WO2012073284A1 - Electronic component inspecting apparatus and parts feeder - Google Patents

Electronic component inspecting apparatus and parts feeder Download PDF

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Publication number
WO2012073284A1
WO2012073284A1 PCT/JP2010/006993 JP2010006993W WO2012073284A1 WO 2012073284 A1 WO2012073284 A1 WO 2012073284A1 JP 2010006993 W JP2010006993 W JP 2010006993W WO 2012073284 A1 WO2012073284 A1 WO 2012073284A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
supply path
bowl
chute
parts feeder
Prior art date
Application number
PCT/JP2010/006993
Other languages
French (fr)
Japanese (ja)
Inventor
木村浩之
Original Assignee
上野精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Priority to PCT/JP2010/006993 priority Critical patent/WO2012073284A1/en
Priority to JP2012546572A priority patent/JP5586072B2/en
Publication of WO2012073284A1 publication Critical patent/WO2012073284A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02Devices for feeding articles or materials to conveyors
    • B65G47/04Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/12Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
    • B65G47/14Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
    • B65G47/1407Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl
    • B65G47/1414Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl by means of movement of at least the whole wall of the container
    • B65G47/1421Vibratory movement

Definitions

  • the present invention relates to an electronic component inspection apparatus that performs various processes while supplying and transporting an electronic component to a transport mechanism, and a parts feeder that supplies the electronic component to the transport mechanism.
  • Post-processing includes marking processing, appearance inspection, electrical property inspection, lead molding processing, classification of electronic components, and packaging.
  • the electronic component inspection apparatus includes various process processing mechanisms on a processing path, a transport mechanism that sequentially aligns and transports electronic components to the process processing mechanism, and a parts feeder that supplies the electronic components to the transport mechanism (for example, patents). Reference 1).
  • the parts feeder extends directly below the transport mechanism and aligns and transports the electronic components to just below the transport mechanism with the front and back surfaces aligned (see, for example, Patent Document 2).
  • This parts feeder is composed of a bowl part, a shooter part and an escape part.
  • the bowl portion is a mortar-shaped container, and a U-shaped groove that rises to the upper edge is spirally engraved on the inner surface.
  • the shooter has a U-shaped rail on a straight line.
  • the escape part reciprocates in parallel from the end of the shooter part to directly below the transport mechanism.
  • the groove of the bowl part and the rail of the shooter part are connected to each other and serve as a supply path for aligning and conveying the electronic components. By vibrating the bowl part and the shooter part respectively, the electronic component is guided to the escape part by the U-shaped groove and rail.
  • the bowl portion and the shooter portion are prepared in advance with supply paths that match the shape and size of the electronic components to be supplied.
  • the bowl part and the chute part were exchanged.
  • the entire parts feeder unit including the bowl and chute is replaced. Therefore, the inspection of the electronic parts is temporarily interrupted by the replacement work of the whole bowl part, chute part, or parts feeder unit and the adjustment after the replacement, and the production efficiency is lowered, and various bowl parts, chute parts, and Since it is necessary to prepare a parts feeder unit, it also contributed to the high cost.
  • the present invention has been proposed in order to solve the above-described problems of the prior art, and provides an electronic component inspection apparatus and a parts feeder that eliminates electronic component switching work as much as possible and improves production efficiency.
  • the purpose is to do.
  • An electronic component inspection apparatus is an electronic component inspection apparatus that performs various process processes while conveying an electronic component, and includes various process processing means arranged alongside the processing path of the electronic component, Conveying means for conveying the electronic component to various process processing means, a bowl portion for accommodating the electronic component, a chute portion disposed between the bowl portion and the conveying means, and the chute from the bowl portion And a supply path for aligning and supplying the electronic components to the conveying means, and the supply path in the bowl portion spirals the inner peripheral surface from the bottom surface to the upper edge of the bowl portion. It is formed by cutting out in a letter shape, and has a step portion that supports the side surface of the electronic component, and a back surface portion that supports the front surface or the back surface.
  • a barrier projecting upward facing the stepped portion, and the barrier is provided in a direction toward the back surface, It has a long slot in the direction toward the step, and any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step.
  • any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step.
  • it may be arranged at one point of the supply path.
  • the supply path of the chute portion has a variable width, and includes a base that forms a bottom surface, and a fixed guide and a movable guide that are disposed opposite to the base and that form both side surfaces.
  • the fulcrum may be pivotally supported at one end of a lever pivotally supported by the base, and may be moved in the width direction according to an arrangement angle of the lever with respect to the supply path.
  • the parts feeder according to the present invention is a parts feeder that supplies the electronic components to an electronic component inspection apparatus that performs various process processes while conveying the electronic components by a conveying means, and a bowl portion that houses the electronic components And a chute portion disposed between the bowl portion and the conveying means, and a supply path for supplying the electronic components in alignment with the conveying means from the bowl portion through the chute portion,
  • the supply path in the bowl portion is formed by spirally cutting an inner peripheral surface into an L shape from the bottom surface to the upper edge of the bowl portion, and a step portion that supports the side surface of the electronic component, and a front surface or a back surface It has the back surface part which supports this, It is characterized by the above-mentioned.
  • a barrier projecting upward facing the stepped portion, and the barrier is provided in a direction toward the back surface, It has a long slot in the direction toward the step, and any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step.
  • any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step.
  • it may be arranged at one point of the supply path.
  • the supply path of the chute portion has a variable width, and includes a base that forms a bottom surface, and a fixed guide and a movable guide that are disposed opposite to the base and that form both side surfaces.
  • the fulcrum may be pivotally supported at one end of a lever pivotally supported by the base, and may be moved in the width direction according to an arrangement angle of the lever with respect to the supply path.
  • each process processing mechanism can be performed without requiring a switching operation. Can be supplied. Therefore, the burden and time of the switching work are reduced, and the production efficiency is improved.
  • FIG. It is a figure which shows schematic structure of an electronic component inspection apparatus. It is a figure which shows schematic structure of a conveyance mechanism. 2 is a schematic diagram showing an electronic component D.
  • FIG. It is a top view of a parts feeder. It is a side view of a parts feeder. It is sectional drawing of a bowl part. It is sectional drawing which shows a barrier. It is sectional drawing of a chute
  • FIG. 1 is a diagram showing a schematic configuration of an electronic component inspection apparatus.
  • FIG. 2 is a diagram illustrating a schematic configuration of the transport mechanism.
  • FIG. 3 is a schematic diagram showing the front and back of the electronic component D. As shown in FIG.
  • the electronic component inspection apparatus 1 is an apparatus that performs various process processes while aligning and conveying the electronic component D.
  • the electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of semiconductor elements include transistors, integrated circuits, resistors, capacitors, and the like.
  • the various process processes are mainly inspection processes after each assembly process such as dicing, mounting, bonding, and sealing, and include marking, visual inspection, test contact, sorting and sorting, and packing process. .
  • the electronic component inspection apparatus 1 enables inspection of electronic components D having different sizes by simple adjustment.
  • the electronic component inspection apparatus 1 includes various process processing mechanisms 4 for the electronic component D and a transport mechanism that transports the electronic components D to the various process processing mechanisms 4.
  • the transport mechanism includes a turntable 21.
  • the center of the turntable 21 is supported by a drive shaft of a direct drive motor 22 disposed below.
  • the turntable 21 rotates intermittently at a predetermined angle as the direct drive motor 22 is driven.
  • a plurality of holding means for holding the electronic component D are attached to the outer peripheral end of the turntable 21 at regular intervals along the outer periphery of the turntable 21.
  • the outer periphery of the turntable 21 serves as a processing path for the electronic component D.
  • the transport mechanism holds the electronic component D by the holding means, aligns it on the outer periphery of the turntable 21, and rotates the turntable 21 to transport the electronic component D in the outer peripheral direction.
  • the arrangement interval of the holding means is equal to the rotation angle of one pitch of the turntable 21.
  • the holding means is a suction nozzle 31 that sucks and separates the electronic component D.
  • the suction nozzle 31 is movable up and down with respect to the turntable 21 by a support portion 32 attached to the outer peripheral end of the turntable 21.
  • a drive unit 33 including an operation rod 34 is disposed immediately above the suction nozzle 31. When the operation rod 34 contacts the upper end of the suction nozzle 31 and is pushed downward, the suction nozzle 31 is lowered.
  • the inside of the pipe of the suction nozzle 31 communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle 31 sucks the electronic component D by generating a negative pressure and releases the electronic component D by vacuum break.
  • Various process processing mechanisms 4 surround the turntable 21 and are arranged at equal intervals in the outer circumferential direction.
  • the arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the turntable 21.
  • the arrangement positions of the various process processing mechanisms 4 coincide with the stop positions P of the holding means.
  • Each of the various transport processing mechanisms is arranged at each stop position P. If the number of stop positions is equal to or greater than the number of transport processing mechanisms 4, these numbers may not be the same, and there may be a stop position P where the transport processing mechanism 4 is not disposed.
  • the various process processing mechanisms 4 for example, the parts feeder 41, the test contact device 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, the taping unit 47, and the discharge of defective products are sequentially performed in the rotation direction of the turntable 21.
  • a device 48 is arranged.
  • the parts feeder 41 is a device that supplies the electronic component D to the electronic component inspection apparatus 1, and supplies a large number of electronic components D in a line up to just below the outer peripheral edge of the turntable 21.
  • the test contact device 42 has a contact that is a plate-like metal such as beryllium copper, and contacts the lead D1 of the electronic component D to cause a current to flow or a voltage to be applied. Measure and inspect electrical characteristics such as voltage, current, resistance, or frequency.
  • the marking unit 43 has a lens for laser irradiation facing the electronic component D, and performs marking by irradiating the electronic component D with a laser.
  • the appearance inspection apparatus 45 has a camera, images the electronic component D, and inspects the presence or absence of an electrode shape, surface defects, scratches, dirt, foreign matter, and the like of the electronic component D from the image.
  • the classification / sorting mechanism 46 classifies the electronic component D into a defective product and a non-defective product according to the results of the appearance inspection and the electrical property inspection, and classifies and shoots according to the level.
  • the taping unit 47 intermittently transports the carrier tape in which the storage pocket of the electronic component D is formed by embossing, and stores the electronic component D determined to be non-defective in the storage pocket.
  • the defective product discharge device 48 discharges the electronic component D that has not been taped and packed from the electronic component inspection device 1.
  • FIG. 4 is a top view of the parts feeder 41
  • FIG. 5 is a side view of the parts feeder 41.
  • the bowl portion 5 and the chute portion 6 are connected to each other, and the escape portion 7 is further arranged at the end of the chute portion 6.
  • the bowl part 5 is supported by the bowl vibrating body 5a.
  • the chute part 6 is supported by the chute vibrating body 6a.
  • the bowl vibrating body 5a and the chute vibrating body 6a have a combination of an electromagnet and a movable core inside, and vibrate by energization control to the electromagnet.
  • the bowl portion 5 is torsionally vibrated with the vibration of the bowl vibrating body 5a.
  • the chute portion 6 vibrates in an oblique direction that intersects with the extending direction at an angle along with the vibration of the chute vibrator 6a.
  • the bowl portion 5 is a mortar-shaped container and is a storage unit that stores the electronic component D.
  • a supply path 51 is engraved on the inner surface of the bowl portion 5 so as to climb the inner wall surface spirally from the bottom portion toward the upper edge.
