JP2007246214A - Visual inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a visual inspection device successfully separating intended electronic components by an air flow for separating the electronic components from disks and alleviating effects by the air flow on holding of other electronic components. <P>SOLUTION: This visual inspection device has separation means 13, 14, 28, 29 for forming a separation air flow to separate an electronic component W sucked to the disks 3, 4 from the disks 3, 4. Negative pressure forming means 12, 30 to 33 for sucking the electronic component W to the disks 3, 4 include a plurality of pipe parts 33 communicated with holes to suck the electronic component W and a communication part 32 for communicating the pipe parts 33 with each other. Each of the pipe parts 33 has a buffer part for buffing the separation air flow. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an appearance inspection apparatus that inspects an electronic component based on the appearance of the electronic component.

  Conventionally, as disclosed in, for example, [Patent Document 1] to [Patent Document 3], a disk for transporting an electronic component by rotation is provided, and the electronic component is inspected based on the appearance of the electronic component transported by the disk. An appearance inspection apparatus is known. Such an appearance inspection apparatus generally holds a large number of electronic components in the circumferential direction of the disk.

  In such an appearance inspection apparatus, as described in [Patent Document 3] and [Patent Document 4], a technique for holding an electronic component on a disk by suction has been proposed. In an appearance inspection apparatus employing such a technique, in order to hold a large number of electronic components in the circumferential direction of the disk, a large number of tubes that apply negative pressure to the suction position of the electronic components are arranged radially in the disk. There is. Among them, in order to simplify the configuration for applying a negative pressure to such a pipe, there are pipes that communicate with each other.

  However, if the electronic component is simply sucked and held on the disk, the removal may not be successful when the electronic component should be detached from the disk. Therefore, in [Patent Document 3] and [Patent Document 4], not only the electronic component is attracted to the disk, but also a pressurizing means for blowing air to the electronic component is provided.

JP 2004-10301 A JP 2002-28578 A JP 2003-275688 A JP 2003-292150 A

  However, when the pressurization by the pressurizing means is transmitted to the pipes communicating with each other, not only the electronic component desired to be detached from the disk but also other electronic components may be detached from the disk. This is a problem because the stable transportation of electronic components by the disk is not secured.

  [Patent Document 4] discloses a structure in which such a tube is provided with a cavity that suppresses fluctuations in a reduced pressure state. However, such a cavity is merely a machining accuracy of a component around the disk and rotational vibration of the disk. This is merely a consideration of fluctuations in the decompressed state caused by.

  The present invention has been made in view of the circumstances as described above. The air flow for detaching the electronic component from the disk can be used to satisfactorily detach the desired electronic component, and the air flow can be used for other electronic components. It is an object of the present invention to provide an appearance inspection apparatus that reduces the influence on holding.

  In order to achieve the above object, the invention described in claim 1 is provided with a disk for transporting an electronic component by rotation, images the appearance of the electronic component transported by the disk, and the imaged electronic component In an appearance inspection apparatus for inspecting the appearance of the electronic component based on the appearance of the electronic component, negative pressure forming means for forming a negative pressure for attracting and transporting the electronic component to the disk, and the electronic component attracted to the disk Detaching means for forming a detachment air flow for detaching the disk from the disk, and a plurality of the negative pressure forming means are provided on the peripheral edge of the disk, each of which holes for adsorbing electronic components, A plurality of pipe portions radially provided so as to communicate with each of the holes from a central portion of the disc inside the disc, and a communication portion that allows the pipe portions to communicate with each other, Circle The middle in the radial direction, and having a buffer portion that performs buffering of the withdrawal airflow.

  According to a second aspect of the present invention, in the appearance inspection apparatus according to the first aspect, the buffer portion is formed to have a larger diameter than other portions of the pipe portion.

  According to a third aspect of the present invention, in the appearance inspection apparatus according to the first or second aspect, the buffer portions are arranged such that the distances from the central portion of the adjacent buffer portions are different from each other. It is characterized by being.

  According to a fourth aspect of the present invention, in the appearance inspection apparatus according to the third aspect, the buffer portions are arranged such that the distances from the central portion of the adjacent buffer portions are alternately repeated. It is characterized by being.

  The present invention includes a disk for conveying an electronic component by rotation, images the appearance of the electronic component conveyed by the disk, and performs an appearance inspection of the electronic component based on the imaged appearance of the electronic component In the inspection apparatus, a negative pressure forming means for forming a negative pressure for adsorbing and transporting the electronic component to the disk and a separation air flow for separating the electronic component adsorbed by the disk from the disk are formed. The negative pressure forming means is provided in a plurality of peripheral portions of the disc, each of which is provided for adsorbing electronic components, and inside the disc from the central portion of the disc to each of the holes. A plurality of pipe portions radially provided so as to communicate with each other, and a communication portion that communicates the pipe portions with each other, and each of the pipe portions relaxes the separation air flow in the radial direction of the disk. Since the electronic parts are attracted to and transported by the disk, the electronic parts can be transported while being held well by the disk. Provided is an appearance inspection apparatus with improved inspection efficiency because it can be separated and the influence of the separation air flow on the holding of other electronic components can be alleviated and only the desired electronic component can be detached from the disk. be able to.

  If the buffer part is formed to have a larger diameter than the other part of the tube part, the electronic component is attracted to the disk and transported, so that the electronic part can be held well and transported. On the other hand, the electronic component can be satisfactorily detached from the disk by the separation air flow, and the influence of the separation air flow on the holding of other electronic components is greatly reduced, and only the desired electronic component is disc Therefore, it is possible to provide an appearance inspection apparatus with improved inspection efficiency.

