TW510961B - Method of manufacturing heat pipe of heat dissipation plate - Google Patents

Abstract

This invention provides a method of manufacturing heat pipes of a heat dissipation plate, comprising the steps of: machining a heat dissipation plate to form a plurality of blind heat transfer passages; sealing the open ends of the heat transfer passages except for one open end; evacuating the passages and filling a working fluid through the last open end; and then sealing the last open end.

Description

510961 V. Description of the invention (1) [Field of the invention The present invention directly contacts and improves the heat conduction effect of a heat pipe. [Background of the invention Press, learners, please refer to a heat sink 1 for a method for manufacturing a heat pipe for a heat sink. In particular, it refers to those that are integrally formed in the heat sink, such as the manufacturing rate, excellent structural strength, and heat dissipation, and the structure tends to be simplified, shortened, and completed. 'A method person; the pole can be kept between poles to reduce the pole, yield rate to open the tube 3 1 tie the exhaust duct 3 to another, significantly more or one plant 3, please outside, the tube is placed in the front groove The openings and grooves of the 6 mouths are as described above, must be extremely high, the heat must be less, and the second one is to use the first picture and a plate groove 1 2 Refer to the inside and note the planting 1, the hot plate 1 6 One can know how to do it, but it is necessary to troubleshoot the problem. The tube 3, the heat pipe with a gap, and the body 6 are shown in the mouth. The picture has a slot 1 to place it; and the way is due to the hot plate. And, its •, the plate body A works in 2 thermal energy, and each, although the heat energy is shown in Figure 6, the fluid, and the heat from the plate heat pipe can be quickly transmitted to an aluminum plate 7 fins oblique The inner wall 3 2 is broken; at the end, the front body 6 is covered with 3 and a plant paste or tin on top of the heat radiation plate to dissipate heat, and a 1 1 heat radiation plate 1 is fixed to the groove 6 1. The capillary structure is provided with a recessed mold and one end of the heat pipe 3 is bent to quickly set a groove paste 3 3, 6 2. It is transferred from the 3 end of the heat pipe, and then embedded in the conduction to the adjacent 12 rooms, and the heat sink 1 is provided with a planting groove 1 2, and the heat pipe heat sink 1 is inserted separately. The two are inevitable or affect the heat. Conducted to giant; tube 3 is easy to be damaged in manufacturing, so there are many defective products,

Page 4 510961 V. Description of the invention (2) Causes waste; 4. Causes the wool inside the tube 5. Aluminum and tin material, so the thermal expansion and expansion caused by the solder paste in the system affects the heat conduction 7. The tube 3 breaks Can destroy the heat dissipation plate; Eight, the heat dissipation speed from the exhaust air outlet, please refer to the conventional knowledge of heat, and the plate type, the lower plate, the upper plate, the lower plate in the upper plate type container 2 inner device 2 The lower plate is on the conventional fine structure plate 7 The heat conduction is on the heat pipe 3 3 ^ Shrinking effect, but also makes the knowledge independent and cannot be 1, It is on the cost of the hot plate 1, distracting the first, second, and second container 2 The 2 2 piece 2 1 2 1 The heat pipe 3 with the piece 2 2 inside must be damaged as shown in 3 1 in the figure; it is a Ming material. The heat pipe 3 has three different media 3 and the plate 6 and the heat 6 2 ^ Therefore, it is easy to operate under the machine, which causes the life of each of them to be reduced. The heat pipe 3 of this type is easy to maintain the vacuum state, and the heat energy cannot be bent as shown by the divergence, so it is easy to be a copper material. Quality, which affects the heat transfer efficiency; the gap between the tube 3 and the heat sink 1 Factors can resist heat but also difficult to re-transmission of thermal conductivity, causing heat to be dissipated between the two limits of the efficiency is the body shown in FIG. The picture system includes the outer surface, the 2 2 surface is the capillary knot inner surface, right, the roots are opposite, and the system contains a contact with the structure to be connected. It should not be used in the heat. Combining a plurality of 2 1 sets the source up. Plate type hot plate 2 1 4 connected to form 6 and adjacent to the heat pipe 3 to add

The plate body has multiple containers 2 to accelerate the dispersion 1 and the plate-shaped container 2 and the lower plate 2 2 to transfer heat and close the space, and 1; and the plate and the plate-shaped plate-shaped container 2 are in close contact with each other. 2 1 One side is connected to the other side

