JP2012203115A - 光結合素子及びその製造方法 - Google Patents
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0236—Fixing laser chips on mounts using an adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5344—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0075—Light guides, optical cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】光結合素子であって、光導波路30と、光導波路30を保持する保持穴11が設けられたフェルール10と、フェルール10の素子搭載面に設けられた電気配線12と、フェルール10の素子搭載面に搭載され、電気配線12に接続された光半導体素子20と、フェルール10の保持穴11に保持された光導波路30と光半導体素子20との間に充填された透明接着剤14とを具備している。光半導体素子20の周囲の少なくとも一辺の一部が、フェルール10の保持穴11を光半導体素子20側に延長させて得られる領域の内側に位置する。
【選択図】 図1
Description
図1及び図2は、第1の実施形態に係わる光結合素子の概略構成を説明するためのもので、図1は断面図、図2は側面図である。
図7は、第2の実施形態に係わる光結合素子の概略構成を説明するためのもので、光半導体素子側から見た側面図である。
図8は、第3の実施形態に係わる光結合素子の概略構成を示す断面図である。
図9(a)〜(c)は、第4の実施形態に係わる光結合素子の製造工程を示す断面図である。本実施形態は、前記図1の光結合素子の製造方法である。
なお、本発明は上述した各実施形態に限定されるものではない。
Claims (5)
- 光導波路と、
前記光導波路を保持する保持穴が設けられたフェルールと、
前記保持穴の一方の開口が位置する前記フェルールの素子搭載面に設けられた電気配線と、
前記フェルールの素子搭載面に搭載され、前記電気配線に接続された光半導体素子と、
前記前記光導波路の一端と前記光半導体素子との間に充填された透明接着剤と、
を具備し、
前記光半導体素子の周囲の少なくとも一辺の一部が、前記フェルールの前記保持穴を前記半導体素子側に延長させて得られる領域の内側に位置することを特徴とする光結合素子。 - 前記保持穴は一方向に沿って複数本並列配列され、前記光半導体素子は前記複数の保持穴に跨って搭載され、前記光半導体素子の長手方向の一辺の一部が前記各保持穴を前記半導体素子側に延長させて得られる領域の内側に位置することを特徴とする請求項1に記載の光結合素子。
- 前記フェルールの保持穴と前記光半導体素子が対向しない位置にある前記透明接着剤を覆うように、不透明樹脂が形成されていることを特徴とする請求項1又は2に記載の光結合素子。
- 請求項1〜3の何れかに記載の光結合素子の製造方法であって、
前記フェルールの素子搭載面に、前記光半導体素子の周囲の少なくとも一辺の一部が、前記フェルールの前記保持穴を前記半導体素子側に延長させて得られる領域の内側に位置するように該光半導体素子を搭載する工程と、
前記フェルールの保持穴に前記透明接着剤を充填する工程と、
前記透明接着剤が充填された状態で、前記光半導体素子の搭載面と反対側から前記フェルールの保持穴に光導波路を挿入し、該光導波路の先端を前記フェルールの光半導体素子搭載面より外側に突出させる工程と、
前記フェルールの光半導体素子搭載面より外側に突出させた前記光導波路を所定の位置まで後退させる工程と、
を含むことを特徴とする光結合素子の製造方法。 - 前記光導波路を前記フェルールの保持穴に挿入する際に、前記光導波路の先端を前記光半導体素子に一旦接触させることを特徴とする請求項4に記載の光結合素子の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011066184A JP2012203115A (ja) | 2011-03-24 | 2011-03-24 | 光結合素子及びその製造方法 |
US13/423,480 US20120243835A1 (en) | 2011-03-24 | 2012-03-19 | Optical coupling element and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011066184A JP2012203115A (ja) | 2011-03-24 | 2011-03-24 | 光結合素子及びその製造方法 |
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JP2012203115A true JP2012203115A (ja) | 2012-10-22 |
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JP2011066184A Withdrawn JP2012203115A (ja) | 2011-03-24 | 2011-03-24 | 光結合素子及びその製造方法 |
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US (1) | US20120243835A1 (ja) |
JP (1) | JP2012203115A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018134933A1 (ja) * | 2017-01-19 | 2018-07-26 | オリンパス株式会社 | 光モジュールおよび内視鏡 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6843606B2 (en) * | 2000-11-14 | 2005-01-18 | National Semiconductor Corporation | Multi-format connector module incorporating chip mounted optical sub-assembly |
DE10065624C2 (de) * | 2000-12-29 | 2002-11-14 | Hans Kragl | Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler |
JP2011248243A (ja) * | 2010-05-28 | 2011-12-08 | Fujitsu Component Ltd | 光電変換モジュール及び光電変換装置 |
-
2011
- 2011-03-24 JP JP2011066184A patent/JP2012203115A/ja not_active Withdrawn
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2012
- 2012-03-19 US US13/423,480 patent/US20120243835A1/en not_active Abandoned
Cited By (1)
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WO2018134933A1 (ja) * | 2017-01-19 | 2018-07-26 | オリンパス株式会社 | 光モジュールおよび内視鏡 |
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