  If the buffer parts are arranged so that the distances from the central part of the adjacent buffer parts are different from each other, the electronic parts are attracted to the disk and transported. On the other hand, the electronic component can be satisfactorily detached from the disk by the separation air flow, and the influence of the separation air flow on the holding of other electronic components can be mitigated. Can be separated from the disk, and the buffer part can be arranged while suppressing the interval between the pipe parts, so that a large number of electronic parts can be transported in a limited size disk. Thus, an appearance inspection apparatus with improved inspection efficiency can be provided.

  If the buffer parts are arranged so that the distances from the central part of the buffer parts adjacent to each other are alternately repeated, the electronic parts are attracted to the disk and conveyed. The components can be transported while being held well on the disk, while the electronic components can be satisfactorily detached from the disk by the air separation air, and the influence of the air separation flow on the holding of other electronic components Since only the desired electronic parts can be detached from the disk, and the buffer part can be easily arranged while suppressing the interval between the pipe parts, it is relatively easy to form the buffer part. Thus, it is possible to suppress the formation cost of the buffer portion, and it is possible to transport a large number of electronic components on a limited-sized disk, and to provide an appearance inspection device with improved inspection efficiency. That.

Hereinafter, an embodiment of an appearance inspection apparatus according to the present invention will be described with reference to the drawings.
As shown in FIG. 1, the appearance inspection apparatus 100 includes a feeder part A of an electronic component W to be inspected, an inspection part B that inspects the appearance while moving the electronic part W sent from the feeder part A, A sorting unit C that sorts and stores the electronic components W inspected by the inspection unit B according to the inspection result, and a control unit as a control unit (not shown) that controls the feeder unit A, the inspection unit B, and the sorting unit C are mainly used. I have.

  The electronic component W is a minute component having a substantially rectangular parallelepiped shape, and has a size called “0603”, “1005”, “1608”, “2412”, and the like. “0603” means that the size is 0.6 mm × 0.5 mm.

  Hereinafter, configurations of the feeder unit A, the inspection unit B, and the sorting unit C will be described.

-Feeder part A The feeder part A stores a large number of electronic parts W, and also feeds the electronic parts W stored by fine vibrations, and the electronic parts W sent from the quantitative supply feeder 1 Are linearly conveyed in a state in which they are aligned in one row, and a cutout portion 10 located on the front end side of the linear feeder 2 is provided.

  The linear feeder 2 adjusts the posture of the electronic component W while conveying the electronic component W by fine vibration. Each of the fixed quantity replenishment feeder 1 and the linear feeder 2 has a light reflection type sensor (not shown) that detects the presence or absence of the electronic component W.

  The cutout unit 10 has a structure for separating the electronic parts W conveyed by the linear feeder 2 one by one and sending them to the inspection unit B. In FIG. 1, only the arrangement position of the cutout unit 10 is illustrated. The structure of the cutout unit 10 will be described below after describing the configurations of the inspection unit B and the sorting unit C in this order.

-Inspection part B The inspection part B is demonstrated referring FIG. 1 thru | or 3. FIG. FIG. 2 is a side view of the appearance inspection apparatus 100, and FIG. 3 is a plan view of the appearance inspection apparatus 100.

  The inspection unit B directly rotates the disks 3 and 4 having the same size and shape arranged in a substantially horizontal direction, the shafts 3A and 4A forming the centers of rotation of the disks 3 and 4, and the disk 3 directly. At the same time, a motor 5 as a stepping motor as a driving means for indirectly rotating the disk 4, an encoder unit 6 which is integrated with the shaft 3 A and detects the phase of the disk 3, and the driving force of the motor 5 is applied to the disk 4. And a drive transmission mechanism (not shown) for transmission.

  The inspection unit B also includes three cameras 7A to 7C for imaging the appearance of the electronic component W conveyed by the disk 3, and three cameras 7D to F for imaging the electronic component W conveyed by the disk 4. And have.

  The motor 5 rotates the disk 4 together with the disk 3 at a constant speed in synchronism with the disk 3 by the drive transmission mechanism. The motor 5 is actuated by an instruction from the control unit.

The disks 3 and 4 are arranged in an upside down manner. The disk 3 is located above the disk 4, and the disk 3 and the disk 4 are arranged such that a part of their peripheral portions overlap each other.
The disc 3 sucks and holds the electronic components W separated and conveyed one by one by the cutout unit 10 on the lower surface thereof at equal intervals along the circumferential direction, and conveys the electronic components W as it rotates.
The disk 4 attracts and holds the electronic component W conveyed by the disk 3 on the upper surface thereof at equal intervals along the circumferential direction, and conveys the electronic component W as it rotates.

  The disks 3 and 4 are characterized by their internal structures. This point will be described in detail with reference to FIGS. 16 to 18 after the structure of the cutout portion 10 is described.

  The structure of the portion where the disks 3 and 4 hold the electronic component W will be described with reference to FIGS. 4 is a plan view of the disk 4 as well as a bottom view of the disk 3, FIG. 5 is a side sectional view of a part of the disks 3 and 4, and FIG. 6 is a front view of a part of the disks 3 and 4. is there.

  The disks 3 and 4 are provided as protrusions that are convex to hold the electronic component W and are concentrically and annularly projected from the peripheral edge of one surface, in other words, in the vicinity of the peripheral edge. A ring portion 8 is provided. The ring portion 8 is located on the lower surface of the disk 3 and on the upper surface of the disk 4. Therefore, each ring portion 8 is in a state of protruding from each of the disks 3 and 4 so as to face each other.