Page 5 510961 V. Description of the invention (3) The upper plate 2 and the real heating body 4 produced in the device 2 are still produced as a combination. Therefore, the plates 2 and 2 have the process and the pumping contact, and the heat conduction is smooth. When the upper and lower plates are empty, the heat transfer efficiency of the upper plate and the upper plate will be increased. In addition, there are still two inevitable heat patterns in the inner surface of the upper surface. There are still two vacuum efficiency conferences. There are two shadows. 1. One or more or more will be able to pass on the convex surface. It is necessary that Yu Yizhi be affected at that time. 2 2 The lower part is caused by 2 bulges. 2 The work flow is guided to the board because it is in the middle of the board. The thermal efficiency of the lid is generated by twisting the upper and lower phases of the couple 11 and 1 1 joints (picture container-type container soldering, let alone its way, for no reason whatsoever, the relative buckling, change, and forced merger). The final contact is not shown; 2, 2 and the pressing plate are not shown, so the method is not the same as the two thermal resistances; the drawing of the lower plate affects the other), and even the welding container such as heat dissipation must have a thin sheet 2 between the heat source and the vacuum. The plate is shaped to dissipate the heat dissipation plate 1. The connection between the plates 1 is based on how the upper and lower plates are easy to combine and maintain the flatness of the system: and because of this, it draws true strength, which damages the two conventional structures that were originally expected. It has the following defects: The major tube 3 mentioned above will be generated, for example, it will fail as shown in the central two figure, so that it will all exist without loss: if there is a crack and the air leak processor, etc.), it comes from In the case of heat dissipating and bumping or falling, it will occur when the structure not shown in the figure is' heated, and then it will fail, causing the heat to be dissipated (not shown in the figure will be burned due to heat conduction interruption; if The second plate-shaped container 2 will generate cracks and leak air, and enter the heat energy of the body 4 (such as a central processing unit).

Page 6 510961 V. Description of the invention (4) Although it is still possible to lose both the pre-plate container 2 and the cost, the three are greatly improved. However, after the first three, the fundamental matrix arrangement has four major drawbacks besides the necessary reasons. Two, three, and three can be too thick and do not shrink. The regrets such as the above are missing. After several methods, you can make a method to eliminate a large amount of energy. [The most popular two types of the effect of the plate shape capacity of the purpose of the invention are not as shown in the figure. —— 2 12 can be too thin to cause the study of the above-mentioned studies to create a product that can be used to reduce production.] The device 2 is used to guide people who know the current rail tube, / ,, and p. When it is transferred to the heat sink 1, the thermal efficiency will be delayed and the thermal mode will be slower. The structure is too complex for commercial use. The arrangement is that the heat sink 1 is inserted into another heat pipe vertically in one direction. Although the one shown in the figure may constitute each of the protrusions 2 1 1, 1 1 has a high possibility, so its vertical The conventional structural systems that can form a matrix-type second picture must exist (or heat-dissipating paste), and the solder paste is rather cumbersome to apply; even the back gap is increased, cracked, and the life is reduced, the invention is invented In order to complete the hair, finally, a kind of heat sink plate process that is completely unacceptable and missing has been developed to improve the production yield. In addition, the plate-type container 2 is not as troublesome and has trouble inserting heat pipes on the matrix type. It cannot form a matrix type, but the matrix formation will be as forefront, and it will still have solder paste. The heat sink paste will not completely exclude these special manufacturers due to thermal expansion and low cooling and high thermal resistance, and it is extremely beneficial to use this. industry

Page 7 510961 V. Description of the invention (5) The method of the present invention is mainly directly formed with the following features: integrated structure, heat pipe structure is not easy to twist, touch, and easy to construct the most effective when heat conduction. The invention is light, thin, and method-making. According to the present invention, the thermal efficiency can be achieved by connecting various types of heat-radiating plates. According to the present invention, since it is a heat dissipation module that is widely used by cocoa, the process is as a heat conduction channel in order to achieve the above method. The first object is to provide a heat dissipation plate that is attached to a heat dissipation plate.取代 It can replace the conventional method with no gaps and no thermal resistance, and the heat conduction efficiency is greatly improved. Even if the shape is even broken, it is the same as the medium between the heat sinks. The purpose is to provide a low cost and short processing time. The third purpose is also to provide a heat dissipation plate formed or provided with a finned plate. The application of this heat dissipation plate has a heat pipe function, which greatly increases the fourth purpose. The invention also provides a heat-dissipating type system, and produces various changes, and the purpose of combining the present invention with various types of electronic heat-dissipating systems. The present invention provides a method for manufacturing a heat-dissipating plate and each heat-conducting channel Except the protector 0, the processing process leaves at least the heat dissipation plate heat pipe manufacturing process and is integrally formed into a vertical heat pipe, which is also extremely high, installed with no numbness or pumping. Yiji can maintain a very flat joint paste or heat dissipation paste, and a lot of other functions: heat dissipation plate with high yield and weight, heat control plate, heat pipe manufacturing method or fin, can be made directly, so that all kinds of heat sinks Due to the characteristics of the heat pipe in the manufacturing method of the scattered plate heat pipe, it can be responded to the different end of the manufacture of various heat plate heat pipes without passing through an open end.

Page 8 510961 V. Description of the invention (6) It is all sealed; the open end reserved by it shall be filled with working fluid and evacuated at the same time, and then sealed. In addition, a capillary structure may be implanted in each of the heat conducting channels before the other open ends are sealed. In order to enable your reviewers to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention; however, the drawings are provided for reference and description only, and are not intended to limit the present invention. [Embodiment] Please refer to the third figure and cooperate with the fourth and fifth figures to show that the present invention is a method for manufacturing a heat pipe for a heat sink, which mainly includes the following processes: The three processes are at least due to the welding of the external phase to seal the external phases that are communicated with each other. The first process: first, a heat sink 5 should be manufactured to an appropriate size and shape for different heat dissipation designs. Addition processing Hot plate process: The heat dissipation plate 5 is further applied to generate a heat conduction channel 5 1: and it is necessary that the heat conduction channel 51 is not penetrated at the other end. It can be drilled, discharged, waterjet, etc., and it does not penetrate to the loose. Avoid to avoid. It must be staggered. End and process: Seal the open end of each heat conduction channel 51, and open the end. Each of the open ends is sealed, and in order to generate deformation and ensure the tightness of the heat conduction channel 51, it can be installed in a manner of complete tightness by diffusion bonding or the like. After the sealing is completed in this way, each of the opened vertical and horizontal matrix-shaped heat conduction channels 5 1 is opened only by the reserved opening. 0

Page 9 510961 V. Description of the invention (7) The fourth production fluid 5 3 See also the fourth hot aisle 5 1 The fluid and pumping are sealed once after one execution.俾 Make the process: through and vacuum, the five figure system can communicate with each other; and the evacuation system can be the same with the open end reserved, and then the open end does not 'use the reserved state, so filling the workflow vacuum It only needs to be carried out at one time, and it can be maintained for 3 hours due to the integrated tube and integrated structure of the heat sink 5, so the process of 1 is placed 5 3 overheating can be formed in addition to the film can be formed and surface holding Extremely flat, as these are also greatly arranged in the same way as above, and arranged in a square radial row, which can be evaporated, copper, aluminum is a plate or fin, a thermal contact effect that distorts and deforms the heat dissipation plate, and only needs to reduce the number of executions. , To implement the boundaries of the process. Formula, which can be listed and communicated with each other as water, ammonia or cold reduction or other external, or 1 1 (such as the excellent rate of 5, within, structure; also in the insured is necessarily determined by the capital, for example, for Matrix ... The characteristics of equal rows and pure water are better. The heat dissipation in the sixth pattern is better. Therefore, the drawdown of the pumping strength must be reduced. The drastic reduction is not used. (Shown in hot plate 5) The matrix plate has good thermal vacuum, and the vacuum heat flux is low. To limit the processing (such as can, C. The surface of the material is 0, and the filler is sealed at the same time. Please match the open end and each of the conductors 5 to 3, only need to fill the vacuum. Later, the heat pipes are arranged and communicated with each other simultaneously. Because of the heat pipe system, it can be manufactured with the heat sink or the working fluid at the outer end 5 to 51, which is extremely simple and easy to manufacture. Can be formed into the heat conduction channel 5 as shown in the fourth figure), or. Among them, the working fluid, such as ketone or refrigerant, has a heat sink 5 in the system. The heat sink 5 is formed or provided with various heat conduction channels 5 therein.

Page 10 510961 V. Description of the invention (8) 1, the cross section can be circular (as shown in the fifth figure), oval, triangle, rectangle, thread, polygon or cone. Furthermore, it can be further performed between the second and third processes: before the other open ends are sealed, a process of implanting a capillary structure 5 2 in each of the heat conduction channels 51 is performed; and the capillary structure 5 2 It can be a metal spring-like, groove-like, column-like, mesh-like, or porous structure formed by sintered metal powder. Most ribs are integrated. The heat-dissipating plate described by others can be a plate 5 as shown in the fourth and fifth figures, or can be a heat-dissipating plate with a type 1 1 formed on the surface as shown in the sixth figure. One, so that a plurality of thermally conductive channels that are crisscrossed and arranged in a matrix arrangement are also formed inside the heat dissipation plates 1. Each of the heat conduction channels 1 3 is also filled with a working fluid 1 3 2 or replanted with a capillary structure 1 3 1 The outer end of each heat conduction channel 1 3 is roughly formed as a sealing edge 1 3 3 as shown in the figure. In this way, with the effect of extremely high thermal conductivity, interface thermal resistance can be avoided. The above-mentioned fins 11 are formed, and of course, a plurality of fins can also be provided on the surface; and the fins and fins can be swirling or scattering. Please refer to the seventh figure, which is based on The invention is a schematic diagram of an embodiment for improving the conventional structure with many defects as shown in the first figure. As shown in the figure, in order to cope with the general heat dissipation plate 1 and the body 4 to be cooled due to inherent limitations, they must be staggered and not on the same straight line, so a heat dissipation plate 5 with a corresponding turning shape and size is manufactured; the heat dissipation plate 5 is processed The thermally conductive channels 5 1 that are not penetrated at the ends of the vertical and horizontal crossings are of course also shown in the seventh figure.

Page 11 510961 V. Description of the invention (9) The position of the fork is to enable the fluid conduction of each group, or (not shown), the heat radiation plate 5 of the heat radiation plate 5 is extremely efficient for the body to be dissipated in the first picture. The multiple effects of one structure are never effective. The second series has only one type of heat and is not affected by the three pastes. Therefore, it never has fins or the thermal resistance effect of the interface where the thermal paste is applied. 4 5 1 When welding, the interior is crossed, and the hot aisle 5 and the capillaries are in the function tube. Make this end and a 4, except, such as, cause, its gp effect, the guide will also be extinct, and the work of the other side, because the other position is not 1 and communicate with the structure, vacuum In addition, the heat dissipation plate 5 is fixed like a fixed heat dissipation plate 1 and connected to both ends of the heat dissipation plate 1 to perform a pole structure. In addition to the structure, the heat conduction channel is drilled, and it is also hot. Of course, it also has a working and sealing structure (the seventh figure is equivalent to The fourth and fifth pictures are exposed on the aluminum plate 7 and the contact is made, and the other end is correspondingly exposed to high-efficiency heat conduction. Compared with the simplified and improved yield, the heat-dissipation diagram has the same effect. It also has the following from the fourth to the sixth: The hot aisle 5 1 does not need to be bent at all, and the capillary junction inside it destroys the thermal energy. 7L · 〇 The heat flux due to heat gain 敎 i 4 \\\ is even more effective. The structure and surface of the transmission medium, all belong to the heat dissipation channel 51 and the heat shrinkable cold shrinkage of the existence of resistance; if you can avoid the need to combine the heat sink is no longer a variety of different media and board 5 the same medium, guide There is no need for tin between plates 5 to affect heat conduction In the case of one step, the heat dissipation plate 5 is soldered, pressed, welded, 1 and the flat plate heat pipe 5 is integrated to open a structure with a strong heat conduction channel, which can indeed resist the surface due to vacuum. The ability to distort and deform

Page 12 510961 Flattened into a shape of influence, even if the track is traced, its fast and final system is based on the thermal conduction type of the thermal invention (radiated connection type is very careless, but the heat caused by the leak itself) The destruction method is made by the higher tube 3, which is made with efficiency or dislocation. The structure is such that it will damage the ribs (collision or will never and then still have a bad transmission rate. The completed thermal equilibrium and the plant are scattered. The advantages of heat dissipation are in any of its categories.) The method of heat treatment can be widely used as a heat sink module, which has the advantages of light weight, thin thickness, and so on. V. Description of the invention (Keeping between the heat sink and the body to be cooled) Extremely effective 5. Because of its external force, it will not be effective at all. The embodiment of the heat sink of the present invention is sufficient. The internal thermal conduction resistance factor causes the cracked heat channel to be ineffective, but it is no longer completely complete. Can no longer dissipate heat and have seven effects. By using this hair, it has the highest heat conduction efficiency and has eight effects. The habit will be missing. It can also be a matrix heat pipe arrangement, for example, it is extremely difficult to achieve. Efficacy ten, taking advantage of the characteristics of this type of heat pipe, the system can be adapted to various types, and has low cost, weight, and high heat conduction efficiency. Therefore, it is evacuating or suffering and the internal structure. As shown in Figure 6) or falling, it also generates cracks due to structural strength; even if there is no failure, it is only a heat sink for heat dissipation. It is not as familiar as the heat sink heat pipe, which can form a matrix arrangement. A hot plate heat pipe forming a gap between the grooves 12. The plate heat pipe has a simple structure; and the manufactured heat dissipation plate has a pipe structure with the same heat transfer rate. It has a high yield rate by combining the present invention with various changes in the conventional technology and its use in various electronic heat dissipation systems. Short processing time

Page 13 510961 V. Description of the invention (π) In summary, the present invention is a rare new invention, which has great industrial applicability and novelty. It can also improve the conventional manufacturing, which is extremely troublesome and extremely structured. Complexity, heat conduction efficiency has not been improved, and it is even more fragile, breakable, vulnerable, etc., and it can even maintain a very flat contact with the body to be cooled. Requirements for the application for invention patents 'Applications made in accordance with the Patent Law' Please check and approve the patents in this case in order to protect the rights of the inventors. However, the above are only the preferred and feasible embodiments of the present invention, and the patent scope of the present invention is not limited by this. Therefore, all equivalent changes made by using the description and drawings of the present invention are included in the present invention in the same way. Within the range, ® is combined with Chen Ming.

Page 14 510961 Brief description of the diagram The first diagram is a perspective view of a conventional structure using a heat pipe to accelerate heat dissipation. The first figure A is a sectional view of the heat pipe according to the first figure. The second diagram is a cross-sectional view of a conventional structure using a plate-type container to accelerate heat dissipation. The third diagram is a schematic diagram of a process of the present invention. The fourth figure is a schematic plan view of a heat sink completed by the process of the present invention. The fifth figure is a partial cross-sectional view of the present invention based on the fourth figure. The sixth figure is a cross-sectional view of an embodiment of the present invention. The seventh diagram is a schematic plan view of another embodiment of the present invention. Explanation of Symbols [Knowledge] 112 22 11 2 2 33 24 66 2 7 Radiating plate planting groove plate type container convex lower plate heat pipe working fluid to be radiator body plate solder paste aluminum plate 222 6 1 rib plate paste Capillary structure Capillary structure solder paste groove

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Claims (1)

510961 VI. Application Patent Scope 1. A method for manufacturing a heat pipe for a heat sink, which mainly processes a plurality of heat conduction channels that are not penetrated at the ends of a heat sink, and each of the heat conduction channels is sealed except that at least one open end is retained. ; Fill the working fluid from the reserved open end, and vacuum and seal at the same time. 2. The manufacturing method of the heat sink and heat pipe as described in item 1 of the scope of the patent application, wherein the processed heat conduction channels are arranged in a matrix type, or arranged in a radial arrangement. 3. The manufacturing method of the heat-dissipating plate heat pipe as described in item 1 of the scope of the patent application, wherein the working fluid is a solution with superheated evaporation and reduction in cold when it is water, ammonia, pure water, alcohol, acetone or refrigerant. By. 4. The method for manufacturing a heat sink and heat pipe as described in item 1 of the scope of patent application, which can further implant a capillary structure in each of the heat conduction channels before sealing the other open ends. 5. The method for manufacturing a heat sink heat pipe as described in item 4 of the scope of the patent application, wherein the capillary structure is a metal spring shape, a groove shape, a column shape, a mesh shape, or a sintered metal powder. Porous structure, etc. 6. The method for manufacturing a heat sink and heat pipe as described in item 1 of the scope of the patent application, wherein the heat sink may be copper, aluminum, or other materials with better thermal conductivity. 7. The method for manufacturing a heat pipe for a heat sink as described in item 1 of the scope of patent application, wherein the cross section of the heat conduction channel can be circular, oval, triangular, rectangular, screw-shaped, polygonal, or pyramidal. . 8. The method for manufacturing a heat sink and heat pipe as described in item 1 of the scope of patent application, wherein the method of sealing other open ends may be welding or Page 17 510961 VI. Scope of patent application Those who need to achieve complete sealing by diffusion bonding, etc., are necessary packaging methods. · 9. The method for manufacturing a heat-dissipating heat pipe as described in item 1 of the scope of patent application, wherein the heat-dissipating plate may be a plate type, or may be a plate having ribs or fins formed on the surface of the heat-dissipating plate. Type person. 10. A method for manufacturing a heat pipe for a heat sink includes the following processes: The first process: a heat sink is manufactured to an appropriate size and shape according to different heat dissipation designs; the second process: the heat sink is subjected to heat conduction. The processing method of the channel; and the heat conduction channel is necessary for the other end not to pass through; the third process: the open end of each heat conduction channel is sealed, and at least one open end must be kept; the fourth process: the reserved The open end is filled with working fluid, and vacuuming and sealing are performed at the same time. 11. The manufacturing method of a heat sink heat pipe as described in item 10 of the scope of patent application, which can further include a process of implanting a capillary structure in each of the heat conduction channels between the second and third processes. Participate Page 18