected from the lower side of the transport disk through the transport disk.
[0015]
Furthermore, an alignment member for aligning chip-type electronic components in a line in the rotation direction of the transport disk is provided on the main surface of the transport disk. This eliminates the restriction that the posture of the chip-type electronic component must be maintained when transferring from the transfer drum to the transfer disk.
[0016]
In addition, chip-type electronic components held on the outer peripheral surface of the transfer drum are transferred efficiently onto the edge of the main surface of the transfer disk that is horizontally arranged by air transfer. Electrical measurements or visual inspections can be performed while conveying electronic components.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a chip-type electronic component handling apparatus and a chip-type electronic component handling method according to the present invention will be described below with reference to the accompanying drawings. In each embodiment, a product inspection apparatus will be described as an example of a chip-type electronic component handling apparatus. However, a conveyance apparatus or the like may be used.
[0018]
As shown in FIG. 1, the product inspection apparatus includes a disk-shaped transport drum 10, a disk-shaped transport disk 55, a parts feeder 60 including a ball feeder 61 and a linear feeder 62, and a delivery mechanism unit 63. And take-out mechanism sections 64 and 65.
[0019]
As shown in FIGS. 2 and 3, a disc-shaped fixed base 30, a drive motor 40 that rotationally drives the transport drum 10, and a housing 50 are disposed on the rear surface side of the transport drum 10. ing.
[0020]
A driving motor 40 is fixed to the left end surface 50 a of the cylindrical housing 50 with a bolt 51. A rotation shaft 41 of the drive motor 40 is connected to a shaft 43 via a relay member 42. The relay member 42 and the rotation shaft 41, and the relay member 42 and the shaft 43 are fixed by bolts 45, respectively. The shaft 43 is supported in the housing 50 by two ball bearings 46 in a rotatable state. The distal end portion 43 a of the shaft 43 passes through a hole 30 a provided in the central portion of the fixed base 30 and is joined to the central portion of the transport drum 10.
[0021]
Suction holding holes 11 for sucking and holding the chip-type electronic component 70 are formed on the outer peripheral surface 10a of the transfer drum 10 at a desired interval, for example, at equal intervals. A decompression source side hole 13 is formed on the rear surface side of the transfer drum 10. Further, a hollow buffer portion 12 that communicates and connects the decompression source side hole 13 and the suction holding hole 11 is formed in the conveying drum 10 so as to extend in the radial direction of the conveying drum 10.
[0022]
On the other hand, the fixed base 30 is fixed to the right end surface 50 b of the housing 50 with bolts 52. An arc-shaped decompression groove 31 is formed in an annular shape in the fixed base 30. The decompression groove 31 is disposed at a position that matches the trajectory along which the decompression source side hole 13 moves as the transport drum 10 rotates. The decompression groove 31 is connected to a decompression device (such as a vacuum pump) that sucks air inside the adapter 39 via the adapter 39.
[0023]
As shown in FIG. 4, a slight gap T is secured between the front surface of the fixed base 30 and the rear surface of the transport drum 10, and the front surface of the decompression groove 31 is sealed in a substantially airtight manner at the rear surface of the transport drum 10. Has been. Therefore, in the formation range of the decompression groove 31, the air inside each of the decompression source side hole 13, the cavity buffer portion 12 and the suction holding hole 11 is sucked, and the chip-type electronic component 70 is sucked into the opening of the suction holding hole 11. Retained.
[0024]
Here, the volume of the cavity buffer unit 12 is set larger than the volume of the decompression source side hole 13 and the volume of the suction holding hole 11. Therefore, when the transfer drum 10 is rotated, the dimension of the gap T changes due to processing accuracy of the transfer drum 10 and vibration during rotation, and the reduced pressure state of the reduced pressure source side hole 13 is changed. Even if the reduced pressure state of the reduced pressure source side hole 13 changes as the reduced pressure source side hole 13 passes through the joint portion P, the change is alleviated by the cavity buffer 12. Accordingly, the suction holding force of the suction holding hole 11 is less susceptible to fluctuations in the reduced pressure state of the reduced pressure source side hole 13. As a result, the chip-type electronic component 70 can be sucked and held stably and reliably by the suction holding hole 11.
