JP2004507960A - 圧電性基板の非対称最適カットを用いた弾性表面波デバイス - Google Patents

圧電性基板の非対称最適カットを用いた弾性表面波デバイス Download PDF

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JP2004507960A
JP2004507960A JP2002523709A JP2002523709A JP2004507960A JP 2004507960 A JP2004507960 A JP 2004507960A JP 2002523709 A JP2002523709 A JP 2002523709A JP 2002523709 A JP2002523709 A JP 2002523709A JP 2004507960 A JP2004507960 A JP 2004507960A
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angle
electrode
piezoelectric substrate
acoustic wave
range
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JP2002523709A
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Japanese (ja)
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JP2004507960A5 (enExample
Inventor
ナターリャ・エフ．・ナウメンコ
ベンジャミン・ピー．・アボット
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ソーテック・インコーポレーテッド
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6423—Means for obtaining a particular transfer characteristic
    • H03H9/6433—Coupled resonator filters
    • H03H9/6483—Ladder SAW filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2002523709A 2000-08-31 2001-05-03 圧電性基板の非対称最適カットを用いた弾性表面波デバイス Pending JP2004507960A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22952300P 2000-08-31 2000-08-31
PCT/US2001/014347 WO2002019522A1 (en) 2000-08-31 2001-05-03 Surface acoustic wave devices using non-symmetric optimized cuts of a piezoelectric substrate

Publications (2)

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JP2004507960A true JP2004507960A (ja) 2004-03-11
JP2004507960A5 JP2004507960A5 (enExample) 2005-03-17

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ID=22861606

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JP2002523709A Pending JP2004507960A (ja) 2000-08-31 2001-05-03 圧電性基板の非対称最適カットを用いた弾性表面波デバイス

Country Status (6)

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US (1) US6556104B2 (enExample)
JP (1) JP2004507960A (enExample)
CN (1) CN1248410C (enExample)
AU (1) AU2001259447A1 (enExample)
DE (1) DE10196571B4 (enExample)
WO (1) WO2002019522A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7411333B2 (en) 2005-07-21 2008-08-12 Tdk Corporation Surface acoustic wave device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391309B2 (ja) 1999-09-02 2003-03-31 株式会社村田製作所 表面波装置及び通信機装置
JP3979279B2 (ja) * 2001-12-28 2007-09-19 株式会社村田製作所 弾性表面波装置
DE10216842B4 (de) * 2002-04-16 2012-10-25 Epcos Ag Substrat für SAW-Bauelemente mit hoher Bandbreite
US6833774B2 (en) * 2002-06-25 2004-12-21 Sawtek, Inc. Surface acoustic wave filter
JP3841053B2 (ja) 2002-07-24 2006-11-01 株式会社村田製作所 弾性表面波装置及びその製造方法
JP2004165879A (ja) * 2002-11-12 2004-06-10 Alps Electric Co Ltd 弾性表面波素子
JPWO2005011117A1 (ja) * 2003-07-29 2006-09-14 株式会社村田製作所 １ポート型弾性表面波共振子及び弾性表面波フィルタ
DE102006019961B4 (de) * 2006-04-28 2008-01-10 Epcos Ag Elektroakustisches Bauelement
US7446453B1 (en) 2006-07-05 2008-11-04 Triquint, Inc. Surface acoustic wave devices using surface acoustic waves with strong piezoelectric coupling
US8035464B1 (en) 2009-03-05 2011-10-11 Triquint Semiconductor, Inc. Bonded wafer SAW filters and methods
US8378553B1 (en) 2010-07-01 2013-02-19 Triquint Semiconductor, Inc. Buried idt SAW filter having low propagation loss
CN105082375B (zh) * 2014-05-05 2017-01-18 中国科学院理化技术研究所 一种晶体切割方法
WO2016104659A1 (ja) * 2014-12-24 2016-06-30 シチズンホールディングス株式会社 弾性表面波デバイス
US10103624B2 (en) * 2016-06-29 2018-10-16 Win Semiconductors Corp. Thermal sensor circuit
JP7068835B2 (ja) * 2018-01-26 2022-05-17 太陽誘電株式会社 弾性波デバイス、フィルタおよびマルチプレクサ
CN108055017A (zh) * 2018-02-11 2018-05-18 海宁市瑞宏科技有限公司 一种用于超带宽声表面波滤波器设计的谐振器结构
FR3094480B1 (fr) * 2019-03-29 2021-10-01 Frecnsys Capteur à ondes acoustiques et interrogation de celui-ci

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001767A (en) * 1975-11-18 1977-01-04 The United States Of America As Represented By The Secretary Of The Air Force Low diffraction loss-low spurious response LiTaO3 substrate for surface acoustic wave devices
US5081389A (en) * 1990-11-30 1992-01-14 Ascom Zelcom Ag. Crystal cut angles for lithium tantalate crystal for novel surface acoustic wave devices
WO1996004713A1 (en) * 1994-08-05 1996-02-15 Japan Energy Corporation Surface acoustic wave device and production method thereof
JP3439294B2 (ja) * 1995-04-10 2003-08-25 三洋電機株式会社 弾性表面波フィルター
JP3358688B2 (ja) 1995-04-10 2002-12-24 三洋電機株式会社 弾性表面波素子
JP3281510B2 (ja) * 1995-05-17 2002-05-13 康敬 清水 弾性表面波素子
JPH09167936A (ja) 1995-10-13 1997-06-24 Fujitsu Ltd 弾性表面波装置
JPH09331229A (ja) * 1996-03-08 1997-12-22 Yasutaka Shimizu 弾性表面波素子
WO1997033368A1 (fr) * 1996-03-08 1997-09-12 Sanyo Electric Co., Ltd. Element pour ondes acoustiques de surface et telephone portatif l'utilisant
JP3224202B2 (ja) 1996-11-28 2001-10-29 富士通株式会社 弾性表面波装置
JP3391309B2 (ja) * 1999-09-02 2003-03-31 株式会社村田製作所 表面波装置及び通信機装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7411333B2 (en) 2005-07-21 2008-08-12 Tdk Corporation Surface acoustic wave device

Also Published As

Publication number Publication date
DE10196571B4 (de) 2007-07-05
US6556104B2 (en) 2003-04-29
CN1476668A (zh) 2004-02-18
CN1248410C (zh) 2006-03-29
AU2001259447A1 (en) 2002-03-13
DE10196571T1 (de) 2003-07-03
WO2002019522A1 (en) 2002-03-07
US20020067227A1 (en) 2002-06-06

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