JP2004047653A5 - - Google Patents
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- Publication number
- JP2004047653A5 JP2004047653A5 JP2002202000A JP2002202000A JP2004047653A5 JP 2004047653 A5 JP2004047653 A5 JP 2004047653A5 JP 2002202000 A JP2002202000 A JP 2002202000A JP 2002202000 A JP2002202000 A JP 2002202000A JP 2004047653 A5 JP2004047653 A5 JP 2004047653A5
- Authority
- JP
- Japan
- Prior art keywords
- plasma processing
- mounting table
- processing apparatus
- substrate mounting
- electrostatic chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 35
- 239000007789 gas Substances 0.000 claims 8
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002202000A JP4033730B2 (ja) | 2002-07-10 | 2002-07-10 | プラズマ処理装置用基板載置台及びプラズマ処理装置及びプラズマ処理装置用の基台部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002202000A JP4033730B2 (ja) | 2002-07-10 | 2002-07-10 | プラズマ処理装置用基板載置台及びプラズマ処理装置及びプラズマ処理装置用の基台部 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004047653A JP2004047653A (ja) | 2004-02-12 |
| JP2004047653A5 true JP2004047653A5 (enrdf_load_stackoverflow) | 2005-10-27 |
| JP4033730B2 JP4033730B2 (ja) | 2008-01-16 |
Family
ID=31708310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002202000A Expired - Fee Related JP4033730B2 (ja) | 2002-07-10 | 2002-07-10 | プラズマ処理装置用基板載置台及びプラズマ処理装置及びプラズマ処理装置用の基台部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4033730B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US8491752B2 (en) | 2006-12-15 | 2013-07-23 | Tokyo Electron Limited | Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism |
| JP2009188332A (ja) | 2008-02-08 | 2009-08-20 | Tokyo Electron Ltd | プラズマ処理装置用基板載置台、プラズマ処理装置および絶縁皮膜の成膜方法 |
| JP5390846B2 (ja) | 2008-12-09 | 2014-01-15 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマクリーニング方法 |
| JP6080571B2 (ja) * | 2013-01-31 | 2017-02-15 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2018107264A (ja) * | 2016-12-26 | 2018-07-05 | 東京エレクトロン株式会社 | 消耗判定方法及びプラズマ処理装置 |
| JP7340938B2 (ja) * | 2019-02-25 | 2023-09-08 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
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2002
- 2002-07-10 JP JP2002202000A patent/JP4033730B2/ja not_active Expired - Fee Related