  • the electronic parts D are aligned in a row while being guided by the supply path 51 by the torsional vibration of the bowl part 5 and climb the inner wall surface of the bowl part 5.
  • a sensor unit 53 is provided on the supply path 51 of the bowl unit 5.
  • the sensor unit 53 detects the front and back of the electronic component D, and separates the electronic component D from the supply path 51 according to the detection result of the front and back of the electronic component D and returns it to the inside of the bowl unit 5.
  • the sensor unit 53 includes a light projecting / receiving sensor.
  • the front and back of the electronic component D are detected according to the amount of reflection from the sensor area. Since the lead D1 is exposed on the back surface of the electronic component D, the reflection amount is higher than that on the front surface.
  • the sensor unit 53 includes a blower hole that blows air so as to cross the supply path 51 as an excluding means for separating the electronic component D from the supply path 51.
  • the blower hole blows air supplied from a compressor or cylinder (not shown) to the electronic component D and blows it into the bowl portion 5 by air pressure.
  • the sensor unit 53 is electrically connected to the sensor amplifier 8.
  • the sensor amplifier 8 amplifies the signal output from the sensor unit 53.
  • the supply and shutoff of air to the blower hole are switched by the electromagnetic valve 9.
  • the electromagnetic valve 9 turns on or off the pneumatic circuit that leads to the blower hole according to the presence or absence of the signal amplified by the sensor amplifier 8.
  • the presence / absence of a signal can be restated as the presence / absence of a signal exceeding a predetermined threshold.
  • the supply path 51 is formed by cutting out the inner wall surface in a substantially L shape. That is, the supply path 51 of the bowl part 5 is constituted by a step part 51a that forms the bottom surface and a back part 51b that rises from the step part 51a and leans against the electronic part D, and the upper part of the electronic part D is released.
  • the step portion 51a supports one side surface of the electronic component D.
  • the back surface portion 51b supports the front surface or the back surface of the electronic component D.
  • the step portion 51a becomes narrower as it climbs upward.
  • the shape of the supply path 51 of the bowl portion 5 enables various electronic components D having different sizes to be conveyed without replacement.
  • a barrier 52 protruding so as to face the stepped part 51 a above the supply path 51 at a single point is provided in front of the sensor part 53.
  • the barrier 52 is in contact with the upper part of the back surface portion 51b.
  • a predetermined space is formed between the barrier 52 and the step portion 51 a of the supply path 51.
  • the barrier 52 is provided with a long hole 52a extending toward the back surface portion 51b.
  • the long hole 52a is formed long in the direction toward the stepped portion 51a.
  • a jig pin 52b is detachably attached to one point of the supply path 51.
  • the jig pin 52b protrudes in parallel with the stepped portion 51a from the upper end of the back surface portion 51b toward the inside of the bowl portion 5.
  • the barriers 52 abut against other electronic components D stacked on the electronic components D as a result of conveyance by torsional vibration, and are rearranged in a row. As shown in FIGS. 7A and 7B, the lower end position of the barrier 52 can be adjusted according to the diameter of the jig pin 52b. Various diameters of the jig pin 52b are prepared in advance according to the size of the electronic component D supplied to the electronic component inspection apparatus 1.
  • the chute part 6 is a linear rail, and a supply path 61 is provided along the straight line.
  • the supply path 61 of the chute unit 6 is connected to the end of the supply path 51 of the bowl unit 5 at the start end.
  • the supply path 61 of the chute 6 is defined by a base 62, a fixed guide 63 and a movable guide 64.
  • the base 62 defines the bottom surface of the supply path 61.
  • the fixed guide 63 and the movable guide 64 are provided on the upper surface of the base 62 and face each other at a predetermined distance to define the side wall of the supply path 61.
  • the fixed guide 63 is fixed on the base 62, and the movable guide 64 is movable on the base 62 in the width direction of the supply path 61.
  • the movable guide 64 is pivotally supported on the action point 65 a of the S-shaped lever 65.
  • the action point 65 a is set at one end of the S-shaped lever 65.
  • the lever 65 has a bent portion closest to the action point 65 a as a fulcrum 65 b, and the fulcrum 65 b is pivotally supported by the base 62.
  • the other end of the lever 65 different from the action point 65a is a force point 65c.
  • a fixing member 65d is fixed to the base 62 at a position spaced apart from the force point 65c of the lever 65 by a predetermined distance.
  • Jig pins 65e with various diameters can be inserted between the fixing member 65d and the force point 65c.
  • a fixing member 66b is fixed at a position spaced a predetermined distance from the recess 66a.
  • the fixing member 66b faces the recess 66a in a direction orthogonal to the supply path 61.
  • the fixing member 66 b extends from the fixed guide 63 across the supply path 61 so as not to obstruct the supply path 61.
  • Jig pins 66c of various diameters can be inserted between the recess 66a and the fixing member 66b.
  • the arrangement angle of the lever 65 with respect to the supply path 61 is changed depending on the diameter of the jig pin 65e, and the position of the movable guide 64 is displaced in the width direction of the supply path 61 accordingly. That is, the supply path 61 defined by the fixed guide 63, the movable guide 64, and the base 62 is inserted with jig pins 65e and 66c having a diameter corresponding to the size of the electronic component D, and the width thereof is adjusted.
  • the electronic parts D of various sizes can be transported without replacement of parts.
  • the escape part 7 has a stopper for controlling the stop and advance of the electronic component D at the end of the supply path 61 of the chute part 6 and a placement space for placing the electronic part D. It moves in parallel from the end to just below the suction nozzle 31 supported by the turntable 21.
  • Such an electronic component inspection apparatus 1 operates as follows. First, one cycle of the operation of the electronic component inspection apparatus 1 includes conveyance and process processing. In the conveyance, the electronic component D is received, the electronic component D is moved, and the electronic component D is transferred in order.
  • the suction nozzle 31 In receiving the electronic component D, the suction nozzle 31 is lowered, the electronic component D on the stage of the process processing mechanism 4 is sucked, and the suction nozzle 31 is lifted in order. In other words, the movement of the electronic component D is rotation of the turntable 21 by a predetermined angle, that is, movement of the suction nozzle 31 to the next stop position P. In the delivery of the electronic component D, the suction nozzle 31 is lowered, the electronic component D is detached from the stage of the process processing mechanism 4, and the suction nozzle 31 is lifted in order.
  • the turntable 21 rotates by a predetermined angle every cycle and stops for a predetermined time.
  • Each suction nozzle 31 sequentially moves to each stop position P on the outer periphery of the turntable 21 by intermittent rotation of the turntable 21.
  • any kind of process processing mechanism 4 is arranged.
  • the suction nozzle 31 descends toward the stage of the process processing mechanism 4 to detach the electronic component D.
  • the process processing mechanism 4 receives the electronic component D
  • the process processing mechanism 4 processes the electronic component D.
  • the suction nozzle 31 descends again toward the stage, sucks the electronic component D, and rises.
  • the turntable 21 moves to the next cycle and rotates by a predetermined angle.
  • the electronic component D is first accommodated in the bowl portion 5.
  • the electronic components D in the bowl portion 5 are aligned in a line while climbing on the inner wall surface of the bowl portion 5 while being guided by the supply path 51 by torsional vibration.
  • the supply path 51 of the bowl portion 5 is L-shaped and opened upward, the height of the electronic component D is not limited, and various electronic components D can be conveyed.
  • the electronic component D stacked on the other electronic component D is brought into contact with the barrier 52 and dropped into the bowl portion 5.
  • the height between the barrier 52 and the stepped portion 51a is adjusted so as to provide a margin of about 0.2 mm when various electronic components D pass under the barrier 52, for example.
  • This height is obtained by adding the height from the stepped portion 51a at the position where the jig pin 52b and the back surface portion 51b are in contact with the diameter of the jig pin 52b, and from the upper end of the long hole 52a of the barrier 52 to the barrier 52. It is a value obtained by subtracting the length to the lower end. That is, the height adjustment of the barrier 52 is achieved by changing the diameter of the jig pin 52b.
  • the front and back of the electronic component D that passes through the sensor unit 53 is detected.
  • the electromagnetic valve 9 is turned on.
  • the solenoid valve 9 is turned on, the pneumatic circuit communicates with the blower hole, and air blows out from the blower hole.
  • the solenoid valve 9 When the electronic component D is conveyed facing the surface, the solenoid valve 9 remains off and the blower hole and the pneumatic circuit are shut off, so that air does not blow out from the blower hole.
  • the component D passes through the sensor unit 53.
  • the electronic components D that have passed through the sensor unit 53 move to the supply path 61 of the chute unit 6, and are aligned in a row while being guided by the supply path 61 by the vibration of the chute unit 6 and reach the end.
  • the width of the supply path 61 of the chute unit 6 is adjusted in advance according to the size of the electronic component D.
  • the width of the supply path 61 is determined by the diameter of the jig pin 66 c that is brought into contact with each recess 66 a and the force point 65 c of the lever 65.
  • the jig pin 66c is inserted between the recess 66a and the fixing member 66b, the recess 66a and the fixing member 66b are separated according to the diameter of the jig pin 66c. That is, the movable guide 64 is pushed away in the width direction according to the diameter of the jig pin 66c.
  • the jig pin 65e inserted between the force point 65c of the lever 65 and the fixing member 65d rotates the lever 65 by an amount corresponding to its diameter around the fulcrum 65b. Accordingly, the action point 65 a of the lever 65 rotates in the width direction of the supply path 61.
  • the movable guide 64 pivotally supported by the lever 65 moves in the width direction by the rotation of the lever 65. That is, the width adjustment of the supply path 61 of the chute 6 is achieved by changing the diameters of the jig pins 65e and 66c.
  • the electronic component D that has reached the end of the supply path 61 of the chute unit 6 is controlled to stop and advance by the stopper of the escape unit 7, moves to the placement space of the escape unit 7 one by one, and immediately below the suction nozzle 31. Moving.
  • the electronic component D is held by the suction nozzle 31 that is located at the end of the supply path of the parts feeder 41 and has moved right up in the first cycle.
  • the electronic component D held at the end of the conveyance path of the parts feeder 41 is sequentially supplied to the test contact 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, and the taping unit 47 for each subsequent cycle. A process is performed.
  • the electronic component D that has not been packed is supplied to the defective product discharge device 48 and discharged from the electronic component inspection device 1.
  • the supply path 51 formed in the bowl portion 5 that accommodates the electronic component D has a spiral inner periphery from the bottom surface to the upper edge.
  • the surface is cut into an L shape, and has a stepped portion 51a that supports the side surface of the electronic component D and a back surface portion 51b that supports the front surface or the back surface.
  • the height of the electronic component D is not limited, and any size electronic component D can be supplied to each process processing mechanism 4 without requiring a switching operation. Therefore, the burden and time of the switching work of the electronic component inspection apparatus 1 are reduced, and the production efficiency is improved.
  • a barrier 52 projecting upward facing the stepped portion 51 a is further disposed at one point of the supply path 51 of the bowl portion 5.
  • the barrier 52 is provided in a direction toward the back portion 51b, has a long hole 52a in the direction toward the step portion 51a, and has a jig pin with various diameters so as to protrude from the back portion 51b in parallel with the step portion 51a. Any one of 52b penetrates the long hole 52a and is detachably attached to be arranged at one point of the supply path 51.
  • this barrier 52 whatever size electronic component D is supplied, only the electronic component D stacked on the other electronic component D can be easily changed by changing the diameter of the jig pin 52 b. Can be returned to. Therefore, even if the supply path 51 is cut out in an L shape, the electronic components D can be accurately aligned and supplied to the transport mechanism.
  • the supply path 61 of the chute unit 6 is configured by a base 62 that forms a bottom surface, and a fixed guide 63 and a movable guide 64 that form both side surfaces.
  • the lever 65 is pivotally supported at one end of the lever 65 and is moved in the width direction according to the arrangement angle of the lever 65 with respect to the supply path 61.
  • the transport mechanism may be a linear transport system, or a plurality of turntables 21.
  • a single transport path may be configured.
  • a holding means instead of the suction nozzle 31 for sucking and releasing the electronic component D by generation and breakage of vacuum, an electrostatic suction method, a Bernoulli chuck method, or a chuck mechanism for mechanically holding the electronic component D is arranged. May be.
  • the various process processing mechanisms 4 are not limited to the types described above, and can be replaced with various process processing mechanisms 4, and the arrangement order can be changed as appropriate.

