JP2003209072A - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法

Info

Publication number
JP2003209072A
JP2003209072A JP2002006557A JP2002006557A JP2003209072A JP 2003209072 A JP2003209072 A JP 2003209072A JP 2002006557 A JP2002006557 A JP 2002006557A JP 2002006557 A JP2002006557 A JP 2002006557A JP 2003209072 A JP2003209072 A JP 2003209072A
Authority
JP
Japan
Prior art keywords
wafer
pressure
layer
adhesive
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002006557A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003209072A5 (enExample
Inventor
Masateru Fukuoka
正輝 福岡
Yasuhiko Oyama
康彦 大山
Munehiro Hatakei
宗宏 畠井
Satoshi Hayashi
聡史 林
Shigeru Danjo
滋 檀上
Masahiko Kitamura
政彦 北村
Koichi Yajima
興一 矢嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd, Disco Abrasive Systems Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002006557A priority Critical patent/JP2003209072A/ja
Priority to CNB038002329A priority patent/CN1322554C/zh
Priority to PCT/JP2003/000238 priority patent/WO2003060972A1/ja
Priority to US10/475,257 priority patent/US6939741B2/en
Priority to TW092100744A priority patent/TWI267168B/zh
Priority to EP03701719A priority patent/EP1467402A4/en
Priority to KR10-2003-7014522A priority patent/KR20040105546A/ko
Publication of JP2003209072A publication Critical patent/JP2003209072A/ja
Publication of JP2003209072A5 publication Critical patent/JP2003209072A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2002006557A 2002-01-15 2002-01-15 Ｉｃチップの製造方法 Pending JP2003209072A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002006557A JP2003209072A (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法
CNB038002329A CN1322554C (zh) 2002-01-15 2003-01-15 Ic片的生产方法
PCT/JP2003/000238 WO2003060972A1 (en) 2002-01-15 2003-01-15 Ic chip manufacturing method
US10/475,257 US6939741B2 (en) 2002-01-15 2003-01-15 IC chip manufacturing method
TW092100744A TWI267168B (en) 2002-01-15 2003-01-15 Manufacturing method of IC chip
EP03701719A EP1467402A4 (en) 2002-01-15 2003-01-15 IC CHIP PROCESS
KR10-2003-7014522A KR20040105546A (ko) 2002-01-15 2003-01-15 Ｉｃ칩의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002006557A JP2003209072A (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2003209072A true JP2003209072A (ja) 2003-07-25
JP2003209072A5 JP2003209072A5 (enExample) 2004-12-24

Family

ID=27645292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002006557A Pending JP2003209072A (ja) 2002-01-15 2002-01-15 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2003209072A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018524144A (ja) * 2015-05-01 2018-08-30 デュポン テイジン フィルムズ ユー．エス．リミテッド パートナーシップ 剥離可能な接着性ポリマーフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018524144A (ja) * 2015-05-01 2018-08-30 デュポン テイジン フィルムズ ユー．エス．リミテッド パートナーシップ 剥離可能な接着性ポリマーフィルム

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