KR100950570B1 - 배치 제조 환경에서 실행간 제어 수행을 위한 방법 및 장치 - Google Patents

배치 제조 환경에서 실행간 제어 수행을 위한 방법 및 장치 Download PDF

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Publication number
KR100950570B1
KR100950570B1 KR1020027001938A KR20027001938A KR100950570B1 KR 100950570 B1 KR100950570 B1 KR 100950570B1 KR 1020027001938 A KR1020027001938 A KR 1020027001938A KR 20027001938 A KR20027001938 A KR 20027001938A KR 100950570 B1 KR100950570 B1 KR 100950570B1
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South Korea
Prior art keywords
control input
input parameters
lot
semiconductor devices
hierarchical
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Expired - Fee Related
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KR1020027001938A
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English (en)
Korean (ko)
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KR20020020965A (ko
Inventor
토프랙안토니제이.
캠벨윌리엄제이.
보데크리스토퍼에이.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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Publication of KR20020020965A publication Critical patent/KR20020020965A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70375—Multiphoton lithography or multiphoton photopolymerization; Imaging systems comprising means for converting one type of radiation into another type of radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/06—Electron sources; Electron guns
    • H01J37/073—Electron guns using field emission, photo emission, or secondary emission electron sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020027001938A 1999-08-10 2000-04-18 배치 제조 환경에서 실행간 제어 수행을 위한 방법 및 장치 Expired - Fee Related KR100950570B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/371,665 US6607926B1 (en) 1999-08-10 1999-08-10 Method and apparatus for performing run-to-run control in a batch manufacturing environment
US09/371,665 1999-08-10

Publications (2)

Publication Number Publication Date
KR20020020965A KR20020020965A (ko) 2002-03-16
KR100950570B1 true KR100950570B1 (ko) 2010-04-01

Family

ID=23464910

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027001938A Expired - Fee Related KR100950570B1 (ko) 1999-08-10 2000-04-18 배치 제조 환경에서 실행간 제어 수행을 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US6607926B1 (enExample)
EP (1) EP1218933A1 (enExample)
JP (1) JP2003506899A (enExample)
KR (1) KR100950570B1 (enExample)
WO (1) WO2001011679A1 (enExample)

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US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
JP2003324055A (ja) * 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4018438B2 (ja) 2002-04-30 2007-12-05 キヤノン株式会社 半導体露光装置を管理する管理システム
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP4353498B2 (ja) * 2002-04-30 2009-10-28 キヤノン株式会社 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム
CN100351725C (zh) 2002-08-01 2007-11-28 应用材料有限公司 用于在先进工艺控制系统中处理歪曲的度量数据的方法、系统和介质
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7095893B2 (en) * 2003-01-06 2006-08-22 Banner Engineering Corporation System and method for determining an image decimation range for use in a machine vision system
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7010374B2 (en) * 2003-03-04 2006-03-07 Hitachi High-Technologies Corporation Method for controlling semiconductor processing apparatus
US6766214B1 (en) * 2003-04-03 2004-07-20 Advanced Micro Devices, Inc. Adjusting a sampling rate based on state estimation results
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
DE102005009026B4 (de) * 2005-02-28 2011-04-07 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben einer fortschrittlichen Prozesssteuerung durch dynamisches Anpassen von Hierarchieebenen
JP4839101B2 (ja) * 2006-03-08 2011-12-21 東京エレクトロン株式会社 基板処理装置、基板処理条件検討方法及び記憶媒体
US20070239305A1 (en) * 2006-03-28 2007-10-11 Haoren Zhuang Process control systems and methods
US7532024B2 (en) 2006-07-05 2009-05-12 Optimaltest Ltd. Methods and systems for semiconductor testing using reference dice
US7809459B2 (en) 2007-12-31 2010-10-05 Hitachi Global Technologies Netherlands B.V. Advanced-process-control system utilizing a lambda tuner
US10203596B2 (en) * 2016-01-06 2019-02-12 United Microelectronics Corp. Method of filtering overlay data by field
US11018064B2 (en) * 2018-12-12 2021-05-25 Kla Corporation Multiple-tool parameter set configuration and misregistration measurement system and method
DE102020211992A1 (de) * 2020-09-24 2022-03-24 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum Verarbeiten von mit einem Simulationsmodell für wenigstens einen Aspekt eines technischen Systems assoziierten Daten
CN116053165A (zh) * 2023-01-09 2023-05-02 长鑫存储技术有限公司 一种半导体加工的防御控制方法、系统、设备及存储介质

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Also Published As

Publication number Publication date
JP2003506899A (ja) 2003-02-18
WO2001011679A1 (en) 2001-02-15
US6607926B1 (en) 2003-08-19
KR20020020965A (ko) 2002-03-16
EP1218933A1 (en) 2002-07-03

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