JP2003533874A - Connecting pipes to block fittings - Google Patents

Abstract

(57) Abstract: A heat plate (410) having a heat pipe (405) disposed in a channel (401) with a slot (450) is provided.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD OF THE INVENTION

The present invention relates to heat dissipation devices, and more particularly to connecting such devices to a heat source.

[0002]

[Prior Art and Problems to be Solved by the Invention]

A heat sink is a device that is widely used to dissipate or, in some cases, absorb heat from an object such as a mechanical device or computer device that needs to be kept cool. One type of heat sink comprises a block of heat conducting material with tunnels or through holes, i.e. a vapor deposition plate. A heat dissipating pipe (heat pipe) is inserted through this tunnel to absorb and dissipate the heat conducted to the heat pipe through the heat conductive material surrounding the heat plate. The heat plate is attached to an object that requires cooling, such as the cabinet wall of a computer or the IC mount of a laptop computer. An example of this type of heat sink is shown in Figure 1.
It was shown to. The tunnel 101 is pierced through the heat plate 110, so that the heat pipe 105 is held in the tunnel 101. In order to achieve maximum efficiency with this type of heat sink, there must be maximum coupling area between the heat pipe surface and the inner wall or surface area of the tunnel. Most heat sinks of this type use an adhesive material to bond the heat pipe to the inner wall of the tunnel (103 in Figure 1).

During assembly of the heat sink, this adhesive material 103 is first inserted to cover the walls of the tunnel. However, subsequent insertion of the heat pipe 105 will result in the insertion of the heat pipe pushing some of the adhesive material and thinning the adhesive material at the desired bond area. Several solutions to this problem have been proposed in the field-.

One solution, shown respectively in the perspective and cross-sectional views of FIGS. 2A and 2B, is, unlike the closed tunnel 101, an open channel 210 having a diameter substantially equal to the diameter of the heat pipe 205. It is the heat plate 210 on which is formed.
This results in a "semi-open" structure. Adhesive 203 during assembly
Can be applied directly to the channel 201 so that the pipe 205 can be positioned within the channel 201 without pushing the adhesive 203 away. The disadvantage of this method is that a significant portion of the surface area 208 will not contact the heat plate. The heat transfer thus obtained is less than the optimum heat transfer.

Another solution proposed in US Pat. No. 5,826,645 to Meyer, IV et al. Is shown in perspective and cross-sectional views, respectively, in FIGS. 3A and 3B. In this disclosure, heat pipe 305 is held in place by two stretch tabs 320 and 321. At the beginning of manufacturing the heat plate 310, the stretching tab 320
And 321 are upright with respect to the surface of the heat sink as shown in FIG. 3B. The stretch tabs 320 and 321 are then bent downward to contact the heat pipe 305 to hold it in place as shown in FIG. 3A. Filling material 326, which may be a thermally conductive adhesive, solder paste or lubricant, fills the area between heat pipe 305 and draw tabs 320 and 321. There are several challenges with this solution. First, it requires extra manufacturing and assembly steps to make and bend the stretch tabs.
Second, the edges of the draw tabs can crush the sides of the heat pipe when pressed against the sides of the heat pipe. Third, large volumes of filler material located on either side of the heat pipe are ineffective and uneconomical.

Therefore, there is a need for a heat sink assembly that can effectively hold a heat pipe in place while providing effective conduction of heat between the conductive material and the heat pipe.

[0007]

[Means for Solving the Problems]

One object of the present invention is to effectively hold the heat pipe in place, while
It is to provide a heat sink assembly that provides effective conduction of heat between the conductive material and the heat pipe.

Another object of the present invention is to provide a heat sink assembly within which an adhesive material economically and effectively connects the heat pipe to the inner surface of the heat plate.

Yet another object of the present invention is to provide a heat sink assembly in which an adhesive material is easily applied and penetrated between the heat pipe and the inner surface of the heat plate.

These and other objects are achieved by the present invention. The present invention is directed to a heat sink assembly having a heat block that constrains a heat pipe in an oval or circular cross-section channel with a transverse slot open to the surface. This allows for easier and more effective application of the adhesive material and more effective heat transfer.

The present invention is also directed to a method of constructing a heat transfer assembly. This method consists of forming channels in the heat plate, forming slots on the surface of the heat plate along the length of the channel, inserting a heat pipe into the channel, and heating the channel and heat. Disposing a thermally conductive adhesive material in the gap through the slots between the pipes.

Other objects and features of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings. It should be understood, however, that the drawings are designed for purposes of illustration only and not as defining the scope of the invention. For the scope of the invention, reference should be made to the appended claims. The drawings are not necessarily drawn to scale and, unless otherwise indicated, the drawings are only intended to conceptually describe the structures and procedures described herein. .

[0013]

DETAILED DESCRIPTION OF THE INVENTION

A preferred embodiment of the present invention comprises a block (ie, heat plate) 410 of thermally conductive material. The heat plate has perforated or milled tunnels or channels 401. A transverse slot 450 is formed on the surface of the heat plate above the channel 401. Channels 401 and / or slots 405 may be formed by molding methods, punching techniques, or other machining techniques known in the art.
The diameter of the channel is larger than the width of the transverse slot 450 and the heat pipe 4
While sized to receive 05, this channel incorporates a thermally conductive adhesive material 403 to bond the heat pipe 405 to the channel wall of the heat plate 410, as described in more detail below. It creates an additional space that can be applied to.

A thermally conductive adhesive or binder 403 is used to thermally couple the heat pipe 405 to the channel 401. This is accomplished by applying an adhesive or binder 403 through slot 450 into the gap 407 defined between heat pipe 405 and channel 401. If the binder 403 is a solder paste of a thermally conductive adhesive, this solder paste will be slot 4
It may be applied via 50 to the top of the channel 401. The heat sink assembly is then heated, causing the solder to flow down along the sides of the pipe 405. Filling the gap 407 with solder flowing between the sides of the heat pipe 405 and all or substantially all of the contact area between the heat pipe 405 and the walls of the channel 401 results in highly efficient thermal contact.

In another embodiment, the thermally conductive adhesive 403 can be a preform or paste applied to the gap 407. The adhesive may be applied to the gap 407 before or after placing the pipe 405 in the channel 401, or by placing the pipe 405 in place and then applying pressure directly from the slot 450 into the gap 407. obtain. These preforms or pastes may be heated by heating the heatsink assembly to allow the preforms to flow, such as the solder described above, or by heating the assembly after applying the paste or preforms. Cures in the gap 407.

As shown in FIGS. 4A and 4B and described below, a transverse slot 450 is formed along the length of the channel 401 to access the channel 401. The heat pipe 405 is surrounded by the channel 401 almost all around. In this way it is ensured that the heat pipe 405 is properly confined by and contained within the wall of the channel. More specifically, the transverse slot 450 has a width "a" that is less than the diameter "b" of the channel 401. Thus, when the heat pipe 405 is placed in the channel 401, the dimensions of the transverse slot 450 prevent the pipe 405 from leaving in a direction perpendicular to the length of the channel 401. As mentioned above, the transverse slots 450 may be formed by molding methods, punching techniques, or other machining techniques known in the art.

Although the heat pipe 405 is preferably substantially circular in cross section, the channel 401 of the preferred embodiment has a slightly oval cross section. This slightly oval cross section ensures that the bonding material can be effectively inserted through the transverse slots 450. In other embodiments, both cross sections of the heat pipe 405 and the channel 401 can take various closed curve shapes from circular to elliptical and oval.

Regardless of which curvilinear shape is used for the heat pipes and tunnels, according to a preferred embodiment of the present invention, there is a suitable gap between the heat pipes and the walls of the tunnel to maximize heat transfer. Good interface dimensions are maintained. In other words, the larger the surface area of the heat pipe, the more it will interface with the heat plate through the walls of the tunnel. The channels surround the entire perimeter of the cross section of the heat pipe, thus increasing the pipe surface area that joins between the heat pipe 405 and the plate 410. Therefore, this increase in pipe surface area guarantees maximum heat transfer.

The transverse slots 450 facilitate the application of adhesive 403 along the top and sides of the heat pipe exposed within the openings of the channels. A suitable adhesive is
It may be an epoxy or solder paste, or other material known to those of ordinary skill in the art having suitable heat transfer properties for thermally bonding and bonding the pipe 405 to the plate 410. In the presently preferred embodiment, the gap 407 is defined between the outer surface of the heat pipe and the wall of the channel. Within this gap, solder or epoxy is applied in a known manner to provide optimum penetration between these outer surfaces and walls, such as when heating the assembly to allow the solder to flow. Thus, the effective penetration of the solder or epoxy covers the entire surface of the heat pipe enclosed within the channel gap.

Optimal heat transfer occurs when the solder or adhesive 403 completely fills the gap 407 at the interface between the heat pipe and the heat plate. The most effective thermal bond occurs when all the air in the gap is removed and replaced with adhesive. According to the inventive channel configuration with respect to FIGS. 4A and 4B, the solder or adhesive penetrates until it fills or nearly fills the heat plate-heat pipe interface.

