JP2004200567A5 - - Google Patents
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- Publication number
- JP2004200567A5 JP2004200567A5 JP2002369847A JP2002369847A JP2004200567A5 JP 2004200567 A5 JP2004200567 A5 JP 2004200567A5 JP 2002369847 A JP2002369847 A JP 2002369847A JP 2002369847 A JP2002369847 A JP 2002369847A JP 2004200567 A5 JP2004200567 A5 JP 2004200567A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiator
- powder
- iron
- core body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000000843 powder Substances 0.000 claims 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000005097 cold rolling Methods 0.000 claims 2
- 238000005098 hot rolling Methods 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002369847A JP2004200567A (ja) | 2002-12-20 | 2002-12-20 | 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002369847A JP2004200567A (ja) | 2002-12-20 | 2002-12-20 | 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004200567A JP2004200567A (ja) | 2004-07-15 |
| JP2004200567A5 true JP2004200567A5 (enExample) | 2005-11-04 |
Family
ID=32765949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002369847A Pending JP2004200567A (ja) | 2002-12-20 | 2002-12-20 | 放熱体及びその製造方法、パワーモジュール用基板、パワーモジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004200567A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100658303B1 (ko) * | 2005-07-04 | 2006-12-14 | 엘지전자 주식회사 | 메탈지지층을 포함하는 수직형 구조의 발광 다이오드 |
| JP4600220B2 (ja) * | 2005-09-01 | 2010-12-15 | 三菱マテリアル株式会社 | 冷却器及びパワーモジュール |
| JP2007150289A (ja) * | 2005-11-04 | 2007-06-14 | Mitsubishi Materials Corp | 放熱体、放熱装置、パワーモジュール用基板及びパワーモジュール |
| US9972579B1 (en) * | 2016-11-16 | 2018-05-15 | Tdk Corporation | Composite magnetic sealing material and electronic circuit package using the same |
-
2002
- 2002-12-20 JP JP2002369847A patent/JP2004200567A/ja active Pending
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