JP2004178872A

JP2004178872A - Joining method for lead wire of electronic parts and support member, and electronic apparatus having joining structure produced by this method

Info

Publication number: JP2004178872A
Application number: JP2002341585A
Authority: JP
Inventors: Yoshiharu Sanagawa; 佳治佐名川; Masao Kubo; 雅男久保
Original assignee: Matsushita Electric Works Ltd
Current assignee: Panasonic Electric Works Co Ltd
Priority date: 2002-11-26
Filing date: 2002-11-26
Publication date: 2004-06-24

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joining method for stably securing a joining strength when a shape of a lead wire etc. is significantly varied from usual state, and even when using a material hardly to be made into an alloy because of large difference in melting points between the lead wire and a support member, in a joining method for an electronic parts having the lead wire to the support member. <P>SOLUTION: In the joining method, the electronic parts 1 having the lead wire 2 and the support member 3 having a support recess 4 to support the lead wire 2 and a counter strip 5 to form the recess 4 are equipped, and the lead wire 2 is inserted from an opening of the recess 4 to irradiate a laser 7, so that the lead wire 2 is joined with the support member 3. The lead wire 2 is inserted into the recess 4 from the opening, a tip portion of the opposite piece 5 is subjected to plastic deformation toward the inside of the tip portion so as to form an adhesive portion 6 between the recess 4 and the lead wire 2, and next, the laser 7 is radiated at least either at the support member 3 or the lead wire 2. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、リード線を有する電子部品を、支持部材の支持凹部で支持した状態で、レーザ照射によりリード線と支持部材を接合する接合方法及びこの方法より作製した接合構造を有する電子機器に関するものである。
【０００２】
【従来の技術】
リード線を有する電子部品を電子機器の端子や回路基板等の支持部材に接合する方法として、はんだ付けにより接合する方法に代り、レーザにより接合する方法が特開２００１―２４３８２７に提案されている。この方法を図１及び図１５に基づいて説明する。図１は電子部品を支持部材で支持した状態の斜視図であり、図１５は接合の手順を示す側面図である。１はコンデンサやコイルのような電子部品であり、両側にあるリード線２、２を介して、支持部材３、３と電気的に接続され、電子機器の回路を構成する。電子部品１は、例えば、直径が約５ｍｍ、長さが約１０ｍｍであり、リード線２は、直径約０．７ｍｍ、長さが約５ｍｍの錫めっき銅線である。支持部材３は、電子機器の導電部分あるいは電気的接続部分を構成するものであり、形状は、例えば、幅約２ｍｍ、高さ約５ｍｍ、厚さ約０．４ｍｍの銅合金（錫５ａｔ％、残り銅）の導電板からなっている。支持部材３の先端部分には、幅約０．５ｍｍ、最大深さ約１ｍｍのＵ字状の支持凹部４が形成されている。この支持凹部４の底部は、半径０．２５ｍｍの半円形状となっている。
【０００３】
電子部品１のリード線２、２は、図１及び図１５（ａ）に示すように、電子機器の成形基板１０上に２個設けられている支持部材３、３の支持凹部４に開口部から挿入されて電子部品１が支持部材３に仮支持される。この状態で、図１５（ｂ）に示すように、支持部材３の先端部分にレーザ７を照射してこれを溶融し、その後凝固して、図１５（ｃ）に示すように、接合部８が形成されてリード線２と支持部材３とが接合する。なお、レーザの具体的な照射条件等は後述する。この方法を用いると、限られた空間内に電子部品１を３次元的に配置することができるので、電子機器を小型化できる。
【０００４】
ここで、レーザ照射前の状態で、リード線２の一部は支持凹部４の両側の対向片５の内方面と密着している。このため、レーザ照射によって支持部材に供給される熱は、リード線２にも伝達し、その温度が上昇する。したがって、支持部材３が溶融すると、ほぼ同時にリード線２も溶融して、両者は合金化する。その結果、凝固した後は、均質な固溶体からなる接合部８を形成でき、接合強度が確保される。
【０００５】
しかし、リード線２の線径が著しく小さかったり、リード線２の断面形状が円形から変形している等の状況になると、リード線２を支持凹部４に挿入しただけでは、両者の密着している面積は極めて小さいものとなる。この状態で支持部３にレーザ７を照射した場合、リード線２への熱伝達が十分に行われず、リード線２の温度が低いままで、支持部材３のみが溶融するという状態になり得る。このようになると、溶融した支持部材３とリード線２との密着が不十分となり、凝固後に接合部８とリード線２との界面にクラックを生じる可能性がある。すなわち、リード線等の形状が通常状態から著しく変動した場合には、接合強度が確保できなくなる恐れがあるのである。
【０００６】
この課題に対応して、リード線と支持部材との密着性を向上させる方法としては、特開２００２―１５８１４２にリード線を押圧し支持部材に押し付ける方法が、特開２００１―２２９９８５にリード線を支持部材の支持凹部にプレスばめにより挿入する方法が提案されている。
【０００７】
【特許文献１】
特開２００１―２４３８２７号広報（第６−８頁、図１４、図１５）
【０００８】
【特許文献２】
特開２００２―１５８１４２号広報（第９−１３頁、図８、図９）
【０００９】
【特許文献３】
特開２００１―２２９９８５号広報（第２−３頁、図５）
【００１０】
【発明が解決しようとする課題】
しかしながら、特許文献２及び特許文献３の方法でも、リード線の材料が鉄で支持部材が銅のように、両者の融点の差が大きく、かつ合金化しにくい場合であって、リード線等の形状が通常状態から著しく変動した場合には、接合強度が確保できなくなる可能性があった。すなわち、リード線と支持部材とを同時に溶融させた場合でも、銅と鉄は合金化しにくいために、鉄だけが先に凝固して、最後に銅が凝固することになる。こうなると、銅の凝固時の体積収縮によって、銅と鉄の界面にクラックを生じる恐れがあった。
【００１１】
本発明は、かかる事由に鑑みてなしたもので、その目的とするところは、リード線を有する電子部品を支持部材に接合する接合方法において、リード線等の形状が通常状態から著しく変動した場合で、かつ、リード線と支持部材の融点差が大きくて合金化しにくい材料を用いた場合であっても、安定して接合強度を確保できる電子部品のリード線と支持部材との接合方法を提供することにある。
【００１２】
【課題を解決するための手段】
請求項１に係る発明は、リード線を有する電子部品と、リード線を支持する支持凹部とこの支持凹部を形成する対向片とを有する支持部材と、を有し、リード線を支持凹部の開口部から挿入してレーザ照射によりリード線と支持部材とを接合する電子部品のリード線と支持部材との接合方法において、前記リード線を前記支持凹部に開口部から挿入し、次に、前記支持凹部と前記リード線との間に密着部を形成するように前記対向片の先端部を内方向に塑性変形させ、次に、前記支持部材又は前記リード線の少なくともいずれかにレーザを照射することを特徴としている。
【００１３】
請求項２に係る発明は、前記密着部を形成する工程において、前記対向片の先端部の両端が接触するように塑性変形させることを特徴としている。
【００１４】
請求項３に係る発明は、請求項１又は請求項２記載の電子部品のリード線と支持部材との接合方法であって、前記支持凹部に前記リード線を開口部から挿入した後、前記リード線よりも開口部側に別線材を挿入することを特徴としている。
【００１５】
請求項４に係る発明は、請求項３記載の電子部品のリード線と支持部材との接合方法であって、前記別線材が前記リード線よりも低融点材料であることを特徴としている。
【００１６】
請求項５に係る発明は、請求項１乃至請求項４記載の電子部品のリード線と支持部材との接合方法であって、前記密着部を形成した後に、前記支持部材と前記リード線との間に電流を通電することで両者を抵抗溶接により固定することを特徴としている。
【００１７】
請求項６に係る発明は、請求項１乃至請求項４記載の電子部品のリード線と支持部材との接合方法であって、前記密着部を形成した後に、前記支持部材と前記リード線とをはんだ付けで固定することを特徴としている。
【００１８】
請求項７に係る発明は、請求項１乃至請求項６記載の電子部品のリード線と支持部材との接合方法であって、前記支持部材と前記リード線とを融点の異なる材料にて形成する場合において、低融点の部材のみにレーザを照射することを特徴としている。
【００１９】
請求項８に係る発明は、請求項１乃至請求項７記載の電子部品のリード線と支持部材との接合方法であって、前記密着部を形成した後に、塑性変形させた前記対向片に気体を吹き付けた状態でレーザを照射することを特徴としている。
【００２０】
請求項９に係る発明は、請求項８記載の電子部品のリード線と支持部材との接合方法であって、前記対向片に吹き付ける気体が不活性ガスであることを特徴としている。
【００２１】
請求項１０に係る発明は、請求項１乃至請求項９記載の電子部品のリード線と支持部材との接合方法であって、前記対向片は、先端に向かうほど幅が小さくなるよう形成されていることを特徴ととしている。
【００２２】
請求項１１に係る発明は、請求項１乃至請求項１０記載の電子部品のリード線と支持部材との接合方法であって、前記支持部材のレーザ照射面に、この支持部材よりもレーザ吸収率の高い材料をコーティングすることを特徴としている。
【００２３】
請求項１２に係る発明は、請求項１乃至請求項１１記載の電子部品のリード線と支持部材との接合方法であって前記支持部材のレーザ照射面の内接円よりも小さいスポット直径のレーザを照射することを特徴としている。
【００２４】
請求項１３に係る発明は、電子部品のリード線と支持部材との接合方法による接合部分を有する電子機器において、請求項１乃至請求項１２記載の電子部品のリード線と支持部材との接合方法により作製した接合構造を有することを特徴としている。
【００２５】
【発明の実施の形態】
（実施形態１）
実施形態１に係る電子部品のリード線と支持部材との接合方法を図１〜３に基づいて説明する。図１は従来の技術の項において説明したものと同様、電子部品を支持部材で支持した状態の斜視図、図２は接合の手順を示す側面図、図３はレーザ照射装置の全体図である。
【００２６】
１はコンデンサやコイルのような電子部品で、例えば、部品本体の両側にリード線２、２を有している。３は端子や導電接続板のような支持部材で、リード線を支持する支持凹部４と、この支持凹部４を形成する対向片５とを有し、例えば、リードフレーム一体の成形基板１０上に所定の間隔をおいて２個設けられている。電子部品１は、そのリード線２、２をそれぞれの支持凹部４、４に電気的に接続されて電子機器の回路を構成する。電子部品１は、例えば、直径が約５ｍｍ、長さが約１０ｍｍであり、リード線２は、直径約０．７ｍｍ、長さが約５ｍｍの錫めっき銅線である。支持部材３は、電子機器の導電部分あるいは電気的接続部分を構成するものであり、形状は、例えば、幅約２ｍｍ、高さ約５ｍｍ、厚さ約０．４ｍｍの銅合金（錫５ａｔ％、残り銅）の導電板からなっている。支持部材３の先端部分には、幅約０．５ｍｍ、最大深さ約１ｍｍのＵ字状の支持凹部４が形成されている。この支持凹部４の底部は、半径０．２５ｍｍの半円形状となっている。
【００２７】
次に、接合方法について説明する。まず、電子部品１のリード線２、２を、支持部材３、３の支持凹部４、４に開口部から挿入する。次に、支持凹部４、４とリード線２、２との間に密着部６を形成するように、外方から内方に向けて、すなわち、Ａ、Ｂ方向に外力を加えることにより、対向片５、５の先端部を内方向に塑性変形させる。これにより、リード線２と支持凹部４とが密着する面積が増大した密着部６を形成する。特に、リード線２等の形状が通常状態、すなわち、断面真円から相当変形した場合であっても、十分に大きい密着する面積を有した密着部６が形成できる。対向片５を塑性変形させる場合、専用の工具又は冶具を用いる。本実施形態では、図２（ｂ）に示すように、塑性変形後の対向片５の内方面が塑性変形前から約１５°程度傾けている。
【００２８】
次に、図２（ｃ）に示すように、リード線２にレーザ７を照射してこれを溶融させる。本実施形態で用いたレーザ７は、ＹＡＧレーザであり、出力はピークパワー約２ｋＷ、照射時間は約５ｍｓである。レーザ７は、具体的には、図３に示すように、レーザ電源部１１から電源の供給を受けたレーザ発振部１２より発振され、直径０．４ｍｍ程度の光ファイバ１３を通して、レーザ照射部１４に導かれる。このレーザ照射部には、焦点距離１６０ｍｍ程度のレンズと焦点距離８０ｍｍ程度のレンズが設けられており、その結果、レーザ７のスポット直径は０．２ｍｍ程度にしている。なお、レーザ照射部１４は、照射位置調整部１５に固定されており、所定位置にレーザ７が照射されるよう位置制御装置１６により位置制御を行う。
【００２９】
ここで、リード線２と支持部材３の一部はレーザ照射前から密着しているので、リード線２でレーザ照射により発生した熱は容易に支持部材３に容易に伝達する。この結果、両者は溶融し合金化して接合部８を形成するので、凝固後はリード線２と支持部材３とは良好な機械的強度で接合される。
【００３０】
（実施形態２）
実施形態２に係る電子部品のリード線と支持部材との接合方法を、図４の接合の手順を示す側面図に基づいて説明する。この接合方法は、支持部材３の対向片５を塑性変形させて密着部６を形成するまでの手順は、実施形態１と同様である。この状態で、図４（ｃ）に示すように、対向片５の先端部分にレーザ７を照射する。ここで、レーザ７は、片方ずつ照射してもよいし、両方同時に照射してもよい。また、他の照射条件は、実施形態１と同一である。ここで、照射レーザ７のスポット直径は０．２ｍｍであり、支持部材３の幅よりも小さい、したがって、レーザ７は、支持部材３のみに照射され、他の部位に漏れることがなく、周辺部への熱影響を防止することができる。
【００３１】
本実施形態では、レーザ照射された支持部材３の融点はリード線２の材料よりも低融点となっている。このために、図４（ｄ）に示すように、レーザ照射によって溶融するのは、支持部材３のみで、リード線２はほとんど溶融することはない。しかし、前述したように、リード線２と支持部材３との一部はレーザ照射前から密着部６を形成しているので、支持部材３の熱はリード線２に容易に伝達する。このために、溶融した支持部材３はリード線２との濡れ性が良好となり、凝固後の接合部８がリード線２の周囲を包みこんだ状態となる。したがって、良好な機械的強度で両者は接合される。ここで、支持部材３で、対向片５の片方のみにレーザを照射すると、リード線２はレーザを照射していない対向片の側に移動し、レーザを照射していない対向片とリード線２との密着が得られにくくなる。したがって、対向片５の両方に同時にレーザ照射した方が、リード線２と接合部８との密着性が良好となり、さらに機械的強度は強くなる。
【００３２】
なお、実施形態１のように、溶融状態で支持部材３とリード線２が合金化する場合には、支持部材３にさらに高出力のレーザ７を照射することにより、支持部材３だけでなく、リード線２も同時に溶融してもよい。この場合は、両者が合金化して接合部８を形成するので、さらに機械的強度を高めれられる。
【００３３】