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  • Mechanical Engineering (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Sorting Of Articles (AREA)

Abstract

Provided is an electronic component inspecting apparatus whereby operations of switching electronic components are eliminated as much as possible, and production efficiency is improved. A parts feeder is also provided. A supply path (51) in a bowl section (5) that contains electronic components (D) is formed by spirally cutting out in an L-shape the inner circumferential surface of the bowl section (5) from the bottom surface to the upper edge, and the supply path has a step part (51a) that supports the side surface of the electronic components (D), and a rear surface part (51b) that supports the front surface or the rear surface of the electronic components. The electronic components (D) on the supply path (51) are surrounded merely by the step part (51a) and the rear surface part (51b), with the top opened, and the height of the electronic components (D) is not limited.

Description

電子部品検査装置及びパーツフィーダElectronic component inspection device and parts feeder
 本発明は、電子部品を搬送機構に供給して搬送しながら各種処理を施す電子部品検査装置、及び電子部品を搬送機構に供給するパーツフィーダに関する。 The present invention relates to an electronic component inspection apparatus that performs various processes while supplying and transporting an electronic component to a transport mechanism, and a parts feeder that supplies the electronic component to the transport mechanism.
 半導体素子等の電子部品は、ダイシング、マウンティング、ボンディング、及びシーリング等の各組み立て工程を経て個片に分離された後、各種検査等の後工程が行われ、テープやコンテナチューブなどに梱包されて出荷される。後工程としては、マーキング処理、外観検査、電気特性検査、リード成形処理、電子部品の分類、及び梱包が挙げられる。   Electronic components such as semiconductor elements are separated into individual pieces through each assembly process such as dicing, mounting, bonding, and sealing, and then subjected to post-processes such as various inspections and packed in tapes, container tubes, etc. Shipped. Post-processing includes marking processing, appearance inspection, electrical property inspection, lead molding processing, classification of electronic components, and packaging.
この後工程は、主に電子部品を搬送しながら各種の検査等を行う電子部品検査装置によって実施される。電子部品検査装置は、処理経路上の各種の工程処理機構と、電子部品を工程処理機構に順に整列搬送する搬送機構と、搬送機構に電子部品を供給するパーツフィーダにより構成される(例えば、特許文献1参照。)。   This post-process is mainly performed by an electronic component inspection apparatus that performs various inspections while conveying the electronic component. The electronic component inspection apparatus includes various process processing mechanisms on a processing path, a transport mechanism that sequentially aligns and transports electronic components to the process processing mechanism, and a parts feeder that supplies the electronic components to the transport mechanism (for example, patents). Reference 1).
パーツフィーダは、搬送機構の直下に延び、表裏をいずれかに揃えて電子部品を搬送機構の直下まで整列搬送する(例えば、特許文献2参照。)。   The parts feeder extends directly below the transport mechanism and aligns and transports the electronic components to just below the transport mechanism with the front and back surfaces aligned (see, for example, Patent Document 2).
このパーツフィーダは、ボウル部とシュータ部とエスケープ部とから構成されている。ボウル部は、すり鉢状の容器であり、内面に上縁へ登るコの字状の溝が螺旋状に刻設されている。シュータ部は、直線上のコの字状のレールを有する。エスケープ部は、シュータ部の終端から搬送機構の直下までを往復平行運動する。ボウル部の溝とシュータ部のレールは、連接されており、電子部品を整列搬送する供給経路となる。ボウル部とシュータ部をそれぞれ振動させることにより、電子部品をコの字状の溝とレールでエスケープ部まで案内する。  This parts feeder is composed of a bowl part, a shooter part and an escape part. The bowl portion is a mortar-shaped container, and a U-shaped groove that rises to the upper edge is spirally engraved on the inner surface. The shooter has a U-shaped rail on a straight line. The escape part reciprocates in parallel from the end of the shooter part to directly below the transport mechanism. The groove of the bowl part and the rail of the shooter part are connected to each other and serve as a supply path for aligning and conveying the electronic components. By vibrating the bowl part and the shooter part respectively, the electronic component is guided to the escape part by the U-shaped groove and rail.
特開2009-286490号公報JP 2009-286490 A 特開2004-182397号公報JP 2004-182397 A
 近年、各種機器の電子化が進展し、また個性ある電子機器の差別化競争が熾烈を極める中、電子機器に使用される電子部品も例外ではなく、多種多様な種類、形状、大きさを有する電子部品が製造されるに至っている。   In recent years, with the progress of computerization of various devices and the intense differentiation competition of unique electronic devices, electronic components used in electronic devices are no exception, and have a wide variety of types, shapes, and sizes. Electronic parts have been manufactured.
製造する電子部品の種類を切り替える場合には、電子部品に合わせた設備の調整や部品交換が必要となる。電子部品の切り替え作業は、生産効率の向上を求める場合には、できるだけ簡便且つ短期間で終了可能であることが望ましい。   When switching the type of electronic component to be manufactured, it is necessary to adjust the equipment and replace the component in accordance with the electronic component. When the improvement of production efficiency is required, it is desirable that the electronic component switching operation can be completed as simply as possible and in a short period of time.
しかし、電子部品検査装置においては、ボウル部とシュータ部は、供給する電子部品の形状や大きさに合わせられた供給経路を有するものがそれぞれ予め用意されており、検査しようとする電子部品に合わせてボウル部とシュート部を交換するようにしていた。ボウル部とシュート部を備えるパーツフィーダユニットを丸ごと交換するケースも多い。そのため、このボウル部、シュート部、又はパーツフィーダユニット丸ごとの交換作業と交換後の調整により電子部品の検査は一時的に中断されて生産効率が落ちるとともに、予め各種のボウル部、シュート部、及びパーツフィーダユニットを用意しておく必要があるため、コスト高の一因ともなっていた。   However, in the electronic component inspection apparatus, the bowl portion and the shooter portion are prepared in advance with supply paths that match the shape and size of the electronic components to be supplied. The bowl part and the chute part were exchanged. In many cases, the entire parts feeder unit including the bowl and chute is replaced. Therefore, the inspection of the electronic parts is temporarily interrupted by the replacement work of the whole bowl part, chute part, or parts feeder unit and the adjustment after the replacement, and the production efficiency is lowered, and various bowl parts, chute parts, and Since it is necessary to prepare a parts feeder unit, it also contributed to the high cost.
 本発明は、上記のような従来技術の問題点を解決するために提案されたもので、電子部品の切り替え作業を極力排除し、生産効率の向上を図った電子部品検査装置及びパーツフィーダを提供することを目的とする。 The present invention has been proposed in order to solve the above-described problems of the prior art, and provides an electronic component inspection apparatus and a parts feeder that eliminates electronic component switching work as much as possible and improves production efficiency. The purpose is to do.
 本発明に係る電子部品検査装置は、電子部品を搬送しながら各種の工程処理を行う電子部品検査装置であって、前記電子部品の処理経路に並んで配置される各種の工程処理手段と、前記各種の工程処理手段に前記電子部品を搬送する搬送手段と、前記電子部品を収容するボウル部と、前記ボウル部と前記搬送手段との間に配置されるシュート部と、前記ボウル部から前記シュート部を経て、前記搬送手段に前記電子部品を整列させて供給する供給経路と、を備え、前記ボウル部内の前記供給経路は、前記ボウル部の底面から上縁へ螺旋状に内周面をL字状に切り欠いて形成され、前記電子部品の側面を支持する段部と、表面若しくは裏面を支持する背面部とを有すること、を特徴とする。   An electronic component inspection apparatus according to the present invention is an electronic component inspection apparatus that performs various process processes while conveying an electronic component, and includes various process processing means arranged alongside the processing path of the electronic component, Conveying means for conveying the electronic component to various process processing means, a bowl portion for accommodating the electronic component, a chute portion disposed between the bowl portion and the conveying means, and the chute from the bowl portion And a supply path for aligning and supplying the electronic components to the conveying means, and the supply path in the bowl portion spirals the inner peripheral surface from the bottom surface to the upper edge of the bowl portion. It is formed by cutting out in a letter shape, and has a step portion that supports the side surface of the electronic component, and a back surface portion that supports the front surface or the back surface.
前記L字状に切り欠いて形成された前記供給経路の一地点に、前記段部と対向する上方に張り出した障壁を更に備え、前記障壁は、前記背面部に向かう方向に貫設され、前記段部に向かう方向に長い長穴を有し、前記段部と平行に前記背面部から突き出すように各種径の治具ピンの何れかが、前記長穴を貫通して着脱可能に取り付けられることにより、前記供給経路の一地点に配置されるようにしてもよい。   Further provided at one point of the supply path formed by cutting out in the L-shape is a barrier projecting upward facing the stepped portion, and the barrier is provided in a direction toward the back surface, It has a long slot in the direction toward the step, and any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step. Thus, it may be arranged at one point of the supply path.
前記シュート部の前記供給経路は、幅が可変であり、底面を形成するベースと、前記ベース上に対向して配置され、両側面を形成する固定ガイド及び可動ガイドと、を備え、前記可動ガイドは、支点が前記ベースで軸支されたレバーの一端に軸支され、当該レバーの前記供給経路に対する配置角度に応じて前記幅方向に移動するようにしてもよい。   The supply path of the chute portion has a variable width, and includes a base that forms a bottom surface, and a fixed guide and a movable guide that are disposed opposite to the base and that form both side surfaces. The fulcrum may be pivotally supported at one end of a lever pivotally supported by the base, and may be moved in the width direction according to an arrangement angle of the lever with respect to the supply path.
