DE60206022T2 - Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender - Google Patents

Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender Download PDF

Info

Publication number
DE60206022T2
DE60206022T2 DE60206022T DE60206022T DE60206022T2 DE 60206022 T2 DE60206022 T2 DE 60206022T2 DE 60206022 T DE60206022 T DE 60206022T DE 60206022 T DE60206022 T DE 60206022T DE 60206022 T2 DE60206022 T2 DE 60206022T2
Authority
DE
Germany
Prior art keywords
laser
electrical conductor
eml
page
field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60206022T
Other languages
German (de)
English (en)
Other versions
DE60206022D1 (de
Inventor
Mohammed Ershad Ali
Edwin De Groot
Brian Elliot Lemoff
Lisa Anne Buckman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE60206022D1 publication Critical patent/DE60206022D1/de
Application granted granted Critical
Publication of DE60206022T2 publication Critical patent/DE60206022T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE60206022T 2002-04-30 2002-10-17 Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender Expired - Lifetime DE60206022T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/136,928 US7065113B2 (en) 2002-04-30 2002-04-30 Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter
US136928 2002-04-30

Publications (2)

Publication Number Publication Date
DE60206022D1 DE60206022D1 (de) 2005-10-13
DE60206022T2 true DE60206022T2 (de) 2006-06-22

Family

ID=29215685

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60206022T Expired - Lifetime DE60206022T2 (de) 2002-04-30 2002-10-17 Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender

Country Status (4)

Country Link
US (1) US7065113B2 (enExample)
EP (1) EP1359648B1 (enExample)
JP (1) JP2003324229A (enExample)
DE (1) DE60206022T2 (enExample)

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4359773A (en) * 1980-07-07 1982-11-16 Bell Telephone Laboratories, Incorporated Semiconductor lasers with selective driving circuit
US5541524A (en) * 1991-08-23 1996-07-30 Nchip, Inc. Burn-in technologies for unpackaged integrated circuits
US5394489A (en) 1993-07-27 1995-02-28 At&T Corp. Wavelength division multiplexed optical communication transmitters
JPH07169872A (ja) * 1993-12-13 1995-07-04 Fujitsu Ltd 半導体装置及びその製造方法
US5475263A (en) * 1994-02-14 1995-12-12 Delco Electronics Corp. Thick film hybrid multilayer circuit
US5583376A (en) * 1995-01-03 1996-12-10 Motorola, Inc. High performance semiconductor device with resin substrate and method for making the same
US5708280A (en) * 1996-06-21 1998-01-13 Motorola Integrated electro-optical package and method of fabrication
US5790728A (en) * 1996-06-28 1998-08-04 Motorola, Inc. Optical coupling component and method of making the same
JPH11168262A (ja) * 1997-09-30 1999-06-22 Canon Inc 面型光デバイス、その製造方法、および表示装置
JP3119246B2 (ja) 1998-08-19 2000-12-18 日本電気株式会社 光送信器
US6243508B1 (en) * 1999-06-01 2001-06-05 Picolight Incorporated Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
US6348991B1 (en) * 1999-10-29 2002-02-19 Intel Corporation Integrated circuit with opposed spatial light modulator and processor
US6639714B2 (en) * 1999-10-29 2003-10-28 Intel Corporation Integrated circuit with opposed spatial light modulator and processor
US6597718B2 (en) * 2000-07-18 2003-07-22 Multiplex, Inc. Electroabsorption-modulated fabry perot laser
US6406934B1 (en) * 2000-09-05 2002-06-18 Amkor Technology, Inc. Wafer level production of chip size semiconductor packages
US6849916B1 (en) * 2000-11-15 2005-02-01 Amkor Technology, Inc. Flip chip on glass sensor package
US6342406B1 (en) * 2000-11-15 2002-01-29 Amkor Technology, Inc. Flip chip on glass image sensor package fabrication method
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
US6635866B2 (en) * 2001-04-19 2003-10-21 Internation Business Machines Corporation Multi-functional fiber optic coupler
US6910812B2 (en) * 2001-05-15 2005-06-28 Peregrine Semiconductor Corporation Small-scale optoelectronic package
US6734552B2 (en) * 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
US7049693B2 (en) * 2001-08-29 2006-05-23 Micron Technology, Inc. Electrical contact array for substrate assemblies
US6647050B2 (en) * 2001-09-18 2003-11-11 Agilent Technologies, Inc. Flip-chip assembly for optically-pumped lasers
US6483037B1 (en) * 2001-11-13 2002-11-19 Motorola, Inc. Multilayer flexible FR4 circuit
US6642485B2 (en) * 2001-12-03 2003-11-04 Visteon Global Technologies, Inc. System and method for mounting electronic components onto flexible substrates
US6864509B2 (en) * 2002-02-06 2005-03-08 Eugene Robert Worley Packaging optically coupled integrated circuits using flip-chip methods
US6867368B2 (en) * 2002-02-14 2005-03-15 Finisar Corporation Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
SG107595A1 (en) * 2002-06-18 2004-12-29 Micron Technology Inc Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assembles and packages including such semiconductor devices or packages and associated methods

