JP2003524302A - 電子的支持体ならびに電子的支持体に開口部を形成するための方法および装置 - Google Patents
電子的支持体ならびに電子的支持体に開口部を形成するための方法および装置Info
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- JP2003524302A JP2003524302A JP2001562068A JP2001562068A JP2003524302A JP 2003524302 A JP2003524302 A JP 2003524302A JP 2001562068 A JP2001562068 A JP 2001562068A JP 2001562068 A JP2001562068 A JP 2001562068A JP 2003524302 A JP2003524302 A JP 2003524302A
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- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18402600P | 2000-02-22 | 2000-02-22 | |
| US18397900P | 2000-02-22 | 2000-02-22 | |
| US60/184,026 | 2000-02-22 | ||
| US60/183,979 | 2000-02-22 | ||
| US23361900P | 2000-09-18 | 2000-09-18 | |
| US60/233,619 | 2000-09-18 | ||
| US78353701A | 2001-02-15 | 2001-02-15 | |
| US09/783,537 | 2001-02-15 | ||
| PCT/US2001/005680 WO2001063984A1 (en) | 2000-02-22 | 2001-02-22 | Electronic supports and methods and apparatus for forming apertures in electronic supports |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003524302A true JP2003524302A (ja) | 2003-08-12 |
Family
ID=27497584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001562068A Withdrawn JP2003524302A (ja) | 2000-02-22 | 2001-02-22 | 電子的支持体ならびに電子的支持体に開口部を形成するための方法および装置 |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1258179A1 (zh) |
| JP (1) | JP2003524302A (zh) |
| KR (1) | KR20020077917A (zh) |
| CN (1) | CN1444838A (zh) |
| AU (1) | AU2001241660A1 (zh) |
| BR (1) | BR0108561A (zh) |
| CA (1) | CA2400787A1 (zh) |
| HK (1) | HK1047678A1 (zh) |
| MX (1) | MXPA02008185A (zh) |
| TW (1) | TW550987B (zh) |
| WO (1) | WO2001063984A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071315A (ja) * | 2009-09-25 | 2011-04-07 | Shinko Electric Ind Co Ltd | 配線基板及び配線基板の製造方法 |
| US10693137B2 (en) | 2013-07-10 | 2020-06-23 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
| US11027458B2 (en) | 2016-03-23 | 2021-06-08 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100704321B1 (ko) | 2002-02-06 | 2007-04-10 | 세키스이가가쿠 고교가부시키가이샤 | 수지 조성물 |
| KR100850760B1 (ko) * | 2007-05-30 | 2008-08-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| US9484123B2 (en) | 2011-09-16 | 2016-11-01 | Prc-Desoto International, Inc. | Conductive sealant compositions |
| CN116396678B (zh) * | 2021-12-27 | 2024-08-09 | 山东工业陶瓷研究设计院有限公司 | 一种常温固化辐射涂层料浆、辐射涂层及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2493662A1 (fr) * | 1980-11-05 | 1982-05-07 | Rhone Poulenc Ind | Substrats metallises pour circuits imprimes et leur procede de preparation |
| GB2185437B (en) * | 1985-12-26 | 1989-12-06 | Hitachi Chemical Co Ltd | Ceramic coated laminate and process for producing the same |
| US5552209A (en) * | 1994-07-29 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Internally damped circuit articles |
| CN1295542A (zh) * | 1998-03-03 | 2001-05-16 | Ppg工业俄亥俄公司 | 无机润滑涂覆的玻璃纤维束以及包括它的产品 |
-
2001
- 2001-02-22 EP EP01912926A patent/EP1258179A1/en not_active Withdrawn
- 2001-02-22 CN CN01808368A patent/CN1444838A/zh active Pending
- 2001-02-22 AU AU2001241660A patent/AU2001241660A1/en not_active Abandoned
- 2001-02-22 CA CA002400787A patent/CA2400787A1/en not_active Abandoned
- 2001-02-22 TW TW090104075A patent/TW550987B/zh not_active IP Right Cessation
- 2001-02-22 JP JP2001562068A patent/JP2003524302A/ja not_active Withdrawn
- 2001-02-22 WO PCT/US2001/005680 patent/WO2001063984A1/en not_active Application Discontinuation
- 2001-02-22 MX MXPA02008185A patent/MXPA02008185A/es unknown
- 2001-02-22 KR KR1020027011010A patent/KR20020077917A/ko not_active Application Discontinuation
- 2001-02-22 BR BR0108561-1A patent/BR0108561A/pt not_active Application Discontinuation
-
2002
- 2002-12-18 HK HK02109182.7A patent/HK1047678A1/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071315A (ja) * | 2009-09-25 | 2011-04-07 | Shinko Electric Ind Co Ltd | 配線基板及び配線基板の製造方法 |
| US10693137B2 (en) | 2013-07-10 | 2020-06-23 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
| US11027458B2 (en) | 2016-03-23 | 2021-06-08 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001063984A1 (en) | 2001-08-30 |
| TW550987B (en) | 2003-09-01 |
| CA2400787A1 (en) | 2001-08-30 |
| MXPA02008185A (es) | 2004-08-12 |
| AU2001241660A1 (en) | 2001-09-03 |
| HK1047678A1 (zh) | 2003-02-28 |
| CN1444838A (zh) | 2003-09-24 |
| EP1258179A1 (en) | 2002-11-20 |
| BR0108561A (pt) | 2002-11-12 |
| KR20020077917A (ko) | 2002-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080513 |