また、本発明に係るパーツフィーダは、電子部品を搬送手段により搬送しながら各種の工程処理を行う電子部品検査装置に前記電子部品を供給するパーツフィーダであって、前記電子部品を収容するボウル部と、前記ボウル部と前記搬送手段との間に配置されるシュート部と、前記ボウル部から前記シュート部を経て、前記搬送手段に前記電子部品を整列させて供給する供給経路と、を備え、前記ボウル部内の前記供給経路は、前記ボウル部の底面から上縁へ螺旋状に内周面をL字状に切り欠いて形成され、前記電子部品の側面を支持する段部と、表面若しくは裏面を支持する背面部とを有すること、を特徴とする。   Further, the parts feeder according to the present invention is a parts feeder that supplies the electronic components to an electronic component inspection apparatus that performs various process processes while conveying the electronic components by a conveying means, and a bowl portion that houses the electronic components And a chute portion disposed between the bowl portion and the conveying means, and a supply path for supplying the electronic components in alignment with the conveying means from the bowl portion through the chute portion, The supply path in the bowl portion is formed by spirally cutting an inner peripheral surface into an L shape from the bottom surface to the upper edge of the bowl portion, and a step portion that supports the side surface of the electronic component, and a front surface or a back surface It has the back surface part which supports this, It is characterized by the above-mentioned.
前記L字状に切り欠いて形成された前記供給経路の一地点に、前記段部と対向する上方に張り出した障壁を更に備え、前記障壁は、前記背面部に向かう方向に貫設され、前記段部に向かう方向に長い長穴を有し、前記段部と平行に前記背面部から突き出すように各種径の治具ピンの何れかが、前記長穴を貫通して着脱可能に取り付けられることにより、前記供給経路の一地点に配置されるようにしてもよい。   Further provided at one point of the supply path formed by cutting out in the L-shape is a barrier projecting upward facing the stepped portion, and the barrier is provided in a direction toward the back surface, It has a long slot in the direction toward the step, and any one of jig pins of various diameters is detachably attached through the slot so as to protrude from the back surface in parallel with the step. Thus, it may be arranged at one point of the supply path.
前記シュート部の前記供給経路は、幅が可変であり、底面を形成するベースと、前記ベース上に対向して配置され、両側面を形成する固定ガイド及び可動ガイドと、を備え、前記可動ガイドは、支点が前記ベースで軸支されたレバーの一端に軸支され、当該レバーの前記供給経路に対する配置角度に応じて前記幅方向に移動するようにしてもよい。  The supply path of the chute portion has a variable width, and includes a base that forms a bottom surface, and a fixed guide and a movable guide that are disposed opposite to the base and that form both side surfaces. The fulcrum may be pivotally supported at one end of a lever pivotally supported by the base, and may be moved in the width direction according to an arrangement angle of the lever with respect to the supply path.
 本発明によれば、電子部品の上方は解放されるため、電子部品の高さに制限がなくなり、いかなる大きさの電子部品であっても切り替え作業を必要とすることなく、各工程処理機構に供給することができる。そのため、切り替え作業の負担及び時間が軽減され、生産効率が向上する。 According to the present invention, since the upper part of the electronic component is released, there is no restriction on the height of the electronic component, and even if it is an electronic component of any size, each process processing mechanism can be performed without requiring a switching operation. Can be supplied. Therefore, the burden and time of the switching work are reduced, and the production efficiency is improved.
電子部品検査装置の概略構成を示す図である。It is a figure which shows schematic structure of an electronic component inspection apparatus. 搬送機構の概略構成を示す図である。It is a figure which shows schematic structure of a conveyance mechanism. 電子部品Dを示す模式図である。2 is a schematic diagram showing an electronic component D. FIG. パーツフィーダの上面図である。It is a top view of a parts feeder. パーツフィーダの側面図である。It is a side view of a parts feeder. ボウル部の断面図である。It is sectional drawing of a bowl part. 障壁を示す断面図である。It is sectional drawing which shows a barrier. シュート部の断面図である。It is sectional drawing of a chute | shoot part. シュート部の詳細構成を示す図である。It is a figure which shows the detailed structure of a chute | shoot part.
 以下、本発明に係る電子部品検査装置の実施形態について図面を参照しつつ詳細に説明する。まず、図1乃至3を参照して、電子部品検査装置の構成について説明する。図1は、電子部品検査装置の概略構成を示す図である。図2は、搬送機構の概略構成を示す図である。図3は、電子部品Dの表裏を示す模式図である。   Hereinafter, embodiments of an electronic component inspection apparatus according to the present invention will be described in detail with reference to the drawings. First, the configuration of the electronic component inspection apparatus will be described with reference to FIGS. FIG. 1 is a diagram showing a schematic configuration of an electronic component inspection apparatus. FIG. 2 is a diagram illustrating a schematic configuration of the transport mechanism. FIG. 3 is a schematic diagram showing the front and back of the electronic component D. As shown in FIG.
 本実施形態に係る電子部品検査装置1は、電子部品Dを整列搬送しながら各種の工程処理を行う装置である。電子部品Dは、電気製品に使用される部品であり、半導体素子が含まれる。半導体素子としては、トランジスタや集積回路や抵抗やコンデンサ等が挙げられる。各種の工程処理は、主に、ダイシング、マウンティング、ボンディング、及びシーリング等の各組み立て工程を経た後の検査工程であり、マーキング、外観検査、テストコンタクト、分類ソート、及び梱包の工程処理が含まれる。   The electronic component inspection apparatus 1 according to the present embodiment is an apparatus that performs various process processes while aligning and conveying the electronic component D. The electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of semiconductor elements include transistors, integrated circuits, resistors, capacitors, and the like. The various process processes are mainly inspection processes after each assembly process such as dicing, mounting, bonding, and sealing, and include marking, visual inspection, test contact, sorting and sorting, and packing process. .
電子部品Dは、図3に示すように、各種存在し、その大きさもまちまちである。電子部品検査装置1は、大きさの異なる電子部品Dを簡便な調整により検査可能にしている。   As shown in FIG. 3, there are various types of electronic components D, and the sizes thereof vary. The electronic component inspection apparatus 1 enables inspection of electronic components D having different sizes by simple adjustment.
この電子部品検査装置1は、電子部品Dに対する各種の工程処理機構4、及び電子部品Dを各種の工程処理機構4を搬送する搬送機構を備えている。搬送機構は、ターンテーブル21を含んで構成される。ターンテーブル21は、下方に配置されたダイレクトドライブモータ22の駆動軸で中心が支持されている。このターンテーブル21は、ダイレクトドライブモータ22の駆動に伴って間欠的に所定角度回転する。   The electronic component inspection apparatus 1 includes various process processing mechanisms 4 for the electronic component D and a transport mechanism that transports the electronic components D to the various process processing mechanisms 4. The transport mechanism includes a turntable 21. The center of the turntable 21 is supported by a drive shaft of a direct drive motor 22 disposed below. The turntable 21 rotates intermittently at a predetermined angle as the direct drive motor 22 is driven.
ターンテーブル21の外周端には、電子部品Dを保持する複数の保持手段がターンテーブル21の外周に沿って等間隔離間して取り付けられている。この搬送機構は、ターンテーブル21の外周が電子部品Dの処理経路となる。搬送機構は、保持手段で電子部品Dを保持し、ターンテーブル21の外周に整列させ、ターンテーブル21を回転させることで外周方向に電子部品Dを搬送する。保持手段の配置間隔は、ターンテーブル21の1ピッチの回転角度と等しい。   A plurality of holding means for holding the electronic component D are attached to the outer peripheral end of the turntable 21 at regular intervals along the outer periphery of the turntable 21. In this transport mechanism, the outer periphery of the turntable 21 serves as a processing path for the electronic component D. The transport mechanism holds the electronic component D by the holding means, aligns it on the outer periphery of the turntable 21, and rotates the turntable 21 to transport the electronic component D in the outer peripheral direction. The arrangement interval of the holding means is equal to the rotation angle of one pitch of the turntable 21.
保持手段は、電子部品Dを吸着、及び離脱させる吸着ノズル31である。吸着ノズル31は、ターンテーブル21の外周端に取り付けられた支持部32によってターンテーブル21に対して上下動可能となっている。吸着ノズル31の直上には、操作ロッド34を備える駆動部33が配置されており、操作ロッド34が吸着ノズル31の上端に当接して下方へ押し下げることにより、吸着ノズル31は下降する。吸着ノズル31のパイプ内部は、図示しない真空発生装置の空気圧回路と連通しており、吸着ノズル31は、負圧の発生によって電子部品Dを吸着し、真空破壊によって電子部品Dを離脱させる。   The holding means is a suction nozzle 31 that sucks and separates the electronic component D. The suction nozzle 31 is movable up and down with respect to the turntable 21 by a support portion 32 attached to the outer peripheral end of the turntable 21. A drive unit 33 including an operation rod 34 is disposed immediately above the suction nozzle 31. When the operation rod 34 contacts the upper end of the suction nozzle 31 and is pushed downward, the suction nozzle 31 is lowered. The inside of the pipe of the suction nozzle 31 communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle 31 sucks the electronic component D by generating a negative pressure and releases the electronic component D by vacuum break.
各種の工程処理機構4は、ターンテーブル21を取り囲んで外周方向に等間隔離間して配置されている。配置間隔は、ターンテーブル21の1ピッチの回転角度と同一若しくは整数倍に等しい。各種の工程処理機構4の配置位置は、各保持手段の停止位置Pと一致する。この各停止位置Pに各種の搬送処理機構が1機ずつ配置される。尚、停止位置の数≧搬送処理機構4の数であれば、これらの数は同数でなくともよく、搬送処理機構4が配置されない停止位置Pが存在していてもよい。   Various process processing mechanisms 4 surround the turntable 21 and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the turntable 21. The arrangement positions of the various process processing mechanisms 4 coincide with the stop positions P of the holding means. Each of the various transport processing mechanisms is arranged at each stop position P. If the number of stop positions is equal to or greater than the number of transport processing mechanisms 4, these numbers may not be the same, and there may be a stop position P where the transport processing mechanism 4 is not disposed.
各種の工程処理機構4としては、ターンテーブル21の回転方向に順に、例えば、パーツフィーダ41、テストコンタクト装置42、マーキングユニット43、外観検査装置45、分類ソート機構46、テーピングユニット47、不良品排出装置48が配置されている。   As the various process processing mechanisms 4, for example, the parts feeder 41, the test contact device 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, the taping unit 47, and the discharge of defective products are sequentially performed in the rotation direction of the turntable 21. A device 48 is arranged.
パーツフィーダ41は、電子部品検査装置1に電子部品Dを供給する装置であり、ターンテーブル21の外周端直下まで多数の電子部品Dを整列させて連続的に供給する。テストコンタクト装置42は、ベリリウム銅等の板状の金属であるコンタクトを有し、電子部品DのリードD1にコンタクトを接触させ、電流を流したり、電圧を印加したりすることで、電子部品Dの電圧、電流、抵抗、又は周波数等の電気特性を測定検査する。   The parts feeder 41 is a device that supplies the electronic component D to the electronic component inspection apparatus 1, and supplies a large number of electronic components D in a line up to just below the outer peripheral edge of the turntable 21. The test contact device 42 has a contact that is a plate-like metal such as beryllium copper, and contacts the lead D1 of the electronic component D to cause a current to flow or a voltage to be applied. Measure and inspect electrical characteristics such as voltage, current, resistance, or frequency.
マーキングユニット43は、電子部品Dに臨んでレーザ照射用のレンズを有し、レーザを電子部品Dに照射してマーキングを行う。外観検査装置45は、カメラを有し、電子部品Dを撮影し、画像から電子部品Dの電極形状、表面の欠陥、キズ、汚れ、異物等の有無を検査する。   The marking unit 43 has a lens for laser irradiation facing the electronic component D, and performs marking by irradiating the electronic component D with a laser. The appearance inspection apparatus 45 has a camera, images the electronic component D, and inspects the presence or absence of an electrode shape, surface defects, scratches, dirt, foreign matter, and the like of the electronic component D from the image.
分類ソート機構46は、外観検査や電気特性の検査の結果に応じて電子部品Dを不良品と良品とに分類し、そのレベルに応じて分類してシュートする。テーピングユニット47は、電子部品Dの収納ポケットがエンボス加工により形成されたキャリアテープを間欠的に移送し、良品と判定された電子部品Dを当該収納ポケットに収納する。不良品排出装置48は、テーピング梱包されなかった電子部品Dを電子部品検査装置1から排出する。   The classification / sorting mechanism 46 classifies the electronic component D into a defective product and a non-defective product according to the results of the appearance inspection and the electrical property inspection, and classifies and shoots according to the level. The taping unit 47 intermittently transports the carrier tape in which the storage pocket of the electronic component D is formed by embossing, and stores the electronic component D determined to be non-defective in the storage pocket. The defective product discharge device 48 discharges the electronic component D that has not been taped and packed from the electronic component inspection device 1.
図4乃至図10に基づき、本実施形態に係るパーツフィーダ41について更に詳細に説明する。まず、図4は、パーツフィーダ41の上面図であり、図5は、パーツフィーダ41の側面図である。パーツフィーダ41は、ボウル部5とシュート部6とを連接して配置し、更にシュート部6の終端にエスケープ部7を配置している。   Based on FIG. 4 thru | or FIG. 10, the parts feeder 41 which concerns on this embodiment is demonstrated in detail. First, FIG. 4 is a top view of the parts feeder 41, and FIG. 5 is a side view of the parts feeder 41. In the parts feeder 41, the bowl portion 5 and the chute portion 6 are connected to each other, and the escape portion 7 is further arranged at the end of the chute portion 6.
ボウル部5は、ボウル振動体5aに支持されている。シュート部6は、シュート振動体6aに支持されている。ボウル振動体5aとシュート振動体6aは、内部に電磁石と可動コアを組み合わせて有し、電磁石への通電制御によって振動する。ボウル部5は、ボウル振動体5aの振動に伴ってねじり振動する。シュート部6は、シュート振動体6aの振動に伴って延び方向と角度を持って交差する斜め方向に振動する。   The bowl part 5 is supported by the bowl vibrating body 5a. The chute part 6 is supported by the chute vibrating body 6a. The bowl vibrating body 5a and the chute vibrating body 6a have a combination of an electromagnet and a movable core inside, and vibrate by energization control to the electromagnet. The bowl portion 5 is torsionally vibrated with the vibration of the bowl vibrating body 5a. The chute portion 6 vibrates in an oblique direction that intersects with the extending direction at an angle along with the vibration of the chute vibrator 6a.
ボウル部5は、すり鉢形状の容器であり、電子部品Dを収容する収容手段である。ボウル部5の内面には、底部から上縁に向かって螺旋状に内壁面を登る供給経路51が刻設されている。電子部品Dは、ボウル部5のねじり振動によって、供給経路51に案内されながら一列に整列してボウル部5の内壁面を登る。   The bowl portion 5 is a mortar-shaped container and is a storage unit that stores the electronic component D. A supply path 51 is engraved on the inner surface of the bowl portion 5 so as to climb the inner wall surface spirally from the bottom portion toward the upper edge. The electronic parts D are aligned in a row while being guided by the supply path 51 by the torsional vibration of the bowl part 5 and climb the inner wall surface of the bowl part 5.
ボウル部5の供給経路51上には、センサ部53が設けられている。センサ部53は、電子部品Dの表裏を検出し、電子部品Dの表裏検出の結果に応じて、電子部品Dを供給経路51から離脱させ、ボウル部5の内部へ戻す。   A sensor unit 53 is provided on the supply path 51 of the bowl unit 5. The sensor unit 53 detects the front and back of the electronic component D, and separates the electronic component D from the supply path 51 according to the detection result of the front and back of the electronic component D and returns it to the inside of the bowl unit 5.
表裏の検出手段としては、例えばセンサ部53は、投受光センサを含む。センサ領域からの反射量に応じて電子部品Dの表裏を検出する。電子部品Dの裏面は、リードD1が露出しているため、反射量が表面に比べて高い。   As the front and back detection means, for example, the sensor unit 53 includes a light projecting / receiving sensor. The front and back of the electronic component D are detected according to the amount of reflection from the sensor area. Since the lead D1 is exposed on the back surface of the electronic component D, the reflection amount is higher than that on the front surface.
電子部品Dを供給経路51から離脱させる排除手段としては、例えば、センサ部53は、供給経路51を横切るように空気を吹き付けるブロア穴を含む。ブロア穴は、図示しないコンプレッサやシリンダから供給された空気を電子部品Dに吹きつけ、空気圧によりボウル部5の内部へ吹き飛ばす。   For example, the sensor unit 53 includes a blower hole that blows air so as to cross the supply path 51 as an excluding means for separating the electronic component D from the supply path 51. The blower hole blows air supplied from a compressor or cylinder (not shown) to the electronic component D and blows it into the bowl portion 5 by air pressure.
センサ部53は、センサアンプ8と電気的に接続されている。センサアンプ8は、センサ部53が出力する信号を増幅する。また、ブロア穴への空気の供給及び遮断は、電磁弁9によって切り替えられる。電磁弁9は、センサアンプ8で増幅された信号の有無に応じてブロア穴に通じる空気圧回路をオン又はオフにする。尚、信号の有無とは、所定の閾値を越える信号の有無と言い換えることができる。   The sensor unit 53 is electrically connected to the sensor amplifier 8. The sensor amplifier 8 amplifies the signal output from the sensor unit 53. The supply and shutoff of air to the blower hole are switched by the electromagnetic valve 9. The electromagnetic valve 9 turns on or off the pneumatic circuit that leads to the blower hole according to the presence or absence of the signal amplified by the sensor amplifier 8. The presence / absence of a signal can be restated as the presence / absence of a signal exceeding a predetermined threshold.
ここで、図6に示すように、供給経路51は、略L字状に内壁面を切り欠くことによって形成される。すなわち、ボウル部5の供給経路51は、底面をなす段部51aと、段部51aから立ち上がり、電子部品Dが寄り掛かる背面部51bによって構成され、電子部品Dの上方は解放されている。段部51aは、電子部品Dの1側面を支持する。背面部51bは、電子部品Dの表面若しくは裏面を支持する。段部51aは、上に登るにつれて幅が狭くなっている。このボウル部5の供給経路51の形状は、大きさの異なる各種の電子部品Dを部品交換無しで搬送可能にしている。   Here, as shown in FIG. 6, the supply path 51 is formed by cutting out the inner wall surface in a substantially L shape. That is, the supply path 51 of the bowl part 5 is constituted by a step part 51a that forms the bottom surface and a back part 51b that rises from the step part 51a and leans against the electronic part D, and the upper part of the electronic part D is released. The step portion 51a supports one side surface of the electronic component D. The back surface portion 51b supports the front surface or the back surface of the electronic component D. The step portion 51a becomes narrower as it climbs upward. The shape of the supply path 51 of the bowl portion 5 enables various electronic components D having different sizes to be conveyed without replacement.
また、図7に示すように、ボウル部5の供給経路51の終端側には、一地点に供給経路51の上方に段部51aと対向するように張り出した障壁52がセンサ部53よりも前段側に設けられている。障壁52は、背面部51bの上側部分と当接している。障壁52と供給経路51の段部51aとの間は、所定の空間が形成されている。   Further, as shown in FIG. 7, on the terminal side of the supply path 51 of the bowl part 5, a barrier 52 protruding so as to face the stepped part 51 a above the supply path 51 at a single point is provided in front of the sensor part 53. On the side. The barrier 52 is in contact with the upper part of the back surface portion 51b. A predetermined space is formed between the barrier 52 and the step portion 51 a of the supply path 51.
この障壁52には、背面部51bに向かう長穴52aが貫設されている。長穴52aは、段部51aに向かう方向に長く形成されている。供給経路51の一地点には、治具ピン52bが着脱可能に取り付けられる。この治具ピン52bは、背面部51bの上端からボウル部5の内側へ向けて段部51aと平行に突き出している。障壁52は、この治具ピン52bが長穴52aを貫通してボウル部5に固定されたときに、長穴52a上端と治具ピン52bとの当接によって、供給経路51の上方に張り出して支持される。   The barrier 52 is provided with a long hole 52a extending toward the back surface portion 51b. The long hole 52a is formed long in the direction toward the stepped portion 51a. A jig pin 52b is detachably attached to one point of the supply path 51. The jig pin 52b protrudes in parallel with the stepped portion 51a from the upper end of the back surface portion 51b toward the inside of the bowl portion 5. When the jig pin 52b passes through the elongated hole 52a and is fixed to the bowl portion 5, the barrier 52 projects over the supply path 51 by the contact between the upper end of the elongated hole 52a and the jig pin 52b. Supported.
この障壁52は、ねじり振動による搬送の結果、電子部品Dの上に積み重なってしまった他の電子部品Dに当接して列に配列し直す。この障壁52の下端位置は、図7の(a)(b)に示すように、治具ピン52bの径に応じて調整可能となっている。治具ピン52bは、電子部品検査装置1に供給される電子部品Dの大きさに応じて各種の径が予め用意される。   The barriers 52 abut against other electronic components D stacked on the electronic components D as a result of conveyance by torsional vibration, and are rearranged in a row. As shown in FIGS. 7A and 7B, the lower end position of the barrier 52 can be adjusted according to the diameter of the jig pin 52b. Various diameters of the jig pin 52b are prepared in advance according to the size of the electronic component D supplied to the electronic component inspection apparatus 1.
シュート部6は、直線形状のレールであり、直線に沿って供給経路61が設けられている。シュート部6の供給経路61は、その始端でボウル部5の供給経路51の終端に連接されている。図8に示すように、このシュート部6の供給経路61は、ベース62と固定ガイド63と可動ガイド64により画成される。ベース62は、供給経路61の底面を画成する。固定ガイド63と可動ガイド64は、ベース62の上面に設けられ、所定距離離間して向き合わされることで供給経路61の側壁を画成する。   The chute part 6 is a linear rail, and a supply path 61 is provided along the straight line. The supply path 61 of the chute unit 6 is connected to the end of the supply path 51 of the bowl unit 5 at the start end. As shown in FIG. 8, the supply path 61 of the chute 6 is defined by a base 62, a fixed guide 63 and a movable guide 64. The base 62 defines the bottom surface of the supply path 61. The fixed guide 63 and the movable guide 64 are provided on the upper surface of the base 62 and face each other at a predetermined distance to define the side wall of the supply path 61.
固定ガイド63は、ベース62上に固定され、可動ガイド64は、供給経路61の幅方向にベース62上を移動可能となっている。図9に示すように、可動ガイド64は、S字のレバー65の作用点65aに軸支されている。作用点65aは、S字のレバー65の一端に設定される。レバー65は、作用点65aに最寄りの屈曲部を支点65bに設定し、支点65bは、ベース62に軸支されている。また、レバー65の作用点65aとは異なる他端が力点65cとなる。ベース62には、レバー65の力点65cと向かい合うように所定距離離間した位置に、固定部材65dが固定されている。固定部材65dと力点65cとの間には、各種径の治具ピン65eが挿入可能となっている。   The fixed guide 63 is fixed on the base 62, and the movable guide 64 is movable on the base 62 in the width direction of the supply path 61. As shown in FIG. 9, the movable guide 64 is pivotally supported on the action point 65 a of the S-shaped lever 65. The action point 65 a is set at one end of the S-shaped lever 65. The lever 65 has a bent portion closest to the action point 65 a as a fulcrum 65 b, and the fulcrum 65 b is pivotally supported by the base 62. The other end of the lever 65 different from the action point 65a is a force point 65c. A fixing member 65d is fixed to the base 62 at a position spaced apart from the force point 65c of the lever 65 by a predetermined distance. Jig pins 65e with various diameters can be inserted between the fixing member 65d and the force point 65c.
可動ガイド64の両端側には、内壁の一部が掘り込まれて凹部66aが形成されている。凹部66aと所定距離離間した位置には、固定部材66bが固定されている。この固定部材66bは、供給経路61と直交する方向で凹部66aと向かい合っている。この固定部材66bは、供給経路61の障害とならないように、固定ガイド63から供給経路61を跨いで延びている。凹部66aと固定部材66bとの間には、各種径の治具ピン66cが挿入可能となっている。   On both end sides of the movable guide 64, a part of the inner wall is dug to form a recess 66a. A fixing member 66b is fixed at a position spaced a predetermined distance from the recess 66a. The fixing member 66b faces the recess 66a in a direction orthogonal to the supply path 61. The fixing member 66 b extends from the fixed guide 63 across the supply path 61 so as not to obstruct the supply path 61. Jig pins 66c of various diameters can be inserted between the recess 66a and the fixing member 66b.
治具ピン65eの径によって、レバー65の供給経路61に対する配置角度が変更され、伴って可動ガイド64は供給経路61の幅方向に位置が変位する。すなわち、この固定ガイド63と可動ガイド64とベース62で画成される供給経路61は、電子部品Dの大きさに対応する径の治具ピン65e、66cを挿入すること、その幅が調整され、各種の大きさの電子部品Dを部品交換無しで搬送可能にしている。   The arrangement angle of the lever 65 with respect to the supply path 61 is changed depending on the diameter of the jig pin 65e, and the position of the movable guide 64 is displaced in the width direction of the supply path 61 accordingly. That is, the supply path 61 defined by the fixed guide 63, the movable guide 64, and the base 62 is inserted with jig pins 65e and 66c having a diameter corresponding to the size of the electronic component D, and the width thereof is adjusted. The electronic parts D of various sizes can be transported without replacement of parts.
エスケープ部7は、シュート部6の供給経路61の終端に電子部品Dの停止及び進行を制御するストッパと、電子部品Dを載置する載置スペースを有し、シュート部6の供給経路61の終端からターンテーブル21に支持されている吸着ノズル31の直下まで平行移動する。   The escape part 7 has a stopper for controlling the stop and advance of the electronic component D at the end of the supply path 61 of the chute part 6 and a placement space for placing the electronic part D. It moves in parallel from the end to just below the suction nozzle 31 supported by the turntable 21.
このような電子部品検査装置1は、以下のように動作する。まず、電子部品検査装置1の動作の1サイクルは、搬送と工程処理よりなる。搬送では、電子部品Dの受け取り、電子部品Dの移動、及び電子部品Dの受け渡しを順に経る。 Such an electronic component inspection apparatus 1 operates as follows. First, one cycle of the operation of the electronic component inspection apparatus 1 includes conveyance and process processing. In the conveyance, the electronic component D is received, the electronic component D is moved, and the electronic component D is transferred in order.
電子部品Dの受け取りでは、吸着ノズル31の下降と、工程処理機構4のステージにある電子部品Dの吸着と、吸着ノズル31の上昇を順に経る。電子部品Dの移動は、換言するとターンテーブル21の所定角度の回転、すなわち吸着ノズル31の次の停止位置Pへの移動である。電子部品Dの受け渡しでは、吸着ノズル31の下降と、工程処理機構4のステージへの電子部品Dの離脱と、吸着ノズル31の上昇を順に経る。   In receiving the electronic component D, the suction nozzle 31 is lowered, the electronic component D on the stage of the process processing mechanism 4 is sucked, and the suction nozzle 31 is lifted in order. In other words, the movement of the electronic component D is rotation of the turntable 21 by a predetermined angle, that is, movement of the suction nozzle 31 to the next stop position P. In the delivery of the electronic component D, the suction nozzle 31 is lowered, the electronic component D is detached from the stage of the process processing mechanism 4, and the suction nozzle 31 is lifted in order.
個別的には、ターンテーブル21は、1サイクルごとに所定角度回転して所定時間停止する。各吸着ノズル31は、ターンテーブル21の間欠回転によって、ターンテーブル21の外周上の各停止位置Pに順に移動する。   Individually, the turntable 21 rotates by a predetermined angle every cycle and stops for a predetermined time. Each suction nozzle 31 sequentially moves to each stop position P on the outer periphery of the turntable 21 by intermittent rotation of the turntable 21.
吸着ノズル31の停止位置Pには、いずれかの種類の工程処理機構4が配置されている。各吸着ノズル31は、停止位置Pに移動すると、工程処理機構4のステージへ向けて下降し、電子部品Dを離脱させる。工程処理機構4は、電子部品Dを受け取ると、当該電子部品Dに処理を施す。電子部品Dへの処理が終了すると、吸着ノズル31は再びステージへ向けて下降し、電子部品Dを吸着し、上昇する。吸着ノズル31が電子部品Dを保持すると、ターンテーブル21は、次のサイクルに移って所定角度回転する。   At the stop position P of the suction nozzle 31, any kind of process processing mechanism 4 is arranged. When each suction nozzle 31 moves to the stop position P, the suction nozzle 31 descends toward the stage of the process processing mechanism 4 to detach the electronic component D. When the process processing mechanism 4 receives the electronic component D, the process processing mechanism 4 processes the electronic component D. When the processing for the electronic component D is completed, the suction nozzle 31 descends again toward the stage, sucks the electronic component D, and rises. When the suction nozzle 31 holds the electronic component D, the turntable 21 moves to the next cycle and rotates by a predetermined angle.
パーツフィーダ41では、まず電子部品Dは、ボウル部5に収容される。ボウル部5内の電子部品Dは、ねじり振動によって供給経路51に案内されながら一列に整列してボウル部5の内壁面を登る。このとき、ボウル部5の供給経路51は、L字状となり上方が解放されているため、電子部品Dの高さに制限はなく、各種の電子部品Dが搬送可能となっている。   In the parts feeder 41, the electronic component D is first accommodated in the bowl portion 5. The electronic components D in the bowl portion 5 are aligned in a line while climbing on the inner wall surface of the bowl portion 5 while being guided by the supply path 51 by torsional vibration. At this time, since the supply path 51 of the bowl portion 5 is L-shaped and opened upward, the height of the electronic component D is not limited, and various electronic components D can be conveyed.
他の電子部品Dの上に積み重なってしまった電子部品Dは、障壁52に当接してボウル部5の内部に落とされる。障壁52と段部51aとの間の高さは、例えば、各種の電子部品Dが障壁52の下を通過するときに0.2mm程度の余裕を設けるように高さが調節される。この高さは、治具ピン52bと背面部51bとが当接する位置の段部51aからの高さと、治具ピン52bの直径とを加算し、障壁52の長穴52aの上端から障壁52の下端までの長さを差し引いた値である。すなわち、障壁52の高さ調節は、治具ピン52bの径を変えることで達成される。   The electronic component D stacked on the other electronic component D is brought into contact with the barrier 52 and dropped into the bowl portion 5. The height between the barrier 52 and the stepped portion 51a is adjusted so as to provide a margin of about 0.2 mm when various electronic components D pass under the barrier 52, for example. This height is obtained by adding the height from the stepped portion 51a at the position where the jig pin 52b and the back surface portion 51b are in contact with the diameter of the jig pin 52b, and from the upper end of the long hole 52a of the barrier 52 to the barrier 52. It is a value obtained by subtracting the length to the lower end. That is, the height adjustment of the barrier 52 is achieved by changing the diameter of the jig pin 52b.
センサ部53を通過する電子部品Dは、その表裏が検出される。センサ部53により電子部品Dが裏面、すなわちリードD1が取り付けられている面を向けて搬送されていることが検出されると、電磁弁9はオンとなる。電磁弁9がオンとなると、空気圧回路とブロア穴とが連通し、ブロア穴から空気が吹き出す。   The front and back of the electronic component D that passes through the sensor unit 53 is detected. When the sensor unit 53 detects that the electronic component D is conveyed toward the back surface, that is, the surface to which the lead D1 is attached, the electromagnetic valve 9 is turned on. When the solenoid valve 9 is turned on, the pneumatic circuit communicates with the blower hole, and air blows out from the blower hole.
