JP2004277508A5 - - Google Patents
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- JP2004277508A5 JP2004277508A5 JP2003068760A JP2003068760A JP2004277508A5 JP 2004277508 A5 JP2004277508 A5 JP 2004277508A5 JP 2003068760 A JP2003068760 A JP 2003068760A JP 2003068760 A JP2003068760 A JP 2003068760A JP 2004277508 A5 JP2004277508 A5 JP 2004277508A5
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- Prior art keywords
- atom
- silica
- forming
- film according
- composition
- Prior art date
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 26
- 239000000377 silicon dioxide Substances 0.000 claims 13
- 125000004429 atom Chemical group 0.000 claims 12
- 239000011248 coating agent Substances 0.000 claims 7
- 238000000576 coating method Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 5
- -1 alkylene glycol dialkyl ether Chemical class 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 2
- 125000001153 fluoro group Chemical group F* 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 125000004437 phosphorous atom Chemical group 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 230000003301 hydrolyzing effect Effects 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Claims (9)
Ｒ１ ｎＳｉＸ４−ｎ …（１）
（式中、Ｒ１は、Ｈ原子若しくはＦ原子、又はＢ原子、Ｎ原子、Ａｌ原子、Ｐ原子、Ｓｉ原子、Ｇｅ原子若しくはＴｉ原子を含む基、又は炭素数１〜２０の有機基を示し、Ｘは加水分解性基を示し、ｎは０〜２の整数を示す。但し、ｎが２のとき、各Ｒ１は同一でも異なっていてもよく、ｎが０〜２のとき、各Ｘは同一でも異なっていてもよい）、
で表される化合物を加水分解縮合して得られるシロキサン樹脂と、
（ｂ）成分：計算溶解度パラメータの値が（ａ）成分のものより小さく、その差が１０（ＭＪ／ｍ３）１／２以上である溶媒と、
を含有してなるシリカ系被膜形成用組成物。(A) component: following formula (1);
R 1 n SiX 4-n (1)
(In the formula, R 1 represents an H atom or F atom, or a group containing B atom, N atom, Al atom, P atom, Si atom, Ge atom or Ti atom, or an organic group having 1 to 20 carbon atoms. , X represents a hydrolyzable group, and n represents an integer of 0 to 2. However, when n is 2, each R 1 may be the same or different, and when n is 0 to 2, May be the same or different)
A siloxane resin obtained by hydrolytic condensation of a compound represented by:
(B) component: a solvent having a calculated solubility parameter value smaller than that of component (a) and a difference of 10 (MJ / m 3 ) 1/2 or more;
A composition for forming a silica-based film comprising:
請求項１〜５のいずれか一項に記載のシリカ系被膜形成用組成物を基板上に塗布して塗布膜を形成し、該塗布膜に含まれる有機溶媒を除去した後、該塗布膜を２５０〜５００℃の加熱温度で焼成することを特徴とするシリカ系被膜の形成方法。A method of forming a silica-based film on a substrate,
The composition for forming a silica-based film according to any one of claims 1 to 5 is applied on a substrate to form a coating film, and after removing the organic solvent contained in the coating film, the coating film is A method for forming a silica-based coating, comprising firing at a heating temperature of 250 to 500 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003068760A JP2004277508A (en) | 2003-03-13 | 2003-03-13 | Silica film-forming composition, silica film, its forming method and electronic part having silica film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003068760A JP2004277508A (en) | 2003-03-13 | 2003-03-13 | Silica film-forming composition, silica film, its forming method and electronic part having silica film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004277508A JP2004277508A (en) | 2004-10-07 |
| JP2004277508A5 true JP2004277508A5 (en) | 2005-09-08 |
Family
ID=33286003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003068760A Withdrawn JP2004277508A (en) | 2003-03-13 | 2003-03-13 | Silica film-forming composition, silica film, its forming method and electronic part having silica film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004277508A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004277502A (en) * | 2003-03-13 | 2004-10-07 | Hitachi Chem Co Ltd | Silica film-forming composition, silica film, its forming method and electronic part having silica film |
| US7345351B2 (en) | 2003-04-09 | 2008-03-18 | Lg Chem, Ltd. | Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same |
| US20060047034A1 (en) | 2004-09-02 | 2006-03-02 | Haruaki Sakurai | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film |
| JP2006117763A (en) * | 2004-10-20 | 2006-05-11 | Catalysts & Chem Ind Co Ltd | Low dielectric constant amorphous silica film-forming coating liquid, its preparation method and low dielectric constant amorphous silica film obtained thereby |
| US20080260956A1 (en) * | 2004-12-21 | 2008-10-23 | Haruaki Sakurai | Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part |
| JP2006213908A (en) * | 2004-12-21 | 2006-08-17 | Hitachi Chem Co Ltd | Composition for forming silica-based film, method for forming silica-based film, silica-based film and electronic part |
-
2003
- 2003-03-13 JP JP2003068760A patent/JP2004277508A/en not_active Withdrawn
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