JP2004525008A5 - - Google Patents

Download PDF

Info

Publication number
JP2004525008A5
JP2004525008A5 JP2002586693A JP2002586693A JP2004525008A5 JP 2004525008 A5 JP2004525008 A5 JP 2004525008A5 JP 2002586693 A JP2002586693 A JP 2002586693A JP 2002586693 A JP2002586693 A JP 2002586693A JP 2004525008 A5 JP2004525008 A5 JP 2004525008A5
Authority
JP
Japan
Prior art keywords
processing method
potential
exposed
film
exposed connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002586693A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004525008A (ja
JP4288077B2 (ja
Filing date
Publication date
Priority claimed from US09/844,377 external-priority patent/US6588095B2/en
Application filed filed Critical
Publication of JP2004525008A publication Critical patent/JP2004525008A/ja
Publication of JP2004525008A5 publication Critical patent/JP2004525008A5/ja
Application granted granted Critical
Publication of JP4288077B2 publication Critical patent/JP4288077B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002586693A 2001-04-27 2002-04-26 デバイスの処理方法 Expired - Fee Related JP4288077B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/844,377 US6588095B2 (en) 2001-04-27 2001-04-27 Method of processing a device by electrophoresis coating
PCT/US2002/013272 WO2002089543A1 (en) 2001-04-27 2002-04-26 Protection of conductive connection by electrophoresis coating and structure formed thereof

Publications (3)

Publication Number Publication Date
JP2004525008A JP2004525008A (ja) 2004-08-19
JP2004525008A5 true JP2004525008A5 (enExample) 2005-12-22
JP4288077B2 JP4288077B2 (ja) 2009-07-01

Family

ID=25292566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002586693A Expired - Fee Related JP4288077B2 (ja) 2001-04-27 2002-04-26 デバイスの処理方法

Country Status (5)

Country Link
US (1) US6588095B2 (enExample)
EP (1) EP1382232B1 (enExample)
JP (1) JP4288077B2 (enExample)
DE (1) DE60232648D1 (enExample)
WO (1) WO2002089543A1 (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
US7053478B2 (en) 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US6914324B2 (en) * 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7371609B2 (en) * 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US20030234443A1 (en) 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
US7202555B2 (en) * 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6877840B2 (en) * 2003-04-30 2005-04-12 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly
US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US7229152B2 (en) * 2003-10-31 2007-06-12 Hewlett-Packard Development Company, L.P. Fluid ejection device with insulating feature
US7579687B2 (en) * 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7511968B2 (en) 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US20060053345A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7446410B2 (en) * 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
GB0919404D0 (en) 2009-11-05 2009-12-23 Xennia Technology Ltd Inkjet printer
JP5405425B2 (ja) * 2010-09-30 2014-02-05 富士フイルム株式会社 液体吐出ヘッド及びインクジェット記録装置並びに給電配線基板の乾燥方法
GB2503482A (en) 2012-06-28 2014-01-01 Ibm Tape head system with electrostatic element
CN112719065A (zh) * 2020-12-23 2021-04-30 成都宏明双新科技股份有限公司 一种改善产品在落料时下层电泳漆层保留量的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4208261A (en) * 1978-06-02 1980-06-17 Shinto Paint Co., Ltd. Continuous method for cathodic electrodeposition
SE435343B (sv) 1978-12-05 1984-09-24 Thams Johan Petter B Forfarande vid beleggning vid skarpa kanter pa metallforemal
GB2117794B (en) 1982-04-06 1986-05-21 Standard Telephones Cables Ltd Electrocoating electrical components
JPS63301591A (ja) 1987-05-30 1988-12-08 Nissha Printing Co Ltd プリント基板用カバ−レイの形成方法
JPH024892A (ja) * 1988-06-22 1990-01-09 Canon Inc 接着性被着材および接着工法
DE3826715A1 (de) * 1988-08-05 1990-02-22 Fraunhofer Ges Forschung Verfahren zum beschichten von substraten mit einem isolierenden ueberzug
JPH02267992A (ja) 1989-04-07 1990-11-01 Mitsubishi Electric Corp 配線板の製造方法
JPH0521680A (ja) 1991-07-10 1993-01-29 Hitachi Cable Ltd 樹脂封止半導体装置の表面処理法
US5442386A (en) 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead
US5855753A (en) * 1996-11-26 1999-01-05 The Trustees Of Princeton University Method for electrohydrodynamically assembling patterned colloidal structures
US5830340A (en) * 1997-03-05 1998-11-03 Trumem International Llc Method for making a composite filter

Similar Documents

Publication Publication Date Title
JP2004525008A5 (enExample)
JP4288077B2 (ja) デバイスの処理方法
US3885304A (en) Electric circuit arrangement and method of making the same
WO2002065487A1 (en) Resistor element, stress sensor and method for manufacturing them
JP2000188368A (ja) Ｅｏｓ過渡現象に対する保護部を提供するための電気デバイスおよび電気デバイス製造方法
US3919602A (en) Electric circuit arrangement and method of making the same
JP3360772B2 (ja) 微細電極の接続構造および微細電極を持つ電子部品の検査方法
JPH05500733A (ja) 印刷配線板複合構造体
CN111854591A (zh) 一种贴片式电子皮肤单元和贴片式电子皮肤
JPH0628121B2 (ja) 異方導電フイルム
JPH0669636A (ja) 部品装着構造と部品装着方法
KR20140020767A (ko) 칩형 전자 부품 및 접속 구조체
JPS6067984A (ja) 平面表示パネルの電極端子取出構造
JPH11145595A (ja) 表面実装部品の実装構造
JP3833084B2 (ja) 電子部品実装用フィルムキャリアテープの製造方法
JP3691821B2 (ja) 応力センサ
JPH0358492A (ja) プリント配線板の製法
JPH01164044A (ja) チップ実装方法
CN107431046A (zh) 电路结构体
JP2932772B2 (ja) 混成集積回路装置
JPS622592A (ja) 平滑型回路モジユ−ルの製造方法
US20230307408A1 (en) Insulating paste-based conductive device and manufacturing method thereof
JP2000311731A (ja) 電気コネクタ
CN109903938A (zh) 一种一体散热的电阻器及制造方法
JPH10144725A (ja) 集積回路の実装方法