電子部品Dが表面を向けて搬送されている場合は、電磁弁9はオフのままであり、ブロア穴と空気圧回路とは遮断されているため、ブロア穴からは空気は吹き出さず、当該電子部品Dは、センサ部53を通過する。   When the electronic component D is conveyed facing the surface, the solenoid valve 9 remains off and the blower hole and the pneumatic circuit are shut off, so that air does not blow out from the blower hole. The component D passes through the sensor unit 53.
センサ部53を通過した電子部品Dは、シュート部6の供給経路61に移り、シュート部6の振動によって供給経路61に案内されながら一列に整列して終端に至る。   The electronic components D that have passed through the sensor unit 53 move to the supply path 61 of the chute unit 6, and are aligned in a row while being guided by the supply path 61 by the vibration of the chute unit 6 and reach the end.
シュート部6の供給経路61は、その幅が電子部品Dの大きさに合わせて予め調整されている。この供給経路61の幅は、各凹部66aとレバー65の力点65cに当接させる治具ピン66cの径によって決まる。凹部66aと固定部材66bとの間に治具ピン66cを挿入すると、治具ピン66cの径に応じて凹部66aと固定部材66bとの間が離間する。すなわち、可動ガイド64は、治具ピン66cの径に応じて幅方向に押し退けられる。   The width of the supply path 61 of the chute unit 6 is adjusted in advance according to the size of the electronic component D. The width of the supply path 61 is determined by the diameter of the jig pin 66 c that is brought into contact with each recess 66 a and the force point 65 c of the lever 65. When the jig pin 66c is inserted between the recess 66a and the fixing member 66b, the recess 66a and the fixing member 66b are separated according to the diameter of the jig pin 66c. That is, the movable guide 64 is pushed away in the width direction according to the diameter of the jig pin 66c.
また、レバー65の力点65cと固定部材65dとの間に挿入された治具ピン65eは、支点65bを中心にレバー65をその径に応じた量だけ回転させる。伴って、レバー65の作用点65aは、供給経路61の幅方向に回転する。レバー65に軸支されている可動ガイド64は、レバー65の回転により幅方向に移動する。すなわち、シュート部6の供給経路61の幅調節は、治具ピン65e、66cの径を変えることで達成される。   Further, the jig pin 65e inserted between the force point 65c of the lever 65 and the fixing member 65d rotates the lever 65 by an amount corresponding to its diameter around the fulcrum 65b. Accordingly, the action point 65 a of the lever 65 rotates in the width direction of the supply path 61. The movable guide 64 pivotally supported by the lever 65 moves in the width direction by the rotation of the lever 65. That is, the width adjustment of the supply path 61 of the chute 6 is achieved by changing the diameters of the jig pins 65e and 66c.
シュート部6の供給経路61の終端に到達した電子部品Dは、エスケープ部7のストッパにより停止及び進行が制御されて、一つずつエスケープ部7の載置スペースに移り、吸着ノズル31の直下まで移動する。   The electronic component D that has reached the end of the supply path 61 of the chute unit 6 is controlled to stop and advance by the stopper of the escape unit 7, moves to the placement space of the escape unit 7 one by one, and immediately below the suction nozzle 31. Moving.
電子部品Dは、パーツフィーダ41の供給経路終端に位置して、第1のサイクルで直上に移動してきた吸着ノズル31によって保持される。パーツフィーダ41の搬送経路終端で保持された電子部品Dは、次以降のサイクルごとに順にテストコンタクト42、マーキングユニット43、外観検査装置45、分類ソート機構46、テーピングユニット47に供給され、各種の工程が施される。梱包されなかった電子部品Dは、不良品排出装置48に供給され、電子部品検査装置1から排出される。   The electronic component D is held by the suction nozzle 31 that is located at the end of the supply path of the parts feeder 41 and has moved right up in the first cycle. The electronic component D held at the end of the conveyance path of the parts feeder 41 is sequentially supplied to the test contact 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, and the taping unit 47 for each subsequent cycle. A process is performed. The electronic component D that has not been packed is supplied to the defective product discharge device 48 and discharged from the electronic component inspection device 1.
以上のように、本実施形態に係る電子部品検査装置1は、パーツフィーダ41において、電子部品Dを収容するボウル部5に形成される供給経路51は、底面から上縁へ螺旋状に内周面をL字状に切り欠いて形成され、電子部品Dの側面を支持する段部51aと、表面若しくは裏面を支持する背面部51bとを有するようにした。これにより、電子部品Dは、1側面と表面若しくは裏面のみが供給経路51の壁面に囲まれ、上方は解放される。従って、電子部品Dの高さに制限がなくなり、いかなる大きさの電子部品Dであっても切り替え作業を必要とすることなく、各工程処理機構4に供給することができる。そのため、電子部品検査装置1の切り替え作業の負担及び時間が軽減され、生産効率が向上する。   As described above, in the electronic component inspection apparatus 1 according to the present embodiment, in the parts feeder 41, the supply path 51 formed in the bowl portion 5 that accommodates the electronic component D has a spiral inner periphery from the bottom surface to the upper edge. The surface is cut into an L shape, and has a stepped portion 51a that supports the side surface of the electronic component D and a back surface portion 51b that supports the front surface or the back surface. As a result, only one side and the front or back surface of the electronic component D are surrounded by the wall surface of the supply path 51, and the upper part is released. Therefore, the height of the electronic component D is not limited, and any size electronic component D can be supplied to each process processing mechanism 4 without requiring a switching operation. Therefore, the burden and time of the switching work of the electronic component inspection apparatus 1 are reduced, and the production efficiency is improved.
また、ボウル部5の供給経路51の一地点に、段部51aと対向する上方に張り出した障壁52を更に配置した。この障壁52は、背面部51bに向かう方向に貫設され、段部51aに向かう方向に長い長穴52aを有し、段部51aと平行に背面部51bから突き出すように各種径の治具ピン52bの何れかが、長穴52aを貫通して着脱可能に取り付けられることにより、供給経路51の一地点に配置されるようにした。この障壁52により、いかなる大きさの電子部品Dを供給しようとも、他の電子部品Dの上に積み重なってしまった電子部品Dのみを、治具ピン52bの径を変えるだけで容易にボウル部5に戻すことができる。従って、供給経路51をL字状に切り欠こうとも、電子部品Dを精度よく整列させて、搬送機構に供給することができる。   In addition, a barrier 52 projecting upward facing the stepped portion 51 a is further disposed at one point of the supply path 51 of the bowl portion 5. The barrier 52 is provided in a direction toward the back portion 51b, has a long hole 52a in the direction toward the step portion 51a, and has a jig pin with various diameters so as to protrude from the back portion 51b in parallel with the step portion 51a. Any one of 52b penetrates the long hole 52a and is detachably attached to be arranged at one point of the supply path 51. With this barrier 52, whatever size electronic component D is supplied, only the electronic component D stacked on the other electronic component D can be easily changed by changing the diameter of the jig pin 52 b. Can be returned to. Therefore, even if the supply path 51 is cut out in an L shape, the electronic components D can be accurately aligned and supplied to the transport mechanism.
また、シュート部6の供給経路61を、底面を形成するベース62と、両側面を形成する固定ガイド63及び可動ガイド64とにより構成するようにし、可動ガイド64は、支点65bがベース62で軸支されたレバー65の一端に軸支され、レバー65の供給経路61に対する配置角度に応じて幅方向に移動するようにした。これにより、シュート部6の供給経路61は、レバーを押し引きするだけで幅を変更できるようになり、電子部品計算装置1の切り替え作業の負担及び時間が更に軽減され、生産効率が向上する。   Further, the supply path 61 of the chute unit 6 is configured by a base 62 that forms a bottom surface, and a fixed guide 63 and a movable guide 64 that form both side surfaces. The lever 65 is pivotally supported at one end of the lever 65 and is moved in the width direction according to the arrangement angle of the lever 65 with respect to the supply path 61. As a result, the width of the supply path 61 of the chute unit 6 can be changed simply by pushing and pulling the lever, and the burden and time of the switching operation of the electronic component calculation apparatus 1 are further reduced, and the production efficiency is improved.
以上のように本発明の実施形態を説明したが、この実施形態は、例として提示したものであり、発明の範囲を限定することを意図していない。この新規な実施形態は、そのほかの様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。そして、この実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although the embodiment of the present invention has been described above, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. And this embodiment and its deformation | transformation are included in the invention described in the claim, and its equivalent range while being included in the range and summary of invention.
例えば、本実施形態では、一つのターンテーブル21に各種の工程処理機構4を配置する場合を例に挙げたが、搬送機構としては、直線搬送方式であってもよく、また複数のターンテーブル21で一の搬送経路を構成するようにしてもよい。また、保持手段として、真空の発生及び破壊により電子部品Dを吸着及び離脱させる吸着ノズル31に代えて、静電吸着方式、ベルヌーイチャック方式、又は電子部品Dを機械的に挟持するチャック機構を配してもよい。また、各種の工程処理機構4は、上記した種類に限られず、各種の工程処理機構4と置き換えることが可能であり、また配置順序も適宜変更可能である。 For example, in the present embodiment, the case where various process processing mechanisms 4 are arranged on one turntable 21 has been described as an example. However, the transport mechanism may be a linear transport system, or a plurality of turntables 21. A single transport path may be configured. Further, as a holding means, instead of the suction nozzle 31 for sucking and releasing the electronic component D by generation and breakage of vacuum, an electrostatic suction method, a Bernoulli chuck method, or a chuck mechanism for mechanically holding the electronic component D is arranged. May be. The various process processing mechanisms 4 are not limited to the types described above, and can be replaced with various process processing mechanisms 4, and the arrangement order can be changed as appropriate.
1 電子部品検査装置
21 ターンテーブル
22 ダイレクトドライブモータ
3 保持手段
31 吸着ノズル
32 支持部
33 駆動部
34 操作ロッド
4 工程処理機構
41 パーツフィーダ
42 テストコンタクト
43 マーキングユニット
45 外観検査装置
46 分類ソート機構
47 テーピングユニット
48 不良品排出装置
5 ボウル部
5a ボウル振動体
51 供給経路
51a 段部
51b 背面部
52 障壁
52a 長穴
52b 治具ピン
53 センサ部
6 シュート部
6a シュート振動体
61 供給経路
62 ベース
63 固定ガイド
64 可動ガイド
65 レバー
65a 作用点
65b 支点
65c 力点
65d 固定部材
65e 治具ピン
66a 凹部
66b 固定部材
66c 治具ピン
7 エスケープ部
8 センサアンプ
9 電磁弁
D 電子部品
D1 リード
P 停止位置
 