[0025]
As shown in FIG. 3, the fixed base 30 is formed with air supply grooves 32 and 33 that are adjacent to the pressure reduction groove 31 and that can block the supply of the pressure reduction air. A decompression device (vacuum pump) is connected to the air supply grooves 32 and 33 via adapters and solenoid valves, respectively.
[0026]
For example, when the chip-type electronic component 70 that has become non-defective in the inspection has been transported to a position corresponding to the air supply groove 32, the electromagnetic valve is driven and the supply of the reduced pressure air to the air supply groove 32 is blocked. Then, the suction holding force of the transfer drum 10 is reduced. Thereby, the non-defective chip type electronic component 70 is dropped and placed on the upper surface 55a of the transfer disk 55 by its own weight. On the other hand, when the chip-type electronic component 70 that has become defective in the inspection has been conveyed, the electromagnetic valve is driven to supply the reduced pressure air to the air supply groove 32, and the position corresponding to the air supply groove 33. To be transferred. In the air supply groove 33, the supply of the reduced pressure air is cut off by driving the electromagnetic valve, and the defective chip-type electronic component 70 is discharged to the defective product tray of the take-out mechanism 64.
[0027]
As a method for removing these chip-type electronic components 70 from the conveying drum 10, in addition to the above-described method of shutting off the supply of reduced-pressure air, a method of mechanically removing by means of an arm or the like having a suction pad or compression There is a method of supplying air.
[0028]
The thickness d of the transport drum 10 is set to be thinner than the outer dimension L in the transport drum thickness direction of the chip-type electronic component 70 sucked and held by the transport drum 10. Specifically, the thickness d of the transfer drum 10 is 0.5 to 1.5 mm (representative value: 1.0 mm), and the diameter is 50 to 170 mm (representative value: 160 mm). The size of the chip-type electronic component 70 is, for example, L: 1.0 to 2.0 mm × W: 0.5 to 1.2 mm × T: 0.5 to 0.95 mm.
[0029]
As a result, the chip-type electronic component 70 being transported has both ends in the transport drum thickness direction, that is, the external terminals protrude from the edge of the transport drum 10, so the chip-type electronic component 70 is connected with the CCD camera from the transport drum thickness direction. It is possible to inspect the both end faces of 70 and to inspect electrical characteristics with a measurement probe. In particular, in the case of the present embodiment, the outer peripheral surface 30a of the fixed base 30 is located on the inner side of the outer peripheral surface 10a of the transfer drum 10, so that the measurement probe is connected to the external terminal of the chip-type electronic component 70 from the fixed base 30 side. It becomes possible to make it contact.
[0030]
A drive motor (not shown) for rotating the transport disk 55 is disposed on the lower surface side of the transport disk 55. The horizontally arranged transfer disks 55 are arranged close to each other below the vertically arranged transfer drum 10 with a desired interval R.
[0031]
The transport drum 10 and the transport disk 55 have a structure in which the outermost periphery does not enter into another rotation region (a structure that does not interfere). Therefore, the transfer drum 10 and the transfer disk 55 can always be rotated independently of each other and the processing speed of the chip-type electronic component 70 can be improved.
[0032]
Further, the transfer disk 55 does not determine in advance the position at which the chip-type electronic component 70 is gripped or sucked and held, and the chip-type electronic component 70 is appropriately placed at any position on the outer peripheral edge. do it. Therefore, it is not necessary to align the suction drum 11 with the suction holding hole 11 of the transport drum 10 and it is not necessary to rotate the transport drum 10 and the transport disk 55 in synchronization.
[0033]
The transfer disk 55 is made of a transparent material such as glass or resin. In this way, by configuring the transfer disk 55 with a transparent body, the bottom surface of the chip-type electronic component 70 placed on the upper surface 55 a of the transfer disk 55 passes through the transfer disk 55 from the lower side of the transfer disk 55. Appearance inspection can be performed.
[0034]
Next, the operation of the product inspection apparatus having the above configuration will be described.
As shown in FIG. 1, the chip-type electronic components 70 aligned by the vibration type ball feeder 61 are sequentially vibrated or air-flowed to the position of the delivery mechanism unit 63 by the linear feeder 62. The delivery mechanism part 63 has an arm or the like, and the chip-type electronic component 70 is brought close to the outer peripheral surface 10 a of the transfer drum 10 with this arm. The suction holding hole 11 at a position facing the delivery mechanism portion 63 of the transfer drum 10 is decompressed by the vacuum pump and the chip electronic component 70 is sucked and held in the suction holding hole 11 in accordance with the proximity timing. The delivery mechanism unit 63 may deliver the chip-type electronic component 70 to the transport drum 10 with compressed air.
[0035]
The chip-type electronic component 70 delivered to the transfer drum 10 is subjected to visual inspection and electrical characteristic measurement inspection of both end surfaces of the chip-type electronic component 70 while being continuously positioned and conveyed. The chip-type electronic component 70 on the transport drum 10 is held in a state in which the longitudinal direction of the chip is orthogonal to the rotation direction of the transport drum 10, and the both end surfaces and their ridge lines (eight) are captured by the CCD camera. Appearance inspection is performed. The conveyance speed is about 800 m / min, for example. The chip-type electronic component 70 that has been inspected is transported to the delivery area. The non-defective chip-type electronic component 70 that has come to the position facing the transport disk 55 is transported by its own weight when the reduced pressure air supply to the air supply groove 32 is cut off and the suction holding force of the transport drum 10 is reduced. The disk 55 is dropped and placed on the upper surface 55a.
[0036]
The transport drum 10 separates the chip-type electronic components 70 one by one and transports them at a constant speed, and is transferred to the transport disk 55 at regular time intervals. Accordingly, the chip-type electronic components 70 on the transport disk 55 can be connected to each other by appropriately setting the rotation speed of the transport disk 55 based on the time interval of the chip-type electronic components 70 transported from the transport drum 10. The interval can be set to an optimum value (constant value) suitable for mass production. As a result, the mutual distance between the chip-type electronic components 70 on the transfer disk 55 is not increased more than necessary, and the chip-type electronic components 70 can be processed efficiently.
[0037]
The position and orientation of the chip-type electronic component 70 transferred onto the transfer disk 55 is corrected by the alignment member 66. Thus, after the transfer disk 55 receives the chip-type electronic components 70, the chip-type electronic components 70 are aligned in a line in the rotation direction of the transfer disk 55. Accordingly, there is no restriction that the posture of the chip-type electronic component 70 must be maintained when the transfer from the transfer drum 10 to the transfer disk 55 is performed.
[0038]
The aligned chip-type electronic components 70 are transported to the inspection area by the transport disk 55, and the remaining four side surfaces and four ridge lines are visually inspected by the CCD camera. The chip-type electronic component 70 that has been inspected is conveyed to a discharge area. The chip-type electronic component 70 that has come to the position facing the take-out mechanism 65 is separated from the transfer disk 55 into a non-defective product and a defective product by driving the solenoid valve and feeding compressed air.
[0039]
The take-out mechanism 64 is installed on the conveying disk 55 side, the defective chip-type electronic component 70 is discharged to the defective tray of the take-out mechanism 64, and the non-defective chip-type electronic component 70 is removed from the take-out mechanism 65. It may be discharged to a good product tray. In this case, in order to prevent a defective product from being mixed into a non-defective product, it is preferable that the take-out mechanism 64 and the take-out mechanism 65 are arranged in this order along the rotation direction of the transport disk 55. Further, all the chip-type electronic components 70 that could not be discharged to the take-out mechanism section are collected in a take-out mechanism section (not shown) provided at the subsequent stage of the take-out mechanism section 65 and returned to the parts feeder 60 again.
