DE10065624C2 - Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler - Google Patents

Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler

Info

Publication number
DE10065624C2
DE10065624C2 DE10065624A DE10065624A DE10065624C2 DE 10065624 C2 DE10065624 C2 DE 10065624C2 DE 10065624 A DE10065624 A DE 10065624A DE 10065624 A DE10065624 A DE 10065624A DE 10065624 C2 DE10065624 C2 DE 10065624C2
Authority
DE
Germany
Prior art keywords
submount
coupling
optical waveguide
coupling arrangement
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10065624A
Other languages
German (de)
English (en)
Other versions
DE10065624A1 (de
Inventor
Hans Kragl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diemount GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE10065624A priority Critical patent/DE10065624C2/de
Priority to EP01985918A priority patent/EP1348143B1/de
Priority to PCT/EP2001/015153 priority patent/WO2002054129A1/de
Priority to JP2002554767A priority patent/JP2004520612A/ja
Publication of DE10065624A1 publication Critical patent/DE10065624A1/de
Application granted granted Critical
Publication of DE10065624C2 publication Critical patent/DE10065624C2/de
Priority to US10/608,922 priority patent/US6832861B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/2804—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers
    • G02B6/2808—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals forming multipart couplers without wavelength selective elements, e.g. "T" couplers, star couplers using a mixing element which evenly distributes an input signal over a number of outputs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
DE10065624A 2000-12-29 2000-12-29 Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler Expired - Fee Related DE10065624C2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10065624A DE10065624C2 (de) 2000-12-29 2000-12-29 Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
EP01985918A EP1348143B1 (de) 2000-12-29 2001-12-20 Kopplungsanordnung zum optischen koppeln eines lichtwellenleiters mit einem elektro-optischen element
PCT/EP2001/015153 WO2002054129A1 (de) 2000-12-29 2001-12-20 Kopplungsanordnung zum optischen koppeln eines lichtwellenleiters mit einem elektro-optischen element
JP2002554767A JP2004520612A (ja) 2000-12-29 2001-12-20 光導波路をエレクトロオプティックもしくはオプトエレクトリックな半導体コンバータに光学的に結合するための結合装置
US10/608,922 US6832861B2 (en) 2000-12-29 2003-06-27 Coupling device for optically coupling an optical waveguide to an electro-optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10065624A DE10065624C2 (de) 2000-12-29 2000-12-29 Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler

Publications (2)

Publication Number Publication Date
DE10065624A1 DE10065624A1 (de) 2002-07-18
DE10065624C2 true DE10065624C2 (de) 2002-11-14

Family

ID=7669366

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10065624A Expired - Fee Related DE10065624C2 (de) 2000-12-29 2000-12-29 Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler

Country Status (5)

Country Link
US (1) US6832861B2 (enExample)
EP (1) EP1348143B1 (enExample)
JP (1) JP2004520612A (enExample)
DE (1) DE10065624C2 (enExample)
WO (1) WO2002054129A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019033A1 (de) * 2007-04-18 2008-10-23 Infineon Technologies Ag Optoelektronische Baugruppen, Verfahren zur optischen Kopplung eines optoelektronischen Bauelementes mit einer optischen Faser und Verfahren zur Herstellung einer optoelektronischen Baugruppe

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077002A1 (de) * 2002-03-08 2003-09-18 Infineon Technologies Ag Aufnahme- und koppelteil für ein opto-elektronisches sende- und/oder empfangselement
DE10250383B4 (de) * 2002-10-29 2007-05-10 Diemount Gmbh Leuchtdiodenanordnung mit Reflektor
DE10250540B3 (de) 2002-10-29 2004-07-15 Infineon Technologies Ag Verfahren zur Herstellung eines optoelektronischen Bauteiles
CN100383573C (zh) 2002-12-02 2008-04-23 3M创新有限公司 多光源照明系统
DE10257128B3 (de) * 2002-12-05 2004-05-27 Schott Glas Vorrichtung zur Einkopplung von Licht in einen Lichtleiter
JP2004272014A (ja) * 2003-03-10 2004-09-30 Seiko Epson Corp 光通信モジュールの製造方法、光通信モジュール、及び電子機器
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
DE10322071A1 (de) * 2003-05-15 2004-09-02 Infineon Technologies Ag Mikrooptikmodul mit Gehäuse und Verfahren zur Herstellung desselben
JP2004354532A (ja) * 2003-05-27 2004-12-16 Seiko Epson Corp 光モジュール及びその製造方法、光通信装置、電子機器
US7020362B2 (en) * 2003-08-05 2006-03-28 Jonathan Simon Low cost optical interconnect for fiber optic system
CN1846290B (zh) * 2003-09-08 2010-12-08 皇家飞利浦电子股份有限公司 底板和电子设备
US20080085122A1 (en) * 2003-11-10 2008-04-10 Melexis Nv Optical Data Transmission, Optical Data Transceivers And Method Of Manufacturing And Packaging Thereof
US7250611B2 (en) 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US20050213914A1 (en) * 2004-03-23 2005-09-29 Motorola, Inc. High efficiency light guide
DE102005014584A1 (de) * 2004-04-16 2005-11-03 G.L.I. Global Light Industries Gmbh Verfahren zur Herstellung eines Lichtleitkörpers sowie Lichtleitkörper
JP2005353816A (ja) * 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
US7246954B2 (en) * 2004-08-09 2007-07-24 Avago Technologies Fiber Ip (Singapore) Ltd. Pte. Opto-electronic housing and optical assembly
EP1645898A1 (en) * 2004-10-05 2006-04-12 STMicroelectronics S.r.l. Optical communication module
DE502004009619D1 (de) * 2004-10-08 2009-07-30 Avago Tech Fiber Ip Sg Pte Ltd Verfahren zum Herstellen eines mit einem Kunststoffgehäuse versehenen optischen oder elektronischen Moduls
JP2006237141A (ja) * 2005-02-23 2006-09-07 Stanley Electric Co Ltd サブマウント型ｌｅｄ
US7343060B2 (en) * 2005-03-04 2008-03-11 Fuji Xerox Co., Ltd. Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount
GB0506274D0 (en) * 2005-03-29 2005-05-04 Melexis Nv Optical data tranceiver
EP1722258A1 (en) * 2005-05-13 2006-11-15 STMicroelectronics S.r.l. Optical radiation coupling module
GB2428103B (en) * 2005-07-07 2009-06-17 Agilent Technologies Inc An optical device
DE102005052356A1 (de) * 2005-09-30 2007-04-12 Osram Opto Semiconductors Gmbh Beleuchtungseinheit mit Lumineszenzdiodenchip und Lichtleiter, Verfahren zum Herstellen einer Beleuchtungseinheit und LCD-Display
US7410306B2 (en) * 2005-10-11 2008-08-12 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Opto-electronic device for optical fibre applications
KR20080080327A (ko) * 2005-11-21 2008-09-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 장치
US7560742B2 (en) * 2005-11-28 2009-07-14 Magna International Inc. Semiconductor-based lighting systems and lighting system components for automotive use
JP4860713B2 (ja) * 2006-03-06 2012-01-25 モレックス インコーポレイテド 光ファイバデータリンク
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
JP2007258399A (ja) * 2006-03-23 2007-10-04 Rohm Co Ltd フォトカプラ
TW200742113A (en) * 2006-04-20 2007-11-01 San-Bao Lin Package structure of light-emitting device
JP4929821B2 (ja) * 2006-04-27 2012-05-09 オムロン株式会社 光伝送モジュール