  The ring portion 8 has V-shaped grooves 9 formed in 60 locations at equal intervals in the circumferential direction, as viewed from the front. Here, the circumferential direction is a tangential direction at the periphery of the disks 3 and 4, and the front view means a state viewed from the periphery of the disks 3 and 4 toward the center.

The groove 9 is formed by two tapered surfaces that are perpendicular to each other. A hole 11 for adsorbing the electronic component W is formed in the groove 9 so as to continue to the bottom thereof.
Each of the holes 11 is connected to a tube 12 as a suction tube portion located inside the disks 3 and 4, and a negative pressure is applied to the tube 12 by a suction mechanism (not shown) having a pump or the like, whereby an electron is applied to the groove 9. The part W is held.

  The suction mechanism, the hole 11, the tube 12, and other internal structures of the disks 3 and 4 to be described later are negative pressures that form a negative pressure for adsorbing and transporting the electronic component W to the disks 3 and 4 in each groove 9. It constitutes a part of the forming means.

  The discs 3 and 4 overlap each other in the vertical direction so that one ring portion 8 faces the other ring portion 8 at each peripheral edge portion. When the grooves 9 of the respective ring portions 8 face each other in the course of rotation, the disks 3 and 4 deliver the electronic component W from the upper disk 3 to the lower disk 4 in that state.

  The intervals in the vertical direction of the disks 3 and 4 are such that the distance between the electronic component W held in the groove 9 on the disk 3 side and the groove on the disk 4 side is as small as possible at the position where the ring portions 8 face each other. Have been adjusted so that.

  In FIG. 1, reference numeral 13 indicates a nozzle disposed on the upper surface side of the disk 3. The nozzle 13 is disposed so as to communicate with the pipe 12 connected to the hole 11 of the groove 9 at a position where the groove 9 of each ring portion 8 faces.

  The nozzle 13 ejects air from the hole 11 of the groove 9 at a timing when the groove 9 of each ring portion 8 faces by an air supply mechanism (not shown). This air is a separation air flow for separating the electronic component W adsorbed on the disk 3 from the disk 3 against the negative pressure formed by the negative pressure forming means. The nozzle 13 and the air supply mechanism function as detachment means that forms a detachment air flow and detaches the electronic component W conveyed by the disk 3 from the disk 3 and sends it toward the disk 4.

  Therefore, the electronic component W moves in a stable posture toward the disk 4 and is held in a correct posture in the groove 9 on the disk 4 side. Here, the correct posture means that the two upward surfaces that are in contact with the groove 9 in the state of being sucked and held in the groove 9 on the disk 3 side are exposed, and are exposed in the state of being sucked and held in the groove 9. This refers to a state in which the two downward facing surfaces are in contact with the groove on the disk 4 side.

  Based on the signal from the encoder unit 6, the cameras 7 </ b> A to 7 </ b> C image different side surfaces of the electronic component W when the electronic component W conveyed by the disk 3 occupies a predetermined position.

  Specifically, the camera 7 </ b> A captures an image of the surface that faces toward the camera 7 </ b> A as the disk 3 rotates, out of the two surfaces facing downward while being attracted to the groove 9 of the disk 3. The camera 7 </ b> B captures an image of the surface facing the outer circumference in a state of being attracted to the groove 9 of the disk 3. The camera 7 </ b> C is a surface opposite to the surface imaged by the camera 7 </ b> A among the two surfaces facing downward while being attracted to the groove 9 of the disk 3, i.e., the one away from the camera 7 </ b> C with the rotation of the disk 3. Image the surface. In addition, since it is also possible to image the surface which faces the inner circumference, it is also possible to image four surfaces during the transport process by the disk 3.

  The cameras 7 </ b> D to 7 </ b> F image different side surfaces of the electronic component W when the electronic component W conveyed by the disk 4 occupies a predetermined position based on a signal from the encoder unit 6.

  Specifically, the camera 7 </ b> D captures an image of the surface that faces the camera 7 </ b> D with the rotation of the disk 4, among the two surfaces that face upward while being attracted to the groove 9 of the disk 4. The camera 7E captures an image of a surface facing the outer circumference in a state where it is attracted to the groove 9 of the disk 4, that is, a surface opposite to the image captured by the camera 7B. The camera 7F is a surface opposite to the surface imaged by the camera 7D among the two surfaces facing downward while being attracted to the groove 9 of the disk 4, that is, the one that is separated from the camera 7F as the disk 4 rotates. Image the surface. In addition, since it is also possible to image the surface which faces a circumference inner side, it is also possible to image four surfaces in the conveyance process by the disk 4.

  Thereby, each of the cameras 7A to F images all six surfaces of the electronic component W. The captured image is subjected to image processing by the control unit, and is used for determining whether the electronic component W is good or bad. In this way, the electronic component W is determined to be good or bad by the appearance.

  Each groove 9 is assigned an address, in other words, an address, and whether the electronic component W is good or bad is stored in a memory provided in the control unit corresponding to the address. A defect has a plurality of modes and is stored in a memory in a state of being distinguished from each other.

  Configuration and control of the cameras 7A to 7F, image processing of data captured by the cameras 7A to 7F, processing for determining whether the electronic component W is good or defective based on the image processing results, and cameras 7A to 7 based on signals from the encoder unit 6 The sequence and control such as determination of the imaging timing by F and storing the determination result of good or bad in association with the address of the groove 9 are performed by the control unit by a general method.

