1296364 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係一種由熱管與散熱 片組合而成的散熱裝置。 ^ 【先前技術】 隨著電腦産業的迅速發展，中央處理器等發熱電子元 件産生的熱量愈來愈多。爲將該等熱量有效散去，通常采 用的方法係利用一熱管的一端與該發熱電子元件接觸，將 發熱電子元件産生的熱量導出，同時在該熱管的另一端套 接複數散熱片，從而將熱量迅速散發出去。其中，該等散 熱片係藉由設置穿孔而與熱管接合的，爲增加該等散熱片 與熱管之_接觸面積’通常在該等散刻穿孔的周^上 -體延伸出接合部，以與齡外壁緊密貼合。爲了降低 熱片接合部與熱管之間的介面熱阻，一種 十 係，熔的金屬焊料將熱管與散熱片焊接在：3 熱官與散熱片之間均勻的塗布焊料，可二 rrr焊料，然後將該等塗有焊料的^= …巨上。然而，這種方法容易造成焊料 溢，導致熱管與散熱片之間的接合不緊密，壓而外 散熱裝置的賴效果。 緊在辦終影響 【發明内容】 散熱=於此’有必要提供—種散熱片與熱管緊密接合的 1296364 該散熱裝置包括至少一熱管及複數散熱片，該等散熱 ^ 片上設有一連接孔供熱管穿設，該等散熱片沿連接孔的周 : 緣向一側延伸設有一接合部，該等接合部上設有一缺口， 其中，該等散熱片於其對應缺口兩端分別設有一導流抽 芽，該等散熱片上之導流抽芽與接合部相接。 與習知技術相比，藉由該等導流抽芽的設置，使焊接 散熱片與熱管的焊料可均勻填充在熱管與散熱片的接合部 之間，從而使上述散熱裝置具有熱管與散熱片接合緊密的 _ 優點。 【實施方式】 圖1所示爲本發明散熱裝置第一實施例的立體分解 圖，該散熱裝置100包括複數散熱片10及複數熱管2〇。 該等熱管20爲彎曲的U型結構，其兩端穿設在散熱片1〇 内。 請參照圖1至圖3，該等散熱片1〇上分別對應設置有 φ 複數連接孔12，以供穿設熱管2〇。該等散熱片10上設有 複數抵頂部14,藉由該等抵頂部14與前一散熱片1〇抵接， 從而在相鄰散熱1〇之間形成流道以供冷媒流體(如散熱 風扇産生的氣流)流過。該等散熱片的中部對應設有一 穿孔16 ,該穿孔16使各散熱片1〇之間的流道相通，可降 低散熱裝置100的流阻，S高散熱裝£ 1〇〇的散熱效率。 該等散熱片10在其每-連接孔12的上方設有一焊料加入 孔13，該焊料加入孔13與該連接孔12相互連通。該等連 接孔I2的周、緣向散熱片10的一側延伸形成一接合部⑵， 1296364 以增加散熱片ίο與熱管20的接觸面積，同時形成一缺口 15。該谭料加入孔13力兩相對侧分別在與該等接合部122 相同的延伸方向上延伸形成一導流抽芽132，該等導流抽 芽132與該接合部122係一體衝麼成型的，且 芽2與該接合部122之間藉由一圓角過渡。導^ 凊參照圖4及圖5，該散熱裝置_的_種較佳的組 裝，製造方法如下：输該等散熱片10穿套在熱管20上。 接著’藉由-細針頭式注射器3〇從散熱片1〇的一側沿焊 料加入孔13插人，將焊料⑽(如财等)塗布在與焊料加入 孔13相接的熱管2〇的外壁上。然後對該焊料4〇進行加 熱，使其受熱熔化，順著導流抽芽I32的導引流入熱管2〇 與接合部122之間，均勻填充熱管2〇與接合部122之間的 空隙。由於導流抽# 132與接合部122之間爲圓角過渡， 在毛細力，的作用下，可確保熔化的焊料4〇順著導流抽芽 132及熱官20與接合部122之間的空隙流入熱管2〇與接 合《Μ22之間，而不會產生溢出及塗布不均勻現象。最後， 對該散熱裝置組合進行冷却，使焊料*㈣化，從而將散熱 片1〇與熱管20焊接在_起，得到散熱裝置1〇〇。 請參照圖6，在將散熱片1〇與熱管2〇焊接時，也可 以藉由棒狀焊條5〇穿插在該等焊料加入孔^及熱管沈 的外壁之間’同樣可以在加齡化_充熱㈣與接合 122之間的空隙。 «月參照圖7 ’其爲本發明散熱裝置第二實施例的局部 放大圖，其中’上述導流抽芽132也可以不必與接合部122 1296364 一體成型，只要將導流抽芽132的下端f折並對應缺口 μ 叠壓在接合部m内侧’使得熔化的焊料 说的導引流入接合部122與熱管2〇之間即可。可以= 的’該等導流抽芽m也可以從散熱片1〇上與接合部⑵ 相^的―側延伸，而叠壓在一相鄰散熱片料接孔12的 接合部122内側。 請參照圖8及圖9,其爲本發明第三實施例的示意圖， 二中，該等散熱片10a的連接孔12接合部122上對應設有 15，該缺口 15的兩端分別向上延伸形成一導流抽 f 2’該導流抽芽152與該接合部122之間爲一圓角過 渡。在製造該散熱片10a時，爲便於生產，可先在散 他上_並彎折出導流抽芽152，再衝壓並成型連航η 及其接合部122，即得到散熱片l〇a。 請參照圖10，爲將該散熱片l〇a與熱管20焊接，可先 ，該等散熱片1〇a穿套在熱管2〇上。接著，藉由一細針頭 ==器30將焊料4〇注射至散熱片伽、導流抽芽说 :、、s 20的外壁形成的容置空間内。然後藉由與第一實施 :同的焊接工藝即可將散熱片l〇a與熱管20焊接在一 起。 /參關11，其爲本發明第四實施例的局部放大圖。 第三實施例中細針頭式注射器30從散熱片10a側向 ^門焊料奶的要求，可在每一散熱片恤的兩導流抽芽说 吟為對應11 又置焊料加入孔18。細針頭式注射器30可從 …、片1〇a的一端沿焊料加入孔18插入，將焊料4〇分別 1296364 ，入由政熱片l〇a、導流抽芽m及熱管％的外壁形成的 谷置二間内° §然’此時亦可直接在焊料加入孔18内塞入 • 棒狀焊條進行焊接。 由以上叙述可知，藉由該等導流抽芽132、152的設 置使得焊料4〇可以均勻填充熱管2〇與接合部m之間 的空隙，從而使熱管20與散熱片1〇緊密結合。 【圖式簡單說明】 圖1爲本發明散熱裝置第一實施例的立體分解圖。 圖2爲圖1所示散熱裝置的立體組合圖。 圖3爲圖2所示散熱裝置圈A部分的放大圖。 圖4爲圖2所示散熱裝置的沿IV-IV綫的侧向剖視圖。 圖5爲本發明散熱裝置第一實施例填加錫膏操作的示 意圖。 圖6爲本發明散熱裝置第一實施例填加焊條操作的示 意圖。 • 圖7爲本發明散熱裝置第二實施例的局部放大圖。 圖8爲本發明散熱裝置第三實施例的立體分解圖。 圖9爲圖8所示散熱裝置圈b部分的放大圖。 圖10爲本發明散熱裝置第三實施例填加焊料操作的 示意圖。 圖U爲本發明散熱裝置第四實施例的局部放大圖。 【主要元件符號說明】 散熱裝置 連接孔 100 12 散熱片 接合部 1〇、 l〇a 122 1296364 焊料加入孔 13. 18 導流抽芽 132、 152 抵頂部 14 缺口 15 穿孔 16 熱管 20 細針頭式注射器 30 焊料 40 焊條 50 111296364 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device which is composed of a heat pipe and a heat sink. ^ [Prior Art] With the rapid development of the computer industry, heat generated by heat-emitting electronic components such as central processing units is increasing. In order to effectively dissipate the heat, a method generally uses one end of a heat pipe to contact the heat-generating electronic component, and heat is generated by the heat-generating electronic component, and a plurality of heat sinks are sleeved at the other end of the heat pipe, thereby The heat quickly dissipated. Wherein the heat sinks are joined to the heat pipe by providing perforations, and in order to increase the contact area of the heat sinks and the heat pipes, the joints are generally extended on the circumference of the scattered perforations to The outer wall of the age is tightly fitted. In order to reduce the thermal resistance of the interface between the hot plate joint and the heat pipe, a ten-series, molten metal solder solders the heat pipe and the heat sink: 3 uniform solder between the heat and the heat sink, two rrr solder, then These soldered ^= ... giants. However, this method is liable to cause solder overflow, resulting in a tight junction between the heat pipe and the heat sink, and the external heat sink is pressed. In the end, the impact of the invention [invention] heat dissipation = this is necessary to provide - the heat sink and the heat pipe tightly coupled 1296364 The heat sink includes at least one heat pipe and a plurality of heat sinks, the heat sink is provided with a connecting hole for the heat pipe The heat sink is disposed along a circumference of the connecting hole: a joint portion extending from one side of the edge, and a gap is formed on the joint portion, wherein the heat sinks are respectively provided with a flow guiding bud at opposite ends of the corresponding gap The flow guiding buds on the heat sinks are in contact with the joint. Compared with the prior art, the soldering of the soldering fins and the heat pipe can be uniformly filled between the joints of the heat pipe and the heat sink, so that the heat dissipating device has the heat pipe and the heat sink. Tight _ advantage. [Embodiment] FIG. 1 is a perspective exploded view of a first embodiment of a heat sink according to the present invention. The heat sink 100 includes a plurality of heat sinks 10 and a plurality of heat pipes 2〇. The heat pipes 20 are curved U-shaped structures, and both ends thereof are bored in the fins 1A. Referring to FIG. 1 to FIG. 3, the heat sinks 1 are respectively provided with φ plurality of connecting holes 12 for piercing the heat pipes 2 〇. The heat sink 10 is provided with a plurality of abutting top portions 14 , and the abutting top portions 14 abut against the previous heat sink 1 , to form a flow path between the adjacent heat sinks 1 以 for a refrigerant fluid (such as a cooling fan) The generated airflow flows through. The middle portion of the heat dissipating fins is correspondingly provided with a through hole 16 which communicates the flow paths between the fins 1 , which can reduce the flow resistance of the heat dissipating device 100 and the heat dissipating efficiency of the S high heat dissipating device. The fins 10 are provided with a solder adding hole 13 above each of the connecting holes 12, and the solder adding holes 13 communicate with the connecting holes 12. The circumference of the connecting holes I2 and the side of the edge extending toward the heat sink 10 extend to form a joint portion (2), 1296364 to increase the contact area of the heat sink ί with the heat pipe 20, and a notch 15 is formed. The two opposite sides of the hole 13 are respectively extended in the same extending direction as the joints 122 to form a flow guiding bud 132, and the guiding buds 132 are integrally formed with the joint portion 122, and The bud 2 and the joint portion 122 are transitioned by a rounded corner. Referring to Figures 4 and 5, a preferred assembly of the heat dissipating device is as follows: the heat sink 10 is placed over the heat pipe 20. Then, the solder (10) (such as Cai) is applied to the outer wall of the heat pipe 2 that is in contact with the solder adding hole 13 by inserting a thin needle-type syringe 3 from the side of the heat sink 1〇 along the solder adding hole 13. on. Then, the solder 4 is heated to be melted by heat, and flows along the guide of the flow guiding bud I32 into between the heat pipe 2 and the joint portion 122 to uniformly fill the gap between the heat pipe 2 and the joint portion 122. Due to the rounded transition between the deflector #132 and the joint portion 122, under the action of the capillary force, the molten solder 4 is ensured along the flow guiding bud 132 and the gap between the heat official 20 and the joint portion 122. It flows between the heat pipe 2〇 and the joint “Μ22” without overflow and uneven coating. Finally, the heat sink assembly is cooled to solder (4), and the heat sink 1 and the heat pipe 20 are welded together to obtain a heat sink 1 . Referring to FIG. 6, when the heat sink 1 is welded to the heat pipe 2, it may be inserted between the solder adding holes and the outer wall of the heat pipe sink by the rod electrode 5'. The gap between the heat (4) and the joint 122. The present invention is a partial enlarged view of the second embodiment of the heat sink according to the present invention, wherein the above-mentioned flow guiding bud 132 may not be integrally formed with the joint portion 122 1296364 as long as the lower end f of the flow guiding bud 132 is folded. The corresponding notch μ is laminated on the inner side of the joint portion m so that the guide of the molten solder flows between the joint portion 122 and the heat pipe 2〇. The guide w will be able to extend from the side of the heat sink 1 to the side of the joint (2) and be laminated inside the joint portion 122 of the adjacent fin feed opening 12. Please refer to FIG. 8 and FIG. 9 , which are schematic views of a third embodiment of the present invention. In the second embodiment, the connecting portion 12 of the connecting hole 12 of the heat dissipating fins 10 is correspondingly disposed 15 , and the two ends of the notch 15 respectively extend upward. A flow guide f 2' is a rounded transition between the flow guiding bud 152 and the joint portion 122. In the manufacture of the heat sink 10a, in order to facilitate the production, the flow guiding bud 152 may be bent and then the hang η and its joint portion 122 may be punched and formed to obtain the heat sink l〇a. Referring to FIG. 10, in order to solder the heat sink 10a to the heat pipe 20, the heat sinks 1A may be placed on the heat pipe 2A. Next, the solder 4 is injected into the accommodating space formed by the outer wall of the heat sink by the thin needle == 30. The heat sink l〇a can then be welded to the heat pipe 20 by the same welding process as the first embodiment. / Reference 11, which is a partial enlarged view of the fourth embodiment of the present invention. In the third embodiment, the requirements of the thin needle-type injector 30 from the side of the heat sink 10a to the soldering of the solder can be made to correspond to the 11 and the solder adding holes 18 in each of the fins. The fine needle-type syringe 30 can be inserted from the end of the sheet 1〇a along the solder adding hole 18, and the solder 4〇 is respectively 1296364, and is formed into a valley formed by the outer surface of the hot sheet l〇a, the flow guiding bud m and the heat pipe %. Place the two insides. § However, you can also directly insert the rod-shaped electrode into the solder-insertion hole 18 for soldering. As can be seen from the above description, by the arrangement of the flow guiding buds 132, 152, the solder 4 〇 can uniformly fill the gap between the heat pipe 2 〇 and the joint portion m, thereby tightly bonding the heat pipe 20 and the heat sink 1 。. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view showing a first embodiment of a heat sink according to the present invention. 2 is a perspective assembled view of the heat sink shown in FIG. 1. Figure 3 is an enlarged view of a portion of the heat sink ring A shown in Figure 2. Figure 4 is a side cross-sectional view of the heat sink of Figure 2 taken along line IV-IV. Fig. 5 is a view showing the operation of filling a solder paste in the first embodiment of the heat sink of the present invention. Fig. 6 is a view showing the operation of filling the electrode in the first embodiment of the heat sink of the present invention. Figure 7 is a partial enlarged view of a second embodiment of the heat sink of the present invention. Figure 8 is a perspective exploded view of a third embodiment of the heat sink of the present invention. Figure 9 is an enlarged view of a portion of the heat sink ring b shown in Figure 8. Fig. 10 is a schematic view showing the operation of filling the solder in the third embodiment of the heat sink of the present invention. Figure U is a partial enlarged view of a fourth embodiment of the heat sink of the present invention. [Main component symbol description] Heat sink connection hole 100 12 Heat sink joint 1〇, l〇a 122 1296364 Solder insertion hole 13. 18 Guided bubbling 132, 152 Abutting top 14 Notch 15 Perforation 16 Heat pipe 20 Fine needle syringe 30 Solder 40 Welding Rod 50 11