[0040]
By the above method, inspection and measurement can be performed while efficiently and smoothly transporting the chip-type electronic component 70.
[0041]
Note that the chip-type electronic component handling apparatus and the chip-type electronic component handling method according to the present invention are not limited to the above embodiments. Various modifications can be made within the scope of the gist. For example, the transport drum 10 is not necessarily disposed perpendicular to the transport disk 55, and may be disposed in parallel or inclined.
[0042]
Further, the chip-type electronic component 70 is first supplied to the transfer disk 55, and the appearance inspection of the four side surfaces and the four ridge lines is performed. Thereafter, the chip-type electronic component 70 is pulled up by an arm with a suction pad or the like and sucked and held on the outer peripheral surface 10a of the transfer drum 10 to perform an appearance inspection and an electrical property measuring device for both end faces and their ridge lines (eight). You may do it. In this case, however, the transport drum 10 and the transport disk 55 need to be rotated in synchronization with each other in accordance with the position of the suction holding hole 11 formed in the outer peripheral surface 10a of the transport drum 10.
[0043]
Furthermore, the number of surface inspections and the number of ridge lines performed by the transport drum 10 and the transport disk 55 can be arbitrarily set according to the installation of the CCD camera.
[0044]
【The invention's effect】
As is clear from the above description, the transport drum and the transport disk have a structure in which the outermost circumferences do not enter into other rotation regions (structures that do not interfere with each other). Therefore, the transfer drum and the transfer disk can always be rotated independently of each other and the processing speed of the chip-type electronic component can be improved. In addition, the transfer disk does not have a predetermined position for gripping or holding the chip-type electronic component in advance, and the chip-type electronic component may be appropriately placed at any position on the outer peripheral edge. . Therefore, it is not necessary to align the position with the transport drum, and it is not necessary to rotate the transport drum and the transport disk in synchronization. As a result, there are few restrictions on the operation during delivery of the chip-type electronic component, and the chip-type electronic component can be processed efficiently at high speed.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an embodiment of a chip-type electronic component handling apparatus according to the present invention.
FIG. 2 is a partial horizontal sectional view of the transfer drum shown in FIG.
FIG. 3 is a partially cutaway front view of the transfer drum shown in FIG. 1;
4 is an enlarged cross-sectional view of a portion A shown in FIG.
FIG. 5 is a schematic configuration diagram showing a conventional chip-type electronic component handling apparatus.
FIG. 6 is a schematic configuration diagram showing another conventional chip-type electronic component handling apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Conveying drum 10a ... Outer peripheral surface 55 ... Conveying disk 55a ... Upper surface (main surface)

Claims (6)

A transfer drum for holding and transporting chip-type electronic components on the outer peripheral surface;
A chip-type electronic component, and a transport disk for transporting the chip-type electronic component mounted on a substantially horizontal main surface;
Arranging the transfer drum and the transfer disk at a desired interval, and transferring the chip-type electronic component between the outer peripheral surface of the transfer drum and the main surface of the transfer disk;
A device for handling chip-type electronic components. 2. The chip-type electronic component handling apparatus according to claim 1, wherein the transport drum and the transport disk are independently driven to rotate without being synchronized with each other. The chip-type electronic component handling apparatus according to claim 1, wherein the transfer disk is made of a transparent body. The chip-type electronic component according to any one of claims 1 to 3, wherein an electrical measurement or an appearance inspection is performed on the chip-type electronic component held on the transport drum or the transport disk. Handling equipment. 5. An alignment member for aligning chip-type electronic components in a line in a rotation direction of the transfer disk is provided on a main surface of the transfer disk. Chip-type electronic component handling equipment. A chip-type electronic component handling method, wherein the chip-type electronic component held on the outer peripheral surface of the transfer drum is transferred by air transfer onto a main surface edge of a transfer disk disposed horizontally.

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