JP2004200567A - 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール - Google Patents

放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール Download PDF

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Publication number
JP2004200567A
JP2004200567A JP2002369847A JP2002369847A JP2004200567A JP 2004200567 A JP2004200567 A JP 2004200567A JP 2002369847 A JP2002369847 A JP 2002369847A JP 2002369847 A JP2002369847 A JP 2002369847A JP 2004200567 A JP2004200567 A JP 2004200567A
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JP
Japan
Prior art keywords
radiator
heat
powder
conductive material
high thermal
Prior art date
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Pending
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JP2002369847A
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English (en)
Japanese (ja)
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JP2004200567A5 (enExample
Inventor
Toshiyuki Nagase
敏之 長瀬
Takeshi Negishi
健 根岸
Yoshiyuki Nagatomo
義幸 長友
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2002369847A priority Critical patent/JP2004200567A/ja
Publication of JP2004200567A publication Critical patent/JP2004200567A/ja
Publication of JP2004200567A5 publication Critical patent/JP2004200567A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002369847A 2002-12-20 2002-12-20 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール Pending JP2004200567A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002369847A JP2004200567A (ja) 2002-12-20 2002-12-20 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002369847A JP2004200567A (ja) 2002-12-20 2002-12-20 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール

Publications (2)

Publication Number Publication Date
JP2004200567A true JP2004200567A (ja) 2004-07-15
JP2004200567A5 JP2004200567A5 (enExample) 2005-11-04

Family

ID=32765949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002369847A Pending JP2004200567A (ja) 2002-12-20 2002-12-20 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール

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JP (1) JP2004200567A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019502A (ja) * 2005-07-04 2007-01-25 Lg Electronics Inc 垂直型構造の発光ダイオード及びその製造方法
JP2007067258A (ja) * 2005-09-01 2007-03-15 Mitsubishi Materials Corp 冷却器及びパワーモジュール
JP2007150289A (ja) * 2005-11-04 2007-06-14 Mitsubishi Materials Corp 放熱体、放熱装置、パワーモジュール用基板及びパワーモジュール
JP2018082142A (ja) * 2016-11-16 2018-05-24 Tdk株式会社 複合磁性封止材料及びこれをモールド材として用いた電子回路パッケージ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019502A (ja) * 2005-07-04 2007-01-25 Lg Electronics Inc 垂直型構造の発光ダイオード及びその製造方法
EP2849235A1 (en) * 2005-07-04 2015-03-18 LG Electronics Inc. Vertical structure LED and fabricating method thereof
EP3057143A1 (en) * 2005-07-04 2016-08-17 LG Electronics Inc. Vertical structure led and fabricating method thereof
JP2007067258A (ja) * 2005-09-01 2007-03-15 Mitsubishi Materials Corp 冷却器及びパワーモジュール
JP2007150289A (ja) * 2005-11-04 2007-06-14 Mitsubishi Materials Corp 放熱体、放熱装置、パワーモジュール用基板及びパワーモジュール
JP2018082142A (ja) * 2016-11-16 2018-05-24 Tdk株式会社 複合磁性封止材料及びこれをモールド材として用いた電子回路パッケージ

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