JP2004047722A - Icチップの製造方法 - Google Patents

Icチップの製造方法 Download PDF

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Publication number
JP2004047722A
JP2004047722A JP2002202990A JP2002202990A JP2004047722A JP 2004047722 A JP2004047722 A JP 2004047722A JP 2002202990 A JP2002202990 A JP 2002202990A JP 2002202990 A JP2002202990 A JP 2002202990A JP 2004047722 A JP2004047722 A JP 2004047722A
Authority
JP
Japan
Prior art keywords
wafer
double
pressure
adhesive tape
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002202990A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004047722A5 (enExample
Inventor
Munehiro Hatakei
畠井 宗宏
Masateru Fukuoka
福岡 正輝
Satoshi Hayashi
林 聡史
Shigeru Danjo
檀上 滋
Yasuhiko Oyama
大山 康彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002202990A priority Critical patent/JP2004047722A/ja
Publication of JP2004047722A publication Critical patent/JP2004047722A/ja
Publication of JP2004047722A5 publication Critical patent/JP2004047722A5/ja
Withdrawn legal-status Critical Current

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Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2002202990A 2002-07-11 2002-07-11 Icチップの製造方法 Withdrawn JP2004047722A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (ja) 2002-07-11 2002-07-11 Icチップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202990A JP2004047722A (ja) 2002-07-11 2002-07-11 Icチップの製造方法

Publications (2)

Publication Number Publication Date
JP2004047722A true JP2004047722A (ja) 2004-02-12
JP2004047722A5 JP2004047722A5 (enExample) 2005-02-17

Family

ID=31709016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002202990A Withdrawn JP2004047722A (ja) 2002-07-11 2002-07-11 Icチップの製造方法

Country Status (1)

Country Link
JP (1) JP2004047722A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082380A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd 表面保護テープの剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082380A (ja) * 2012-10-17 2014-05-08 Disco Abrasive Syst Ltd 表面保護テープの剥離方法

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