JP2003198043A5 - - Google Patents

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Publication number
JP2003198043A5
JP2003198043A5 JP2001390918A JP2001390918A JP2003198043A5 JP 2003198043 A5 JP2003198043 A5 JP 2003198043A5 JP 2001390918 A JP2001390918 A JP 2001390918A JP 2001390918 A JP2001390918 A JP 2001390918A JP 2003198043 A5 JP2003198043 A5 JP 2003198043A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor laser
laser device
thickness
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001390918A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003198043A (ja
JP4236840B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001390918A priority Critical patent/JP4236840B2/ja
Priority claimed from JP2001390918A external-priority patent/JP4236840B2/ja
Priority to US10/322,599 priority patent/US7065117B2/en
Publication of JP2003198043A publication Critical patent/JP2003198043A/ja
Publication of JP2003198043A5 publication Critical patent/JP2003198043A5/ja
Priority to US11/408,932 priority patent/US20060193360A1/en
Application granted granted Critical
Publication of JP4236840B2 publication Critical patent/JP4236840B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001390918A 2001-12-25 2001-12-25 半導体レーザ素子 Expired - Fee Related JP4236840B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001390918A JP4236840B2 (ja) 2001-12-25 2001-12-25 半導体レーザ素子
US10/322,599 US7065117B2 (en) 2001-12-25 2002-12-19 Semiconductor laser element having end-facet protection layer which includes unoxidized or unnitrided first sublayer formed on end facet and second sublayer produced by oxidizing or nitriding the surface of the first sublayer
US11/408,932 US20060193360A1 (en) 2001-12-25 2006-04-24 Semiconductor laser element having end-facet protection layer which includes unoxidized or unnitrided first sublayer formed on end facet and second sublayer produced by oxidizing or nitriding the surface of the first sublayer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001390918A JP4236840B2 (ja) 2001-12-25 2001-12-25 半導体レーザ素子

Publications (3)

Publication Number Publication Date
JP2003198043A JP2003198043A (ja) 2003-07-11
JP2003198043A5 true JP2003198043A5 (enExample) 2005-02-10
JP4236840B2 JP4236840B2 (ja) 2009-03-11

Family

ID=19188461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001390918A Expired - Fee Related JP4236840B2 (ja) 2001-12-25 2001-12-25 半導体レーザ素子

Country Status (2)

Country Link
US (2) US7065117B2 (enExample)
JP (1) JP4236840B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072488A (ja) * 2003-08-27 2005-03-17 Mitsubishi Electric Corp 半導体レーザ装置
JP2008543090A (ja) * 2005-06-01 2008-11-27 ビンオプテイクス・コーポレイシヨン 空間フィルタ
JP5285835B2 (ja) * 2005-07-13 2013-09-11 株式会社東芝 半導体素子およびその製造方法
JP5191650B2 (ja) * 2005-12-16 2013-05-08 シャープ株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
JP5430826B2 (ja) * 2006-03-08 2014-03-05 シャープ株式会社 窒化物半導体レーザ素子
GB2439973A (en) * 2006-07-13 2008-01-16 Sharp Kk Modifying the optical properties of a nitride optoelectronic device
US7646798B2 (en) * 2006-12-28 2010-01-12 Nichia Corporation Nitride semiconductor laser element
JP2010073757A (ja) * 2008-09-16 2010-04-02 Furukawa Electric Co Ltd:The 半導体レーザ素子の製造方法および半導体レーザ素子
US9343871B1 (en) * 2012-04-05 2016-05-17 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US10559939B1 (en) 2012-04-05 2020-02-11 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US8948222B1 (en) 2013-09-30 2015-02-03 Jds Uniphase Corporation Laser diode light source
CN106033866B (zh) * 2015-03-20 2019-12-03 云晖科技有限公司 垂直腔面发射激光器
US10340415B2 (en) * 2016-09-01 2019-07-02 Lg Innotek Co., Ltd. Semiconductor device and semiconductor device package including the same
KR102524303B1 (ko) 2016-09-10 2023-04-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자
EP3514840A4 (en) 2016-09-13 2019-08-21 LG Innotek Co., Ltd. SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT HOUSING THEREWITH
US10903395B2 (en) 2016-11-24 2021-01-26 Lg Innotek Co., Ltd. Semiconductor device having varying concentrations of aluminum
DE102017112610A1 (de) * 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser
US10714900B2 (en) 2018-06-04 2020-07-14 Ii-Vi Delaware, Inc. Ex-situ conditioning of laser facets and passivated devices formed using the same
US10505332B1 (en) 2018-06-04 2019-12-10 Ii-Vi Delaware, Inc. Ex-situ conditioning of laser facets and passivated devices formed using the same
US12424819B2 (en) * 2022-05-26 2025-09-23 Arima Lasers Corp. Edge-emitting semiconductor laser with high thermal conductivity and low reflection front mirror surface

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033320B2 (ja) * 1978-03-24 1985-08-02 日本電気株式会社 半導体レ−ザ及びその製造方法
US4563368A (en) * 1983-02-14 1986-01-07 Xerox Corporation Passivation for surfaces and interfaces of semiconductor laser facets or the like
US4656638A (en) 1983-02-14 1987-04-07 Xerox Corporation Passivation for surfaces and interfaces of semiconductor laser facets or the like
JPH0447979Y2 (enExample) * 1986-01-20 1992-11-12
EP0416190B1 (en) * 1989-09-07 1994-06-01 International Business Machines Corporation Method for mirror passivation of semiconductor laser diodes
US5144634A (en) 1989-09-07 1992-09-01 International Business Machines Corporation Method for mirror passivation of semiconductor laser diodes
JPH0766500A (ja) * 1993-08-27 1995-03-10 Toshiba Corp 光学薄膜形成方法
EP0792531A1 (en) * 1995-09-14 1997-09-03 Koninklijke Philips Electronics N.V. Semiconductor diode laser and method of manufacturing same
JPH09162496A (ja) * 1995-12-12 1997-06-20 Nippon Telegr & Teleph Corp <Ntt> 半導体レーザ及びその製造方法
JP3710627B2 (ja) * 1997-08-13 2005-10-26 三菱化学株式会社 化合物半導体発光素子
EP0898345A3 (en) 1997-08-13 2004-01-02 Mitsubishi Chemical Corporation Compound semiconductor light emitting device and method of fabricating the same
JP3196831B2 (ja) * 1998-04-20 2001-08-06 日本電気株式会社 半導体レーザ素子の製造方法
JP3699851B2 (ja) * 1998-05-11 2005-09-28 三菱化学株式会社 半導体発光素子の製造方法
JP3699842B2 (ja) * 1998-12-04 2005-09-28 三菱化学株式会社 化合物半導体発光素子
JP3699840B2 (ja) * 1998-12-04 2005-09-28 三菱化学株式会社 化合物半導体発光素子
JP3814432B2 (ja) * 1998-12-04 2006-08-30 三菱化学株式会社 化合物半導体発光素子
JP2001230483A (ja) 2000-02-14 2001-08-24 Fuji Photo Film Co Ltd 半導体レーザ装置
JP3887174B2 (ja) * 2001-01-24 2007-02-28 日本オプネクスト株式会社 半導体発光装置
US6975661B2 (en) * 2001-06-14 2005-12-13 Finisar Corporation Method and apparatus for producing VCSELS with dielectric mirrors and self-aligned gain guide
US6812152B2 (en) * 2001-08-09 2004-11-02 Comlase Ab Method to obtain contamination free laser mirrors and passivation of these

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