TW473608B - Channel connection for pipe to block joints - Google Patents

Channel connection for pipe to block joints Download PDF

Info

Publication number
TW473608B
TW473608B TW90110990A TW90110990A TW473608B TW 473608 B TW473608 B TW 473608B TW 90110990 A TW90110990 A TW 90110990A TW 90110990 A TW90110990 A TW 90110990A TW 473608 B TW473608 B TW 473608B
Authority
TW
Taiwan
Prior art keywords
channel
item
shape
section
scope
Prior art date
Application number
TW90110990A
Other languages
English (en)
Chinese (zh)
Inventor
Che M Cheung
Marvin F Moore
Roberto Prosperi
Original Assignee
Aavid Thermalloy Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy Llc filed Critical Aavid Thermalloy Llc
Application granted granted Critical
Publication of TW473608B publication Critical patent/TW473608B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW90110990A 2000-05-04 2001-06-15 Channel connection for pipe to block joints TW473608B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20201100P 2000-05-04 2000-05-04

Publications (1)

Publication Number Publication Date
TW473608B true TW473608B (en) 2002-01-21

Family

ID=22748199

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90110990A TW473608B (en) 2000-05-04 2001-06-15 Channel connection for pipe to block joints

Country Status (5)

Country Link
EP (1) EP1281036A1 (de)
JP (1) JP2003533874A (de)
CN (1) CN1427941A (de)
TW (1) TW473608B (de)
WO (1) WO2001084068A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219300B (zh) * 2012-01-19 2016-01-20 升业科技股份有限公司 散热底板、薄型散热模组及其制造方法
CN103500734B (zh) * 2013-09-18 2016-06-08 张永亮 一种液冷绝缘式散热器
WO2017152299A1 (zh) * 2016-03-08 2017-09-14 徐海军 水冷散热板
CN105636415A (zh) * 2016-03-08 2016-06-01 北京热刺激光技术有限责任公司 新型水冷散热板
DE102018116510A1 (de) 2018-07-09 2020-01-09 Connaught Electronics Ltd. Kamera für ein Kraftfahrzeug mit einer spezifischen Wärmeabführvorrichtung
KR102170252B1 (ko) * 2018-09-18 2020-10-26 (주)하이텍영상 히트파이프 조립형 방열체 및 이를 이용한 히트싱크

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5960865A (en) * 1998-07-17 1999-10-05 Lucent Technologies Inc. Mounting bracket with integral heat sink capabilities

Also Published As

Publication number Publication date
CN1427941A (zh) 2003-07-02
EP1281036A1 (de) 2003-02-05
JP2003533874A (ja) 2003-11-11
WO2001084068A1 (en) 2001-11-08

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees