BR0108561A - Suportes eletrônicos e método e aparelho para formar aberturas em suportes eletrônicos - Google Patents
Suportes eletrônicos e método e aparelho para formar aberturas em suportes eletrônicosInfo
- Publication number
- BR0108561A BR0108561A BR0108561-1A BR0108561A BR0108561A BR 0108561 A BR0108561 A BR 0108561A BR 0108561 A BR0108561 A BR 0108561A BR 0108561 A BR0108561 A BR 0108561A
- Authority
- BR
- Brazil
- Prior art keywords
- electronic supports
- layer
- electronic
- supports
- forming openings
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
"SUPORTES ELETRôNICOS E MéTODO E APARELHO PARA FORMAR ABERTURAS EM SUPORTES ELETRôNICOS". A presente invenção apresenta um suporte eletrônico (210) que compreende: (A) uma camada de pré-impregnação (214) que compreende: (1) pelo menos um material de reforço (220); (2) pelo menos um material de matriz (216) em contato com pelo menos uma porção de pelo menos um material de reforço (220); e (B) pelo menos uma camada (217) em contato com pelo menos uma porção (224) de pelo menos uma superfície da camada de pré-impregnação (214), pelo menos uma camada de pré-impregnação (217) compreendendo pelo menos um enchimento inorgânico (218) e não mais de 25 por cento em peso de materiais adesivos com base no peso total de pelo menos uma camada (217) em uma base de sólidos total.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18397900P | 2000-02-22 | 2000-02-22 | |
US18402600P | 2000-02-22 | 2000-02-22 | |
US23361900P | 2000-09-18 | 2000-09-18 | |
US78353701A | 2001-02-15 | 2001-02-15 | |
PCT/US2001/005680 WO2001063984A1 (en) | 2000-02-22 | 2001-02-22 | Electronic supports and methods and apparatus for forming apertures in electronic supports |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0108561A true BR0108561A (pt) | 2002-11-12 |
Family
ID=27497584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0108561-1A BR0108561A (pt) | 2000-02-22 | 2001-02-22 | Suportes eletrônicos e método e aparelho para formar aberturas em suportes eletrônicos |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP1258179A1 (pt) |
JP (1) | JP2003524302A (pt) |
KR (1) | KR20020077917A (pt) |
CN (1) | CN1444838A (pt) |
AU (1) | AU2001241660A1 (pt) |
BR (1) | BR0108561A (pt) |
CA (1) | CA2400787A1 (pt) |
HK (1) | HK1047678A1 (pt) |
MX (1) | MXPA02008185A (pt) |
TW (1) | TW550987B (pt) |
WO (1) | WO2001063984A1 (pt) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10693137B2 (en) | 2013-07-10 | 2020-06-23 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7754803B2 (en) | 2002-02-06 | 2010-07-13 | Sekisui Chemical Co., Ltd. | Resin composition |
KR100850760B1 (ko) * | 2007-05-30 | 2008-08-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
JP5367523B2 (ja) * | 2009-09-25 | 2013-12-11 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
US9484123B2 (en) | 2011-09-16 | 2016-11-01 | Prc-Desoto International, Inc. | Conductive sealant compositions |
JP6712774B2 (ja) | 2016-03-23 | 2020-06-24 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板、プリプレグの製造方法 |
CN116396678B (zh) * | 2021-12-27 | 2024-08-09 | 山东工业陶瓷研究设计院有限公司 | 一种常温固化辐射涂层料浆、辐射涂层及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2493662A1 (fr) * | 1980-11-05 | 1982-05-07 | Rhone Poulenc Ind | Substrats metallises pour circuits imprimes et leur procede de preparation |
GB2185437B (en) * | 1985-12-26 | 1989-12-06 | Hitachi Chemical Co Ltd | Ceramic coated laminate and process for producing the same |
US5552209A (en) * | 1994-07-29 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Internally damped circuit articles |
BR9908621A (pt) * | 1998-03-03 | 2000-10-31 | Ppg Ind Ohio Inc | Filamentos de fibra de vidro revestidos com lubrificante inorgânico e produtos incluindo os mesmos |
-
2001
- 2001-02-22 EP EP01912926A patent/EP1258179A1/en not_active Withdrawn
- 2001-02-22 WO PCT/US2001/005680 patent/WO2001063984A1/en not_active Application Discontinuation
- 2001-02-22 JP JP2001562068A patent/JP2003524302A/ja not_active Withdrawn
- 2001-02-22 MX MXPA02008185A patent/MXPA02008185A/es unknown
- 2001-02-22 CA CA002400787A patent/CA2400787A1/en not_active Abandoned
- 2001-02-22 CN CN01808368A patent/CN1444838A/zh active Pending
- 2001-02-22 AU AU2001241660A patent/AU2001241660A1/en not_active Abandoned
- 2001-02-22 BR BR0108561-1A patent/BR0108561A/pt not_active Application Discontinuation
- 2001-02-22 KR KR1020027011010A patent/KR20020077917A/ko not_active Application Discontinuation
- 2001-02-22 TW TW090104075A patent/TW550987B/zh not_active IP Right Cessation
-
2002
- 2002-12-18 HK HK02109182.7A patent/HK1047678A1/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10693137B2 (en) | 2013-07-10 | 2020-06-23 | Boron Nitride Power, Llc | Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices |
Also Published As
Publication number | Publication date |
---|---|
KR20020077917A (ko) | 2002-10-14 |
CA2400787A1 (en) | 2001-08-30 |
TW550987B (en) | 2003-09-01 |
HK1047678A1 (zh) | 2003-02-28 |
JP2003524302A (ja) | 2003-08-12 |
MXPA02008185A (es) | 2004-08-12 |
EP1258179A1 (en) | 2002-11-20 |
AU2001241660A1 (en) | 2001-09-03 |
WO2001063984A1 (en) | 2001-08-30 |
CN1444838A (zh) | 2003-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired |