JP2004507081A5 - - Google Patents

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Publication number
JP2004507081A5
JP2004507081A5 JP2002520272A JP2002520272A JP2004507081A5 JP 2004507081 A5 JP2004507081 A5 JP 2004507081A5 JP 2002520272 A JP2002520272 A JP 2002520272A JP 2002520272 A JP2002520272 A JP 2002520272A JP 2004507081 A5 JP2004507081 A5 JP 2004507081A5
Authority
JP
Japan
Prior art keywords
transistor
layer
compound semiconductor
gate insulator
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002520272A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004507081A (ja
Filing date
Publication date
Priority claimed from US09/636,484 external-priority patent/US6936900B1/en
Application filed filed Critical
Priority claimed from PCT/US2001/025150 external-priority patent/WO2002015233A2/en
Publication of JP2004507081A publication Critical patent/JP2004507081A/ja
Publication of JP2004507081A5 publication Critical patent/JP2004507081A5/ja
Pending legal-status Critical Current

Links

JP2002520272A 2000-08-10 2001-08-10 集積トランジスタ素子 Pending JP2004507081A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/636,484 US6936900B1 (en) 2000-05-04 2000-08-10 Integrated transistor devices
PCT/US2001/025150 WO2002015233A2 (en) 2000-08-10 2001-08-10 Integrated transistor devices

Publications (2)

Publication Number Publication Date
JP2004507081A JP2004507081A (ja) 2004-03-04
JP2004507081A5 true JP2004507081A5 (enExample) 2005-03-03

Family

ID=24552107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002520272A Pending JP2004507081A (ja) 2000-08-10 2001-08-10 集積トランジスタ素子

Country Status (5)

Country Link
EP (1) EP1312122A4 (enExample)
JP (1) JP2004507081A (enExample)
KR (1) KR20030027017A (enExample)
AU (1) AU2001288239A1 (enExample)
WO (1) WO2002015233A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6936900B1 (en) 2000-05-04 2005-08-30 Osemi, Inc. Integrated transistor devices
US6756320B2 (en) * 2002-01-18 2004-06-29 Freescale Semiconductor, Inc. Method of forming article comprising an oxide layer on a GaAs-based semiconductor structure
AU2003217189A1 (en) * 2002-01-22 2003-09-02 Massachusetts Institute Of Technology A method of fabrication for iii-v semiconductor surface passivation
US7187045B2 (en) 2002-07-16 2007-03-06 Osemi, Inc. Junction field effect metal oxide compound semiconductor integrated transistor devices
US7382001B2 (en) * 2004-01-23 2008-06-03 International Rectifier Corporation Enhancement mode III-nitride FET
US7250627B2 (en) * 2004-03-12 2007-07-31 Hewlett-Packard Development Company, L.P. Semiconductor device
JP7067702B2 (ja) * 2017-06-30 2022-05-16 国立研究開発法人物質・材料研究機構 窒化ガリウム系の半導体装置及びその製造方法
CN116072707B (zh) * 2023-02-08 2024-07-26 杭州合盛微电子有限公司 一种含稀土栅介质层的平面型SiC MOSFET及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962883A (en) * 1994-03-23 1999-10-05 Lucent Technologies Inc. Article comprising an oxide layer on a GaAs-based semiconductor body
US5665658A (en) * 1996-03-21 1997-09-09 Motorola Method of forming a dielectric layer structure
US5945718A (en) * 1998-02-12 1999-08-31 Motorola Inc. Self-aligned metal-oxide-compound semiconductor device and method of fabrication

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