JP2003533874A - パイプのブロック継手への接続 - Google Patents

パイプのブロック継手への接続

Info

Publication number
JP2003533874A
JP2003533874A JP2001581046A JP2001581046A JP2003533874A JP 2003533874 A JP2003533874 A JP 2003533874A JP 2001581046 A JP2001581046 A JP 2001581046A JP 2001581046 A JP2001581046 A JP 2001581046A JP 2003533874 A JP2003533874 A JP 2003533874A
Authority
JP
Japan
Prior art keywords
heat
channel
pipe
cross
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001581046A
Other languages
English (en)
Japanese (ja)
Inventor
チェ・エム・チュング
マーヴィン・エフ・ムーア
ロベルト・プロスペリ
Original Assignee
アアヴィッド・サーマロイ・エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アアヴィッド・サーマロイ・エルエルシー filed Critical アアヴィッド・サーマロイ・エルエルシー
Publication of JP2003533874A publication Critical patent/JP2003533874A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2001581046A 2000-05-04 2001-05-03 パイプのブロック継手への接続 Withdrawn JP2003533874A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20201100P 2000-05-04 2000-05-04
US60/202,011 2000-05-04
PCT/US2001/014609 WO2001084068A1 (en) 2000-05-04 2001-05-03 Channel connection for pipe to block joints

Publications (1)

Publication Number Publication Date
JP2003533874A true JP2003533874A (ja) 2003-11-11

Family

ID=22748199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001581046A Withdrawn JP2003533874A (ja) 2000-05-04 2001-05-03 パイプのブロック継手への接続

Country Status (5)

Country Link
EP (1) EP1281036A1 (de)
JP (1) JP2003533874A (de)
CN (1) CN1427941A (de)
TW (1) TW473608B (de)
WO (1) WO2001084068A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200032427A (ko) * 2018-09-18 2020-03-26 (주)하이텍영상 히트파이프 조립형 방열체 및 이를 이용한 히트싱크
JP2021525994A (ja) * 2018-07-09 2021-09-27 コノート、エレクトロニクス、リミテッドＣｏｎｎａｕｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｌｔｄ． 特定の熱放散装置を有する動力車両用のカメラ

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219300B (zh) * 2012-01-19 2016-01-20 升业科技股份有限公司 散热底板、薄型散热模组及其制造方法
CN103500734B (zh) * 2013-09-18 2016-06-08 张永亮 一种液冷绝缘式散热器
CN105636415A (zh) * 2016-03-08 2016-06-01 北京热刺激光技术有限责任公司 新型水冷散热板
WO2017152299A1 (zh) * 2016-03-08 2017-09-14 徐海军 水冷散热板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5960865A (en) * 1998-07-17 1999-10-05 Lucent Technologies Inc. Mounting bracket with integral heat sink capabilities

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021525994A (ja) * 2018-07-09 2021-09-27 コノート、エレクトロニクス、リミテッドＣｏｎｎａｕｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｌｔｄ． 特定の熱放散装置を有する動力車両用のカメラ
US11720002B2 (en) 2018-07-09 2023-08-08 Connaught Electronics Ltd. Camera for a motor vehicle with a specific heat dissipating device
KR20200032427A (ko) * 2018-09-18 2020-03-26 (주)하이텍영상 히트파이프 조립형 방열체 및 이를 이용한 히트싱크
KR102170252B1 (ko) 2018-09-18 2020-10-26 (주)하이텍영상 히트파이프 조립형 방열체 및 이를 이용한 히트싱크

Also Published As

Publication number Publication date
CN1427941A (zh) 2003-07-02
WO2001084068A1 (en) 2001-11-08
EP1281036A1 (de) 2003-02-05
TW473608B (en) 2002-01-21

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20080805