JP2004219318A5 - - Google Patents

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Publication number
JP2004219318A5
JP2004219318A5 JP2003008507A JP2003008507A JP2004219318A5 JP 2004219318 A5 JP2004219318 A5 JP 2004219318A5 JP 2003008507 A JP2003008507 A JP 2003008507A JP 2003008507 A JP2003008507 A JP 2003008507A JP 2004219318 A5 JP2004219318 A5 JP 2004219318A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003008507A
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Japanese (ja)
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JP2004219318A (ja
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Publication date
Application filed filed Critical
Priority to JP2003008507A priority Critical patent/JP2004219318A/ja
Priority claimed from JP2003008507A external-priority patent/JP2004219318A/ja
Publication of JP2004219318A publication Critical patent/JP2004219318A/ja
Publication of JP2004219318A5 publication Critical patent/JP2004219318A5/ja
Pending legal-status Critical Current

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JP2003008507A 2003-01-16 2003-01-16 放射線検出器 Pending JP2004219318A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Publications (2)

Publication Number Publication Date
JP2004219318A JP2004219318A (ja) 2004-08-05
JP2004219318A5 true JP2004219318A5 (xx) 2005-11-24

Family

ID=32898277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003008507A Pending JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Country Status (1)

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JP (1) JP2004219318A (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4379295B2 (ja) 2004-10-26 2009-12-09 ソニー株式会社 半導体イメージセンサー・モジュール及びその製造方法
JP4934826B2 (ja) * 2005-12-07 2012-05-23 株式会社アクロラド 放射線画像検出モジュールおよび放射線画像検出装置
JP4451864B2 (ja) * 2006-07-11 2010-04-14 浜松ホトニクス株式会社 配線基板及び固体撮像装置
US20080068815A1 (en) * 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
JP4722103B2 (ja) * 2007-09-21 2011-07-13 京セラ株式会社 X線検出素子搭載用配線基板およびx線検出装置
JP4722104B2 (ja) * 2007-09-21 2011-07-13 京セラ株式会社 X線検出素子搭載用配線基板およびx線検出装置
JP4733098B2 (ja) * 2007-11-09 2011-07-27 富士フイルム株式会社 放射線画像撮影装置
US7576330B1 (en) * 2008-04-30 2009-08-18 General Electric Company Computed tomography detector apparatus
WO2010038877A1 (ja) * 2008-10-03 2010-04-08 株式会社 東芝 放射線検出装置及び放射線撮影装置
WO2013080105A2 (en) * 2011-11-29 2013-06-06 Koninklijke Philips Electronics N.V. Scintillator pack comprising an x-ray absorbing encapsulation and x-ray detector array comprising such scintillator pack
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
JP2016206101A (ja) * 2015-04-27 2016-12-08 ソニー株式会社 放射線検出装置、撮像装置、および撮像システム
CN111522052B (zh) * 2020-05-13 2022-03-25 奕瑞新材料科技(太仓)有限公司 一种x光探测器结构及其工作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136298A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd プリント回路基板の製造方法
JPH0367471U (xx) * 1989-11-02 1991-07-01
US5436458A (en) * 1993-12-06 1995-07-25 Minnesota Mining And Manufacturing Company Solid state radiation detection panel having tiled photosensitive detectors arranged to minimize edge effects between tiles
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JPH11345956A (ja) * 1998-03-16 1999-12-14 Canon Inc 撮像装置
JP2001099942A (ja) * 1999-09-29 2001-04-13 Toshiba Corp X線平面検出装置
JP4481410B2 (ja) * 2000-02-02 2010-06-16 株式会社東芝 X線ct用二次元検出器、x線ct用二次元検出器の製造方法及びx線ctスキャナ
JP2001318155A (ja) * 2000-02-28 2001-11-16 Toshiba Corp 放射線検出器、およびx線ct装置
JP4532782B2 (ja) * 2000-07-04 2010-08-25 キヤノン株式会社 放射線撮像装置及びシステム
JP4564141B2 (ja) * 2000-07-25 2010-10-20 株式会社東芝 X線ct装置
JP2002214352A (ja) * 2001-01-19 2002-07-31 Canon Inc 放射線画像撮影装置
DE10109542B4 (de) * 2001-02-28 2004-02-05 Siemens Ag Anordung zur Verbindung eines auf einer Leiterplatte angebrachten Bauelementes mit einer flexiblen Schichtanordnung

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