DE60206022D1 - Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender - Google Patents
Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten SenderInfo
- Publication number
- DE60206022D1 DE60206022D1 DE60206022T DE60206022T DE60206022D1 DE 60206022 D1 DE60206022 D1 DE 60206022D1 DE 60206022 T DE60206022 T DE 60206022T DE 60206022 T DE60206022 T DE 60206022T DE 60206022 D1 DE60206022 D1 DE 60206022D1
- Authority
- DE
- Germany
- Prior art keywords
- laser
- integrated circuit
- based transmitter
- transmitter
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/136,928 US7065113B2 (en) | 2002-04-30 | 2002-04-30 | Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter |
US136928 | 2002-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60206022D1 true DE60206022D1 (de) | 2005-10-13 |
DE60206022T2 DE60206022T2 (de) | 2006-06-22 |
Family
ID=29215685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60206022T Expired - Lifetime DE60206022T2 (de) | 2002-04-30 | 2002-10-17 | Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender |
Country Status (4)
Country | Link |
---|---|
US (1) | US7065113B2 (de) |
EP (1) | EP1359648B1 (de) |
JP (1) | JP2003324229A (de) |
DE (1) | DE60206022T2 (de) |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4359773A (en) * | 1980-07-07 | 1982-11-16 | Bell Telephone Laboratories, Incorporated | Semiconductor lasers with selective driving circuit |
US5541524A (en) * | 1991-08-23 | 1996-07-30 | Nchip, Inc. | Burn-in technologies for unpackaged integrated circuits |
US5394489A (en) | 1993-07-27 | 1995-02-28 | At&T Corp. | Wavelength division multiplexed optical communication transmitters |
JPH07169872A (ja) * | 1993-12-13 | 1995-07-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5475263A (en) * | 1994-02-14 | 1995-12-12 | Delco Electronics Corp. | Thick film hybrid multilayer circuit |
US5583376A (en) * | 1995-01-03 | 1996-12-10 | Motorola, Inc. | High performance semiconductor device with resin substrate and method for making the same |
US5708280A (en) * | 1996-06-21 | 1998-01-13 | Motorola | Integrated electro-optical package and method of fabrication |
US5790728A (en) * | 1996-06-28 | 1998-08-04 | Motorola, Inc. | Optical coupling component and method of making the same |
JPH11168262A (ja) * | 1997-09-30 | 1999-06-22 | Canon Inc | 面型光デバイス、その製造方法、および表示装置 |
JP3119246B2 (ja) | 1998-08-19 | 2000-12-18 | 日本電気株式会社 | 光送信器 |
US6243508B1 (en) * | 1999-06-01 | 2001-06-05 | Picolight Incorporated | Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide |
JP3728147B2 (ja) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | 光電気混載配線基板 |
US6348991B1 (en) * | 1999-10-29 | 2002-02-19 | Intel Corporation | Integrated circuit with opposed spatial light modulator and processor |
US6639714B2 (en) * | 1999-10-29 | 2003-10-28 | Intel Corporation | Integrated circuit with opposed spatial light modulator and processor |
US6597718B2 (en) * | 2000-07-18 | 2003-07-22 | Multiplex, Inc. | Electroabsorption-modulated fabry perot laser |
US6406934B1 (en) * | 2000-09-05 | 2002-06-18 | Amkor Technology, Inc. | Wafer level production of chip size semiconductor packages |
US6849916B1 (en) * | 2000-11-15 | 2005-02-01 | Amkor Technology, Inc. | Flip chip on glass sensor package |
US6342406B1 (en) * | 2000-11-15 | 2002-01-29 | Amkor Technology, Inc. | Flip chip on glass image sensor package fabrication method |
US6686588B1 (en) * | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
US6635866B2 (en) * | 2001-04-19 | 2003-10-21 | Internation Business Machines Corporation | Multi-functional fiber optic coupler |
US6910812B2 (en) * | 2001-05-15 | 2005-06-28 | Peregrine Semiconductor Corporation | Small-scale optoelectronic package |
US6734552B2 (en) * | 2001-07-11 | 2004-05-11 | Asat Limited | Enhanced thermal dissipation integrated circuit package |
US7049693B2 (en) * | 2001-08-29 | 2006-05-23 | Micron Technology, Inc. | Electrical contact array for substrate assemblies |
US6647050B2 (en) * | 2001-09-18 | 2003-11-11 | Agilent Technologies, Inc. | Flip-chip assembly for optically-pumped lasers |
US6483037B1 (en) * | 2001-11-13 | 2002-11-19 | Motorola, Inc. | Multilayer flexible FR4 circuit |
US6642485B2 (en) * | 2001-12-03 | 2003-11-04 | Visteon Global Technologies, Inc. | System and method for mounting electronic components onto flexible substrates |
US6864509B2 (en) * | 2002-02-06 | 2005-03-08 | Eugene Robert Worley | Packaging optically coupled integrated circuits using flip-chip methods |
US6867368B2 (en) * | 2002-02-14 | 2005-03-15 | Finisar Corporation | Multi-layer ceramic feedthrough structure in a transmitter optical subassembly |
SG107595A1 (en) * | 2002-06-18 | 2004-12-29 | Micron Technology Inc | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods |
-
2002
- 2002-04-30 US US10/136,928 patent/US7065113B2/en not_active Expired - Fee Related
- 2002-10-17 DE DE60206022T patent/DE60206022T2/de not_active Expired - Lifetime
- 2002-10-17 EP EP02023302A patent/EP1359648B1/de not_active Expired - Fee Related
-
2003
- 2003-04-25 JP JP2003121471A patent/JP2003324229A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE60206022T2 (de) | 2006-06-22 |
US20030202549A1 (en) | 2003-10-30 |
EP1359648A1 (de) | 2003-11-05 |
EP1359648B1 (de) | 2005-09-07 |
JP2003324229A (ja) | 2003-11-14 |
US7065113B2 (en) | 2006-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD., |
|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 PU |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA |