JP2004520612A - 光導波路をエレクトロオプティックもしくはオプトエレクトリックな半導体コンバータに光学的に結合するための結合装置 - Google Patents

光導波路をエレクトロオプティックもしくはオプトエレクトリックな半導体コンバータに光学的に結合するための結合装置 Download PDF

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JP2004520612A
JP2004520612A JP2002554767A JP2002554767A JP2004520612A JP 2004520612 A JP2004520612 A JP 2004520612A JP 2002554767 A JP2002554767 A JP 2002554767A JP 2002554767 A JP2002554767 A JP 2002554767A JP 2004520612 A JP2004520612 A JP 2004520612A
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Prior art keywords
coupling device
submount
optical waveguide
semiconductor element
coupling
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Pending
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JP2002554767A
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JP2004520612A5 (enExample
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ハンス・クラグル
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ディーモント・ゲーエムベーハー
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2808—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using a mixing element which evenly distributes an input signal over a number of outputs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
JP2002554767A 2000-12-29 2001-12-20 光導波路をエレクトロオプティックもしくはオプトエレクトリックな半導体コンバータに光学的に結合するための結合装置 Pending JP2004520612A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10065624A DE10065624C2 (de) 2000-12-29 2000-12-29 Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
PCT/EP2001/015153 WO2002054129A1 (de) 2000-12-29 2001-12-20 Kopplungsanordnung zum optischen koppeln eines lichtwellenleiters mit einem elektro-optischen element

Publications (2)

Publication Number Publication Date
JP2004520612A true JP2004520612A (ja) 2004-07-08
JP2004520612A5 JP2004520612A5 (enExample) 2005-05-26

Family

ID=7669366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002554767A Pending JP2004520612A (ja) 2000-12-29 2001-12-20 光導波路をエレクトロオプティックもしくはオプトエレクトリックな半導体コンバータに光学的に結合するための結合装置

Country Status (5)

Country Link
US (1) US6832861B2 (enExample)
EP (1) EP1348143B1 (enExample)
JP (1) JP2004520612A (enExample)
DE (1) DE10065624C2 (enExample)
WO (1) WO2002054129A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237141A (ja) * 2005-02-23 2006-09-07 Stanley Electric Co Ltd サブマウント型ｌｅｄ
JP2009025587A (ja) * 2007-07-20 2009-02-05 Sanwa Denki Kogyo Co Ltd 光サブアッセンブリ構造
JP2010016329A (ja) * 2008-07-03 2010-01-21 Samsung Electro Mech Co Ltd 発光ダイオードパッケージ
JP2011048371A (ja) * 2009-08-28 2011-03-10 General Electric Co <Ge> 発光ダイオード−光ガイドカップリング装置
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置
JP2014502040A (ja) * 2010-10-26 2014-01-23 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム、変調装置およびファイバ固定基板を製造する方法
US9022632B2 (en) 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
JP2015087744A (ja) * 2013-09-26 2015-05-07 オリンパス株式会社 光伝送モジュールおよび内視鏡

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077002A1 (de) * 2002-03-08 2003-09-18 Infineon Technologies Ag Aufnahme- und koppelteil für ein opto-elektronisches sende- und/oder empfangselement
DE10250383B4 (de) * 2002-10-29 2007-05-10 Diemount Gmbh Leuchtdiodenanordnung mit Reflektor
DE10250540B3 (de) 2002-10-29 2004-07-15 Infineon Technologies Ag Verfahren zur Herstellung eines optoelektronischen Bauteiles
CN100383573C (zh) 2002-12-02 2008-04-23 3M创新有限公司 多光源照明系统
DE10257128B3 (de) * 2002-12-05 2004-05-27 Schott Glas Vorrichtung zur Einkopplung von Licht in einen Lichtleiter
JP2004272014A (ja) * 2003-03-10 2004-09-30 Seiko Epson Corp 光通信モジュールの製造方法、光通信モジュール、及び電子機器
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
DE10322071A1 (de) * 2003-05-15 2004-09-02 Infineon Technologies Ag Mikrooptikmodul mit Gehäuse und Verfahren zur Herstellung desselben
JP2004354532A (ja) * 2003-05-27 2004-12-16 Seiko Epson Corp 光モジュール及びその製造方法、光通信装置、電子機器
US7020362B2 (en) * 2003-08-05 2006-03-28 Jonathan Simon Low cost optical interconnect for fiber optic system
CN1846290B (zh) * 2003-09-08 2010-12-08 皇家飞利浦电子股份有限公司 底板和电子设备
US20080085122A1 (en) * 2003-11-10 2008-04-10 Melexis Nv Optical Data Transmission, Optical Data Transceivers And Method Of Manufacturing And Packaging Thereof
US7250611B2 (en) 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US20050213914A1 (en) * 2004-03-23 2005-09-29 Motorola, Inc. High efficiency light guide
DE102005014584A1 (de) * 2004-04-16 2005-11-03 G.L.I. Global Light Industries Gmbh Verfahren zur Herstellung eines Lichtleitkörpers sowie Lichtleitkörper
JP2005353816A (ja) * 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
US7246954B2 (en) * 2004-08-09 2007-07-24 Avago Technologies Fiber Ip (Singapore) Ltd. Pte. Opto-electronic housing and optical assembly
EP1645898A1 (en) * 2004-10-05 2006-04-12 STMicroelectronics S.r.l. Optical communication module
DE502004009619D1 (de) * 2004-10-08 2009-07-30 Avago Tech Fiber Ip Sg Pte Ltd Verfahren zum Herstellen eines mit einem Kunststoffgehäuse versehenen optischen oder elektronischen Moduls
US7343060B2 (en) * 2005-03-04 2008-03-11 Fuji Xerox Co., Ltd. Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount
GB0506274D0 (en) * 2005-03-29 2005-05-04 Melexis Nv Optical data tranceiver
EP1722258A1 (en) * 2005-05-13 2006-11-15 STMicroelectronics S.r.l. Optical radiation coupling module
GB2428103B (en) * 2005-07-07 2009-06-17 Agilent Technologies Inc An optical device
DE102005052356A1 (de) * 2005-09-30 2007-04-12 Osram Opto Semiconductors Gmbh Beleuchtungseinheit mit Lumineszenzdiodenchip und Lichtleiter, Verfahren zum Herstellen einer Beleuchtungseinheit und LCD-Display
US7410306B2 (en) * 2005-10-11 2008-08-12 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Opto-electronic device for optical fibre applications
KR20080080327A (ko) * 2005-11-21 2008-09-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 장치
US7560742B2 (en) * 2005-11-28 2009-07-14 Magna International Inc. Semiconductor-based lighting systems and lighting system components for automotive use
JP4860713B2 (ja) * 2006-03-06 2012-01-25 モレックス インコーポレイテド 光ファイバデータリンク
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
JP2007258399A (ja) * 2006-03-23 2007-10-04 Rohm Co Ltd フォトカプラ
TW200742113A (en) * 2006-04-20 2007-11-01 San-Bao Lin Package structure of light-emitting device
JP4929821B2 (ja) * 2006-04-27 2012-05-09 オムロン株式会社 光伝送モジュール
JP2007310083A (ja) * 2006-05-17 2007-11-29 Fuji Xerox Co Ltd 光伝送モジュールおよびその製造方法
EP1930216A1 (en) * 2006-12-07 2008-06-11 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Wire beam
DE102006058622A1 (de) * 2006-12-11 2008-06-19 Schleifring Und Apparatebau Gmbh Empfangseinheit für einen optischen Drehübertrager
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
DE102007019033A1 (de) * 2007-04-18 2008-10-23 Infineon Technologies Ag Optoelektronische Baugruppen, Verfahren zur optischen Kopplung eines optoelektronischen Bauelementes mit einer optischen Faser und Verfahren zur Herstellung einer optoelektronischen Baugruppe
US7621677B2 (en) * 2007-08-21 2009-11-24 Ylx Corp. Optical coupler for a light emitting device with enhanced output brightness
EP2222183A4 (en) * 2007-11-20 2014-02-19 Intercontinental Great Brands Llc DOUBLE-COATED CONFECTIONERY PRODUCT
US20090142444A1 (en) * 2007-11-29 2009-06-04 Cadbury Adams Usa Llc Particulate coating processing
WO2009117834A1 (en) 2008-03-26 2009-10-01 Magna International Inc. Fog lamp and the like employing semiconductor light sources
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
CA2664963A1 (en) * 2008-05-01 2009-11-01 Magna International Inc. Hotspot cutoff d-optic
US20090294949A1 (en) * 2008-05-30 2009-12-03 Infineon Technologies Ag Molded semiconductor device
US7855377B2 (en) * 2008-08-05 2010-12-21 Fujitsu Limited Alignment structures for an optical assembly
US20100098374A1 (en) 2008-10-20 2010-04-22 Avago Technologies Fiber Ip (Signgapore) Pte. Ltd. Optoelectronic component based on premold technology
US7731433B1 (en) 2008-12-05 2010-06-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device
DE102009030060A1 (de) * 2009-06-22 2011-01-05 Geuder Ag Medizinisches Handgerät zur Beleuchtung
TWI398025B (zh) 2009-10-07 2013-06-01 財團法人工業技術研究院 偏極光發光二極體元件及其製造方法
EP3190439B1 (en) * 2010-01-06 2018-08-29 Fujikura Ltd. Optical coupling structure and optical transreceiver module
JP2012203115A (ja) * 2011-03-24 2012-10-22 Toshiba Corp 光結合素子及びその製造方法
DE102011119972B4 (de) * 2011-12-02 2015-10-01 Schott Ag Verfahren zum Koppeln eines Glasfaserbündels mit einem optischen Konversionselement sowie Baugruppe mit einem optischen Konversionselement und einem Glasfaserbündel
US9570883B2 (en) * 2011-12-28 2017-02-14 Intel Corporation Photonic package architecture
JP5230829B1 (ja) 2012-03-09 2013-07-10 株式会社フジクラ 水分の除去方法、光ファイバの半田付け方法、及び、半導体レーザモジュールの製造方法
US9537067B2 (en) 2012-05-03 2017-01-03 Technische Universität Berlin Radiation emitting device
TW201346362A (zh) * 2012-05-04 2013-11-16 Hon Hai Prec Ind Co Ltd 光纖模組
US9490240B2 (en) 2012-09-28 2016-11-08 Intel Corporation Film interposer for integrated circuit devices
TWI578043B (zh) * 2012-10-24 2017-04-11 鴻海精密工業股份有限公司 光電轉換模組
US9366396B2 (en) 2013-01-30 2016-06-14 Cree, Inc. Optical waveguide and lamp including same
US9442243B2 (en) 2013-01-30 2016-09-13 Cree, Inc. Waveguide bodies including redirection features and methods of producing same
US9291320B2 (en) 2013-01-30 2016-03-22 Cree, Inc. Consolidated troffer
US9625638B2 (en) 2013-03-15 2017-04-18 Cree, Inc. Optical waveguide body
US9519095B2 (en) 2013-01-30 2016-12-13 Cree, Inc. Optical waveguides
US9411086B2 (en) 2013-01-30 2016-08-09 Cree, Inc. Optical waveguide assembly and light engine including same
US10502899B2 (en) * 2013-03-15 2019-12-10 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire
US10436970B2 (en) 2013-03-15 2019-10-08 Ideal Industries Lighting Llc Shaped optical waveguide bodies
US9798072B2 (en) 2013-03-15 2017-10-24 Cree, Inc. Optical element and method of forming an optical element
US10379278B2 (en) * 2013-03-15 2019-08-13 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire outdoor and/or enclosed structure LED luminaire having outward illumination
US10209429B2 (en) 2013-03-15 2019-02-19 Cree, Inc. Luminaire with selectable luminous intensity pattern
US9366799B2 (en) 2013-03-15 2016-06-14 Cree, Inc. Optical waveguide bodies and luminaires utilizing same
DE102013004773A1 (de) * 2013-03-20 2014-09-25 Jenoptik Polymer Systems Gmbh Beleuchtungsmodul
CN105899986B (zh) * 2014-01-08 2018-04-24 飞利浦照明控股有限公司 用于高亮度led源的颜色混合输出
US9733440B2 (en) * 2014-04-29 2017-08-15 Corning Incorporated Optical connectors for coupling light sources to optical fibers
US12372219B2 (en) * 2014-05-30 2025-07-29 Cree Lighting Usa Llc LED luminaire with a cavity, finned interior, and a curved outer wall extending from a surface on which the light source is mounted
JP6518113B2 (ja) * 2015-04-10 2019-05-22 ヒロセ電機株式会社 光電気変換コネクタ及びその製造方法
US9851516B2 (en) * 2015-10-29 2017-12-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical components assembly
US11719882B2 (en) 2016-05-06 2023-08-08 Ideal Industries Lighting Llc Waveguide-based light sources with dynamic beam shaping
US10416377B2 (en) 2016-05-06 2019-09-17 Cree, Inc. Luminaire with controllable light emission
EP3355667A1 (de) * 2017-01-30 2018-08-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer elektrischen schaltung und elektrische schaltung
ES2792043T3 (es) * 2017-12-04 2020-11-06 Grieshaber Vega Kg Placa de circuitos impresos para un aparato de medición de nivel de llenado por radar con un acoplamiento de guía de ondas
US11569398B2 (en) 2019-07-15 2023-01-31 SLT Technologies, Inc Power photodiode structures and devices
US11575055B2 (en) 2019-07-15 2023-02-07 SLT Technologies, Inc Methods for coupling of optical fibers to a power photodiode
WO2021011705A1 (en) 2019-07-15 2021-01-21 Slt Technologies, Inc. Power photodiode structures, methods of making, and methods of use
JP7547486B2 (ja) * 2020-02-18 2024-09-09 エスエルティー テクノロジーズ インコーポレイテッド パワーフォトダイオード、光ファイバのパワーフォトダイオードへの接続方法、および、光ファイバ給電システム
FR3107753A1 (fr) * 2020-03-02 2021-09-03 Stmicroelectronics (Research & Development) Limited Optical device
WO2021209492A1 (en) * 2020-04-15 2021-10-21 CommScope Connectivity Belgium BV Device and method for sealing cables in telecommunications enclosures
CN113625400B (zh) * 2020-05-08 2024-05-28 青岛海信宽带多媒体技术有限公司 一种光模块

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028110A (en) * 1982-11-29 1991-07-02 Adc Telecommunications, Inc. Fiber optical component
US4647331A (en) * 1983-07-29 1987-03-03 Motorola, Inc. Method for assembling an electro-optical device
DE3339189A1 (de) * 1983-10-26 1985-05-09 Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, 1000 Berlin Laser-glasfaser-kopplung und verfahren zur herstellung einer solchen koppelverbindung
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
US4945400A (en) 1988-03-03 1990-07-31 At&T Bell Laboratories Subassembly for optoelectronic devices
DE3834395A1 (de) * 1988-10-10 1990-04-12 Telefunken Electronic Gmbh Kopplungsvorrichtung einer optischen faser mit einer lichtemittierenden diode
US5349234A (en) * 1992-05-29 1994-09-20 Eastman Kodak Company Package and method for assembly of infra-red imaging devices
DE4219667C2 (de) * 1992-06-16 1994-12-01 Kernforschungsz Karlsruhe Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JPH08166523A (ja) * 1994-12-13 1996-06-25 Hitachi Ltd 光アセンブリ
WO1996022177A1 (de) * 1995-01-18 1996-07-25 Robert Bosch Gmbh Anordnung zur umsetzung von optischen in elektrische signale und verfahren zur herstellung
US5645977A (en) 1995-09-22 1997-07-08 Industrial Technology Research Institute Method of making molds for manufacturing multiple-lead microstructures
US5675678A (en) * 1995-10-10 1997-10-07 Ceram Optec Industries Inc. Flexible system for linearly distributed illumination
DE19602079C1 (de) * 1996-01-20 1997-05-15 Karlsruhe Forschzent Verfahren zum Herstellen von Reflexionsgittern für Mikrospektrometer
US6070315A (en) 1996-01-20 2000-06-06 Forschungszentrum Karlsruhe Gmbh Method of producing a microspectrometer reflection grating
KR19980042931A (ko) * 1996-11-29 1998-08-17 쿠라우찌 노리타카 광모듈 및 그 제조방법과 광모듈의 광학적반사부재와 그 위치결정방법 및 위치결정장치
SE508068C2 (sv) * 1996-12-19 1998-08-24 Ericsson Telefon Ab L M Mikroreplikering i metall
TW357470B (en) * 1997-07-15 1999-05-01 Kai-Feng Huang Vertical resonance cavity injection-type glowing laser package
DE19851265C2 (de) * 1998-11-06 2001-06-21 Harting Elektrooptische Bauteile Gmbh & Co Kg Elektro-optische Baugruppe sowie Verfahren zur Herstellung einer solchen Baugruppe
DE19861162A1 (de) * 1998-11-06 2000-06-29 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
EP1002696B1 (en) 1998-11-17 2007-08-01 Ichikoh Industries Limited Light emitting diode mounting structure
DE19852832C2 (de) * 1998-11-17 2001-11-29 Heraeus Gmbh W C Verfahren zur Herstellung eines Metall-Kunststoff-Laminats
WO2000057492A1 (en) 1999-10-18 2000-09-28 Obschestvo S Ogranichennoi Otvetstvennostiju 'korvet-Lights' Luminescent diode device
US6865790B2 (en) * 2002-02-27 2005-03-15 Jds Uniphase Corporation Method of removing optical device
US6773532B2 (en) * 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
US20030161133A1 (en) * 2002-02-27 2003-08-28 Optronx Optical transmitter header having passive electrical component
US6653557B2 (en) * 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US6859470B2 (en) * 2002-02-27 2005-02-22 Jds Uniphase Corporation Air trench that limits thermal coupling between laser and laser driver
US6647039B2 (en) * 2002-02-27 2003-11-11 Jds Uniphase Corporation Reconfigurable laser header
US6646777B2 (en) * 2002-02-27 2003-11-11 Jds Uniphase Corporation Optical isolator with improved mounting characteristics

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237141A (ja) * 2005-02-23 2006-09-07 Stanley Electric Co Ltd サブマウント型ｌｅｄ
JP2009025587A (ja) * 2007-07-20 2009-02-05 Sanwa Denki Kogyo Co Ltd 光サブアッセンブリ構造
US9022632B2 (en) 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
JP2010016329A (ja) * 2008-07-03 2010-01-21 Samsung Electro Mech Co Ltd 発光ダイオードパッケージ
US9594207B2 (en) 2008-07-03 2017-03-14 Samsung Electronics Co., Ltd. LED package and a backlight unit comprising said LED package
US8258526B2 (en) 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
JP2011048371A (ja) * 2009-08-28 2011-03-10 General Electric Co <Ge> 発光ダイオード−光ガイドカップリング装置
KR20180085380A (ko) * 2009-08-28 2018-07-26 제너럴 일렉트릭 캄파니 커플링 장치
KR102025016B1 (ko) * 2009-08-28 2019-09-24 제너럴 일렉트릭 캄파니 커플링 장치
JP2014502040A (ja) * 2010-10-26 2014-01-23 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム、変調装置およびファイバ固定基板を製造する方法
JP2017059849A (ja) * 2010-10-26 2017-03-23 マッパー・リソグラフィー・アイピー・ビー．ブイ． 変調装置およびそれを使用する荷電粒子マルチ小ビームリソグラフィシステム
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置
JP2015087744A (ja) * 2013-09-26 2015-05-07 オリンパス株式会社 光伝送モジュールおよび内視鏡

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