JP2007310083A (ja) * 2006-05-17 2007-11-29 Fuji Xerox Co Ltd 光伝送モジュールおよびその製造方法
EP1930216A1 (en) * 2006-12-07 2008-06-11 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Wire beam
DE102006058622A1 (de) * 2006-12-11 2008-06-19 Schleifring Und Apparatebau Gmbh Empfangseinheit für einen optischen Drehübertrager
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
JP2009025587A (ja) * 2007-07-20 2009-02-05 Sanwa Denki Kogyo Co Ltd 光サブアッセンブリ構造
US7621677B2 (en) * 2007-08-21 2009-11-24 Ylx Corp. Optical coupler for a light emitting device with enhanced output brightness
EP2222183A4 (en) * 2007-11-20 2014-02-19 Intercontinental Great Brands Llc DOUBLE-COATED CONFECTIONERY PRODUCT
US20090142444A1 (en) * 2007-11-29 2009-06-04 Cadbury Adams Usa Llc Particulate coating processing
WO2009117834A1 (en) 2008-03-26 2009-10-01 Magna International Inc. Fog lamp and the like employing semiconductor light sources
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
CA2664963A1 (en) * 2008-05-01 2009-11-01 Magna International Inc. Hotspot cutoff d-optic
US20090294949A1 (en) * 2008-05-30 2009-12-03 Infineon Technologies Ag Molded semiconductor device
KR101101134B1 (ko) 2008-07-03 2012-01-05 삼성엘이디 주식회사 Ｌｅｄ 패키지 및 그 ｌｅｄ 패키지를 포함하는 백라이트 유닛
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
US7855377B2 (en) * 2008-08-05 2010-12-21 Fujitsu Limited Alignment structures for an optical assembly
US20100098374A1 (en) 2008-10-20 2010-04-22 Avago Technologies Fiber Ip (Signgapore) Pte. Ltd. Optoelectronic component based on premold technology
US7731433B1 (en) 2008-12-05 2010-06-08 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device
DE102009030060A1 (de) * 2009-06-22 2011-01-05 Geuder Ag Medizinisches Handgerät zur Beleuchtung
US8066417B2 (en) * 2009-08-28 2011-11-29 General Electric Company Light emitting diode-light guide coupling apparatus
TWI398025B (zh) 2009-10-07 2013-06-01 財團法人工業技術研究院 偏極光發光二極體元件及其製造方法
EP3190439B1 (en) * 2010-01-06 2018-08-29 Fujikura Ltd. Optical coupling structure and optical transreceiver module
KR101725299B1 (ko) * 2010-10-26 2017-04-10 마퍼 리쏘그라피 아이피 비.브이. 변조 디바이스 및 이를 사용하는 하전 입자 멀티-빔렛 리소그래피 시스템
JP2012203115A (ja) * 2011-03-24 2012-10-22 Toshiba Corp 光結合素子及びその製造方法
JP5284432B2 (ja) * 2011-09-02 2013-09-11 三菱レイヨン株式会社 光源装置
DE102011119972B4 (de) * 2011-12-02 2015-10-01 Schott Ag Verfahren zum Koppeln eines Glasfaserbündels mit einem optischen Konversionselement sowie Baugruppe mit einem optischen Konversionselement und einem Glasfaserbündel
US9570883B2 (en) * 2011-12-28 2017-02-14 Intel Corporation Photonic package architecture
JP5230829B1 (ja) 2012-03-09 2013-07-10 株式会社フジクラ 水分の除去方法、光ファイバの半田付け方法、及び、半導体レーザモジュールの製造方法
US9537067B2 (en) 2012-05-03 2017-01-03 Technische Universität Berlin Radiation emitting device
TW201346362A (zh) * 2012-05-04 2013-11-16 Hon Hai Prec Ind Co Ltd 光纖模組
US9490240B2 (en) 2012-09-28 2016-11-08 Intel Corporation Film interposer for integrated circuit devices
TWI578043B (zh) * 2012-10-24 2017-04-11 鴻海精密工業股份有限公司 光電轉換模組
US9366396B2 (en) 2013-01-30 2016-06-14 Cree, Inc. Optical waveguide and lamp including same
US9442243B2 (en) 2013-01-30 2016-09-13 Cree, Inc. Waveguide bodies including redirection features and methods of producing same
US9291320B2 (en) 2013-01-30 2016-03-22 Cree, Inc. Consolidated troffer
US9625638B2 (en) 2013-03-15 2017-04-18 Cree, Inc. Optical waveguide body
US9519095B2 (en) 2013-01-30 2016-12-13 Cree, Inc. Optical waveguides
US9411086B2 (en) 2013-01-30 2016-08-09 Cree, Inc. Optical waveguide assembly and light engine including same
US10502899B2 (en) * 2013-03-15 2019-12-10 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire
US10436970B2 (en) 2013-03-15 2019-10-08 Ideal Industries Lighting Llc Shaped optical waveguide bodies
US9798072B2 (en) 2013-03-15 2017-10-24 Cree, Inc. Optical element and method of forming an optical element
US10379278B2 (en) * 2013-03-15 2019-08-13 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire outdoor and/or enclosed structure LED luminaire having outward illumination
US10209429B2 (en) 2013-03-15 2019-02-19 Cree, Inc. Luminaire with selectable luminous intensity pattern
US9366799B2 (en) 2013-03-15 2016-06-14 Cree, Inc. Optical waveguide bodies and luminaires utilizing same
DE102013004773A1 (de) * 2013-03-20 2014-09-25 Jenoptik Polymer Systems Gmbh Beleuchtungsmodul
JP6411088B2 (ja) * 2013-09-26 2018-10-24 オリンパス株式会社 光伝送モジュールおよび内視鏡
CN105899986B (zh) * 2014-01-08 2018-04-24 飞利浦照明控股有限公司 用于高亮度led源的颜色混合输出
US9733440B2 (en) * 2014-04-29 2017-08-15 Corning Incorporated Optical connectors for coupling light sources to optical fibers
US12372219B2 (en) * 2014-05-30 2025-07-29 Cree Lighting Usa Llc LED luminaire with a cavity, finned interior, and a curved outer wall extending from a surface on which the light source is mounted
JP6518113B2 (ja) * 2015-04-10 2019-05-22 ヒロセ電機株式会社 光電気変換コネクタ及びその製造方法
US9851516B2 (en) * 2015-10-29 2017-12-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical components assembly
US11719882B2 (en) 2016-05-06 2023-08-08 Ideal Industries Lighting Llc Waveguide-based light sources with dynamic beam shaping
US10416377B2 (en) 2016-05-06 2019-09-17 Cree, Inc. Luminaire with controllable light emission
EP3355667A1 (de) * 2017-01-30 2018-08-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer elektrischen schaltung und elektrische schaltung
ES2792043T3 (es) * 2017-12-04 2020-11-06 Grieshaber Vega Kg Placa de circuitos impresos para un aparato de medición de nivel de llenado por radar con un acoplamiento de guía de ondas
US11569398B2 (en) 2019-07-15 2023-01-31 SLT Technologies, Inc Power photodiode structures and devices
US11575055B2 (en) 2019-07-15 2023-02-07 SLT Technologies, Inc Methods for coupling of optical fibers to a power photodiode
WO2021011705A1 (en) 2019-07-15 2021-01-21 Slt Technologies, Inc. Power photodiode structures, methods of making, and methods of use
JP7547486B2 (ja) * 2020-02-18 2024-09-09 エスエルティー テクノロジーズ インコーポレイテッド パワーフォトダイオード、光ファイバのパワーフォトダイオードへの接続方法、および、光ファイバ給電システム
FR3107753A1 (fr) * 2020-03-02 2021-09-03 Stmicroelectronics (Research & Development) Limited Optical device
WO2021209492A1 (en) * 2020-04-15 2021-10-21 CommScope Connectivity Belgium BV Device and method for sealing cables in telecommunications enclosures
CN113625400B (zh) * 2020-05-08 2024-05-28 青岛海信宽带多媒体技术有限公司 一种光模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3339189A1 (de) * 1983-10-26 1985-05-09 Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, 1000 Berlin Laser-glasfaser-kopplung und verfahren zur herstellung einer solchen koppelverbindung
DE3834395C2 (enExample) * 1988-10-10 1991-02-28 Telefunken Electronic Gmbh, 7100 Heilbronn, De
US6004046A (en) * 1996-11-29 1999-12-21 Sumitomo Electric Industries, Ltd. Optical module and method of making the same
DE19851265A1 (de) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Elektro-optische Baugruppe sowie Verfahren zur Herstellung einer solchen Baugruppe

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028110A (en) * 1982-11-29 1991-07-02 Adc Telecommunications, Inc. Fiber optical component
US4647331A (en) * 1983-07-29 1987-03-03 Motorola, Inc. Method for assembling an electro-optical device
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
US4945400A (en) 1988-03-03 1990-07-31 At&T Bell Laboratories Subassembly for optoelectronic devices
US5349234A (en) * 1992-05-29 1994-09-20 Eastman Kodak Company Package and method for assembly of infra-red imaging devices
DE4219667C2 (de) * 1992-06-16 1994-12-01 Kernforschungsz Karlsruhe Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JPH08166523A (ja) * 1994-12-13 1996-06-25 Hitachi Ltd 光アセンブリ
WO1996022177A1 (de) * 1995-01-18 1996-07-25 Robert Bosch Gmbh Anordnung zur umsetzung von optischen in elektrische signale und verfahren zur herstellung
US5645977A (en) 1995-09-22 1997-07-08 Industrial Technology Research Institute Method of making molds for manufacturing multiple-lead microstructures
US5675678A (en) * 1995-10-10 1997-10-07 Ceram Optec Industries Inc. Flexible system for linearly distributed illumination
DE19602079C1 (de) * 1996-01-20 1997-05-15 Karlsruhe Forschzent Verfahren zum Herstellen von Reflexionsgittern für Mikrospektrometer
US6070315A (en) 1996-01-20 2000-06-06 Forschungszentrum Karlsruhe Gmbh Method of producing a microspectrometer reflection grating
SE508068C2 (sv) * 1996-12-19 1998-08-24 Ericsson Telefon Ab L M Mikroreplikering i metall
TW357470B (en) * 1997-07-15 1999-05-01 Kai-Feng Huang Vertical resonance cavity injection-type glowing laser package
DE19861162A1 (de) * 1998-11-06 2000-06-29 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
EP1002696B1 (en) 1998-11-17 2007-08-01 Ichikoh Industries Limited Light emitting diode mounting structure
DE19852832C2 (de) * 1998-11-17 2001-11-29 Heraeus Gmbh W C Verfahren zur Herstellung eines Metall-Kunststoff-Laminats
WO2000057492A1 (en) 1999-10-18 2000-09-28 Obschestvo S Ogranichennoi Otvetstvennostiju 'korvet-Lights' Luminescent diode device
US6865790B2 (en) * 2002-02-27 2005-03-15 Jds Uniphase Corporation Method of removing optical device
US6773532B2 (en) * 2002-02-27 2004-08-10 Jds Uniphase Corporation Method for improving heat dissipation in optical transmitter
US20030161133A1 (en) * 2002-02-27 2003-08-28 Optronx Optical transmitter header having passive electrical component
US6653557B2 (en) * 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US6859470B2 (en) * 2002-02-27 2005-02-22 Jds Uniphase Corporation Air trench that limits thermal coupling between laser and laser driver
US6647039B2 (en) * 2002-02-27 2003-11-11 Jds Uniphase Corporation Reconfigurable laser header
US6646777B2 (en) * 2002-02-27 2003-11-11 Jds Uniphase Corporation Optical isolator with improved mounting characteristics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3339189A1 (de) * 1983-10-26 1985-05-09 Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, 1000 Berlin Laser-glasfaser-kopplung und verfahren zur herstellung einer solchen koppelverbindung
DE3834395C2 (enExample) * 1988-10-10 1991-02-28 Telefunken Electronic Gmbh, 7100 Heilbronn, De
US6004046A (en) * 1996-11-29 1999-12-21 Sumitomo Electric Industries, Ltd. Optical module and method of making the same
DE19851265A1 (de) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Elektro-optische Baugruppe sowie Verfahren zur Herstellung einer solchen Baugruppe

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Kagl,H. et al.: MICROMID: A low cost fabrication technology for polymer fiber transceiver modules. POF Conference 2000 Boston *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019033A1 (de) * 2007-04-18 2008-10-23 Infineon Technologies Ag Optoelektronische Baugruppen, Verfahren zur optischen Kopplung eines optoelektronischen Bauelementes mit einer optischen Faser und Verfahren zur Herstellung einer optoelektronischen Baugruppe

Also Published As

Publication number Publication date
EP1348143B1 (de) 2005-09-28
US6832861B2 (en) 2004-12-21
DE10065624A1 (de) 2002-07-18
EP1348143A1 (de) 2003-10-01
WO2002054129A1 (de) 2002-07-11
JP2004520612A (ja) 2004-07-08
US20040008952A1 (en) 2004-01-15

Similar Documents

Publication Publication Date Title
DE10065624C2 (de) Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
DE19932430C2 (de) Opto-elektronische Baugruppe sowie Bauteil für diese Baugruppe
EP1127285A1 (de) Elektro-optische baugruppe sowie verfahren zur herstellung einer solchen baugruppe
DE69431512T2 (de) Lichtempfängerstruktur für optische Vorrichtungen vom Wellenleitertyp
DE10001875C2 (de) Optisches Sende-/Empfangsmodul mit internem Lichtwellenleiter
DE19711138C2 (de) Herstellungsverfahren für ein elektrooptisches Modul
DE10004411A1 (de) Elektrooptisches Sende-/Empfangsmodul und Verfahren zu seiner Herstellung
DE102005034649B4 (de) Optische Halbleitervorrichtung, optischer Verbinder und damit ausgerüstete elektronische Einrichtung
DE10034865A1 (de) Optoelektronisches oberflächenmontierbares Modul
DE10322757B4 (de) Optoelektronische Sende- und/oder Empfangsanordnungen
WO2018078025A1 (de) Laserbauelement und verfahren zum herstellen eines laserbauelements
DE102004025661B4 (de) Optische-Vorrichtung -Gehäuse mit Drehspiegel und Ausrichtungspfosten
DE10329988B3 (de) Opto-elektronische Sende- und/oder Empfangsanordnung
EP1168022A2 (de) Optomodul mit durchkontaktiertem Trägersubstrat
DE10112274B4 (de) Optoelektonisches Sendemodul und Verfahren zu dessen Herstellung
DE10150986A1 (de) Sende- und/oder Empfangseinrichtung
DE10314494B3 (de) Elektrooptisches Modul
DE19851265C2 (de) Elektro-optische Baugruppe sowie Verfahren zur Herstellung einer solchen Baugruppe
DE102012022634B3 (de) Bauelement zur Ein- und/oder Auskopplung elektromagnetischer Strahlung in und/oder aus einer Lichtleitfaser sowie Verfahren zu seiner Herstellung
DE10321257A1 (de) Metallträger (Leadframe) zur Aufnahme und Kontaktierung elektrischer und/oder optoelektronischer Bauelemente
EP1623256A1 (de) Mikrooptikmodul mit spritzgegossenem gehäuse und verfahren zur herstellung desselben
DE10160508B4 (de) Anordnung zur Detektion von optischen Signalen mindestens eines optischen Kanals eines planaren optischen Schaltkreises und/oder zur Einkopplung optischer Signale in mindestens einen optischen Kanal eines planaren optischen Schaltkreises
EP1447696B1 (de) Modulares optoelektronisches Bauelement
DE10319900A1 (de) Optoelektronische Sende- und/oder Empfangsanordnung
DE102004016480B4 (de) Vollintegrierte hybride optisch-elektrische Leiterplatte

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DIEMOUNT GMBH, 99099 ERFURT, DE

8381 Inventor (new situation)

Inventor name: KRAGL, HANS, DR.-ING., 31199 DIEKHOLZEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: DIEMOUNT GMBH, 38855 WERNIGERODE, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee