JP2003324229A - レーザベースの送信機のレーザアレイと集積回路とを相互接続する方法及び装置 - Google Patents

レーザベースの送信機のレーザアレイと集積回路とを相互接続する方法及び装置

Info

Publication number
JP2003324229A
JP2003324229A JP2003121471A JP2003121471A JP2003324229A JP 2003324229 A JP2003324229 A JP 2003324229A JP 2003121471 A JP2003121471 A JP 2003121471A JP 2003121471 A JP2003121471 A JP 2003121471A JP 2003324229 A JP2003324229 A JP 2003324229A
Authority
JP
Japan
Prior art keywords
driver
array
laser
eml
electrical conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003121471A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003324229A5 (enExample
Inventor
Mohammed Ershad Ali
モハメド・エルシャド・アリ
Edwin De Groot
エドウィン・デ・グロート
Brian Elliot Lemoff
ブライアン・エリオット・レモフ
Lisa Anne Buckman
リサ・アン・バックマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2003324229A publication Critical patent/JP2003324229A/ja
Publication of JP2003324229A5 publication Critical patent/JP2003324229A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP2003121471A 2002-04-30 2003-04-25 レーザベースの送信機のレーザアレイと集積回路とを相互接続する方法及び装置 Withdrawn JP2003324229A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/136928 2002-04-30
US10/136,928 US7065113B2 (en) 2002-04-30 2002-04-30 Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter

Publications (2)

Publication Number Publication Date
JP2003324229A true JP2003324229A (ja) 2003-11-14
JP2003324229A5 JP2003324229A5 (enExample) 2006-06-15

Family

ID=29215685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003121471A Withdrawn JP2003324229A (ja) 2002-04-30 2003-04-25 レーザベースの送信機のレーザアレイと集積回路とを相互接続する方法及び装置

Country Status (4)

Country Link
US (1) US7065113B2 (enExample)
EP (1) EP1359648B1 (enExample)
JP (1) JP2003324229A (enExample)
DE (1) DE60206022T2 (enExample)

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4359773A (en) * 1980-07-07 1982-11-16 Bell Telephone Laboratories, Incorporated Semiconductor lasers with selective driving circuit
US5541524A (en) * 1991-08-23 1996-07-30 Nchip, Inc. Burn-in technologies for unpackaged integrated circuits
US5394489A (en) 1993-07-27 1995-02-28 At&T Corp. Wavelength division multiplexed optical communication transmitters
JPH07169872A (ja) * 1993-12-13 1995-07-04 Fujitsu Ltd 半導体装置及びその製造方法
US5475263A (en) * 1994-02-14 1995-12-12 Delco Electronics Corp. Thick film hybrid multilayer circuit
US5583376A (en) * 1995-01-03 1996-12-10 Motorola, Inc. High performance semiconductor device with resin substrate and method for making the same
US5708280A (en) * 1996-06-21 1998-01-13 Motorola Integrated electro-optical package and method of fabrication
US5790728A (en) * 1996-06-28 1998-08-04 Motorola, Inc. Optical coupling component and method of making the same
JPH11168262A (ja) * 1997-09-30 1999-06-22 Canon Inc 面型光デバイス、その製造方法、および表示装置
JP3119246B2 (ja) 1998-08-19 2000-12-18 日本電気株式会社 光送信器
US6243508B1 (en) * 1999-06-01 2001-06-05 Picolight Incorporated Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
US6348991B1 (en) * 1999-10-29 2002-02-19 Intel Corporation Integrated circuit with opposed spatial light modulator and processor
US6639714B2 (en) * 1999-10-29 2003-10-28 Intel Corporation Integrated circuit with opposed spatial light modulator and processor
US6597718B2 (en) * 2000-07-18 2003-07-22 Multiplex, Inc. Electroabsorption-modulated fabry perot laser
US6406934B1 (en) * 2000-09-05 2002-06-18 Amkor Technology, Inc. Wafer level production of chip size semiconductor packages
US6849916B1 (en) * 2000-11-15 2005-02-01 Amkor Technology, Inc. Flip chip on glass sensor package
US6342406B1 (en) * 2000-11-15 2002-01-29 Amkor Technology, Inc. Flip chip on glass image sensor package fabrication method
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
US6635866B2 (en) * 2001-04-19 2003-10-21 Internation Business Machines Corporation Multi-functional fiber optic coupler
US6910812B2 (en) * 2001-05-15 2005-06-28 Peregrine Semiconductor Corporation Small-scale optoelectronic package
US6734552B2 (en) * 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
US7049693B2 (en) * 2001-08-29 2006-05-23 Micron Technology, Inc. Electrical contact array for substrate assemblies
US6647050B2 (en) * 2001-09-18 2003-11-11 Agilent Technologies, Inc. Flip-chip assembly for optically-pumped lasers
US6483037B1 (en) * 2001-11-13 2002-11-19 Motorola, Inc. Multilayer flexible FR4 circuit
US6642485B2 (en) * 2001-12-03 2003-11-04 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
US6864509B2 (en) * 2002-02-06 2005-03-08 Eugene Robert Worley Packaging optically coupled integrated circuits using flip-chip methods
US6867368B2 (en) * 2002-02-14 2005-03-15 Finisar Corporation Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
SG107595A1 (en) * 2002-06-18 2004-12-29 Micron Technology Inc Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods

Also Published As

Publication number Publication date
US7065113B2 (en) 2006-06-20
DE60206022D1 (de) 2005-10-13
DE60206022T2 (de) 2006-06-22
US20030202549A1 (en) 2003-10-30
EP1359648B1 (en) 2005-09-07
EP1359648A1 (en) 2003-11-05

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