一方、リード線２が鉄（融点１５３６℃）、支持部材３が銅（融点１０８３℃）のように、両者の融点の差が大きく、両者が合金化しない場合にも、本実施形態は有効となる。この場合は、レーザ照射により、銅の支持部材３のみを溶融させて、鉄のリード線２を溶融させないようにする。このとき、前述したように、支持部材３が溶融状態でリード線２の周辺を包むようになって凝固し、接合部８を形成する。このために、凝固後に良好な機械強度で両者は接合される。
【００３４】
ただし、レーザ７の出力が高すぎると、支持部材３だけでなく、リード線２も溶融してしまう。ここで、銅と鉄とは、液体・固体ともに固溶限が小さく合金化しにくい。このために、溶融状態から冷却したときに、鉄のみが先に凝固して、銅は溶融した状態となる。このようになると、最後まで溶融している銅の部分が凝固するときに、体積収縮のために、微小クラックが発生し、いわゆる高温割れを起こす恐れを生じてしまう。したがって、このような場合は、銅の支持部材３のみを溶融させることが必要となる。
【００３５】
本実施形態は、上記説明から明らかなように、支持部材がリード線よりも低融点で、両者が合金化しない場合に、特に有効となる。
【００３６】
（実施形態３）
実施形態３に係る電子部品のリード線と支持部材との接合方法を、図５の接合の手順を示す側面図に基づいて説明する。この接合方法は、、支持部材３の対向片５を塑性変形させて密着部６を形成するまでの手順は、実施形態２と同様である。この状態で、図５（ｂ）に示すように、支持部材３とリード線２とに電極２１、２１を取付けて、両者の間に約１ｋＡの電流を通電させる。このことにより、両者が接触している部分ではジュール熱が発生し、両者が抵抗溶接される。この結果として、より広い範囲にわたって密着部６が形成される。この後、実施形態２と同一にして、図５（ｃ）、（ｄ）に示すように、支持部材３の先端部分にレーザ７を照射して、両者を接合する。本実施形態では、レーザ照射前の支持部材３とリード線２がより確実に密着しているので、溶融した支持部材３はリード線２の周辺を包むようになって凝固し、接合部８を形成する。このために、凝固後に良好な機械強度で両者は接合される。
【００３７】
（実施形態４）
実施形態４に係る電子部品のリード線と支持部材との接合方法を、図６の接合の手順を示す側面図に基づいて説明する。この接合方法では、図６（ａ）のように、リード線２としてはんだめっき２３をした銅の線材を用いる。本実施形態の接合方法は、支持部材３の対向片５を塑性変形させて密着部６を形成するまでの手順は、実施形態２と同様である。この状態で、図６（ｂ）に示すように、リード線２にヒータ２４を取付けて加熱して、表面のはんだを溶融させることで、より広い範囲にわたって密着部６が形成される。ここで、本実施形態で用いるヒータは、はんだを溶融すればよいので、低出力なもので十分である。この後、実施形態２と同様にして、図６（ｃ）、（ｄ）に示すように、支持部材３の先端部分にレーザ７を照射して、両者を接合する。本実施形態では、レーザ照射前の支持部材３とリード線２がより確実に密着しているので、溶融した支持部材３はリード線２の周辺を包むようになって凝固し、接合部８を形成する。このために、凝固後に良好な機械的強度で両者は接合される。なお、ここで、はんだとは、錫・鉛合金だけでなく、錫・亜鉛合金等の低融点（融点が２００〜５００℃）の合金も含んでいる。
【００３８】
（実施形態５）
実施形態５に係る電子部品のリード線と支持部材との接合方法を、図７の接合の手順を示す側面図に基づいて説明する。この接合方法は、支持部材３の先端部を塑性変形させて密着部６を形成するまでの手順は、実施形態２と同一である。この状態で、図７（ｃ）に示すように、支持部材３の対向片５に両側から、気体２５を吹き付けながら、レーザ７を照射して、支持部材３を溶融させる。本実施形態では、吹き付ける気体２５の吹き付けの条件は、例えば、流量は毎分１０リットルで、圧力は０．１ＭＰａである。こうすることにより、溶融した支持部材３は、リード線側に移動し、溶融した支持部材３はリード線２の周辺を包むようになって凝固し、接合部８を形成する。このために、凝固後に良好な機械的強度で両者は接合される。
【００３９】
また、吹き付ける気体２５は、空気でも効果を得ることができる。さらに、窒素、アルゴン等の不活性気体を用いれば、材料が酸化する可能性が小さくなり、接合部の機械強度がより良好となる。
【００４０】
（実施形態６）
実施形態６に係る電子部品のリード線と支持部材との接合方法を、図８の接合の手順を示す側面図に基づいて説明する。この接合方法では、図８（ａ）に示すように、レーザ７を照射させる支持部材３の対向片５の表面に、支持部材３よりもレーザ吸収率の高い材料２６をコーティングする。他の接合方法は、図８（ｂ）、（ｃ）、（ｄ）に示すように、実施形態２と同様である。ここで、支持部材３として銅（レーザ吸収率１０％）を用いた場合、例えば、コーティング材としては錫（レーザ吸収率４６％）を用いることができる。簡易的には、めっきを表面にコーティングしてもよい。
【００４１】
本実施形態では、レーザ照射したときの吸収率が増加し、接合部分の機械的強度のばらつきが小さくなり、品質が安定する。さらにレーザ照射時にレーザ７の反射光が減少し、周辺部への熱影響が少なくなる。
【００４２】
（実施形態７）
実施形態７に係る電子部品のリード線と支持部材との接合方法を、図９の接合の手順を示す側面図に基づいて説明する。この接合方法で使用する支持部材３の対向片５は、図９（ａ）に示すように、先端に先端に向かうほど幅が小さくなるように傾斜がつけられている。具体的には、対向片５の先端の角部分の面取り加工をすることにより得ることができる。このような支持部材３に、図９（ｂ）に示すように、かしめ冶具２７をあてがうことで、先端部を塑性変形させて密着部６を形成する。他の接合方法は、図９（ｃ）、（ｄ）に示すように、実施形態２と同様である。
【００４３】
本実施形態では、支持部材の対向片を容易に塑性変形させて密着部を形成することができるので、生産性を向上することができる。
【００４４】
（実施形態８）
実施形態８に係る電子部品のリード線と支持部材との接合方法を、図１０の接合の手順を示す側面図に基づいて説明する。この接合方法は、実施形態１と同様のリード線２と支持部材３を用いる。ここで図１０（ｂ）に示すように、対向片５を内方向に塑性変形させて、対向片５の先端部分が接触することで、接触部９を形成させる。この状態で、図１０（ｃ）、（ｄ）に示すように、接触部９にレーザ７を照射させ、支持部材３を溶融せさて接合する。
【００４５】
本実施形態では、溶融した支持部材３はリード線２の周辺を包むようになって凝固し、接合部８を形成する。このために、凝固後に良好な機械強度で両者は接合される。
【００４６】
（実施形態９）
実施形態９に係る電子部品のリード線と支持部材との接合方法を、図１１の接合の手順を示す側面図に基づいて説明する。この接合方法は、実施形態１と同様の支持部材３とリード線２を用いる。ここで、図１１（ａ）に示すように、リード線２を支持部材３の支持凹部４に挿入した後に、別線材２８をリード線２よりも開口部側にさらに挿入する。別線材２８は、リード線２よりも小さい直径０．５ｍｍであり、材料はリード線２と同様の銅である。この状態で、図１１（ｂ）に示すように、実施形態１と同様に、支持部材３の対向片５の外方向から外力を加えることにより、塑性変形させて密着部６を形成させる。ここで、図１１（ａ）、（ｂ）に示すように、レーザ７を別線材２８に照射させて、別線材２８と支持部材３を溶融させて、接合部を形成し、リード線２を支持部材３に接合する。なお、このとき、リード線２の一部も溶融して、接合部を形成する場合もある。
【００４７】
本実施形態では、溶融した別線材がリード線を包むようになって凝固し、接合部を形成する。このために、凝固後に良好な機械強度でリード線と支持部材とは接合される。
【００４８】
（実施形態１０）
実施形態１０に係る電子部品のリード線と支持部材との接合方法は、図１２の接合の手順を示す側面図に基づいて説明する。この接合方法は、実施形態９の接合の接合方法で、別線材２８をリード線２よりも低融点としている。実施形態９と同様の手順で、図１２（ａ）に示すように、リード線２を支持部材３の支持凹部４に嵌着した後に、図１２（ｂ）に示すように、別線材２８をリード線２よりも開口部にさらに嵌着する。そして、支持部材３の対向片５の外方向から外力を加えることにより、塑性変形させて密着部６を形成する。この状態で、図１２（ｃ）に示すように、別線材２８にレーザ７を照射する。本実施形態では、別線材２８が低融点であるために、リード線２及び支持部材３はほとんど溶融することがない。このために、図１２（ｄ）に示すように、レーザ照射により溶融した別線材２８がろう材のような働きをして接合部８を形成し、リード線２を支持部材３に接合する。
【００４９】
本実施形態では、リード線が溶融しないので、溶接部の劣化を防止することができるとともに、レーザの出力を低減することが可能で、周辺部への熱影響を防止することができる。
【００５０】
（実施形態１１）
実施形態１１に係る電子機器を図１３、図１４に基づいて説明する。図１３は車載用の高輝度放電灯３０の点灯始動時に高圧を発生させるイグナイタの組立図であり、図１４はイグナイタの主要電子部品の組立図である。この電子機器であるイグナイタは、高輝度放電灯３０を取付けるソケット３１、上蓋３２、下蓋３３、各種電子部品１とを有している。ここで、電子部品１はリード線２を配線（図では省略）に設けられている支持部材３に実施形態２の接合方法で接合することで、イグナイタに組み込まれる。
【００５１】
本実施形態では、電子部品の接合部の品質が安定しているので、電子機器としての信頼性も向上する。
【００５２】
なお、ここでは電子機器としてイグナイタについて説明したが、インバータやコンバータ等の電子部品で構成されるものであってよいことは勿論である。
【００５３】
【発明の効果】
請求項１に係る電子部品のリード線と支持部材との接合方法は、リード線を有する電子部品と支持凹部と前記支持凹部を形成する対向片と、を有する支持部材とを接合する接合方法であって、前記リード線を前記支持凹部の開口部から挿入することにより前記電子部品を前記支持部材で支持した状態で、レーザ照射によって前記リード線と前記支持部材とを接合する接合方法において、前記リード線を前記支持凹部に開口部から挿入し、次に、前記支持凹部と前記リード線との間に密着部を形成するように前記対向片の先端部を内方向に塑性変形させて、次に、前記支持部材又は前記リード線の少なくともいずれかにレーザを照射して溶融させて接合することを特徴としているので、凝固後に接合部と周囲部材とが良好に密着することで、接合部の機械的強度が向上し、品質が安定する。
【００５４】
請求項２に係る電子部品のリード線と支持部材との接合方法は、請求項１記載の方法において、前記密着部を形成する段階において、前記対向片の先端部の両端が接触するように塑性変形させることを特徴としているので、請求項１記載の効果に加えて、接合部の機械的強度がさらに向上し、品質がより安定する。
【００５５】
請求項３に係る電子部品のリード線と支持部材との接合方法は、請求項１又は請求項２記載の方法において、前記支持凹部に前記リード線を開口部から挿入した後、前記リード線よりも開口部側に別線材を挿入することを特徴としているので、請求項１又は請求項２記載の効果に加えて、接合部の機械的強度がさらに向上し、品質がより安定する。
【００５６】
請求項４に係る電子部品のリード線と支持部材との接合方法は、請求項３記載の方法において、前記別線材が前記リード線よりも低融点材料であることを特徴としているので、請求項３記載の効果に加えて、レーザ７の出力を低くすることができる。
【００５７】
請求項５に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項４記載の方法において、前記密着部を形成した後に、前記支持部材と前記リード線との間に電流を通電することで両者を抵抗溶接により固定することを特徴としているので、請求項１乃至請求項４記載の効果に加えて、特別な仕様のリード線や支持部材を用いることなく、接合部の機械的強度がさらに向上し、品質がより安定する。
【００５８】
請求項６に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項４記載の方法において、前記密着部を形成した後に、前記支持部材と前記リード線とをはんだ付けで固定することを特徴としているので、請求項１乃至請求項４記載の効果に加えて、簡易なヒータ装置の使用で、接合部の機械的強度がさらに向上し、品質がより安定する。
【００５９】
請求項７に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項６記載の方法において、融点の異なる前記支持部材と前記リード線とを接合する接合方法において、低融点の材料のみにレーザを照射することを特徴としているので、請求項１乃至請求項６記載の効果に加えて、融点差の大きな材料についても適用することができる。
【００６０】
請求項８に係る電子部品のリード線と支持部材との接合方法は、請請求項１乃至請求項７記載の方法において、前記密着部を形成した後に、前記対向片に気体を吹き付けた状態でレーザを照射することを特徴としているので、請求項１乃至請求項７記載の効果に加えて、接合部の機械的強度がさらに向上し、品質がより安定する。
【００６１】
請求項９に係る電子部品のリード線と支持部材との接合方法は、請求項８の方法において、前記対向片に吹き付ける気体が不活性ガスであることを特徴としているので、請求項８記載の効果に加えて、接合部の酸化が防止されて接合部の品質がより安定する。
【００６２】
請求項１０に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項９記載の方法において、先端になるほど幅が短くなる対向片を有することを特徴としているので、請求項１乃至請求項９記載の効果に加えて、冶具を用いて支持部材を容易に塑性変形することが可能となり、生産性が向上する。
【００６３】
請求項１０に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項１０記載の方法において、前記支持部材のレーザ照射面に前記支持部材よりもレーザ吸収率の高い材料をコーティングすることを特徴としているので、請求項１乃至請求項１０記載の効果に加えて、接合部の機械的強度がさらに向上し、品質がより安定する。
【００６４】
請求項１２に係る電子部品のリード線と支持部材との接合方法は、請求項１乃至請求項１１記載の方法において、前記支持部材のレーザ照射面の内接円よりも小さいスポット直径のレーザを照射することを特徴としているので、請求項１乃至請求項１１記載の効果に加えて、接合部の周辺部への熱影響を抑制することができる。
【００６５】
請求項１３に係る電子機器は、請求項１乃至請求項１２記載の電子部品のリード線と支持部材との接合方法により作製した接合構造を有することを特徴としているので、電子機器の接合部の特性が安定し、電子機器としての信頼性が向上する。
【図面の簡単な説明】
【図１】電子部品を支持部材で支持した状態の斜視図である。
【図２】実施形態１に係るリード線と支持部材との接合の手順を示す側面図である。
【図３】レーザ照射装置の全体図である。
【図４】実施形態２に係るリード線と支持部材との接合の手順を示す側面図である。
【図５】実施形態３に係るリード線と支持部材との接合の手順を示す側面図である。
【図６】実施形態４に係るリード線と支持部材との接合の手順を示す側面図である。
【図７】実施形態５に係るリード線と支持部材との接合の手順を示す側面図である。
【図８】実施形態６に係るリード線と支持部材との接合の手順を示す側面図である。
【図９】実施形態７に係るリード線と支持部材との接合の手順を示す側面図である。
【図１０】実施形態８に係るリード線と支持部材との接合の手順を示す側面図である。
【図１１】実施形態９に係るリード線と支持部材との接合の手順を示す側面図である。
【図１２】実施形態１０に係るリード線と支持部材との接合の手順を示す側面図である。
【図１３】実施形態１１に係るイグナイタの組立図である。
【図１４】同上の主要電子部品の組立図である。
【図１５】従来のリード線と支持部材との接合の手順を示す側面図である。
【符号の説明】
１電子部品
２リード線
３支持部材
４支持凹部
５対向片
６密着部
７レーザ
８接合部
９接触部
１０成形基板
Ａ、Ｂ外力の方向
１１レーザ電源部
１２発振部
１３光ファイバ
１４レーザ照射部
１５照射位置調整部
１６位置制御装置
２１電極
２２通電用電源
２３はんだめっき
２４ヒータ
２５気体
２６レーザ吸収体
２７かしめ冶具
２８別線材
３０高輝度放電灯
３１高輝度放電灯用ソケット
３２電子機器の上蓋
３３電子機器の下蓋[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a joining method for joining a lead wire and a support member by laser irradiation in a state where an electronic component having a lead wire is supported by a support recess of a support member, and an electronic apparatus having a joining structure manufactured by this method. It is.