Therefore, the heat sink assembly according to the present invention can effectively hold the heat pipe in place while providing more effective heat transfer between the heat plate and the heat pipe. Furthermore, the bonding material of the heat sink assembly according to the present invention is easily applied through the slots 450 and spreads (penetrates) between the heat pipes on the inner surface of the channels. This provides an economical and more effective heat transfer connection.

The main novel features of the present invention are shown and described as applied to its preferred embodiments,
And, as noted, various omissions, substitutions, and changes in the form and details of the apparatus described and shown can be carried out by those skilled in the art without departing from the scope of the invention. All combinations of these elements and / or method steps that perform substantially the same function in substantially the same manner to achieve the same result are explicitly intended to be within the scope of the present invention. ing. Furthermore, the steps of the structure and / or method shown and / or described with respect to any disclosed form or embodiment of the invention may refer to any other disclosed or described or suggested form, or general design matter. It should be noted that it can be applied as a matter of. Accordingly, the invention is limited only by the claims.

[Brief description of drawings]

FIG. 1 is a perspective view of a conventional heat sink having a through hole.

2A is a perspective view of a half open heat sink according to the prior art. FIG. Is.

FIG. 2B is a cross-sectional view of a half open heat sink according to the prior art.

FIG. 3A is a perspective view of a tabbed heat sink according to the prior art.

FIG. 3B is a cross-sectional view of a heat sink with a tab according to the prior art.

FIG. 4A is a perspective view of a preferred embodiment of the present invention.

FIG. 4B is a cross-sectional view of the preferred embodiment of the present invention.

[Explanation of symbols]

  401 ... Channel   403 ... Adhesive   405 ... Heat pipe   407 ... Gap   410 ... Thermally conductive material (heat plate)   450 ... slot

[Procedure amendment]

[Submission date] November 25, 2002 (2002.1.15)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Contents of correction]

[Claims]

─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Roberto Prospéry             United States, Texas, 78727, Oh             Stin Kapatella Trace 5700             # 718 F-term (reference) 5E322 AA01 AA11 AB06 DB10                 5F036 AA01 BA08 BA23 BB01 BC05

Claims (13)

[Claims] 1. A heat comprising a channel having a cross section and defined by a channel wall, a slot formed in a surface, the slot extending into the channel substantially along a length of the channel. A heat pipe having a plate, an outer surface and a cross section, the heat pipe sized to be received within the channel such that a gap is formed between the outer surface and the wall of the channel, A heat pipe having a cross section larger than the width of the slot to prevent the heat pipe from being disengaged from the channel when moving at a right angle to the heat plate; And an adhesive material that provides a thermal bond between the heat pipe and the heat plate. 2. The heat transfer assembly of claim 1, wherein the cross section of the channel is one of a substantially circular shape, a substantially oval shape, and a substantially oval shape. 3. The heat transfer assembly of claim 1, wherein the cross section of the pipe is one of a substantially circular shape, a substantially oval shape, and a substantially oval shape. 4. The heat transfer assembly according to claim 2, wherein the cross section of the pipe is one of a substantially circular shape, a substantially elliptical shape, and a substantially oval shape. 5. The heat transfer assembly according to claim 1, wherein the adhesive material is one of a solder paste, a solder epoxy, and an adhesive. 6. The heat transfer assembly according to claim 1, wherein the adhesive material substantially fills the gap. 7. Forming a heat plate having a surface, forming a channel having a cross section and a length in the heat plate, and forming a surface of the heat plate substantially along the length of the channel. Forming a slot having a width less than the cross section of the channel and extending into the channel through the surface of the heat plate to permit access to the channel; Inserting a heat pipe sized to form a gap with the constituent walls into the channel along at least a portion of the length of the channel; and thermally coupling the pipe to the heat plate. And disposing a thermally conductive adhesive material within the gap by accessing the gap through the slot. How to configure the guide assembly. 8. A heat transfer assembly comprising the method of claim 7, wherein the heat transfer assembly is heated to cause the heat conductive adhesive material to flow into the gap to substantially fill the gap. Three-dimensional. 9. The heat transfer method of claim 7, wherein the cross section of the channel is one of a substantially circular shape, a substantially oval shape, and a substantially oval shape. Assembly. 10. The heat transfer method of claim 7, wherein the cross section of the pipe is one of a substantially circular shape, a substantially oval shape, and a substantially oval shape. Assembly. 11. The heat transfer method of claim 9, wherein the cross section of the pipe is one of a substantially circular shape, a substantially elliptical shape, and a substantially oval shape. Assembly. 12. The heat transfer assembly of claim 7, wherein the heat conductive adhesive material is one of a solder paste, a solder epoxy, and an adhesive. 13. A heat transfer assembly comprising the method of claim 7, wherein the heat conductive adhesive material substantially fills the gap.