DESCRIPTION OF SYMBOLS 1 Electronic component inspection apparatus 21 Turntable 22 Direct drive motor 3 Holding means 31 Adsorption nozzle 32 Support part 33 Drive part 34 Operation rod 4 Process processing mechanism 41 Parts feeder 42 Test contact 43 Marking unit 45 Appearance inspection apparatus 46 Classification / sorting mechanism 47 Taping Unit 48 Defective Product Discharge Device 5 Bowl Part 5a Bowl Vibrating Body 51 Supply Path 51a Stepped Part 51b Back Part 52 Barrier 52a Long Hole 52b Jig Pin 53 Sensor Part 6 Chute Part 6a Chute Vibrator 61 Supply Path 62 Base 63 Fixed Guide 64 Movable guide 65 Lever 65a Action point 65b Support point 65c Force point 65d Fixing member 65e Jig pin 66a Recess 66b Fixing member 66c Jig pin 7 Escape part 8 Sensor amplifier 9 Electromagnetic valve D Electronic component D1 Lead P Stop position

Claims (6)

  1.  電子部品を搬送しながら各種の工程処理を行う電子部品検査装置であって、
     前記電子部品の処理経路に並んで配置される各種の工程処理手段と、
     前記各種の工程処理手段に前記電子部品を搬送する搬送手段と、
     前記電子部品を収容するボウル部と、
     前記ボウル部と前記搬送手段との間に配置されるシュート部と、
     前記ボウル部から前記シュート部を経て、前記搬送手段に前記電子部品を整列させて供給する供給経路と、
     を備え、
     前記ボウル部内の前記供給経路は、
     前記ボウル部の底面から上縁へ螺旋状に内周面をL字状に切り欠いて形成され、
     前記電子部品の側面を支持する段部と、表面若しくは裏面を支持する背面部とを有すること、
     を特徴とする電子部品検査装置。
    An electronic component inspection apparatus that performs various process processes while conveying electronic components,
    Various process processing means arranged alongside the processing path of the electronic component,
    Conveying means for conveying the electronic component to the various process processing means;
    A bowl portion for housing the electronic component;
    A chute disposed between the bowl and the conveying means;
    A supply path for aligning and supplying the electronic components to the transport means from the bowl portion through the chute portion;
    With
    The supply path in the bowl portion is:
    The inner peripheral surface is spirally cut from the bottom surface of the bowl part to the upper edge, and is formed in an L shape,
    Having a step portion for supporting the side surface of the electronic component and a back surface portion for supporting the front surface or the back surface;
    An electronic component inspection apparatus characterized by.
  2.  前記L字状に切り欠いて形成された前記供給経路の一地点に、前記段部と対向する上方に張り出した障壁を更に備え、
     前記障壁は、
     前記背面部に向かう方向に貫設され、前記段部に向かう方向に長い長穴を有し、
     前記段部と平行に前記背面部から突き出すように各種径の治具ピンの何れかが、前記長穴を貫通して着脱可能に取り付けられることにより、前記供給経路の一地点に配置されること、
     を特徴とする請求項1記載の電子部品検査装置。
    Further provided at one point of the supply path formed by cutting out in the L shape, a barrier projecting upward facing the stepped portion,
    The barrier is
    Penetrating in the direction toward the back portion, having a long slot in the direction toward the stepped portion,
    Any of the jig pins of various diameters so as to protrude from the back surface portion in parallel with the stepped portion is detachably attached through the elongated hole, thereby being disposed at one point of the supply path. ,
    The electronic component inspection apparatus according to claim 1.
  3.  前記シュート部の前記供給経路は、幅が可変であり、
     底面を形成するベースと、
     前記ベース上に対向して配置され、両側面を形成する固定ガイド及び可動ガイドと、
     を備え、
     前記可動ガイドは、
     支点が前記ベースで軸支されたレバーの一端に軸支され、当該レバーの前記供給経路に対する配置角度に応じて前記幅方向に移動すること、
     を特徴する請求項1又は2に記載の電子部品検査装置。
    The supply path of the chute is variable in width,
    A base forming a bottom surface;
    A fixed guide and a movable guide which are arranged opposite to each other on the base and form both side surfaces;
    With
    The movable guide is
    A fulcrum is pivotally supported at one end of a lever pivotally supported by the base, and the fulcrum moves in the width direction according to an arrangement angle of the lever with respect to the supply path;
    The electronic component inspection apparatus according to claim 1, wherein:
  4.  電子部品を搬送手段により搬送しながら各種の工程処理を行う電子部品検査装置に前記電子部品を供給するパーツフィーダであって、
     前記電子部品を収容するボウル部と、
     前記ボウル部と前記搬送手段との間に配置されるシュート部と、
     前記ボウル部から前記シュート部を経て、前記搬送手段に前記電子部品を整列させて供給する供給経路と、
     を備え、
     前記ボウル部内の前記供給経路は、
     前記ボウル部の底面から上縁へ螺旋状に内周面をL字状に切り欠いて形成され、
     前記電子部品の側面を支持する段部と、表面若しくは裏面を支持する背面部とを有すること、
     を特徴とするパーツフィーダ。
    A parts feeder that supplies the electronic component to an electronic component inspection apparatus that performs various process processes while conveying the electronic component by a conveying means,
    A bowl portion for housing the electronic component;
    A chute disposed between the bowl and the conveying means;
    A supply path for aligning and supplying the electronic components to the transport means from the bowl portion through the chute portion;
    With
    The supply path in the bowl portion is:
    Formed by cutting the inner peripheral surface into an L shape spirally from the bottom surface of the bowl part to the upper edge,
    Having a step portion for supporting the side surface of the electronic component and a back surface portion for supporting the front surface or the back surface;
    Parts feeder characterized by.
  5.  前記L字状に切り欠いて形成された前記供給経路の一地点に、前記段部と対向する上方に張り出した障壁を更に備え、
     前記障壁は、
     前記背面部に向かう方向に貫設され、前記段部に向かう方向に長い長穴を有し、
     前記段部と平行に前記背面部から突き出すように各種径の治具ピンの何れかが、前記長穴を貫通して着脱可能に取り付けられることにより、前記供給経路の一地点に配置されること、
     を特徴とする請求項4記載のパーツフィーダ。
    Further provided at one point of the supply path formed by cutting out in the L shape, a barrier projecting upward facing the stepped portion,
    The barrier is
    Penetrating in the direction toward the back portion, having a long slot in the direction toward the stepped portion,
    Any of the jig pins of various diameters so as to protrude from the back surface portion in parallel with the stepped portion is detachably attached through the elongated hole, thereby being disposed at one point of the supply path. ,
    The parts feeder according to claim 4.
  6.  前記シュート部の前記供給経路は、幅が可変であり、
     底面を形成するベースと、
     前記ベース上に対向して配置され、両側面を形成する固定ガイド及び可動ガイドと、
     を備え、
     前記可動ガイドは、
     支点が前記ベースで軸支されたレバーの一端に軸支され、当該レバーの前記供給経路に対する配置角度に応じて前記幅方向に移動すること、
     を特徴する請求項4又は5に記載のパーツフィーダ。
     
    The supply path of the chute is variable in width,
    A base forming a bottom surface;
    A fixed guide and a movable guide which are arranged opposite to each other on the base and form both side surfaces;
    With
    The movable guide is
    A fulcrum is pivotally supported at one end of a lever pivotally supported by the base, and the fulcrum moves in the width direction according to an arrangement angle of the lever with respect to the supply path;
    The parts feeder according to claim 4 or 5, characterized by the above.
PCT/JP2010/006993 2010-11-30 2010-11-30 Electronic component inspecting apparatus and parts feeder WO2012073284A1 (en)

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JPWO2012073284A1 (en) 2014-05-19

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