[0002]
[Prior art]
As a method of joining an electronic component having a lead wire to a support member such as a terminal of an electronic device or a circuit board, a method of joining by laser is proposed in Japanese Patent Laid-Open No. 2001-243827 instead of joining by soldering. This method will be described with reference to FIGS. FIG. 1 is a perspective view of a state in which an electronic component is supported by a support member, and FIG. 15 is a side view showing a joining procedure. Reference numeral 1 denotes an electronic component such as a capacitor or a coil, which is electrically connected to the support members 3 and 3 via lead wires 2 and 2 on both sides to constitute a circuit of the electronic device. For example, the electronic component 1 has a diameter of about 5 mm and a length of about 10 mm, and the lead wire 2 is a tin-plated copper wire having a diameter of about 0.7 mm and a length of about 5 mm. The support member 3 constitutes a conductive part or an electrical connection part of an electronic device. The shape of the support member 3 is, for example, a copper alloy having a width of about 2 mm, a height of about 5 mm, and a thickness of about 0.4 mm (tin 5 at%, The remaining copper is a conductive plate. A U-shaped support recess 4 having a width of about 0.5 mm and a maximum depth of about 1 mm is formed at the distal end portion of the support member 3. The bottom of the support recess 4 has a semicircular shape with a radius of 0.25 mm.
[0003]
As shown in FIGS. 1 and 15A, the lead wires 2 and 2 of the electronic component 1 have openings in the support recesses 4 of the support members 3 and 3 provided on the molded substrate 10 of the electronic device. The electronic component 1 is temporarily supported by the support member 3. In this state, as shown in FIG. 15B, the tip portion of the support member 3 is irradiated with the laser 7 to melt it, and then solidified. As shown in FIG. The lead wire 2 and the support member 3 are joined. Specific laser irradiation conditions and the like will be described later. When this method is used, the electronic component 1 can be three-dimensionally arranged in a limited space, so that the electronic device can be downsized.
[0004]
Here, in a state before the laser irradiation, a part of the lead wire 2 is in close contact with the inner surface of the opposing piece 5 on both sides of the support recess 4. For this reason, the heat supplied to the support member by laser irradiation is also transmitted to the lead wire 2, and the temperature rises. Therefore, when the support member 3 is melted, the lead wire 2 is melted almost simultaneously, and both are alloyed. As a result, after solidifying, the joint portion 8 made of a homogeneous solid solution can be formed, and the joining strength is ensured.
[0005]
However, when the lead wire 2 has a remarkably small wire diameter or the lead wire 2 is deformed from a circular cross-section, the lead wire 2 can be brought into close contact with the support recess 4 only by insertion. The area is extremely small. When the support portion 3 is irradiated with the laser 7 in this state, heat transfer to the lead wire 2 is not sufficiently performed, and only the support member 3 can be melted while the temperature of the lead wire 2 remains low. If it becomes like this, adhesion | attachment with the support member 3 and the lead wire 2 which were fuse | melted will become inadequate, and a crack may arise in the interface of the junction part 8 and the lead wire 2 after solidification. That is, when the shape of the lead wire or the like is significantly changed from the normal state, there is a possibility that the bonding strength cannot be secured.
[0006]
Corresponding to this problem, as a method of improving the adhesion between the lead wire and the support member, the method of pressing the lead wire against the support member in Japanese Patent Laid-Open No. 2002-158142 and the method of pressing the lead wire in Japanese Patent Laid-Open No. 2001-229985 There has been proposed a method of inserting into the support recess of the support member by press fitting.
[0007]
[Patent Document 1]
Japanese Laid-Open Patent Publication No. 2001-243827 (page 6-8, FIG. 14, FIG. 15)
[0008]
[Patent Document 2]
Japanese Laid-Open Patent Publication No. 2002-158142 (page 9-13, FIG. 8, FIG. 9)
[0009]
[Patent Document 3]
Japanese Laid-Open Patent Publication No. 2001-229985 (page 2-3, FIG. 5)
[0010]
[Problems to be solved by the invention]
However, even in the methods of Patent Document 2 and Patent Document 3, when the lead wire material is iron and the supporting member is copper, the difference between the melting points is large and it is difficult to alloy. However, when the temperature significantly changes from the normal state, the bonding strength may not be ensured. That is, even when the lead wire and the supporting member are melted at the same time, since copper and iron are difficult to alloy, only iron solidifies first, and finally copper solidifies. When this happens, there is a risk of cracking at the interface between copper and iron due to volume shrinkage during the solidification of copper.
[0011]
The present invention has been made in view of such a reason, and the object of the present invention is when the shape of the lead wire or the like significantly varies from the normal state in the joining method for joining the electronic component having the lead wire to the support member. In addition, even when using a material that has a large melting point difference between the lead wire and the support member and is difficult to be alloyed, a method for joining the lead wire and the support member of the electronic component that can stably secure the joint strength is provided. There is to do.
[0012]
[Means for Solving the Problems]
The invention according to claim 1 includes an electronic component having a lead wire, a support member having a support recess for supporting the lead wire and an opposing piece forming the support recess, and the lead wire is opened in the support recess. In a method of joining a lead wire and a support member of an electronic component that joins the lead wire and the support member by laser irradiation and inserting the lead wire into the support recess from the opening, and then the support The tip of the opposing piece is plastically deformed inward so as to form a close contact portion between the recess and the lead wire, and then laser is applied to at least one of the support member or the lead wire It is characterized by.
[0013]
The invention according to claim 2 is characterized in that, in the step of forming the contact portion, plastic deformation is performed so that both ends of the tip portion of the opposed piece are in contact with each other.
[0014]
The invention according to claim 3 is a method of joining the lead wire of the electronic component and the support member according to claim 1 or 2, wherein the lead wire is inserted into the support recess from the opening, and then the lead It is characterized in that another wire is inserted closer to the opening than the wire.
[0015]
The invention according to claim 4 is the method for joining the lead wire of the electronic component and the support member according to claim 3, wherein the separate wire is a material having a lower melting point than the lead wire.
[0016]
According to a fifth aspect of the present invention, there is provided a method for joining a lead wire and a support member of an electronic component according to any one of the first to fourth aspects, wherein the support member and the lead wire are formed after the contact portion is formed. Both are fixed by resistance welding by passing a current between them.
[0017]
The invention according to claim 6 is the method for joining the lead wire and the support member of the electronic component according to claim 1 to claim 4, wherein the support member and the lead wire are formed after the close contact portion is formed. It is characterized by being fixed by soldering.
[0018]
The invention according to claim 7 is the method of joining the lead wire and the support member of the electronic component according to claim 1 to claim 6, wherein the support member and the lead wire are formed of materials having different melting points. In some cases, only the low melting point member is irradiated with the laser.
[0019]
The invention according to an eighth aspect is the method for joining the lead wire of the electronic component and the support member according to the first to seventh aspects, wherein after forming the contact portion, a gas is applied to the facing piece plastically deformed. It is characterized by irradiating a laser in a state of spraying.
[0020]
The invention according to claim 9 is the method for joining the lead wire of the electronic component and the support member according to claim 8, characterized in that the gas blown to the facing piece is an inert gas.
[0021]
The invention according to claim 10 is the method for joining the lead wire of the electronic component and the support member according to claim 1 to claim 9, wherein the opposing piece is formed so that the width decreases toward the tip. It is characterized by being.
[0022]
According to an eleventh aspect of the present invention, there is provided a method for joining a lead wire of an electronic component according to any one of the first to tenth aspects and a support member, wherein the laser irradiation surface of the support member is more laser absorptive than the support member It is characterized by coating high material.
[0023]
According to a twelfth aspect of the present invention, there is provided a method for joining a lead wire of an electronic component and a support member according to any one of the first to eleventh aspects, wherein the laser has a spot diameter smaller than the inscribed circle of the laser irradiation surface of the support member It is characterized by irradiating.
[0024]
According to a thirteenth aspect of the present invention, there is provided an electronic apparatus having a joining portion obtained by a joining method between a lead wire of an electronic component and a support member. It is characterized by having a joint structure produced by the above.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
A method for joining the lead wire and the support member of the electronic component according to the first embodiment will be described with reference to FIGS. 1 is a perspective view of a state in which an electronic component is supported by a supporting member, as described in the section of the prior art, FIG. 2 is a side view showing a joining procedure, and FIG. 3 is an overall view of a laser irradiation apparatus. .
[0026]
Reference numeral 1 denotes an electronic component such as a capacitor or a coil, which has, for example, lead wires 2 and 2 on both sides of the component main body. Reference numeral 3 denotes a support member such as a terminal or a conductive connection plate, which includes a support recess 4 that supports the lead wire and an opposing piece 5 that forms the support recess 4. Two are provided at a predetermined interval. The electronic component 1 constitutes a circuit of an electronic device by electrically connecting the lead wires 2 and 2 to the respective support recesses 4 and 4. For example, the electronic component 1 has a diameter of about 5 mm and a length of about 10 mm, and the lead wire 2 is a tin-plated copper wire having a diameter of about 0.7 mm and a length of about 5 mm. The support member 3 constitutes a conductive part or an electrical connection part of an electronic device. The shape of the support member 3 is, for example, a copper alloy having a width of about 2 mm, a height of about 5 mm, and a thickness of about 0.4 mm (tin 5 at%, The remaining copper is a conductive plate. A U-shaped support recess 4 having a width of about 0.5 mm and a maximum depth of about 1 mm is formed at the distal end portion of the support member 3. The bottom of the support recess 4 has a semicircular shape with a radius of 0.25 mm.
[0027]
Next, a joining method will be described. First, the lead wires 2 and 2 of the electronic component 1 are inserted into the support recesses 4 and 4 of the support members 3 and 3 from the opening. Next, by forming an adhesion portion 6 between the support recesses 4 and 4 and the lead wires 2 and 2, facing each other by applying an external force from the outside to the inside, that is, in the A and B directions. The tip portions of the pieces 5 and 5 are plastically deformed inward. As a result, the contact portion 6 in which the area where the lead wire 2 and the support recess 4 are in close contact with each other is formed. In particular, even when the shape of the lead wire 2 or the like is in a normal state, that is, when the cross section is substantially deformed from a perfect circle, the contact portion 6 having a sufficiently large contact area can be formed. When the facing piece 5 is plastically deformed, a dedicated tool or jig is used. In the present embodiment, as shown in FIG. 2B, the inner surface of the opposing piece 5 after plastic deformation is inclined by about 15 ° from before plastic deformation.
[0028]
Next, as shown in FIG. 2C, the lead wire 2 is irradiated with a laser 7 to melt it. The laser 7 used in this embodiment is a YAG laser, the output is a peak power of about 2 kW, and the irradiation time is about 5 ms. Specifically, as shown in FIG. 3, the laser 7 is oscillated from a laser oscillation unit 12 that is supplied with power from a laser power supply unit 11, and passes through an optical fiber 13 having a diameter of about 0.4 mm and is irradiated with a laser irradiation unit 14. Led to. This laser irradiation unit is provided with a lens having a focal length of about 160 mm and a lens having a focal length of about 80 mm. As a result, the spot diameter of the laser 7 is set to about 0.2 mm. The laser irradiation unit 14 is fixed to the irradiation position adjustment unit 15, and the position control device 16 performs position control so that the laser 7 is irradiated to a predetermined position.
[0029]
Here, since the lead wire 2 and a part of the support member 3 are in close contact before the laser irradiation, the heat generated by the laser irradiation of the lead wire 2 is easily transferred to the support member 3. As a result, both are melted and alloyed to form the joint 8, and thus the lead wire 2 and the support member 3 are joined with good mechanical strength after solidification.
[0030]
(Embodiment 2)
A method for joining the lead wire of the electronic component and the support member according to the second embodiment will be described with reference to a side view showing the joining procedure of FIG. In this joining method, the procedure from plastic deformation of the opposing piece 5 of the support member 3 to form the contact portion 6 is the same as that of the first embodiment. In this state, as shown in FIG. 4C, the tip of the facing piece 5 is irradiated with the laser 7. Here, the laser 7 may be irradiated one by one or both at the same time. Other irradiation conditions are the same as those in the first embodiment. Here, the spot diameter of the irradiation laser 7 is 0.2 mm, which is smaller than the width of the support member 3. Therefore, the laser 7 is irradiated only to the support member 3 and does not leak to other parts, and the peripheral portion. The heat effect on can be prevented.
[0031]
In this embodiment, the melting point of the support member 3 irradiated with the laser is lower than that of the material of the lead wire 2. For this reason, as shown in FIG. 4D, only the support member 3 is melted by the laser irradiation, and the lead wire 2 is hardly melted. However, as described above, a part of the lead wire 2 and the support member 3 forms the contact portion 6 before the laser irradiation, so that the heat of the support member 3 is easily transmitted to the lead wire 2. For this reason, the molten support member 3 has good wettability with the lead wire 2, and the joined portion 8 after solidification wraps around the lead wire 2. Therefore, both are joined with good mechanical strength. Here, when the support member 3 irradiates only one of the opposed pieces 5 with the laser, the lead wire 2 moves to the opposite piece not irradiated with the laser, and the opposed piece and the lead wire 2 not irradiated with the laser. It becomes difficult to obtain close contact with. Therefore, when both the opposing pieces 5 are irradiated with laser simultaneously, the adhesion between the lead wire 2 and the joint 8 is improved, and the mechanical strength is further increased.
[0032]
In addition, when the support member 3 and the lead wire 2 are alloyed in the molten state as in the first embodiment, not only the support member 3 but also the support member 3 is irradiated with a higher-power laser 7. The lead wire 2 may also be melted at the same time. In this case, since both are alloyed to form the joint 8, the mechanical strength can be further increased.
[0033]
On the other hand, the present embodiment is effective even when the lead wire 2 is iron (melting point 1536 ° C.) and the support member 3 is copper (melting point 1083 ° C.) and the difference between the melting points is large and the two are not alloyed. Become. In this case, only the copper support member 3 is melted by laser irradiation so that the iron lead wire 2 is not melted. At this time, as described above, the support member 3 is solidified so as to wrap around the lead wire 2 in a molten state, and the joint portion 8 is formed. For this reason, both are joined with good mechanical strength after solidification.
[0034]
However, if the output of the laser 7 is too high, not only the support member 3 but also the lead wire 2 is melted. Here, copper and iron are difficult to be alloyed due to their small solid solubility limit for both liquid and solid. For this reason, when it cools from a molten state, only iron solidifies first and copper will be in the molten state. In this case, when the copper portion that has been melted to the end is solidified, a microcrack is generated due to volume shrinkage, which may cause a so-called hot crack. Therefore, in such a case, it is necessary to melt only the copper support member 3.
[0035]
As is clear from the above description, this embodiment is particularly effective when the support member has a lower melting point than the lead wire and the two are not alloyed.
[0036]
(Embodiment 3)
A method for joining the lead wire and the support member of the electronic component according to the third embodiment will be described based on a side view showing the joining procedure of FIG. In this joining method, the procedure from plastic deformation of the opposing piece 5 of the support member 3 to form the contact portion 6 is the same as that of the second embodiment. In this state, as shown in FIG. 5B, the electrodes 21 and 21 are attached to the support member 3 and the lead wire 2, and a current of about 1 kA is passed between them. As a result, Joule heat is generated at the portion where both are in contact, and both are resistance welded. As a result, the contact portion 6 is formed over a wider range. Thereafter, in the same manner as in the second embodiment, as shown in FIGS. 5C and 5D, the tip portion of the support member 3 is irradiated with the laser 7 to join them together. In this embodiment, since the support member 3 and the lead wire 2 before laser irradiation are more closely attached to each other, the molten support member 3 is solidified so as to wrap around the lead wire 2 to form the joint 8. To do. For this reason, both are joined with good mechanical strength after solidification.
[0037]
(Embodiment 4)
A method for joining the lead wire and the support member of the electronic component according to the fourth embodiment will be described based on a side view showing the joining procedure of FIG. In this joining method, as shown in FIG. 6A, a copper wire with solder plating 23 is used as the lead wire 2. In the joining method of the present embodiment, the procedure from plastic deformation of the opposing piece 5 of the support member 3 to form the contact portion 6 is the same as that of the second embodiment. In this state, as shown in FIG. 6B, the contact portion 6 is formed over a wider range by attaching and heating the heater 24 to the lead wire 2 and melting the surface solder. Here, as the heater used in the present embodiment, it is sufficient to melt the solder. Thereafter, in the same manner as in the second embodiment, as shown in FIGS. 6C and 6D, the tip portion of the support member 3 is irradiated with the laser 7 to join them together. In this embodiment, since the support member 3 and the lead wire 2 before laser irradiation are more closely attached to each other, the molten support member 3 is solidified so as to wrap around the lead wire 2 to form the joint 8. To do. For this reason, both are joined with good mechanical strength after solidification. Here, the solder includes not only a tin / lead alloy but also an alloy having a low melting point (melting point: 200 to 500 ° C.) such as a tin / zinc alloy.
[0038]
(Embodiment 5)
A method for joining the lead wire of the electronic component and the support member according to the fifth embodiment will be described based on a side view showing the joining procedure of FIG. In this joining method, the procedure from plastic deformation of the tip of the support member 3 to form the contact portion 6 is the same as that of the second embodiment. In this state, as shown in FIG. 7C, the support member 3 is melted by irradiating the laser 7 while blowing the gas 25 from both sides to the opposing piece 5 of the support member 3. In this embodiment, the conditions for blowing the gas 25 to be blown are, for example, a flow rate of 10 liters per minute and a pressure of 0.1 MPa. By doing so, the molten support member 3 moves to the lead wire side, and the molten support member 3 is solidified so as to wrap around the lead wire 2, thereby forming the joint portion 8. For this reason, both are joined with good mechanical strength after solidification.
[0039]
Moreover, the gas 25 to spray can also obtain an effect with air. Furthermore, if an inert gas such as nitrogen or argon is used, the possibility that the material is oxidized is reduced, and the mechanical strength of the joint is improved.
[0040]
(Embodiment 6)