  In this manner, in the inspection unit B, the electronic component W is attracted to the disks 3 and 4 by the negative pressure forming means, so that the holding during transportation is good, the imaging and inspection are performed well, and the time per time The occurrence of inspection defects is suppressed, and inspection efficiency is high. Since the electronic component W is transferred from the upper disk 3 to the lower disk 4, the stability of the movement of the electronic component W during the transfer is high, and the electronic component W is well held by the disk 4. Inspection is performed satisfactorily, occurrence of inspection failures per hour is suppressed, and inspection efficiency is high.

  Since the groove 9 is V-shaped, when the electronic component W is transferred from the disk 3 to the disk 4, the corner facing the lower side of the electronic component W is smoothly in the groove 9 of the lower disk 4. Entered, positioned, and highly stable with respect to movement of the electronic component W during delivery, the electronic component W is well held by the disk 4, and thus imaging and inspection are performed well, resulting in poor inspection per hour. Occurrence is suppressed and inspection efficiency is high.

  Since the groove 9 is V-shaped, the disks 3 and 4 can hold the electronic component W well, and the surface hidden by the groove 9 when holding the electronic component W having a substantially hexahedron shape is 2 Since only four surfaces are exposed, there are many surfaces that can be imaged and inspection efficiency is high. Furthermore, since the surface hidden by the groove 9 of the disk 3 is exposed to the disk 4 by delivery, the entire surface of the electronic component W can be photographed, the inspection efficiency is high, and the inspection reliability is high.

Sorting unit C The sorting unit C includes a plurality of nozzles 14 disposed on the lower surface side of the disk 4, a plurality of tubes 15 disposed at positions corresponding to the respective nozzles 14, and each tube 15. Each of the bins 16 serving as a plurality of accommodating portions and a suction mechanism (not shown) that generates a negative pressure toward the corresponding bin 16 in each tube 15 are provided.

  Each nozzle 14 is disposed so as to communicate with the pipe 12 connected to the groove 9 occupying the corresponding position. Each nozzle 14 independently ejects air from the hole 11 of the groove 9 at a timing when the groove 9 occupies a corresponding position by an air supply mechanism (not shown) provided with a pump or the like.

  This air is a separation air flow for separating the electronic component W adsorbed on the disk 4 from the disk 4 against the negative pressure formed by the negative pressure forming means. Each nozzle 14 and the air supply mechanism function as a detachment unit that forms a detachment air flow and detaches the electronic component W conveyed by the disk 4 from the disk 4 and sends it toward a predetermined bin 16.

  Each tube 15 has one end opened at a position where the electronic component W that is detached from the disk 3 enters by the separation air flow, and the other end is opened in the corresponding bin 16. The suction mechanism has a pump and the like. The tube 15 and the suction mechanism function as a housing and suction unit that generates a housing air flow for sucking the electronic component W conveyed by the disk 3 toward the predetermined bin 16.

  Each bin 16 has a different electronic component W to be accommodated. That is, each bin 16 is provided so as to be used properly according to the inspection result of the electronic component W, and accommodates the electronic component W determined to be non-defective, and the electronic component W determined to be defective. There is something to accommodate. Although there is one bin 16 for storing the electronic component W determined to be a non-defective product, there are a plurality of bins 16 for storing the electronic component W determined to be defective, and they are selectively used depending on the defect mode.

  Although suction by the tube 15 is always performed, the timing of the ejection of air from each nozzle 14 is controlled by the control unit. In this timing, the address of the groove 9 stored corresponding to the determination result of the good / bad electronic component W is stored so as to be accommodated in the corresponding bin 16 according to the determination result of the good / bad electronic component W. Determined by reference.

  Therefore, the electronic component W is surely detached from the disk 4 at a predetermined position and reliably conveyed into a predetermined bin 16 according to a good or defective state due to air ejection by the nozzle 14 and suction by the tube 15. , Housed. As described above, the electronic components W discharged from the disk 4 are sorted into the predetermined bins 16 according to the state.

  The detachment means and the accommodation suction means function as sorting and discharging means for discharging the electronic component W that has been inspected from the disk 4 at a predetermined position according to the inspection result. The sorting unit C functions as a sorting unit that sorts the electronic parts W that have been inspected and are conveyed by the disks 3 and 4 based on the inspection result.

-About the cutout unit 10 The structure of the cutout unit 10 will be described with reference to FIGS. FIG. 7 is a side view of the cutout portion 10, and also shows the front end portion of the linear feeder 2 and a partial cross section of the disk 3. FIG. 8 is a plan view of a part of the cutout unit 10, and FIG. 9 is a front view of a part of the cutout unit 10. The direction perpendicular to the paper surface in FIG. 7 corresponds to the left-right direction in FIGS.

  The cutout unit 10 supplies the electronic components W, which are arranged in a straight line without a gap by the linear feeder 2, to the disk 3 one by one. The cutout unit 10 is separated from the main body of the linear feeder 2 with a gap of 0.03 to 0.05 mm and is separated from each other, and is in a non-vibrating state. The reason for providing such a gap is to prevent the vibration of the main body of the linear feeder 2 from being transmitted to the cutout section 10, and to ensure that the electronic component W is satisfactorily conveyed from the main body of the linear feeder 2 to the cutout section 10.

  The cutout unit 10 includes a separation base 21 as a pair of displacement members that form holes 24 into which the electronic components W that are linearly arranged and conveyed by the linear feeder 2 without any gaps, and the electronic component W on the most distal side. And a contact portion 22 as a contact member with which the front side surface contacts.

  The cutout unit 10 also includes a detection unit (not shown) that emits and emits laser light in a direction perpendicular to the paper surface in FIG. 7 at a point P shown in FIG. 7, and a separation base 21 in the horizontal direction in FIGS. A support base 23 movably supported, a drive mechanism (not shown) that drives and displaces the separation base 21 in the direction in which the separation base 21 comes in contact with and separates from the support base 23, that is, in the left-right direction in FIGS. And a nozzle 28 disposed on the upper surface side of the disk 3.

  As shown in FIGS. 8 and 9, each separation base 21 is configured to form a hole 24 into which the electronic component W conveyed by the linear feeder 2 enters while being in contact with each other. That is, as shown in FIG. 9, each separation base 21 has V-shaped grooves on end surfaces facing each other, and holes 24 are formed by attaching these grooves. Each groove has two tapered surfaces which are perpendicular to each other, and as shown in FIG. 9, the shape of the hole 24 viewed from the front is a quadrangular shape whose corners are directed vertically and horizontally.

  The separation base 21 has a shape in which the upper right side in FIG. 7 is cut out, and forms a space 35 between the separation base 21 and the contact portion 22. The most distal electronic component W that has passed through the hole 24 is exposed in the space 35. In other words, the front side of the electronic component W exposed through the hole 24 and exposed to the space 35 abuts against and comes into contact with the contact portion 22, and another electronic component W is conveyed in a daisy chain from behind. The most distal electronic component W is positioned in the left-right direction in FIG.

  The ring portion 8 enters the space 35. The lower end position of the ring portion 8 is slightly higher than the upper end position of the hole 24, and does not hinder the conveyance of the electronic component W to the space 35, and the electronic component W positioned as described above is not It moves upward by suction by the tube 12 and is adsorbed by the groove 9. FIG. 7 shows a state where the electronic component W is normally attracted.

  The surface of the contact portion 22 with which the front side surface of the electronic component W abuts forms a plane perpendicular to the traveling direction of the electronic component W, that is, the extending direction of the hole 24, and prevents the electronic component W from moving upward. It has a smooth surface to prevent it from happening.

  The detection unit can detect a supply failure of the electronic component W to the disk 3, and includes an emission unit that emits laser light and an incident unit that receives the laser light emitted from the emission unit. The incident unit transmits a signal indicating whether or not the laser beam is received to the control unit.

  As shown in FIG. 7, the point P is a position where the laser light is incident on the incident portion without being blocked by the electronic component W when the electronic component W is normally adsorbed. Therefore, the electronic component W is not detected when the incident portion receives laser light, and the electronic component W is detected when the incident portion does not receive laser light.

  As shown in FIGS. 8 and 9, the support base 23 is provided between the state where each separation base 21 abuts and the state where each separation base 21 is separated as shown in FIGS. 10 and 11. The separation base 21 is supported so that it can slide.

  As shown in FIGS. 10 and 11, the support base 23 has an opening 36 that is exposed upward when the separation bases 21 are separated from each other, a discharge path 25 that communicates with the opening 36, and a negative pressure applied to the discharge path 25. And a suction mechanism (not shown) as discharge suction means for generating a suction air flow for sucking the electronic component W from the opening 36.

  The discharge path 25 is connected to a tube denoted by reference numeral 26 in FIG. The tube 26 is connected to a bin 27 as a housing member that houses the electronic component W that has been sucked from the opening 36 and passed through the tube 26 by a suction mechanism. The suction mechanism is always operating.

  The drive mechanism drives each separation base 21 to take one of the states shown in FIGS. 8 and 9 and the states shown in FIGS. 10 and 11 according to an instruction from the control unit. Each separation base 21 has a basic position in the state shown in FIGS. 8 and 9 and occupies positions separated from each other as shown in FIGS. 10 and 11 by the drive mechanism when some abnormality occurs as will be described later.

  The nozzle 28 is arranged so as to communicate with the pipe 12 connected to the groove 9 at a position above the groove 9 located immediately above the electronic component W that has passed through the hole 24 and has contacted the contact portion 22 in the space 35. It is installed. The nozzle 28 ejects air from the groove 9 at a predetermined timing described later by an air supply mechanism (not shown).

  This air is a separation air flow for separating the electronic component W adsorbed on the disk 3 from the disk 3 against the negative pressure formed by the negative pressure forming means. The nozzle 28 and the air supply mechanism function as detachment means that forms a detachment air flow and detaches the electronic component W conveyed by the disk 3 from the disk 3 and sends it toward the bin 27.

  Based on the signal from the incident part, the control part determines whether the electronic component W has been normally attracted to the groove 9 or some abnormality has occurred. The occurrence of abnormality has four patterns shown in FIGS. 12 to 15, respectively. The control unit performs predetermined control when an abnormality occurs based on a signal from the incident part. Yes.

  The abnormality shown in FIG. 12 is a state in which an abnormality has occurred in the posture of the electronic component W, that is, the electronic component W is inclined only by entering only a part of the tip side of the electronic component W into the groove 9. This is an abnormality that occurs when adsorption is not performed. In this case, at the point P, the laser light from the emitting part is continuously blocked, and the electronic component W is continuously detected. This case is hereinafter referred to as a workpiece posture abnormality.

  When the continuous detection state of the electronic component W exceeds a predetermined time, the control unit determines that an abnormality has occurred, stops driving the feeder unit A, stops the motor 5, and stops the rotation of the disks 3 and 4. . The control unit also operates the drive mechanism to displace the separation base 21 from the state shown in FIGS. 8 and 9 to the state shown in FIGS. 10 and 11, and drives the air supply mechanism to form a separation air flow. Then, the electronic component W is separated from the groove 9 and discharged into the discharge path 25. At this time, the electronic components conveyed in the hole 24 also fall into the discharge path 25, and all these electronic components W are accommodated in the bin 27 via the tube 26.

  The control unit stops the operation of the air supply mechanism after a predetermined time has elapsed, returns the separation base 21 to the state shown in FIGS. 8 and 9, and resumes the driving of the feeder unit A. The control unit detects the electronic component W based on a signal from the incident unit within a predetermined time, and determines that the electronic component W is normally adsorbed to the groove 9 when the electronic component W is not detected within the predetermined time. The motor 5 is driven to restart the rotation of the disks 3 and 4.

  The abnormality shown in FIG. 13 is when the size and shape of the electronic component W are abnormal, that is, when the electronic component W is abnormal, and the electronic component W does not move upward and normal suction is not performed. Is an abnormality that occurs. In this case, at the point P, the laser light from the emitting part is continuously blocked, and the electronic component W is continuously detected.

As an aspect in which the electronic component W is deformed, the length is longer than that of the normal electronic component W, as shown in FIG. In some cases, it remains in the state. Hereinafter, this case is referred to as a deformed workpiece abnormality.
When the continuous detection state of the electronic component W exceeds a predetermined time, the control unit determines that an abnormality has occurred, and performs the same control as in the case of the workpiece posture abnormality.

The abnormality shown in FIG. 14 is neither a work posture abnormality nor a deformed work abnormality, and the electronic component W does not move upward due to a weight that is heavier than a normal one, and normal suction is not performed. It is an abnormality that occurs. In this case as well, the laser light from the emitting part is continuously blocked at the point P, and the electronic component W is continuously detected. This case is hereinafter referred to as adsorption abnormality.
When the continuous detection state of the electronic component W exceeds a predetermined time, the control unit determines that an abnormality has occurred, and performs control similar to that in the case of a workpiece posture abnormality or a deformed workpiece abnormality.

  The abnormality shown in FIG. 15 is a state in which the conveyance of the electronic component W has occurred, specifically, the electronic component W stays in the hole 24 for some reason and becomes clogged, and the electronic component W does not pass through the hole 24. Therefore, this is an abnormality that occurs when normal adsorption is not performed. In this case, at the point P, the laser beam from the emitting part is continuously detected by the incident part, and the state where the electronic component W is not detected continues. This case is hereinafter referred to as a workpiece loading abnormality.

  When the continuous non-detection state of the electronic component W exceeds a predetermined time, the control unit determines that an abnormality has occurred, stops the feeder unit A, stops the motor 5, and stops the rotation of the disks 3 and 4 To do. The control unit also operates the drive mechanism to displace the separation base 21 from the state shown in FIGS. 8 and 9 to the state shown in FIGS. 10 and 11, and moves the electronic component W in the hole 24 into the discharge path 25. To discharge.

  At this time, the air supply mechanism is not driven, but may be performed. Alternatively, the linear feeder 2 may be continuously driven to shift to a discharge mode in which the electronic component W is forcibly discharged. The electronic component W that has fallen into the discharge path 25 is accommodated in the bin 27 via the tube 26.

  After a predetermined time has elapsed, the control unit returns the separation base 21 to the state shown in FIGS. 8 and 9 and resumes the driving of the feeder unit A. The control unit detects the electronic component W based on a signal from the incident unit within a predetermined time, and determines that the electronic component W is normally adsorbed to the groove 9 when the electronic component W is not detected within the predetermined time. The motor 5 is driven to restart the rotation of the disks 3 and 4.

  In addition, as an aspect detected as an abnormality, there is a case where all the electronic components W of the feeder unit A are supplied to the inspection unit B and become empty. In this case, the laser beam from the emitting part continues to be detected by the incident part at the point P as in the case of the workpiece carry-in abnormality, and the state where the electronic component W is not detected continues. In this case, the sensor provided in each of the quantitative supply feeder 1 and the linear feeder 2 also continues to be in a state where the electronic component W is not detected. This case is hereinafter referred to as a workpiece inspection completion state.

  In the workpiece inspection completion state, the control unit performs the same control as in the case of the workpiece loading abnormality, but the state where the electronic component W is not detected continues even after the feeder unit A is restarted after the above-described predetermined operation. It will be. Therefore, if the electronic component W is not detected even if the control at the time of the workpiece loading abnormality is repeated, the control unit stops all the operations of the appearance inspection apparatus 100 and shifts to the standby state, assuming that the workpiece inspection has been completed. To do. Whether or not to shift to the standby state when the control at the time of abnormal workpiece loading is repeated is set as appropriate.

  Since the cutout part 10 does not vibrate, the electronic component W does not vibrate when the electronic component W exposed in the space 35 is attracted to the groove 9 of the disk 3, and maintains a stable posture. Therefore, the supply capability to the groove 9 is high, so that the workpiece posture abnormality and the suction abnormality are less likely to occur, the occurrence of supply failure per time is suppressed, and the inspection efficiency is high.

-Internal structure of disk 3 and disk 4 The internal structure of the disks 3 and 4 is demonstrated with reference to FIG. 16 thru | or FIG. 16 is a side sectional view of a part of the disks 3 and 4 and the shafts 3A and 4A, and FIGS. 17 and 18 are schematic views of the AA section of FIG.

  The tubes 12 are formed so as to penetrate the disks 3 and 4 in the thickness direction of the disks 3 and 4, respectively. One end of the tube 12 communicates with the groove 9, and the other end communicates with the nozzles 13, 14, and 28 as described above. In FIG. 18, the nozzles 13, 14, and 28 are merely illustrated for convenience of explanation, and are different from actual ones.

  The other end of the tube 12 can communicate with the nozzles 13, 14, 28 as described above, while the disks 3, 4 rotate, while the nozzles 13, 14, 28 are fixedly arranged at fixed positions. Because it is.

