|
US7069101B1
(en)
|
1999-07-29 |
2006-06-27 |
Applied Materials, Inc. |
Computer integrated manufacturing techniques
|
|
US6449524B1
(en)
*
|
2000-01-04 |
2002-09-10 |
Advanced Micro Devices, Inc. |
Method and apparatus for using equipment state data for run-to-run control of manufacturing tools
|
|
KR100336525B1
(ko)
*
|
2000-08-07 |
2002-05-11 |
윤종용 |
반도체 장치의 제조를 위한 노광 방법
|
|
US7188142B2
(en)
|
2000-11-30 |
2007-03-06 |
Applied Materials, Inc. |
Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
|
|
US6910947B2
(en)
|
2001-06-19 |
2005-06-28 |
Applied Materials, Inc. |
Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
|
|
US7201936B2
(en)
|
2001-06-19 |
2007-04-10 |
Applied Materials, Inc. |
Method of feedback control of sub-atmospheric chemical vapor deposition processes
|
|
US6913938B2
(en)
|
2001-06-19 |
2005-07-05 |
Applied Materials, Inc. |
Feedback control of plasma-enhanced chemical vapor deposition processes
|
|
US7101799B2
(en)
|
2001-06-19 |
2006-09-05 |
Applied Materials, Inc. |
Feedforward and feedback control for conditioning of chemical mechanical polishing pad
|
|
US7082345B2
(en)
|
2001-06-19 |
2006-07-25 |
Applied Materials, Inc. |
Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
|
|
US7047099B2
(en)
|
2001-06-19 |
2006-05-16 |
Applied Materials Inc. |
Integrating tool, module, and fab level control
|
|
US7698012B2
(en)
*
|
2001-06-19 |
2010-04-13 |
Applied Materials, Inc. |
Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
|
|
US7160739B2
(en)
|
2001-06-19 |
2007-01-09 |
Applied Materials, Inc. |
Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
|
|
US7337019B2
(en)
|
2001-07-16 |
2008-02-26 |
Applied Materials, Inc. |
Integration of fault detection with run-to-run control
|
|
US6984198B2
(en)
|
2001-08-14 |
2006-01-10 |
Applied Materials, Inc. |
Experiment management system, method and medium
|
|
US7225047B2
(en)
|
2002-03-19 |
2007-05-29 |
Applied Materials, Inc. |
Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
|
|
JP2003324055A
(ja)
*
|
2002-04-30 |
2003-11-14 |
Canon Inc |
管理システム及び装置及び方法並びに露光装置及びその制御方法
|
|
US7069104B2
(en)
*
|
2002-04-30 |
2006-06-27 |
Canon Kabushiki Kaisha |
Management system, management apparatus, management method, and device manufacturing method
|
|
JP4018438B2
(ja)
|
2002-04-30 |
2007-12-05 |
キヤノン株式会社 |
半導体露光装置を管理する管理システム
|
|
JP4353498B2
(ja)
*
|
2002-04-30 |
2009-10-28 |
キヤノン株式会社 |
管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム
|
|
US6999836B2
(en)
|
2002-08-01 |
2006-02-14 |
Applied Materials, Inc. |
Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
|
|
AU2003290932A1
(en)
|
2002-11-15 |
2004-06-15 |
Applied Materials, Inc. |
Method, system and medium for controlling manufacture process having multivariate input parameters
|
|
US7095893B2
(en)
*
|
2003-01-06 |
2006-08-22 |
Banner Engineering Corporation |
System and method for determining an image decimation range for use in a machine vision system
|
|
US7333871B2
(en)
|
2003-01-21 |
2008-02-19 |
Applied Materials, Inc. |
Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
|
|
US7010374B2
(en)
*
|
2003-03-04 |
2006-03-07 |
Hitachi High-Technologies Corporation |
Method for controlling semiconductor processing apparatus
|
|
US6766214B1
(en)
*
|
2003-04-03 |
2004-07-20 |
Advanced Micro Devices, Inc. |
Adjusting a sampling rate based on state estimation results
|
|
US7205228B2
(en)
|
2003-06-03 |
2007-04-17 |
Applied Materials, Inc. |
Selective metal encapsulation schemes
|
|
US7354332B2
(en)
|
2003-08-04 |
2008-04-08 |
Applied Materials, Inc. |
Technique for process-qualifying a semiconductor manufacturing tool using metrology data
|
|
US7356377B2
(en)
|
2004-01-29 |
2008-04-08 |
Applied Materials, Inc. |
System, method, and medium for monitoring performance of an advanced process control system
|
|
US6980873B2
(en)
|
2004-04-23 |
2005-12-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
|
|
US7437404B2
(en)
*
|
2004-05-20 |
2008-10-14 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
System and method for improving equipment communication in semiconductor manufacturing equipment
|
|
US7096085B2
(en)
|
2004-05-28 |
2006-08-22 |
Applied Materials |
Process control by distinguishing a white noise component of a process variance
|
|
US6961626B1
(en)
|
2004-05-28 |
2005-11-01 |
Applied Materials, Inc |
Dynamic offset and feedback threshold
|
|
DE102005009026B4
(de)
*
|
2005-02-28 |
2011-04-07 |
Advanced Micro Devices, Inc., Sunnyvale |
Verfahren zum Betreiben einer fortschrittlichen Prozesssteuerung durch dynamisches Anpassen von Hierarchieebenen
|
|
JP4839101B2
(ja)
*
|
2006-03-08 |
2011-12-21 |
東京エレクトロン株式会社 |
基板処理装置、基板処理条件検討方法及び記憶媒体
|
|
US20070239305A1
(en)
*
|
2006-03-28 |
2007-10-11 |
Haoren Zhuang |
Process control systems and methods
|
|
US7532024B2
(en)
*
|
2006-07-05 |
2009-05-12 |
Optimaltest Ltd. |
Methods and systems for semiconductor testing using reference dice
|
|
US7809459B2
(en)
|
2007-12-31 |
2010-10-05 |
Hitachi Global Technologies Netherlands B.V. |
Advanced-process-control system utilizing a lambda tuner
|
|
US10203596B2
(en)
*
|
2016-01-06 |
2019-02-12 |
United Microelectronics Corp. |
Method of filtering overlay data by field
|
|
US11018064B2
(en)
*
|
2018-12-12 |
2021-05-25 |
Kla Corporation |
Multiple-tool parameter set configuration and misregistration measurement system and method
|
|
DE102020211992A1
(de)
*
|
2020-09-24 |
2022-03-24 |
Robert Bosch Gesellschaft mit beschränkter Haftung |
Verfahren und Vorrichtung zum Verarbeiten von mit einem Simulationsmodell für wenigstens einen Aspekt eines technischen Systems assoziierten Daten
|
|
CN116053165A
(zh)
*
|
2023-01-09 |
2023-05-02 |
长鑫存储技术有限公司 |
一种半导体加工的防御控制方法、系统、设备及存储介质
|