A method for joining the lead wire and the support member of the electronic component according to the sixth embodiment will be described based on a side view showing the joining procedure of FIG. In this joining method, as shown in FIG. 8A, a material 26 having a laser absorption rate higher than that of the support member 3 is coated on the surface of the facing piece 5 of the support member 3 to be irradiated with the laser 7. Other bonding methods are the same as those in the second embodiment as shown in FIGS. 8B, 8C, and 8D. Here, when copper (laser absorption rate 10%) is used as the support member 3, for example, tin (laser absorption rate 46%) can be used as the coating material. For simplicity, the surface may be coated with plating.
[0041]
In the present embodiment, the absorptance when laser irradiation is performed is increased, the variation in mechanical strength of the joint portion is reduced, and the quality is stabilized. Further, the reflected light of the laser 7 is reduced during laser irradiation, and the thermal influence on the peripheral portion is reduced.
[0042]
(Embodiment 7)
A method for joining the lead wire and the support member of the electronic component according to the seventh embodiment will be described based on a side view showing the joining procedure of FIG. As shown in FIG. 9A, the opposing piece 5 of the support member 3 used in this joining method is inclined so that the width decreases toward the tip. Specifically, it can be obtained by chamfering the corner portion at the tip of the facing piece 5. As shown in FIG. 9B, the contact member 6 is plastically deformed by applying a caulking jig 27 to the support member 3 as shown in FIG. Other bonding methods are the same as those in the second embodiment, as shown in FIGS.
[0043]
In the present embodiment, the opposing piece of the support member can be easily plastically deformed to form the close contact portion, so that productivity can be improved.
[0044]
(Embodiment 8)
A method for joining the lead wire and the support member of the electronic component according to the eighth embodiment will be described based on a side view showing the joining procedure of FIG. This joining method uses the lead wire 2 and the support member 3 similar to those of the first embodiment. Here, as shown in FIG. 10 (b), the opposing piece 5 is plastically deformed inward, and the tip portion of the opposing piece 5 comes into contact with each other to form the contact portion 9. In this state, as shown in FIGS. 10C and 10D, the contact portion 9 is irradiated with the laser 7 and the support member 3 is melted and joined.
[0045]
In the present embodiment, the molten support member 3 is wrapped around the periphery of the lead wire 2 to form a joint 8. For this reason, both are joined with good mechanical strength after solidification.
[0046]
(Embodiment 9)
The joining method of the lead wire of the electronic component which concerns on Embodiment 9, and a supporting member is demonstrated based on the side view which shows the procedure of joining of FIG. This joining method uses the same support member 3 and lead wire 2 as in the first embodiment. Here, as shown in FIG. 11A, after the lead wire 2 is inserted into the support recess 4 of the support member 3, another wire 28 is further inserted into the opening side of the lead wire 2. The separate wire 28 has a diameter of 0.5 mm smaller than that of the lead wire 2, and the material is copper similar to that of the lead wire 2. In this state, as shown in FIG. 11B, as in the first embodiment, by applying an external force from the outside of the facing piece 5 of the support member 3, the contact portion 6 is formed by plastic deformation. Here, as shown in FIGS. 11A and 11B, the separate wire 28 is irradiated with the laser 7 to melt the separate wire 28 and the support member 3, thereby forming a joint portion. The support member 3 is joined. At this time, a part of the lead wire 2 may be melted to form a joint.
[0047]
In the present embodiment, the melted separate wire wraps around the lead wire and solidifies to form a joint. For this reason, the lead wire and the support member are joined with good mechanical strength after solidification.
[0048]
(Embodiment 10)
A method for joining the lead wire and the support member of the electronic component according to the tenth embodiment will be described based on a side view showing the joining procedure of FIG. This joining method is the joining method of the embodiment 9, and the separate wire 28 has a lower melting point than the lead wire 2. After the lead wire 2 is fitted into the support concave portion 4 of the support member 3 as shown in FIG. 12A in the same procedure as in the ninth embodiment, the separate wire 28 is attached as shown in FIG. The lead wire 2 is further fitted into the opening. Then, by applying an external force from the outside of the opposing piece 5 of the support member 3, the contact portion 6 is formed by plastic deformation. In this state, as shown in FIG. 12C, the laser 7 is irradiated to the separate wire 28. In the present embodiment, since the separate wire 28 has a low melting point, the lead wire 2 and the support member 3 hardly melt. For this purpose, as shown in FIG. 12 (d), the separate wire 28 melted by the laser irradiation functions like a brazing material to form the joint 8, and the lead wire 2 is joined to the support member 3.
[0049]
In this embodiment, since the lead wire does not melt, it is possible to prevent the welded portion from being deteriorated, to reduce the output of the laser, and to prevent the thermal influence on the peripheral portion.
[0050]
(Embodiment 11)
An electronic apparatus according to Embodiment 11 will be described with reference to FIGS. FIG. 13 is an assembly diagram of an igniter that generates high pressure at the start of lighting of the in-vehicle high-intensity discharge lamp 30, and FIG. 14 is an assembly diagram of main electronic components of the igniter. The igniter that is an electronic device includes a socket 31 to which the high-intensity discharge lamp 30 is attached, an upper lid 32, a lower lid 33, and various electronic components 1. Here, the electronic component 1 is incorporated in the igniter by joining the lead wire 2 to the support member 3 provided in the wiring (not shown) by the joining method of the second embodiment.
[0051]
In this embodiment, since the quality of the junction part of an electronic component is stable, the reliability as an electronic device is also improved.
[0052]
Although the igniter has been described as an electronic device here, it is needless to say that the igniter may be composed of an electronic component such as an inverter or a converter.
[0053]
【The invention's effect】
The electronic component lead wire and support member joining method according to claim 1 is a joining method of joining an electronic component having a lead wire, a support recess, and a support member having an opposing piece forming the support recess. In the joining method of joining the lead wire and the support member by laser irradiation in a state where the electronic component is supported by the support member by inserting the lead wire from the opening of the support recess, A lead wire is inserted into the support recess from the opening, and then the tip of the opposing piece is plastically deformed inward so as to form a close contact portion between the support recess and the lead wire. In addition, since at least one of the support member and the lead wire is melted by irradiating a laser, the bonded portion and the surrounding member are in good contact with each other after solidification. Mechanical strength is improved parts, quality is stabilized.
[0054]
According to a second aspect of the present invention, there is provided a method for joining the lead wire of the electronic component and the support member according to the first aspect, wherein the both ends of the front end portion of the facing piece are in contact with each other in the step of forming the contact portion. Since it is made to deform | transform, in addition to the effect of Claim 1, the mechanical strength of a junction part further improves and quality is stabilized more.
[0055]
According to a third aspect of the present invention, there is provided a method of joining the lead wire of the electronic component and the support member according to the first or second aspect, wherein the lead wire is inserted into the support recess from the opening, and then the lead wire is used. Further, since another wire is inserted into the opening, the mechanical strength of the joint is further improved and the quality is further stabilized in addition to the effect of the first or second aspect.
[0056]
According to a fourth aspect of the present invention, there is provided a method for joining a lead wire and a support member of an electronic component according to the third aspect, wherein the separate wire is a material having a lower melting point than the lead wire. In addition to the effect described in 3, the output of the laser 7 can be reduced.
[0057]
A method for joining a lead wire of an electronic component and a support member according to claim 5 is the method according to claim 1 to 4, wherein after the close contact portion is formed, between the support member and the lead wire. Since both are fixed by resistance welding by energizing an electric current, in addition to the effects of claims 1 to 4, the joint portion can be used without using a lead wire or a support member having a special specification. The mechanical strength is further improved, and the quality is more stable.
[0058]
The method for joining the lead wire and the support member of the electronic component according to claim 6 is the method according to any one of claims 1 to 4, wherein the support member and the lead wire are soldered after the contact portion is formed. In addition to the effects of claims 1 to 4, the use of a simple heater device further improves the mechanical strength of the joint and further stabilizes the quality.
[0059]
According to a seventh aspect of the present invention, there is provided a method for joining a lead wire and a support member of an electronic component according to any one of the first to sixth aspects, wherein the support member and the lead wire having different melting points are joined together. Since only the melting point material is irradiated with the laser, in addition to the effects of claims 1 to 6, the invention can be applied to a material having a large melting point difference.
[0060]
The method for joining a lead wire of an electronic component and a support member according to claim 8 is the method according to claim 1 to claim 7, wherein after the close contact portion is formed, gas is blown onto the facing piece. Since it is characterized by irradiating with a laser, in addition to the effects of claims 1 to 7, the mechanical strength of the joint is further improved and the quality is more stable.
[0061]
The method for joining the lead wire of the electronic component and the support member according to claim 9 is characterized in that, in the method of claim 8, the gas sprayed to the facing piece is an inert gas. In addition to the effect, the oxidation of the joint is prevented, and the quality of the joint becomes more stable.
[0062]
The method for joining a lead wire of an electronic component and a support member according to claim 10 is characterized in that in the method according to claims 1 to 9, the electronic component lead wire has a facing piece that decreases in width toward the tip. In addition to the effects of Items 1 to 9, the support member can be easily plastically deformed using a jig, and productivity is improved.
[0063]
The method for joining the lead wire of an electronic component and the support member according to claim 10 is the method according to claim 1 to claim 10, wherein the laser irradiation surface of the support member has a laser absorption rate higher than that of the support member. In addition to the effects of claims 1 to 10, the mechanical strength of the joint is further improved and the quality is more stable.
[0064]
A method for joining a lead wire of an electronic component and a support member according to a twelfth aspect is the method according to the first to eleventh aspects, wherein a laser having a spot diameter smaller than the inscribed circle of the laser irradiation surface of the support member is used. Since it is characterized by irradiating, in addition to the effects of claims 1 to 11, it is possible to suppress the thermal influence on the peripheral part of the joint.
[0065]
The electronic device according to claim 13 is characterized by having a joining structure produced by the joining method of the lead wire of the electronic component according to claims 1 to 12 and the support member. The characteristics are stabilized and the reliability as an electronic device is improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component supported by a support member.
FIG. 2 is a side view showing a procedure for joining the lead wire and the support member according to the first embodiment.
FIG. 3 is an overall view of a laser irradiation apparatus.
4 is a side view showing a procedure for joining a lead wire and a support member according to Embodiment 2. FIG.
5 is a side view showing a procedure for joining a lead wire and a support member according to Embodiment 3. FIG.
6 is a side view showing a procedure for joining a lead wire and a support member according to Embodiment 4. FIG.
7 is a side view showing a procedure for joining a lead wire and a support member according to Embodiment 5. FIG.
FIG. 8 is a side view showing a procedure for joining a lead wire and a support member according to a sixth embodiment.
FIG. 9 is a side view showing a procedure for joining a lead wire and a support member according to a seventh embodiment.
FIG. 10 is a side view showing a procedure for joining a lead wire and a support member according to an eighth embodiment.
FIG. 11 is a side view showing a procedure for joining a lead wire and a support member according to the ninth embodiment.
12 is a side view showing a procedure for joining a lead wire and a support member according to Embodiment 10. FIG.
13 is an assembly view of an igniter according to Embodiment 11. FIG.
FIG. 14 is an assembly drawing of the main electronic components.
FIG. 15 is a side view showing a procedure for joining a conventional lead wire and a support member.
[Explanation of symbols]
1 Electronic components
2 Lead wire
3 Support members
4 Support recess
5 Opposing pieces
6 adhesion part
7 Laser
8 joints
9 Contact area
10 Molded substrate
A, B Direction of external force
11 Laser power supply
12 Oscillator
13 Optical fiber
14 Laser irradiation part
15 Irradiation position adjuster
16 Position control device
21 electrodes
22 Power supply for energization
23 Solder plating
24 heater
25 gas
26 Laser absorber
27 Caulking jig
28 Separate wire
30 High-intensity discharge lamp
31 Socket for high-intensity discharge lamp
32 Top cover of electronic equipment
33 Lower lid of electronic equipment

Claims

An electronic component having a lead wire, and a support member having a support recess for supporting the lead wire and an opposing piece for forming the support recess, and the lead wire is inserted through the opening of the support recess to perform laser irradiation. In a method for joining a lead wire and a support member of an electronic component for joining a lead wire and a support member, the lead wire is inserted into the support recess from an opening, and then between the support recess and the lead wire. The lead of the electronic component is characterized in that the tip of the opposing piece is plastically deformed inward so as to form a close contact portion, and then at least one of the support member and the lead wire is irradiated with a laser. Bonding method of wire and support member.

2. The method for joining a lead wire of an electronic component and a support member according to claim 1, wherein in the step of forming the contact portion, plastic deformation is performed so that both ends of the tip portion of the facing piece are in contact with each other.

3. The lead wire and support for an electronic component according to claim 1, wherein after the lead wire is inserted into the support recess from the opening, another wire is inserted closer to the opening than the lead wire. Joining method with member.

4. The method of joining an electronic component lead wire and a support member according to claim 3, wherein the separate wire material is a material having a lower melting point than the lead wire.

5. The electronic component lead according to claim 1, wherein after forming the contact portion, an electric current is passed between the support member and the lead wire to fix both by resistance welding. 6. Bonding method of wire and support member.

5. The method for joining a lead wire and a support member of an electronic component according to claim 1, wherein the support member and the lead wire are fixed by soldering after the close contact portion is formed.

7. The lead wire for an electronic component according to claim 1, wherein when the support member and the lead wire are formed of materials having different melting points, only a member having a low melting point is irradiated with a laser. Bonding method with support member.

8. The lead wire of an electronic component and a support member according to claim 1, wherein after the close contact portion is formed, a laser is irradiated in a state where a gas is blown onto the opposing piece plastically deformed. Joining method.

The method for joining a lead wire of an electronic component and a support member according to claim 8, wherein the gas blown onto the facing piece is an inert gas.

The method for joining a lead wire and a support member of an electronic component according to claim 1, wherein the facing piece is formed to have a width that decreases toward the tip.

11. The method of joining a lead wire of an electronic component and a support member according to claim 1, wherein the laser irradiation surface of the support member is coated with a material having a laser absorption rate higher than that of the support member.

12. The method of joining a lead wire of an electronic component and a support member according to claim 1, wherein a laser having a spot diameter smaller than an inscribed circle of the laser irradiation surface of the support member is irradiated.

13. An electronic apparatus comprising a joining structure produced by a joining method of a lead wire of an electronic component according to claim 1 and a support member.