JP2004535306A5 - - Google Patents
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- Publication number
- JP2004535306A5 JP2004535306A5 JP2003513743A JP2003513743A JP2004535306A5 JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5 JP 2003513743 A JP2003513743 A JP 2003513743A JP 2003513743 A JP2003513743 A JP 2003513743A JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive article
- wear indicator
- abrasive
- fixed abrasive
- composite element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002131 composite material Substances 0.000 claims 3
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/910,425 US20020077037A1 (en) | 1999-05-03 | 2001-07-20 | Fixed abrasive articles |
PCT/US2002/021940 WO2003008151A1 (en) | 2001-07-20 | 2002-07-12 | Fixed abrasive articles with wear indicators |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004535306A JP2004535306A (ja) | 2004-11-25 |
JP2004535306A5 true JP2004535306A5 (enrdf_load_stackoverflow) | 2006-01-05 |
Family
ID=25428766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003513743A Withdrawn JP2004535306A (ja) | 2001-07-20 | 2002-07-12 | 摩耗インジケータを有する固定研磨物品 |
Country Status (7)
Families Citing this family (95)
Publication number | Priority date | Publication date | Assignee | Title |
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US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7066800B2 (en) | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US6991526B2 (en) | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6896776B2 (en) | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
US6837983B2 (en) * | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
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US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
US7186164B2 (en) | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
US7390744B2 (en) | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US20050176251A1 (en) * | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
EP1799402A4 (en) * | 2004-10-06 | 2009-12-16 | Rajeev Bajaj | METHOD AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION |
EP2797109B1 (en) * | 2004-11-01 | 2018-02-28 | Ebara Corporation | Polishing apparatus |
US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US20140120807A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
CN101238178B (zh) | 2005-06-29 | 2012-04-11 | 圣戈本磨料股份有限公司 | 用于研磨产品的高性能树脂 |
US7494519B2 (en) * | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
JP4756583B2 (ja) * | 2005-08-30 | 2011-08-24 | 株式会社東京精密 | 研磨パッド、パッドドレッシング評価方法、及び研磨装置 |
CA2647881C (en) * | 2006-04-04 | 2012-02-14 | Saint-Gobain Abrasives, Inc. | Infrared cured abrasive articles and method of manufacture |
US20070243798A1 (en) * | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
US7410413B2 (en) * | 2006-04-27 | 2008-08-12 | 3M Innovative Properties Company | Structured abrasive article and method of making and using the same |
US7422982B2 (en) * | 2006-07-07 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
CA2694713C (en) * | 2007-07-27 | 2013-01-15 | Saint-Gobain Abrasifs | Abrasive products with splice marks and automated splice detection |
US20090110890A1 (en) * | 2007-10-30 | 2009-04-30 | 3M Innovative Properties Company | Color changing wear indicator |
CN101990483B (zh) * | 2008-04-01 | 2013-10-16 | 音诺帕德股份有限公司 | 具有经控制的孔隙形态的抛光垫 |
US20090307986A1 (en) * | 2008-06-12 | 2009-12-17 | Hung-Hui Huang | Polishing composition and making method thereof for polishing a substrate |
US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
US20100227141A1 (en) * | 2009-03-05 | 2010-09-09 | Gm Global Technology Operations, Inc. | Protective coating for industrial parts |
US20110021114A1 (en) * | 2009-07-27 | 2011-01-27 | Mcardle James L | Abrasive article with preconditioning and persistent indicators |
US20130126334A1 (en) * | 2010-08-31 | 2013-05-23 | Yoshihiro Tawara | Method for producing glass substrate for magnetic disks, and method for producing magnetic disk |
CN102229099A (zh) * | 2011-05-22 | 2011-11-02 | 浙江省天台祥和实业有限公司 | 密封件研磨清洗机 |
CN102499604A (zh) * | 2011-11-01 | 2012-06-20 | 常熟新诚鑫织造有限公司 | 带使用提示装置的毛巾面料 |
US9746129B2 (en) | 2012-09-28 | 2017-08-29 | Momentive Performance Materials Inc. | Puck wear detection |
JP5373171B1 (ja) * | 2012-10-20 | 2013-12-18 | 株式会社ナノテム | 砥石およびそれを用いた研削・研磨装置 |
KR101506613B1 (ko) | 2013-05-13 | 2015-03-27 | 이화다이아몬드공업 주식회사 | 와이어 절삭공구 및 그 제조방법 |
KR200478500Y1 (ko) | 2013-10-01 | 2015-10-14 | 김도영 | 양면 연마장치용 연마패드 |
GB2537161B (en) * | 2015-04-10 | 2019-06-19 | Reckitt Benckiser Brands Ltd | Novel material |
US11103117B2 (en) * | 2016-04-29 | 2021-08-31 | 3M Innovative Properties Company | Cleaning articles including scouring bodies that form printed instructions |
DE102016115770A1 (de) * | 2016-08-25 | 2018-03-01 | Smiths Heimann Gmbh | Strahlenschutzelement mit integrierter Austauschanzeige |
JP6732381B2 (ja) * | 2016-10-03 | 2020-07-29 | 株式会社ディスコ | 切削装置 |
US10344993B2 (en) * | 2017-06-29 | 2019-07-09 | Deere & Company | Extractor fan with wear indicator |
WO2019014282A1 (en) * | 2017-07-10 | 2019-01-17 | Osborn, A Unit Of Jason Incorporated | ABRASIVE POLISHING OR BUFFLAGE ARTICLE WITHOUT COMPOUND |
CN107685288B (zh) * | 2017-09-05 | 2019-05-10 | 南京航空航天大学 | 一种游离磨粒轨迹检测方法 |
CN109420973B (zh) * | 2017-09-05 | 2020-11-17 | 联华电子股份有限公司 | 晶片研磨盘与其使用方法 |
US11325221B2 (en) * | 2017-11-16 | 2022-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with multipurpose composite window |
US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
CN108127582B (zh) * | 2017-12-13 | 2019-12-31 | 湖北鼎汇微电子材料有限公司 | 一种制备抛光层的模具及制备方法 |
CN109108800A (zh) * | 2018-08-13 | 2019-01-01 | 芜湖九鼎电子科技有限公司 | 一种全自动仪表镜面磨光机 |
EP3616840B1 (en) * | 2018-09-03 | 2024-10-30 | 3M Innovative Properties Company | Abrasive article |
US11911871B2 (en) * | 2018-10-31 | 2024-02-27 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing composite article |
WO2020128853A1 (en) | 2018-12-18 | 2020-06-25 | 3M Innovative Properties Company | Tooling splice accommodation for abrasive article production |
EP3898087A1 (en) * | 2018-12-18 | 2021-10-27 | 3M Innovative Properties Company | Patterned abrasive substrate and method |
US12011807B2 (en) | 2018-12-18 | 2024-06-18 | 3M Innovative Properties Company | Shaped abrasive particle transfer assembly |
EP3898092A1 (en) | 2018-12-18 | 2021-10-27 | 3M Innovative Properties Company | Camouflage for abrasive articles |
CN113260486A (zh) | 2018-12-18 | 2021-08-13 | 3M创新有限公司 | 具有间隔颗粒的涂层磨料制品及其制备方法和设备 |
CN113226648A (zh) | 2018-12-18 | 2021-08-06 | 3M创新有限公司 | 磨料制品产生中改善的颗粒接收 |
CN113226647A (zh) | 2018-12-18 | 2021-08-06 | 3M创新有限公司 | 具有不同加工速度的磨料制品制造机 |
CN109454547A (zh) * | 2018-12-27 | 2019-03-12 | 杭州众硅电子科技有限公司 | 一种用于cmp抛光垫寿命在线检测的系统和方法 |
CN111896407A (zh) * | 2020-06-09 | 2020-11-06 | 河北招岳聚氨酯制品有限公司 | 一种筛板磨损监测系统 |
US11673429B2 (en) * | 2020-08-24 | 2023-06-13 | Evident Canada, Inc. | Shoe interface wear indicator |
CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
CN119421762A (zh) * | 2022-06-22 | 2025-02-11 | 3M创新有限公司 | 磨料制品、系统和使用方法 |
EP4364945A1 (en) * | 2022-11-01 | 2024-05-08 | Roller Bearing Company of America, Inc. | Machinable molded fretting buffer |
Family Cites Families (46)
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US5014468A (en) * | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
AT396213B (de) * | 1990-04-11 | 1993-07-26 | Swarovski Tyrolit Schleif | Schleifscheibe |
US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
JP3286941B2 (ja) * | 1991-07-09 | 2002-05-27 | 株式会社日立製作所 | ダイヤモンド研削砥石のツルーイング法 |
US5437754A (en) * | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
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US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
US5536202A (en) * | 1994-07-27 | 1996-07-16 | Texas Instruments Incorporated | Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
US5527424A (en) * | 1995-01-30 | 1996-06-18 | Motorola, Inc. | Preconditioner for a polishing pad and method for using the same |
JP3438383B2 (ja) * | 1995-03-03 | 2003-08-18 | ソニー株式会社 | 研磨方法およびこれに用いる研磨装置 |
JP3708167B2 (ja) * | 1995-05-17 | 2005-10-19 | 株式会社荏原製作所 | 研磨布及び該研磨布を備えたポリッシング装置 |
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JP2830907B2 (ja) * | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | 半導体基板研磨装置 |
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JP3295888B2 (ja) * | 1998-04-22 | 2002-06-24 | 株式会社藤森技術研究所 | ケミカルマシンポリッシャの研磨盤用研磨ドレッサ |
US6106661A (en) * | 1998-05-08 | 2000-08-22 | Advanced Micro Devices, Inc. | Polishing pad having a wear level indicator and system using the same |
JPH11347919A (ja) * | 1998-06-09 | 1999-12-21 | Oki Electric Ind Co Ltd | 半導体素子の研磨平坦化装置及び研磨平坦化方法 |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
US6093085A (en) * | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
GB2345657B (en) * | 1999-01-13 | 2001-08-15 | United Microelectronics Corp | Lifetime self-indicated polishing pad |
US6244935B1 (en) * | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
US6238592B1 (en) * | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
US6264533B1 (en) * | 1999-05-28 | 2001-07-24 | 3M Innovative Properties Company | Abrasive processing apparatus and method employing encoded abrasive product |
-
2001
- 2001-07-20 US US09/910,425 patent/US20020077037A1/en not_active Abandoned
-
2002
- 2002-07-12 CN CNA028147529A patent/CN1535197A/zh active Pending
- 2002-07-12 JP JP2003513743A patent/JP2004535306A/ja not_active Withdrawn
- 2002-07-12 WO PCT/US2002/021940 patent/WO2003008151A1/en active Application Filing
- 2002-07-12 KR KR10-2004-7000826A patent/KR20040017328A/ko not_active Withdrawn
- 2002-07-12 EP EP02746972A patent/EP1409201A1/en not_active Withdrawn
- 2002-07-19 TW TW091116153A patent/TW565488B/zh active
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