  A hollow needle 29 is disposed in the tube 12 over substantially the entire thickness of the disks 3 and 4. In FIG. 17, the needle 29 is only shown for convenience of explanation, and is different from the actual one.

  The end portions of the needle 29 on the nozzles 13, 14, and 28 side are in close contact with the inner wall surface of the tube 12 so as to guide all the separated air flows from the nozzles 13, 14, and 28 into the needle 29. The end of the needle 29 on the groove 9 side is tapered, facing the hole 11, and the air supplied from the nozzles 13, 14, 28 is efficiently discharged from the groove 9. It is separated from the inner wall surface of the tube 12.

  Therefore, the negative pressure formed by the negative pressure forming means acts in the groove 9 from the hole 11 and adsorbs the electronic component W to the groove 9, but when the separation air flow is formed, the separation air flow is The electronic component W ejected into the groove 9 from 11 and adsorbed in the groove 9 is detached from the disks 3 and 4.

  Each of the shafts 3A and 4A has a hole 30 extending in the axial direction and a plurality of holes 31 formed from the hole 30 toward the peripheral surfaces of the shafts 3A and 4A. The hole 30 is connected to a suction mechanism, and the inside of the holes 30 and 31 is maintained at a negative pressure.

  The discs 3 and 4 are cylindrical space portions 32 positioned around the axes 3A and 4A, and radially from the space portions 32 toward the respective tubes 12, that is, radially from the central portions of the discs 3 and 4 toward the respective tubes 12. And a plurality of formed pipe portions 33. Each of the tube portions 33 has one end communicating with the space portion 32 and the other end communicating with the tube 12. Thereby, the pipe part 33 communicates with the space part 32 and the pipe 12 and communicates with each of the holes 11 via the pipe 12.

  Each tube 12 extends in the radial direction of the disks 3 and 4. Here, the radial direction is a direction connecting the rotation center and the outer periphery of the disks 3 and 4. The space part 32 has a function as a communication part that allows the pipe parts 33 to communicate with each other.

  Each pipe part 33 has a pocket 34 as a buffer part for buffering the separated air flow, having a depth in the thickness direction of the disks 3 and 4 in the middle in the radial direction. The pocket 34 is formed to have a larger diameter than the other portion of the pipe portion 33, that is, the portion excluding the pocket 34.

  The pockets 34 are arranged such that the distances from the centers of the disks 3 and 4 are alternately repeated between the adjacent pipe portions 33. Thereby, compared with the case where the distance between the center of the disks 3 and 4 and each pocket 34 is equal distance, the holding | maintenance number of the electronic components W by the disks 3 and 4 can be increased. That is, in order to form a large number of grooves 9 and increase the number of electronic components W held by the disks 3 and 4, pockets 34 are provided for the respective tube portions 33 even if the intervals between the tube portions 33 are reduced. An area in which the pocket 34 is provided is secured so that it can be done.

  In order to secure a region where the pocket 34 is provided, it is arranged so that the distances from the center of the disks 3 and 4 of the adjacent pockets 34 are alternately repeated as in the present embodiment, This distance is preferable from the viewpoint of the formation of the pockets 34, but such a distance is arranged in such a manner that the distances from the centers of the disks 3 and 4 of the adjacent pockets 34 are different from each other in an aspect other than the alternately repeating aspect. May be.

  With such a structure, a negative pressure that attracts the electronic component W to the groove 9 is generated by the suction mechanism through the holes 30 and 31, the space portion 32, the tube portion 33, the tube 12, and the hole 11. These suction mechanisms, holes 30 and 31, space portion 32, tube portion 33, tube 12 and hole 11 form a negative pressure for adsorbing and transporting electronic component W to disks 3 and 4 in each groove 9. The pressure forming means is configured.

On the other hand, as described above, the air supply mechanism is driven at a predetermined timing to remove the electronic component W from the groove 9, and air is blown into the tube 12 from the nozzles 13, 14, and 28.
At this time, when air is blown into the other pipe part 33 such as the adjacent pipe part 33 through the pipe part 33 and the space part 32 communicated with the pipe 12, the groove 9 communicated with the pipe part 33. There is a risk that the electronic component W that should be attracted to the product will be detached.

  This is because the gap between the pipe parts 33 facing the space part 32 is small, so if a separation air flow flows into the space part 32 from a certain pipe part 33, the surrounding atmospheric pressure increases, This is because the pressure of the pipe portion 33 cannot maintain the negative pressure necessary for adsorbing the electronic component W in the groove 9 communicating with the pipe portion 33.

  However, the needle 29 is disposed so that the separated air flow supplied from the nozzles 13, 14 and 28 is efficiently ejected from the groove 9, and the pocket 34 is provided to reduce the volume of the pipe portion 33. Air is blown into a certain pipe 12 by increasing the pressure and buffering the instantaneous change in atmospheric pressure from the pipe 12 side to the space 32 side or from the space 32 side to the pipe 12 side. Even in such a case, the influence on the adjacent and surrounding tube 12 is reduced, and the suction state of the electronic component W to be sucked is ensured.

  Therefore, since only the desired electronic component W is detached from the disks 3 and 4 and the other electronic components W are transported while being held by the disks 3 and 4, the imaging and inspection are performed well and finally As a result, the inspection efficiency is improved.

  Since the adjacent pockets 34 are arranged at different distances from the center, not only the thickness direction of the disks 3 and 4 but also the size in the radial direction can be increased, thereby improving the buffer efficiency. Has improved. However, the size only in the thickness direction may be increased. If the diameter of the entire pipe portion 33 is increased, the negative pressure forming efficiency is reduced. Therefore, it is desirable to increase the diameter of only the pocket 34 portion. It has a structure.

  Since the adjacent pockets 34 are arranged at different distances from the center, not only the thickness direction of the disks 3 and 4 but also the size in the radial direction can be increased, and further, the interval between the pipe portions 33 can be suppressed. Therefore, it is possible to increase the number of electronic parts W held by the disks 3 and 4 by increasing the number of the pipe portions 33 while suppressing the size of the disks 3 and 4.

  Since the adjacent pockets 34 are arranged so that the distances from the center are alternately repeated, the manufacturing process of the pockets 34 is simple, and the pockets 34 are relatively easily manufactured. Is suppressed.

  The configuration and operation of the appearance inspection apparatus 100 according to the present invention have been described above, but operations that are not particularly described are also controlled by the control unit. The control unit includes a CUP, a memory, and the like.

  Of the grooves 9 of the disk 3, the grooves 9 after the electronic component W is transferred to the disk 4, and before the electronic component W is adsorbed by the cutout portion 10, the holes 11 are exposed, and the air Is in a state to enter. Further, among the grooves 9 of the disk 4, the grooves 9 after sorting the electronic components W, and before receiving the electronic components W from the disks 3, the holes 11 are exposed and air enters. It has become. Therefore, although the negative pressure is reduced by the ingress of air, the shape and size of the output of the suction mechanism, the hole 11, the pipe 12, the pipe part 33, the space part 32, etc. The electronic component W is designed to be maintained in a range in which the holding of the electronic component W is maintained well.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Deformation / change is possible.

  For example, the encoder 6 is used to improve the accuracy of rotation control of the disks 3 and 4 by performing mechanical detection in addition to electronic control of the motor 5 which is a stepping motor. The rotation control of the disks 3 and 4 may be performed only by electronic control of the motor 5 without using the motor.

  Moreover, the camera which images the electronic component W should just be provided corresponding to the position of the surface which should be image | photographed by the number of the surfaces of the electronic component W which should be imaged. It may be arranged. Each air supply mechanism and each suction mechanism may be provided with a pump or the like, or may be operated by a common pump or the like.

  The effects described in the embodiments of the present invention are only the most preferable effects resulting from the present invention, and the effects of the present invention are limited to those described in the embodiments of the present invention. is not.

It is a schematic perspective view of the external appearance inspection apparatus in this embodiment. It is a schematic side view of the external appearance inspection apparatus in this embodiment. It is a schematic plan view of the external appearance inspection apparatus in this embodiment. It is the top view or bottom view of the disk with which the appearance inspection apparatus in this embodiment was equipped, and the one part enlarged view. It is an expanded sectional side view of the convex part and groove | channel of a disk with which the external appearance inspection apparatus in this embodiment was equipped. It is an expansion front sectional view of the convex part and slot of a disk with which the appearance inspection device in this embodiment was equipped. It is a partial expanded sectional view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the state by which the electronic component was supplied normally. It is a partial top view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the state in which the electronic component is supplied normally. It is a front view of a part of the cutout part provided in the appearance inspection apparatus in the present embodiment, and is a diagram showing a state in which electronic components are normally supplied. It is a partial top view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the state in which supply of the electronic component was not normal. It is a front view of a part of the cutout part provided in the appearance inspection apparatus in the present embodiment, and is a diagram showing a state where the supply of electronic components is not normal. It is a partial expanded sectional view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the state in which supply of an electronic component is not normal. It is a partial expanded sectional side view of the cutout part with which the visual inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the other state in which supply of an electronic component is not normal. It is a partial expanded sectional view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows another state in which supply of an electronic component is not normal. It is a partial expanded sectional view of the cutout part with which the appearance inspection apparatus in this embodiment was equipped, Comprising: It is a figure which shows the other state in which supply of an electronic component is not normal. It is a side sectional view of a part of a disk provided in the appearance inspection apparatus in this embodiment and the surrounding structure. It is the schematic of the AA cross section of FIG. FIG. 17 is another schematic view taken along line AA of FIG. 16.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Disc 4 Disc 11 Hole 11, 12, 30-34 Negative pressure formation means 13 Release means 14 Release means 28 Release means 32 Communication part 33 Pipe part 34 Buffer part 100 Appearance inspection apparatus W Electronic component

Claims (4)

In an appearance inspection apparatus that includes a disk for conveying an electronic component by rotation, images the appearance of the electronic component conveyed by the disk, and inspects the appearance of the electronic component based on the imaged appearance of the electronic component,
A negative pressure forming means for forming a negative pressure for adsorbing and transporting the electronic component to the disk, and a detaching means for forming a separation air flow for detaching the electronic component adsorbed by the disk from the disk. Have
A plurality of the negative pressure forming means are provided at the peripheral edge of the disk, and each of the negative pressure forming means is provided radially so as to communicate with each of the holes from the center of the disk inside the disk and holes for adsorbing electronic components. A plurality of pipe sections, and a communication section for communicating the pipe sections with each other,
Each of the tube parts has a buffer part for buffering the separated air flow in the middle of the disk in the radial direction. The appearance inspection apparatus according to claim 1,
The appearance inspection apparatus, wherein the buffer portion is formed to have a larger diameter than other portions of the tube portion. In the visual inspection apparatus according to claim 1 or 2,
The appearance inspection apparatus, wherein the buffer portions are arranged so that the distances from the central portion of the adjacent buffer portions are different from each other. The appearance inspection apparatus according to claim 3,
The appearance inspection apparatus, wherein the buffer portions are arranged so that the distances from the central portions of the adjacent buffer portions are alternately repeated.

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