Also Published As

Publication number Publication date
US7065113B2 (en) 2006-06-20
DE60206022D1 (de) 2005-10-13
US20030202549A1 (en) 2003-10-30
JP2003324229A (ja) 2003-11-14
EP1359648B1 (en) 2005-09-07
EP1359648A1 (en) 2003-11-05

Similar Documents

Publication Publication Date Title
EP0931346B1 (de) Mikroelektronisches bauteil in sandwich-bauweise
EP0766354B1 (de) Laserdiodenbauelement mit Wärmesenke
DE69221458T2 (de) Bausatz für einen Laserdiodenblock
DE602004006676T2 (de) Gefaltete flexible Verbindungsschaltung mit Rasterkontaktschnittstelle
DE69819216T2 (de) Freitragende Kugelverbindung für integrierte Schaltungschippackung
DE102008026229B4 (de) Wärmeübertragungsvorrichtung zur doppelseitigen Kühlung eines Halbleiterbauelementes
DE10361899B4 (de) Ausdehnungsangepasstes wärmespreizendes Mehrlagensubstrat
EP0055376A2 (de) Anschlussteil für das lösbare Verbinden eines Halbleiterchips mit ihm
WO1998015005A9 (de) Mikroelektronisches bauteil in sandwich-bauweise
DE10251247A1 (de) Halbleiterbaugruppe mit Halbleiterchip, gebildet unter Verwendung eines Halbleiters mit breitem Bandabstand als Basismaterial
DE10217073A1 (de) Miniatur-Halbleitergehäuse für optoelektronische Bauelemente
DE102019127593B4 (de) Sockel für ein Gehäuse mit einer elektronischen Komponente zur Hochfrequenz-Signalübertragung
DE60114338T2 (de) Herstellungsverfahren für optisches Halbleitermodul
DE60132214T2 (de) Verfahren zur herstellung einer optischen montageplatte
DE10032796A1 (de) Optomodul
DE60320613T2 (de) Optische Vorrichtung und deren Herstellungsverfahren, optisches Modul, und optisches Transmissionssystem
DE602005003720T2 (de) Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign
DE102021104885A1 (de) Sockel und Gehäuse mit integriertem Kühler für elektronische Bauelemente
DE112021007591T5 (de) Halbleiterlaser-Lichtquellenvorrichtung
DE102010031023B9 (de) Parallele optische Kommunikationsvorrichtungen mit schweißbaren Einsätzen, sowie zugehörige Verfahren zum Festmachen
DE10227544B4 (de) Vorrichtung zur optischen Datenübertragung
DE60206022T2 (de) Verfahren und Vorrichtung zur Verbindung eines Laser und einer integrierten Schaltung in einem laser-basierten Sender
EP0915515A2 (de) Anordnung zum Übertragen von elektrischen Signalen zwischen einem auf einer Trägerplatte thermisch isoliertem Modul und angrenzenden Nachbarmodulen
EP3577506B1 (de) Elektrooptische schaltung mit einer optischen übertragungsstrecke, elektrooptische baugruppe zum einbau in eine solche elektrooptische schaltung und verfahren zum erzeugen einer optischen schnittstelle einer elektrooptischen schaltung
DE19910164C2 (de) Elektrooptisches Modul

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.,

8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 PU

8328 Change in the person/name/address of the agent

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA