JP2004146808A - 半導体デバイスを封止する為の方法及びその方法を実現する為の装置 - Google Patents

半導体デバイスを封止する為の方法及びその方法を実現する為の装置 Download PDF

Info

Publication number
JP2004146808A
JP2004146808A JP2003324962A JP2003324962A JP2004146808A JP 2004146808 A JP2004146808 A JP 2004146808A JP 2003324962 A JP2003324962 A JP 2003324962A JP 2003324962 A JP2003324962 A JP 2003324962A JP 2004146808 A JP2004146808 A JP 2004146808A
Authority
JP
Japan
Prior art keywords
gasket
device chip
cap
sealing
raised pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003324962A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004146808A5 (enExample
Inventor
Frank S Geefay
フランク　エス．　ジーフェイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2004146808A publication Critical patent/JP2004146808A/ja
Publication of JP2004146808A5 publication Critical patent/JP2004146808A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003324962A 2002-10-22 2003-09-17 半導体デバイスを封止する為の方法及びその方法を実現する為の装置 Withdrawn JP2004146808A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/277,479 US6919222B2 (en) 2002-10-22 2002-10-22 Method for sealing a semiconductor device and apparatus embodying the method

Publications (2)

Publication Number Publication Date
JP2004146808A true JP2004146808A (ja) 2004-05-20
JP2004146808A5 JP2004146808A5 (enExample) 2006-11-02

Family

ID=29711730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003324962A Withdrawn JP2004146808A (ja) 2002-10-22 2003-09-17 半導体デバイスを封止する為の方法及びその方法を実現する為の装置

Country Status (4)

Country Link
US (2) US6919222B2 (enExample)
JP (1) JP2004146808A (enExample)
DE (1) DE10325020B4 (enExample)
GB (1) GB2396055B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7343535B2 (en) 2002-02-06 2008-03-11 Avago Technologies General Ip Dte Ltd Embedded testing capability for integrated serializer/deserializers
US20050063431A1 (en) * 2003-09-19 2005-03-24 Gallup Kendra J. Integrated optics and electronics
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US20050213995A1 (en) * 2004-03-26 2005-09-29 Myunghee Lee Low power and low jitter optical receiver for fiber optic communication link
JP2006344902A (ja) * 2005-06-10 2006-12-21 Fujifilm Holdings Corp 半導体モジュール
US7161283B1 (en) * 2005-06-30 2007-01-09 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Method for placing metal contacts underneath FBAR resonators
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
US7544542B2 (en) * 2006-08-07 2009-06-09 Advanced Micro Devices, Inc. Reduction of damage to thermal interface material due to asymmetrical load
US7667324B2 (en) * 2006-10-31 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Systems, devices, components and methods for hermetically sealing electronic modules and packages
US20080231600A1 (en) 2007-03-23 2008-09-25 Smith George E Near-Normal Incidence Optical Mouse Illumination System with Prism
US9520856B2 (en) 2009-06-24 2016-12-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9099983B2 (en) 2011-02-28 2015-08-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator device comprising a bridge in an acoustic reflector
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US9667218B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising feedback circuit
US9154103B2 (en) 2012-01-30 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator
US9667220B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising heater and sense resistors
US9608592B2 (en) 2014-01-21 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic wave resonator (FBAR) having stress-relief
US9793874B2 (en) 2014-05-28 2017-10-17 Avago Technologies General Ip Singapore (Singapore) Pte. Ltd. Acoustic resonator with electrical interconnect disposed in underlying dielectric
CN111082768B (zh) * 2018-10-19 2023-10-27 天津大学 封装结构及具有其的半导体器件、具有半导体器件的电子设备
CN111245385B (zh) * 2019-12-04 2025-03-14 天津大学 芯片封装模块及封装方法及具有该模块的电子装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163510B1 (en) * 1984-05-28 1989-03-29 Koto Electric Co. Ltd. Hermetically sealable package for electronic component
US5821175A (en) * 1988-07-08 1998-10-13 Cauldron Limited Partnership Removal of surface contaminants by irradiation using various methods to achieve desired inert gas flow over treated surface
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5388443A (en) * 1993-06-24 1995-02-14 Manaka; Junji Atmosphere sensor and method for manufacturing the sensor
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
US6168948B1 (en) * 1995-06-29 2001-01-02 Affymetrix, Inc. Miniaturized genetic analysis systems and methods
JPH0969585A (ja) 1995-08-31 1997-03-11 Mitsubishi Electric Corp 電子部品搭載装置およびその気密封止方法
US6281573B1 (en) * 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6168947B1 (en) * 1999-02-11 2001-01-02 Food Industry Research And Development Institute Nematophagous fungus Esteya vermicola
AU2002214013A1 (en) 2000-10-11 2002-04-22 Telefonaktiebolager L M Ericsson (Publ) A method of making a gasket on a pcb and a pcb
DE60025214T2 (de) * 2000-10-19 2006-08-24 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Mikrodeckelgehäuse auf Scheibenebene
US6537892B2 (en) * 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
JP2003086355A (ja) 2001-09-05 2003-03-20 Kiko Kenji Kagi Kofun Yugenkoshi 有機ｅｌ素子の封止構造並びに封止方法及び封止装置
US6933537B2 (en) 2001-09-28 2005-08-23 Osram Opto Semiconductors Gmbh Sealing for OLED devices

Also Published As

Publication number Publication date
DE10325020B4 (de) 2007-10-31
GB0324538D0 (en) 2003-11-26
GB2396055B (en) 2006-06-14
US6919222B2 (en) 2005-07-19
US6836013B2 (en) 2004-12-28
GB2396055A (en) 2004-06-09
US20040077126A1 (en) 2004-04-22
US20040077127A1 (en) 2004-04-22
DE10325020A1 (de) 2004-05-13

Similar Documents

Publication Publication Date Title
JP2004146808A (ja) 半導体デバイスを封止する為の方法及びその方法を実現する為の装置
JP4768952B2 (ja) シリコンガスケットを含むウエハレベルパッケージおよびその製造方法
US5385869A (en) Semiconductor chip bonded to a substrate and method of making
EP1011133B1 (fr) Composant microélectronique CMS enrobé, notamment pour un dispositif médical implantable actif, et son procédé de fabrication
US7129576B2 (en) Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
US6664129B2 (en) Integrated circuits and methods for their fabrication
CN1091300C (zh) 芯片上的半导体器件封装及其制造方法
JP5768975B2 (ja) 接合部の構造及びその接合方法並びに電子部品
US6310421B2 (en) Surface acoustic wave device and method for fabricating the same
TWI484611B (zh) 箔片基底半導體封裝
JP2000183094A (ja) 半導体装置およびその製造方法
US7550314B2 (en) Patterned plasma treatment to improve distribution of underfill material
KR100314277B1 (ko) 웨이퍼 레벨 패키지
CA2075462C (en) Bump structure and method for bonding to a semi-conductor device
JP5021098B2 (ja) 半導体基板の接合方法およびｍｅｍｓデバイス
CN101421178A (zh) 用于制造电子组件的方法、电子组件、覆盖物和衬底
US7642642B2 (en) Microcap wafer bonding apparatus
US6572781B2 (en) Microelectronic packaging methods and components
KR100668809B1 (ko) 웨이퍼 레벨 패키지
JP5783601B2 (ja) 中空パッケージ
JP2002083906A (ja) 集積半導体のための支持マトリックス及びそれを製作する方法
JPH04348047A (ja) 半導体集積回路電極
JP2810551B2 (ja) 半導体パッケージ
JPS6018845Y2 (ja) Ｄｈｄガラス封止ダイオ−ド
TW202539980A (zh) 包封式微機電系統裝置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060913

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20070328

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20070409

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20070501