US20010050165A1 - Channel connection for pipe to block joints - Google Patents
Channel connection for pipe to block joints Download PDFInfo
- Publication number
- US20010050165A1 US20010050165A1 US09/848,016 US84801601A US2001050165A1 US 20010050165 A1 US20010050165 A1 US 20010050165A1 US 84801601 A US84801601 A US 84801601A US 2001050165 A1 US2001050165 A1 US 2001050165A1
- Authority
- US
- United States
- Prior art keywords
- channel
- heat
- pipe
- transfer assembly
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to heat dissipation devices and more particularly to the connection of such devices to a thermal source.
- Heat sinks are widely used devices that dissipate, or in some case, absorb, heat from objects that need to remain cool, such as machinery or computer equipment.
- One type of heat sink comprises a block of heat conductive material, or evaporative plate, with a tunnel or bore machined through it. A heat dissipating pipe is inserted through this tunnel in order to absorb and dissipate the heat conducted to it through the heat conducting material of the surrounding heat plate.
- the heat plate is attached to the object that requires cooling, such as, for example, a wall of a computer cabinet or the mounting of an IC in a laptop computer. An example of this type of heat sink is shown in FIG.
- this adhesive material 103 is inserted first in order to cover the walls of the tunnel.
- the heat pipe 105 is inserted afterwards, it displaces some of the adhesive material 103 and results in a less than desirable coupling region.
- FIGS. 2A and 2B One solution, which is shown in the perspective and cross-sectional views of FIGS. 2A and 2B, respectively, is a heat sink where an open channel 201 , as opposed to a closed tunnel 101 , is formed in heat plate 210 with channel 201 having a diameter substantially equal to the diameter of the pipe 205 .
- an adhesive 203 can be applied directly to channel 201 and pipe 205 can then be positioned in the channel 201 without displacing the adhesive 203 .
- a drawback to this approach is that a significant amount of pipe surface area 208 is not in contact with the heat plate, thus resulting in a less than optimal heat transfer.
- FIGS. 3A and 3B Another solution proposed in U.S. Pat. No. 5,826,645 to Meyer, IV et al. is shown in the perspective and cross-sectional views of FIGS. 3A and 3B, respectively.
- the heat pipe 305 is held in place by two extension tabs 320 and 321 .
- extension tabs 320 and 321 are vertical to the surface of the heat sink, as shown in FIG. 3B.
- extension tabs 320 and 321 are bent down to contact and hold in place heat pipe 305 , as shown in FIG. 3A.
- Filler material 326 which may be a heat conductive adhesive, solder paste or lubricant, fills up the region between heat pipe 305 and extension tabs 320 and 321 .
- Filler material 326 which may be a heat conductive adhesive, solder paste or lubricant, fills up the region between heat pipe 305 and extension tabs 320 and 321 .
- One object of the present invention is to provide a heat sink assembly that can effectively hold the heat pipe in place while providing for an efficient transfer of heat between the conductive material and the heat pipe.
- Another object of the present invention is to provide a heat sink assembly in which the bonding material economically and efficiently connects the heat pipe with the inner surface of the heat plate.
- Yet another object of the present invention is to provide a heat sink assembly in which the bonding material is easily applied and spread (wicking) between the heat pipe with the inner surface of the heat plate.
- the present invention is also directed to a method for forming a heat transfer assembly by forming in a channel in a heat plate, forming a slot in the surface of the heat plate along the length of the channel, inserting a heat pipe into the channel, and disposing heat conductive adhesive material in the gap between the channel and the heat pipe through the slot.
- FIG. 1 is a perspective view of a drilled through heat sink according to the prior art
- FIGS. 2A and 2B are the perspective and cross-sectional views, respectively, of a half open heat sink according to the prior art
- FIGS. 3A and 3B are the perspective and cross-sectional views, respectively, of a tabbed heat sink according to the prior art.
- FIGS. 4A and 4B are the perspective and cross-sectional views, respectively, of a preferred embodiment according to the present invention.
- the presently preferred embodiment of the present invention consists of a heat conductive material block (or heat plate) 410 having a drilled or milled tunnel or channel 401 that has a transverse slot 450 formed in the surface of the heat plate above the channel 401 .
- the channel 401 and/or slot 450 can be formed via a molding process, via drilling techniques, or other machinery techniques as are well-known in the art.
- the diameter of the channel is larger than the width of the transverse slot 450 and is sized to accept a heat pipe 405 while providing additional space for allowing application of a thermally conductive adhesive material 403 to the channel walls to bond the heat pipe 405 to the channel walls of the heat plate 410 , as discussed more fully below.
- a thermally conductive adhesive or bonding agent 403 is used to thermally couple the heat pipe 405 with the channel 401 . This is accomplished by applying the adhesive or bonding agent 403 through the slot 450 into a gap 407 formed between the heat pipe 405 and the channel 401 .
- the bonding agent 403 is a thermally conductive adhesive solder paste, it could be applied through slot 450 to the top portion of channel 401 . Then, the heat sink assembly would be heated, causing the solder to flow downward along the sides of the pipe 405 .
- An efficient thermal contact results when the solder flows between the sides of heat pipe 405 and all or substantially all of the contact area between the heat pipe 405 and the walls of channel 401 , thereby filling the gap 407 .
- the thermally conductive adhesive 403 can be in a preform or paste that is applied to the gap 407 , either before or after the heat pipe 405 is disposed in the channel 401 , or may be disposed by pressure directly into the gap 407 via the slot 450 once the pipe 405 is in place.
- the preform or paste will be cured in the gap 407 by heating the heat sink assembly to allow a preform to flow or by applying a paste or preform and then heating the assembly.
- the transverse slot 450 is made along the length of the channel 401 for providing access thereto.
- Heat pipe 405 is enclosed by channel 401 to almost its full circumference thus insuring that heat pipe 405 is properly constrained by and contained within the channel walls.
- the transverse slot 450 has a width “a” which is less than a diameter “b” of channel 401 .
- the transverse slot 450 prevents the pipe 405 from being removed from the channel 401 in a direction perpendicular to the channel length.
- the transverse slot 450 can be formed via a molding process, via drilling techniques, or other machinery techniques as are well-known in the art.
- heat pipe 405 is preferably substantially circular in cross-section
- the channel 401 of the preferred embodiment has a slightly elliptical cross-section, thus insuring that bonding material may be effectively inserted through transverse slot 450 during assembly.
- the cross-sections of both heat pipe 405 and channel 401 may take a variety of closed curvilinear shapes, from circles to ellipses and ovals.
- the transverse slot 450 allows for easy application of an adhesive 403 along the top and sides of the heat pipe that are exposed in the channel opening.
- a suitable adhesive may be an epoxy or solder paste, or other material known by those having ordinary skill which possess the appropriate thermally-conductive properties for thermally coupling and binding the pipe 405 to the plate 410 .
- the gap 407 is provided between the outer surface of the heat pipe and the channel walls in which the solder or epoxy is applied in a known manner for providing optimum wicking action therebetween, such as when the assembly is heated to allow the solder to flow.
- there is effective wicking action of the solder or epoxy to cover the full surface of the heat pipe enclosed in the channel gap.
- a heat sink assembly according to the present invention can effectively hold a heat pipe in place, while providing for a more efficient transfer of heat between the heat plate and the heat pipe. Furthermore, the bonding material in a heat sink assembly according to the present invention is easily applied through the slot 450 and spread (wicked) between the heat pipe with the inner surface of the channel, thereby providing an economic and more efficient heat transfer connection.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- This application claims priority from U.S. Provisional patent application Ser. No. 60/202,011 which was filed on May 04, 2000.
- 1.Field of the Invention
- The present invention relates to heat dissipation devices and more particularly to the connection of such devices to a thermal source.
- 2.Description of the Related Art
- Heat sinks are widely used devices that dissipate, or in some case, absorb, heat from objects that need to remain cool, such as machinery or computer equipment. One type of heat sink comprises a block of heat conductive material, or evaporative plate, with a tunnel or bore machined through it. A heat dissipating pipe is inserted through this tunnel in order to absorb and dissipate the heat conducted to it through the heat conducting material of the surrounding heat plate. The heat plate is attached to the object that requires cooling, such as, for example, a wall of a computer cabinet or the mounting of an IC in a laptop computer. An example of this type of heat sink is shown in FIG. 1, where tunnel101 is bored through
heat plate 110, andheat dissipating pipe 105 is held inside tunnel 101. To achieve the greatest efficiency with this type of heat sink, there needs to be a maximum coupling area between the heat pipe surface and the inner walls or surface area of the tunnel. For most heat sinks of this type, an adhesive material (shown at 103 in FIG. 1) is used to couple the heat pipe to the inner surface walls of the tunnel. - When assembling the heat sink, this
adhesive material 103 is inserted first in order to cover the walls of the tunnel. However, when theheat pipe 105 is inserted afterwards, it displaces some of theadhesive material 103 and results in a less than desirable coupling region. Several solutions to this problem have been proposed in the art. - One solution, which is shown in the perspective and cross-sectional views of FIGS. 2A and 2B, respectively, is a heat sink where an
open channel 201, as opposed to a closed tunnel 101, is formed inheat plate 210 withchannel 201 having a diameter substantially equal to the diameter of thepipe 205. This results in a “half-open” design. During assembly, anadhesive 203 can be applied directly tochannel 201 andpipe 205 can then be positioned in thechannel 201 without displacing theadhesive 203. A drawback to this approach is that a significant amount ofpipe surface area 208 is not in contact with the heat plate, thus resulting in a less than optimal heat transfer. - Another solution proposed in U.S. Pat. No. 5,826,645 to Meyer, IV et al. is shown in the perspective and cross-sectional views of FIGS. 3A and 3B, respectively. In that disclosure, the
heat pipe 305 is held in place by twoextension tabs heat plate 310 is first made,extension tabs extension tabs place heat pipe 305, as shown in FIG. 3A.Filler material 326, which may be a heat conductive adhesive, solder paste or lubricant, fills up the region betweenheat pipe 305 andextension tabs - Therefore, there is a need for a heat sink assembly which can effectively hold the heat pipe in place, while providing for an efficient transfer of heat between the conductive material and the heat pipe.
- One object of the present invention is to provide a heat sink assembly that can effectively hold the heat pipe in place while providing for an efficient transfer of heat between the conductive material and the heat pipe.
- Another object of the present invention is to provide a heat sink assembly in which the bonding material economically and efficiently connects the heat pipe with the inner surface of the heat plate.
- Yet another object of the present invention is to provide a heat sink assembly in which the bonding material is easily applied and spread (wicking) between the heat pipe with the inner surface of the heat plate.
- These and other objects are achieved by the present invention which is directed to a heat sink assembly having a heat block constraining a heat pipe within an elliptical or circular channel having a transverse slot which opens onto the surface of the heat block, thereby allowing for easier and more efficient application of bonding material and more efficient heat transfer.
- The present invention is also directed to a method for forming a heat transfer assembly by forming in a channel in a heat plate, forming a slot in the surface of the heat plate along the length of the channel, inserting a heat pipe into the channel, and disposing heat conductive adhesive material in the gap between the channel and the heat pipe through the slot.
- Other objects and features of the present invention will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not necessarily drawn to scale and that, unless otherwise indicated, they are merely intended to conceptually illustrate the structures and procedures described herein.
- In the drawings:
- FIG. 1 is a perspective view of a drilled through heat sink according to the prior art;
- FIGS. 2A and 2B are the perspective and cross-sectional views, respectively, of a half open heat sink according to the prior art;
- FIGS. 3A and 3B are the perspective and cross-sectional views, respectively, of a tabbed heat sink according to the prior art; and
- FIGS. 4A and 4B are the perspective and cross-sectional views, respectively, of a preferred embodiment according to the present invention.
- The presently preferred embodiment of the present invention consists of a heat conductive material block (or heat plate)410 having a drilled or milled tunnel or
channel 401 that has atransverse slot 450 formed in the surface of the heat plate above thechannel 401. Thechannel 401 and/orslot 450 can be formed via a molding process, via drilling techniques, or other machinery techniques as are well-known in the art. The diameter of the channel is larger than the width of thetransverse slot 450 and is sized to accept aheat pipe 405 while providing additional space for allowing application of a thermally conductiveadhesive material 403 to the channel walls to bond theheat pipe 405 to the channel walls of theheat plate 410, as discussed more fully below. - A thermally conductive adhesive or
bonding agent 403 is used to thermally couple theheat pipe 405 with thechannel 401. This is accomplished by applying the adhesive orbonding agent 403 through theslot 450 into agap 407 formed between theheat pipe 405 and thechannel 401. For example, if thebonding agent 403 is a thermally conductive adhesive solder paste, it could be applied throughslot 450 to the top portion ofchannel 401. Then, the heat sink assembly would be heated, causing the solder to flow downward along the sides of thepipe 405. An efficient thermal contact results when the solder flows between the sides ofheat pipe 405 and all or substantially all of the contact area between theheat pipe 405 and the walls ofchannel 401, thereby filling thegap 407. - As another example, the thermally
conductive adhesive 403 can be in a preform or paste that is applied to thegap 407, either before or after theheat pipe 405 is disposed in thechannel 401, or may be disposed by pressure directly into thegap 407 via theslot 450 once thepipe 405 is in place. Like the solder discussed above, the preform or paste will be cured in thegap 407 by heating the heat sink assembly to allow a preform to flow or by applying a paste or preform and then heating the assembly. - As shown in FIGS. 4A and 4B, and as explained below, the
transverse slot 450 is made along the length of thechannel 401 for providing access thereto.Heat pipe 405 is enclosed bychannel 401 to almost its full circumference thus insuring thatheat pipe 405 is properly constrained by and contained within the channel walls. More particularly, thetransverse slot 450 has a width “a” which is less than a diameter “b” ofchannel 401. Thus, whenheat pipe 405 is placed within thechannel 401, the dimension of thetransverse slot 450 prevents thepipe 405 from being removed from thechannel 401 in a direction perpendicular to the channel length. As stated above, thetransverse slot 450 can be formed via a molding process, via drilling techniques, or other machinery techniques as are well-known in the art. - Although
heat pipe 405 is preferably substantially circular in cross-section, thechannel 401 of the preferred embodiment has a slightly elliptical cross-section, thus insuring that bonding material may be effectively inserted throughtransverse slot 450 during assembly. In other embodiments, the cross-sections of bothheat pipe 405 andchannel 401 may take a variety of closed curvilinear shapes, from circles to ellipses and ovals. - Regardless of which curvilinear shapes are used for the heat pipe and tunnel, preferred embodiments of the present invention maintain the appropriate interface dimension between the heat pipe and the tunnel walls for maximizing heat transfer. In other words, as much of the surface area of the heat pipe as possible is interfaced with the heat plate via the tunnel walls. Since the channel encloses the heat pipe to almost the full cross-sectional circumference, there is an increased pipe surface area for bonding between the
heat pipe 405 and theplate 410, thus insuring a maximum amount of heat transfer. - The
transverse slot 450 allows for easy application of an adhesive 403 along the top and sides of the heat pipe that are exposed in the channel opening. A suitable adhesive may be an epoxy or solder paste, or other material known by those having ordinary skill which possess the appropriate thermally-conductive properties for thermally coupling and binding thepipe 405 to theplate 410. In the presently preferred embodiment, thegap 407 is provided between the outer surface of the heat pipe and the channel walls in which the solder or epoxy is applied in a known manner for providing optimum wicking action therebetween, such as when the assembly is heated to allow the solder to flow. Thus, there is effective wicking action of the solder or epoxy to cover the full surface of the heat pipe enclosed in the channel gap. - Optimum heat transfer takes place when the solder or adhesive403 completely fills the
gap 407 in the interface between the heat pipe and the heat plate. A most efficient thermal coupling results when all air is removed in the gap and replaced with adhesive 403. With the inventive channel design described with reference to FIGS. 4A and 4B, the solder or adhesive will wick to fill or nearly fill the heat plate-to-heat pipe interface. - Therefore, a heat sink assembly according to the present invention can effectively hold a heat pipe in place, while providing for a more efficient transfer of heat between the heat plate and the heat pipe. Furthermore, the bonding material in a heat sink assembly according to the present invention is easily applied through the
slot 450 and spread (wicked) between the heat pipe with the inner surface of the channel, thereby providing an economic and more efficient heat transfer connection. - While there have shown and described and pointed out fundamental novel features of the invention as applied to a preferred embodiment thereof, it will be understood that various omissions and substitutions and changes in the form and details of the devices illustrated, and in their operation, may be made by those skilled in the art without departing from the spirit of the invention. For example, it is expressly intended that all combinations of those elements and/or method steps which perform substantially the same function in substantially the same way to achieve the same results are within the scope of the invention. Moreover, it should be recognized that structures and/or elements and/or method steps shown and/or described in connection with any disclosed form or embodiment of the invention may be incorporated in any other disclosed or described or suggested form or embodiment as a general matter of design choice. It is the intention, therefore, to be limited only as indicated by the scope of the claims appended hereto.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/848,016 US20010050165A1 (en) | 2000-05-04 | 2001-05-03 | Channel connection for pipe to block joints |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20201100P | 2000-05-04 | 2000-05-04 | |
US09/848,016 US20010050165A1 (en) | 2000-05-04 | 2001-05-03 | Channel connection for pipe to block joints |
Publications (1)
Publication Number | Publication Date |
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US20010050165A1 true US20010050165A1 (en) | 2001-12-13 |
Family
ID=26897283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US09/848,016 Abandoned US20010050165A1 (en) | 2000-05-04 | 2001-05-03 | Channel connection for pipe to block joints |
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US (1) | US20010050165A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080047139A1 (en) * | 2006-08-17 | 2008-02-28 | Hul-Chun Hsu | Method For Combining Axially Heated Heat Pipes And Heat-Conducting Base |
US20080055857A1 (en) * | 2006-09-05 | 2008-03-06 | Shyh-Ming Chen | Method for connecting heat pipes and a heat sink |
US20110000645A1 (en) * | 2009-07-06 | 2011-01-06 | Ping Chen | Heat dissipating board structure and method of manufacturing the same |
US8756810B2 (en) * | 2009-08-04 | 2014-06-24 | Asia Vital Components Co., Ltd. | Board-shaped heat Dissipating method of manufacturing |
US20150258643A1 (en) * | 2014-03-11 | 2015-09-17 | Asia Vital Components Co., Ltd. | Method of manufacturing thermal module with enhanced assembling structure |
CN105081590A (en) * | 2015-07-31 | 2015-11-25 | 湘潭电机股份有限公司 | Cold plate of brazing structure and manufacturing method |
US20170030655A1 (en) * | 2015-07-28 | 2017-02-02 | The Boeing Company | Heat exchanger systems and methods |
US20230077598A1 (en) * | 2021-09-14 | 2023-03-16 | Hamilton Sundstrand Corporation | Cooling in conductors for chips |
-
2001
- 2001-05-03 US US09/848,016 patent/US20010050165A1/en not_active Abandoned
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080047139A1 (en) * | 2006-08-17 | 2008-02-28 | Hul-Chun Hsu | Method For Combining Axially Heated Heat Pipes And Heat-Conducting Base |
US7900353B2 (en) * | 2006-08-17 | 2011-03-08 | Jaffe Limited | Method for combining axially heated heat pipes and heat-conducting base |
US20080055857A1 (en) * | 2006-09-05 | 2008-03-06 | Shyh-Ming Chen | Method for connecting heat pipes and a heat sink |
US20110094104A1 (en) * | 2006-09-05 | 2011-04-28 | Shyh-Ming Chen | Method for connecting heat pipes and a heat sink |
US20110000645A1 (en) * | 2009-07-06 | 2011-01-06 | Ping Chen | Heat dissipating board structure and method of manufacturing the same |
US8756810B2 (en) * | 2009-08-04 | 2014-06-24 | Asia Vital Components Co., Ltd. | Board-shaped heat Dissipating method of manufacturing |
US20150258643A1 (en) * | 2014-03-11 | 2015-09-17 | Asia Vital Components Co., Ltd. | Method of manufacturing thermal module with enhanced assembling structure |
US9327369B2 (en) * | 2014-03-11 | 2016-05-03 | Asia Vital Components Co., Ltd. | Method of manufacturing thermal module with enhanced assembling structure |
US20170030655A1 (en) * | 2015-07-28 | 2017-02-02 | The Boeing Company | Heat exchanger systems and methods |
US10619940B2 (en) * | 2015-07-28 | 2020-04-14 | The Boeing Company | Heat exchanger systems and methods |
CN105081590A (en) * | 2015-07-31 | 2015-11-25 | 湘潭电机股份有限公司 | Cold plate of brazing structure and manufacturing method |
US20230077598A1 (en) * | 2021-09-14 | 2023-03-16 | Hamilton Sundstrand Corporation | Cooling in conductors for chips |
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