JP2003234020A - 導電性微粒子 - Google Patents
導電性微粒子Info
- Publication number
- JP2003234020A JP2003234020A JP2002029784A JP2002029784A JP2003234020A JP 2003234020 A JP2003234020 A JP 2003234020A JP 2002029784 A JP2002029784 A JP 2002029784A JP 2002029784 A JP2002029784 A JP 2002029784A JP 2003234020 A JP2003234020 A JP 2003234020A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- fine particles
- particles
- metal layer
- conductive fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 62
- 239000007771 core particle Substances 0.000 claims abstract description 15
- 239000010419 fine particle Substances 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000011162 core material Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 5
- 230000002265 prevention Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 66
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 238000007772 electroless plating Methods 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002666 PdCl2 Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029784A JP2003234020A (ja) | 2002-02-06 | 2002-02-06 | 導電性微粒子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029784A JP2003234020A (ja) | 2002-02-06 | 2002-02-06 | 導電性微粒子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003234020A true JP2003234020A (ja) | 2003-08-22 |
| JP2003234020A5 JP2003234020A5 (enrdf_load_stackoverflow) | 2005-08-11 |
Family
ID=27773836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002029784A Pending JP2003234020A (ja) | 2002-02-06 | 2002-02-06 | 導電性微粒子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003234020A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317270A (ja) * | 2004-04-27 | 2005-11-10 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| WO2006019154A1 (ja) * | 2004-08-20 | 2006-02-23 | Sekisui Chemical Co., Ltd. | 導電性微粒子及び異方性導電材料 |
| JP2006228474A (ja) * | 2005-02-15 | 2006-08-31 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
| JP2006269296A (ja) * | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料 |
| JP2006344416A (ja) * | 2005-06-07 | 2006-12-21 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
| JP2006351508A (ja) * | 2005-05-20 | 2006-12-28 | Sekisui Chem Co Ltd | 導電性粒子、導電性粒子の製造方法及び異方性導電材料 |
| JP2007035573A (ja) * | 2005-07-29 | 2007-02-08 | Sekisui Chem Co Ltd | 導電性微粒子、及び、異方性導電材料 |
| JP2007035572A (ja) * | 2005-07-29 | 2007-02-08 | Sekisui Chem Co Ltd | 導電性微粒子、及び、異方性導電材料 |
| JP2007207665A (ja) * | 2006-02-03 | 2007-08-16 | Sekisui Chem Co Ltd | 導電性粒子の製造方法、導電性粒子及び異方性導電材料 |
| WO2008130080A1 (en) * | 2007-04-23 | 2008-10-30 | Hanwha Chemical Corporation | Manufacturing method of conductive electroless plating powder |
| US7491445B2 (en) * | 2004-09-02 | 2009-02-17 | Sekisui Chemical Co., Ltd. | Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof |
| WO2009063827A1 (ja) * | 2007-11-12 | 2009-05-22 | Hitachi Chemical Company, Ltd. | 回路接続材料、及び回路部材の接続構造 |
| JP2012109252A (ja) * | 2011-12-22 | 2012-06-07 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| JP2012151486A (ja) * | 2006-01-16 | 2012-08-09 | Hitachi Chem Co Ltd | 導電性接着フィルム |
| US9173302B2 (en) | 2006-08-29 | 2015-10-27 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1171560A (ja) * | 1997-08-28 | 1999-03-16 | Ricoh Co Ltd | 異方導電性接着材および液晶表示装置および液晶表示装置の作製方法 |
| JPH1173818A (ja) * | 1997-08-28 | 1999-03-16 | Ricoh Co Ltd | 導電性粒子および異方導電性接着材および液晶表示装置 |
| JP2000195339A (ja) * | 1998-12-25 | 2000-07-14 | Sony Chem Corp | 異方導電性接着フィルム |
| JP2000243132A (ja) * | 1999-02-22 | 2000-09-08 | Nippon Chem Ind Co Ltd | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
-
2002
- 2002-02-06 JP JP2002029784A patent/JP2003234020A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1171560A (ja) * | 1997-08-28 | 1999-03-16 | Ricoh Co Ltd | 異方導電性接着材および液晶表示装置および液晶表示装置の作製方法 |
| JPH1173818A (ja) * | 1997-08-28 | 1999-03-16 | Ricoh Co Ltd | 導電性粒子および異方導電性接着材および液晶表示装置 |
| JP2000195339A (ja) * | 1998-12-25 | 2000-07-14 | Sony Chem Corp | 異方導電性接着フィルム |
| JP2000243132A (ja) * | 1999-02-22 | 2000-09-08 | Nippon Chem Ind Co Ltd | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317270A (ja) * | 2004-04-27 | 2005-11-10 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| US7470416B2 (en) | 2004-08-20 | 2008-12-30 | Sekisui Chemical Co., Ltd. | Conductive fine particles and anisotropic conductive material |
| WO2006019154A1 (ja) * | 2004-08-20 | 2006-02-23 | Sekisui Chemical Co., Ltd. | 導電性微粒子及び異方性導電材料 |
| JP2006059721A (ja) * | 2004-08-20 | 2006-03-02 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
| US7491445B2 (en) * | 2004-09-02 | 2009-02-17 | Sekisui Chemical Co., Ltd. | Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof |
| JP2006228474A (ja) * | 2005-02-15 | 2006-08-31 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
| JP2006269296A (ja) * | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料 |
| JP2006351508A (ja) * | 2005-05-20 | 2006-12-28 | Sekisui Chem Co Ltd | 導電性粒子、導電性粒子の製造方法及び異方性導電材料 |
| JP2006344416A (ja) * | 2005-06-07 | 2006-12-21 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
| JP2007035572A (ja) * | 2005-07-29 | 2007-02-08 | Sekisui Chem Co Ltd | 導電性微粒子、及び、異方性導電材料 |
| JP2007035573A (ja) * | 2005-07-29 | 2007-02-08 | Sekisui Chem Co Ltd | 導電性微粒子、及び、異方性導電材料 |
| JP2012151486A (ja) * | 2006-01-16 | 2012-08-09 | Hitachi Chem Co Ltd | 導電性接着フィルム |
| JP2007207665A (ja) * | 2006-02-03 | 2007-08-16 | Sekisui Chem Co Ltd | 導電性粒子の製造方法、導電性粒子及び異方性導電材料 |
| US9173302B2 (en) | 2006-08-29 | 2015-10-27 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
| WO2008130080A1 (en) * | 2007-04-23 | 2008-10-30 | Hanwha Chemical Corporation | Manufacturing method of conductive electroless plating powder |
| KR100879578B1 (ko) * | 2007-04-23 | 2009-01-22 | 한화석유화학 주식회사 | 도전성 무전해 도금분체의 제조방법 |
| WO2009063827A1 (ja) * | 2007-11-12 | 2009-05-22 | Hitachi Chemical Company, Ltd. | 回路接続材料、及び回路部材の接続構造 |
| JP2012109252A (ja) * | 2011-12-22 | 2012-06-07 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050117 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050117 |
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| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060718 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060906 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070104 |