JP2003520903A - 液体または溶解形状にある少なくとも1つの前駆体を少なくとも一つの基板に沈積させる方法および装置 - Google Patents
液体または溶解形状にある少なくとも1つの前駆体を少なくとも一つの基板に沈積させる方法および装置Info
- Publication number
- JP2003520903A JP2003520903A JP2001554503A JP2001554503A JP2003520903A JP 2003520903 A JP2003520903 A JP 2003520903A JP 2001554503 A JP2001554503 A JP 2001554503A JP 2001554503 A JP2001554503 A JP 2001554503A JP 2003520903 A JP2003520903 A JP 2003520903A
- Authority
- JP
- Japan
- Prior art keywords
- precursor
- reaction chamber
- temperature
- evaporation
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Chemically Coating (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10003758.5 | 2000-01-28 | ||
DE10003758A DE10003758A1 (de) | 2000-01-28 | 2000-01-28 | Vorrichtung und Verfahren zum Abscheiden wenigstens eines in flüssiger oder gelöster Form vorliegenden Prekursors |
PCT/DE2001/000348 WO2001055478A2 (de) | 2000-01-28 | 2001-01-29 | Verfahren und vorrichtung zum abscheiden eines in flüssiger form vorliegenden prekursors auf einem substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003520903A true JP2003520903A (ja) | 2003-07-08 |
Family
ID=7629070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001554503A Pending JP2003520903A (ja) | 2000-01-28 | 2001-01-29 | 液体または溶解形状にある少なくとも1つの前駆体を少なくとも一つの基板に沈積させる方法および装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030056728A1 (de) |
EP (1) | EP1252362B1 (de) |
JP (1) | JP2003520903A (de) |
KR (1) | KR20020084102A (de) |
AT (1) | ATE257183T1 (de) |
DE (2) | DE10003758A1 (de) |
WO (1) | WO2001055478A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011236507A (ja) * | 2003-09-19 | 2011-11-24 | Akzo Nobel Nv | 液体/蒸気堆積方法による基体の金属被覆 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070071896A1 (en) | 2003-08-20 | 2007-03-29 | Veeco Instruments Inc. | Alkyl push flow for vertical flow rotating disk reactors |
US7514119B2 (en) | 2005-04-29 | 2009-04-07 | Linde, Inc. | Method and apparatus for using solution based precursors for atomic layer deposition |
US20070007879A1 (en) * | 2005-07-11 | 2007-01-11 | Bergman Thomas J Jr | Low vapor pressure gas delivery system and apparatus |
KR101443665B1 (ko) * | 2006-10-06 | 2014-10-02 | 비코 인스트루먼츠 인코포레이티드 | 수직 흐름 회전 디스크 리액터를 위한 밀도 매칭 알킬 압출 흐름 |
US7883745B2 (en) * | 2007-07-30 | 2011-02-08 | Micron Technology, Inc. | Chemical vaporizer for material deposition systems and associated methods |
US9303319B2 (en) | 2010-12-17 | 2016-04-05 | Veeco Instruments Inc. | Gas injection system for chemical vapor deposition using sequenced valves |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0252755A1 (de) * | 1986-07-11 | 1988-01-13 | Unvala Limited | Chemische Vakuum-Abscheidung |
JP2896268B2 (ja) * | 1992-05-22 | 1999-05-31 | 三菱電機株式会社 | 半導体基板の表面処理装置及びその制御方法 |
JP2870719B2 (ja) * | 1993-01-29 | 1999-03-17 | 東京エレクトロン株式会社 | 処理装置 |
FR2707671B1 (fr) * | 1993-07-12 | 1995-09-15 | Centre Nat Rech Scient | Procédé et dispositif d'introduction de précurseurs dans une enceinte de dépôt chimique en phase vapeur. |
JPH0765991A (ja) * | 1993-08-26 | 1995-03-10 | Hitachi Electron Eng Co Ltd | Cvd反応炉のプラズマ測定装置 |
US5534066A (en) * | 1993-10-29 | 1996-07-09 | International Business Machines Corporation | Fluid delivery apparatus having an infrared feedline sensor |
US5520969A (en) * | 1994-02-04 | 1996-05-28 | Applied Materials, Inc. | Method for in-situ liquid flow rate estimation and verification |
US5492724A (en) * | 1994-02-22 | 1996-02-20 | Osram Sylvania Inc. | Method for the controlled delivery of vaporized chemical precursor to an LPCVD reactor |
US5451260A (en) * | 1994-04-15 | 1995-09-19 | Cornell Research Foundation, Inc. | Method and apparatus for CVD using liquid delivery system with an ultrasonic nozzle |
