JP2004277508A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004277508A5 JP2004277508A5 JP2003068760A JP2003068760A JP2004277508A5 JP 2004277508 A5 JP2004277508 A5 JP 2004277508A5 JP 2003068760 A JP2003068760 A JP 2003068760A JP 2003068760 A JP2003068760 A JP 2003068760A JP 2004277508 A5 JP2004277508 A5 JP 2004277508A5
- Authority
- JP
- Japan
- Prior art keywords
- atom
- silica
- forming
- film according
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 26
- 239000000377 silicon dioxide Substances 0.000 claims 13
- 125000004429 atom Chemical group 0.000 claims 12
- 239000011248 coating agent Substances 0.000 claims 7
- 238000000576 coating method Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 5
- -1 alkylene glycol dialkyl ether Chemical class 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 2
- 125000001153 fluoro group Chemical group F* 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 125000004437 phosphorous atom Chemical group 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 230000003301 hydrolyzing effect Effects 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003068760A JP2004277508A (ja) | 2003-03-13 | 2003-03-13 | シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003068760A JP2004277508A (ja) | 2003-03-13 | 2003-03-13 | シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004277508A JP2004277508A (ja) | 2004-10-07 |
| JP2004277508A5 true JP2004277508A5 (https=) | 2005-09-08 |
Family
ID=33286003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003068760A Withdrawn JP2004277508A (ja) | 2003-03-13 | 2003-03-13 | シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004277508A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004277502A (ja) * | 2003-03-13 | 2004-10-07 | Hitachi Chem Co Ltd | シリカ系被膜形成用組成物、シリカ系被膜及びその形成方法並びにシリカ系被膜を備える電子部品 |
| CN100457844C (zh) | 2003-04-09 | 2009-02-04 | Lg化学株式会社 | 生产绝缘膜的涂料组合物、制备绝缘膜的方法、绝缘膜及含有该绝缘膜的半导体器件 |
| US20060047034A1 (en) | 2004-09-02 | 2006-03-02 | Haruaki Sakurai | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film |
| JP2006117763A (ja) * | 2004-10-20 | 2006-05-11 | Catalysts & Chem Ind Co Ltd | 低誘電率非晶質シリカ系被膜形成用塗布液、その調製方法およびこれより得られる低誘電率非晶質シリカ系被膜 |
| JP2006213908A (ja) * | 2004-12-21 | 2006-08-17 | Hitachi Chem Co Ltd | シリカ系被膜形成用組成物、シリカ系被膜の形成方法、シリカ系被膜、及び、電子部品 |
| US20080260956A1 (en) * | 2004-12-21 | 2008-10-23 | Haruaki Sakurai | Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part |
-
2003
- 2003-03-13 JP JP2003068760A patent/JP2004277508A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004277501A5 (https=) | ||
| KR900005894B1 (ko) | 표면이 평평한 절연층의 형성방법 | |
| JP4015214B2 (ja) | 電子ビームによる水素シルセスキオキサン樹脂の硬化 | |
| EP1564269A1 (en) | Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device | |
| JP2002075783A5 (https=) | ||
| JP2004277508A5 (https=) | ||
| JP2003064307A5 (https=) | ||
| JP5170445B2 (ja) | ケイ素含有膜形成用材料、ならびにケイ素含有絶縁膜およびその形成方法 | |
| JP2002252143A5 (https=) | ||
| JP2003206403A5 (https=) | ||
| JP2003171616A5 (https=) | ||
| KR101677095B1 (ko) | 유기 ｅｌ 발광체 배향 제어용 조성물, 유기 ｅｌ 발광체 배향 제어막, 유기 ｅｌ 소자 및 그 제조 방법 | |
| KR101850890B1 (ko) | 유기막 조성물, 유기막, 및 패턴형성방법 | |
| KR101521617B1 (ko) | 고내열성 및 고내화학성의 보호박막 조성물 및 이를 이용하여 보호박막을 제조하는 방법 | |
| JP4349390B2 (ja) | シリコーン系材料組成物、シリカ系被膜及び半導体装置 | |
| KR20150015261A (ko) | 고내열성 및 고내화학성의 보호박막 조성물 및 이를 이용하여 보호박막을 제조하는 방법 | |
| KR101465582B1 (ko) | 고내열성 및 고내화학성의 보호박막 조성물 및 이를 이용하여 보호박막을 제조하는 방법 | |
| CN106046695A (zh) | 有机层组合物、有机层以及形成图案的方法 | |
| JP2007019486A5 (https=) | ||
| JP4734815B2 (ja) | 組成物、その組成物を用いた低誘電率膜の形成方法、低誘電率膜及びその低誘電率膜を有する電子部品 | |
| JP2005001996A (ja) | 新規化合物およびその用途 | |
| CN110066533A (zh) | 用于形成绝缘层的组合物和由其形成的绝缘层 | |
| TW200504164A (en) | Composition for forming porous film and method for forming the same, porous film and method for forming the same, interlevel insulator film, and semiconductor device | |
| JPH0314866A (ja) | 誘電体用樹脂組成物とフィルムコンデンサ | |
| JPWO2008133243A1 (ja) | Ｂｓｔ系誘電層、そのｂｓｔ系誘電層を備えるキャパシタ層形成材、電極回路付キャパシタ層構成部材及び内蔵キャパシタ回路を備えるプリント配線板 |