JP2003229408A5 - - Google Patents

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Publication number
JP2003229408A5
JP2003229408A5 JP2002027630A JP2002027630A JP2003229408A5 JP 2003229408 A5 JP2003229408 A5 JP 2003229408A5 JP 2002027630 A JP2002027630 A JP 2002027630A JP 2002027630 A JP2002027630 A JP 2002027630A JP 2003229408 A5 JP2003229408 A5 JP 2003229408A5
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JP
Japan
Prior art keywords
ring
processed
processing apparatus
flat surface
surface portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002027630A
Other languages
English (en)
Japanese (ja)
Other versions
JP4209618B2 (ja
JP2003229408A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002027630A external-priority patent/JP4209618B2/ja
Priority to JP2002027630A priority Critical patent/JP4209618B2/ja
Priority to AU2002366921A priority patent/AU2002366921A1/en
Priority to TW091135997A priority patent/TWI272877B/zh
Priority to PCT/JP2002/013016 priority patent/WO2003054947A1/ja
Priority to TW095107948A priority patent/TW200626020A/zh
Priority to US10/498,478 priority patent/US7882800B2/en
Publication of JP2003229408A publication Critical patent/JP2003229408A/ja
Publication of JP2003229408A5 publication Critical patent/JP2003229408A5/ja
Publication of JP4209618B2 publication Critical patent/JP4209618B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002027630A 2001-12-13 2002-02-05 プラズマ処理装置及びリング部材 Expired - Fee Related JP4209618B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材
TW095107948A TW200626020A (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processor using the ring mechanism
TW091135997A TWI272877B (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
PCT/JP2002/013016 WO2003054947A1 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
AU2002366921A AU2002366921A1 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism
US10/498,478 US7882800B2 (en) 2001-12-13 2002-12-12 Ring mechanism, and plasma processing device using the ring mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002027630A JP4209618B2 (ja) 2002-02-05 2002-02-05 プラズマ処理装置及びリング部材

Publications (3)

Publication Number Publication Date
JP2003229408A JP2003229408A (ja) 2003-08-15
JP2003229408A5 true JP2003229408A5 (enrdf_load_stackoverflow) 2005-07-14
JP4209618B2 JP4209618B2 (ja) 2009-01-14

Family

ID=27749086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002027630A Expired - Fee Related JP4209618B2 (ja) 2001-12-13 2002-02-05 プラズマ処理装置及びリング部材

Country Status (1)

Country Link
JP (1) JP4209618B2 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303099A (ja) 2004-04-14 2005-10-27 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
JP4670311B2 (ja) * 2004-10-28 2011-04-13 住友精密工業株式会社 ドライエッチング装置
US8382941B2 (en) 2008-09-15 2013-02-26 Micron Technology, Inc. Plasma reactor with adjustable plasma electrodes and associated methods
JP5398358B2 (ja) 2009-05-29 2014-01-29 三菱重工業株式会社 基板支持台の構造及びプラズマ処理装置
JP6085079B2 (ja) 2011-03-28 2017-02-22 東京エレクトロン株式会社 パターン形成方法、処理容器内の部材の温度制御方法、及び基板処理システム
JP2015005634A (ja) * 2013-06-21 2015-01-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
CN111180305A (zh) * 2013-06-26 2020-05-19 应用材料公司 在icp等离子体处理腔室中用于高产出、衬底极端边缘缺陷减少的单环设计
US20150001180A1 (en) * 2013-06-28 2015-01-01 Applied Materials, Inc. Process kit for edge critical dimension uniformity control
US20170002465A1 (en) 2015-06-30 2017-01-05 Lam Research Corporation Separation of Plasma Suppression and Wafer Edge to Improve Edge Film Thickness Uniformity
JP6966286B2 (ja) 2017-10-11 2021-11-10 東京エレクトロン株式会社 プラズマ処理装置、フォーカスリングの昇降制御方法およびフォーカスリングの昇降制御プログラム
WO2020081644A1 (en) * 2018-10-18 2020-04-23 Lam Research Corporation Lower plasma exclusion zone ring for bevel etcher
JP7541005B2 (ja) * 2018-12-03 2024-08-27 アプライド マテリアルズ インコーポレイテッド チャックとアーク放電に関する性能が改良された静電チャック設計
WO2020257095A1 (en) 2019-06-18 2020-12-24 Lam Research Corporation Reduced diameter carrier ring hardware for substrate processing systems
CN116469803B (zh) * 2023-04-17 2024-11-05 浙江海纳半导体股份有限公司 一种去边设备

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