US5431734A (en) * | 1994-04-28 | 1995-07-11 | International Business Machines Corporation | Aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control |
JP3122311B2 (ja) * | 1994-06-29 | 2001-01-09 | 東京エレクトロン株式会社 | 成膜処理室への液体材料供給装置及びその使用方法 |
US5614247A (en) * | 1994-09-30 | 1997-03-25 | International Business Machines Corporation | Apparatus for chemical vapor deposition of aluminum oxide |
US5570781A (en) * | 1994-10-05 | 1996-11-05 | Slash Corporation | Container for retaining displaying media discs |
US5620524A (en) * | 1995-02-27 | 1997-04-15 | Fan; Chiko | Apparatus for fluid delivery in chemical vapor deposition systems |
US5570815A (en) * | 1995-06-06 | 1996-11-05 | International Business Machine Corp. | Chemical delivery system |
US5997642A (en) * | 1996-05-21 | 1999-12-07 | Symetrix Corporation | Method and apparatus for misted deposition of integrated circuit quality thin films |
US6244575B1 (en) * | 1996-10-02 | 2001-06-12 | Micron Technology, Inc. | Method and apparatus for vaporizing liquid precursors and system for using same |
US6280793B1 (en) * | 1996-11-20 | 2001-08-28 | Micron Technology, Inc. | Electrostatic method and apparatus for vaporizing precursors and system for using same |
US5876503A (en) * | 1996-11-27 | 1999-03-02 | Advanced Technology Materials, Inc. | Multiple vaporizer reagent supply system for chemical vapor deposition utilizing dissimilar precursor compositions |
JP3106991B2 (ja) * | 1997-02-13 | 2000-11-06 | 株式会社島津製作所 | 液体材料気化装置 |
US6074487A (en) * | 1997-02-13 | 2000-06-13 | Shimadzu Corporation | Unit for vaporizing liquid materials |
US6193936B1 (en) * | 1998-11-09 | 2001-02-27 | Nanogram Corporation | Reactant delivery apparatuses |
US6007330A (en) * | 1998-03-12 | 1999-12-28 | Cosmos Factory, Inc. | Liquid precursor delivery system |
US6358323B1 (en) * | 1998-07-21 | 2002-03-19 | Applied Materials, Inc. | Method and apparatus for improved control of process and purge material in a substrate processing system |
US6179925B1 (en) * | 1999-05-14 | 2001-01-30 | Applied Materials, Inc. | Method and apparatus for improved control of process and purge material in substrate processing system |
JP4335470B2 (ja) * | 2000-03-31 | 2009-09-30 | 東京エレクトロン株式会社 | 塗布装置及び混合装置 |
US6451692B1 (en) * | 2000-08-18 | 2002-09-17 | Micron Technology, Inc. | Preheating of chemical vapor deposition precursors |
US6838114B2 (en) * | 2002-05-24 | 2005-01-04 | Micron Technology, Inc. | Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces |
-
2000
- 2000-01-28 DE DE10003758A patent/DE10003758A1/de not_active Withdrawn
-
2001
- 2001-01-29 AT AT01946907T patent/ATE257183T1/de not_active IP Right Cessation
- 2001-01-29 WO PCT/DE2001/000348 patent/WO2001055478A2/de active IP Right Grant
- 2001-01-29 JP JP2001554503A patent/JP2003520903A/ja active Pending
- 2001-01-29 DE DE50101262T patent/DE50101262D1/de not_active Expired - Lifetime
- 2001-01-29 EP EP01946907A patent/EP1252362B1/de not_active Expired - Lifetime
- 2001-01-29 KR KR1020027009569A patent/KR20020084102A/ko not_active Application Discontinuation
-
2002
- 2002-07-25 US US10/205,639 patent/US20030056728A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011236507A (ja) * | 2003-09-19 | 2011-11-24 | Akzo Nobel Nv | 液体/蒸気堆積方法による基体の金属被覆 |
Also Published As
Publication number | Publication date |
---|---|
EP1252362B1 (de) | 2004-01-02 |
KR20020084102A (ko) | 2002-11-04 |
DE10003758A1 (de) | 2001-08-02 |
WO2001055478A3 (de) | 2002-02-28 |
ATE257183T1 (de) | 2004-01-15 |
EP1252362A2 (de) | 2002-10-30 |
WO2001055478A2 (de) | 2001-08-02 |
US20030056728A1 (en) | 2003-03-27 |
DE50101262D1 (de) | 2004-02-05 |
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