JP2004178872A - 電子部品のリード線と支持部材との接合方法及びこの方法により作製した接合構造を有する電子機器 - Google Patents
電子部品のリード線と支持部材との接合方法及びこの方法により作製した接合構造を有する電子機器 Download PDFInfo
- Publication number
- JP2004178872A JP2004178872A JP2002341585A JP2002341585A JP2004178872A JP 2004178872 A JP2004178872 A JP 2004178872A JP 2002341585 A JP2002341585 A JP 2002341585A JP 2002341585 A JP2002341585 A JP 2002341585A JP 2004178872 A JP2004178872 A JP 2004178872A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- support member
- joining
- electronic component
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 183
- 238000000034 method Methods 0.000 title claims abstract description 118
- 238000005304 joining Methods 0.000 title claims abstract description 106
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000007789 gas Substances 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 238000007711 solidification Methods 0.000 description 11
- 230000008023 solidification Effects 0.000 description 11
- 229910052742 iron Inorganic materials 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- UVTGXFAWNQTDBG-UHFFFAOYSA-N [Fe].[Pb] Chemical compound [Fe].[Pb] UVTGXFAWNQTDBG-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002341585A JP2004178872A (ja) | 2002-11-26 | 2002-11-26 | 電子部品のリード線と支持部材との接合方法及びこの方法により作製した接合構造を有する電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002341585A JP2004178872A (ja) | 2002-11-26 | 2002-11-26 | 電子部品のリード線と支持部材との接合方法及びこの方法により作製した接合構造を有する電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004178872A true JP2004178872A (ja) | 2004-06-24 |
| JP2004178872A5 JP2004178872A5 (enExample) | 2005-10-27 |
Family
ID=32703874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002341585A Pending JP2004178872A (ja) | 2002-11-26 | 2002-11-26 | 電子部品のリード線と支持部材との接合方法及びこの方法により作製した接合構造を有する電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004178872A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006185694A (ja) * | 2004-12-27 | 2006-07-13 | Yazaki Corp | 圧接端子 |
| JP2008519692A (ja) * | 2004-11-15 | 2008-06-12 | バレオ エレクトロニク エ システメ デ リアイソン | 溶加材なしにレーザ溶接する方法、およびその方法で形成される電気装置 |
| JP2009248184A (ja) * | 2008-04-11 | 2009-10-29 | Mitsubishi Electric Corp | 溶接継手及びその製造方法 |
| EP2683522A4 (en) * | 2011-03-11 | 2015-06-03 | Univ Columbia | METHODS, DEVICES AND SYSTEMS FOR CONNECTING MATERIALS AND ARTICLES OBTAINED IN THIS WAY |
| CN109158722A (zh) * | 2018-10-08 | 2019-01-08 | 上海力声特医学科技有限公司 | 免清洗焊接方法 |
| JP2021153038A (ja) * | 2020-03-18 | 2021-09-30 | 矢崎総業株式会社 | 端子付き電線の製造方法及び端子付き電線 |
| DE102022209107A1 (de) * | 2022-09-01 | 2024-03-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Filteranordnung |
-
2002
- 2002-11-26 JP JP2002341585A patent/JP2004178872A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008519692A (ja) * | 2004-11-15 | 2008-06-12 | バレオ エレクトロニク エ システメ デ リアイソン | 溶加材なしにレーザ溶接する方法、およびその方法で形成される電気装置 |
| JP2006185694A (ja) * | 2004-12-27 | 2006-07-13 | Yazaki Corp | 圧接端子 |
| JP2009248184A (ja) * | 2008-04-11 | 2009-10-29 | Mitsubishi Electric Corp | 溶接継手及びその製造方法 |
| EP2683522A4 (en) * | 2011-03-11 | 2015-06-03 | Univ Columbia | METHODS, DEVICES AND SYSTEMS FOR CONNECTING MATERIALS AND ARTICLES OBTAINED IN THIS WAY |
| US9662745B2 (en) | 2011-03-11 | 2017-05-30 | The Trustees Of Columbia University In The City Of New York | Methods, devices, systems for joining materials and resulting articles |
| CN109158722A (zh) * | 2018-10-08 | 2019-01-08 | 上海力声特医学科技有限公司 | 免清洗焊接方法 |
| JP2021153038A (ja) * | 2020-03-18 | 2021-09-30 | 矢崎総業株式会社 | 端子付き電線の製造方法及び端子付き電線 |
| JP7143369B2 (ja) | 2020-03-18 | 2022-09-28 | 矢崎総業株式会社 | 端子付き電線の製造方法及び端子付き電線 |
| DE102022209107A1 (de) * | 2022-09-01 | 2024-03-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Filteranordnung |
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