CN106033866B - 垂直腔面发射激光器 - Google Patents

垂直腔面发射激光器 Download PDF

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CN106033866B
CN106033866B CN201510124564.0A CN201510124564A CN106033866B CN 106033866 B CN106033866 B CN 106033866B CN 201510124564 A CN201510124564 A CN 201510124564A CN 106033866 B CN106033866 B CN 106033866B
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巴多拉帕斯·巴布·达亚尔
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Yun Hui Technology Co Ltd
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Abstract

本发明公开一种垂直腔面发射激光器,适于发射850nm和/或附近波长的光,所述垂直腔面发射激光器包括有源区,所述有源区包括:一个或多个InxGa1‑xAs量子阱;以及与所述量子阱连接的两个或多个GaAs1‑yPy势垒;其中数值x的范围为0.05~0.1,数值y的范围为0.2~0.29。本发明具有更强光限制、更高的通信速度、更好高温稳定性、更长使用寿命。

Description

垂直腔面发射激光器
技术领域
本发明涉及一种垂直腔面发射激光器(vertical cavity surface emittinglaser,VCSEL),尤其涉及一种发射850nm波长的光、且具有良好稳定性能的量子阱和势垒的VCSEL。
背景技术
VCSEL是一种能发射垂直于衬底方向的光的半导体激光器。一般地,VCSEL包括一有源区,该有源区具有大增益、低阈值电流、高光功效及稳定性等特点以足够地控制偏振。该VCSEL适用于多种应用例如图像形成装置的光源、光学拾取装置的光源、光学连接的光通信发射机或光模块等等。
该VCSEL的有源区设置在两个半导体多层反射镜(例如分布布拉格反射器DBR)之间,在该区域里电子和空穴结合形成光。该有源区包括量子阱结构以向光子器件提供较低的阈值电流、并提供高效率和在选择光波长上提供更好的适应性。
量子阱结构由至少一个(n个)量子阱层以及与之交替设置的相应数目(n+1个)势垒层组成。每一量子阱层的厚度在一纳米到十纳米之间。势垒层通常比量子阱层厚些。量子阱结构的量子阱层的半导体材料选择因应光子器件的所需光波长而设,而势垒层的半导体材料则与量子阱层的结构不一样,其具有较大的能带隙能量以及较低的折射率。
现有的一种产生850nm波长的VCSEL,其有源区的量子阱结构的量子阱由砷化镓(GaAs)、铝砷化镓(AlGaAs)组成。如图1a所示,为具有该量子阱结构的有代表性的有源区10的能量带图示。图中纵坐标标示为能量带,横坐标标示为自衬底的距离。如图所示,该有源区10包括第一覆盖层121、由AlGaAs制成的第一势垒层141、由GaAs制成的量子阱层16、由AlGaAs制成的第二势垒层142,以及第二覆盖层121。图1a展示了上述每一层体的半导体材料的导带101及价带102的能量。
该具有AlGaAs势垒层141、142以及GaAs量子阱层16的有源区10具有I类异质结构。在该异质结构中,GaAs量子阱层16的价带能量比AlGaAs势垒层141、142的价带能量大,但GaAs量子阱层16的导带能量则比AlGaAs势垒层141、142的价带能量小。
在具有I类异质结构的量子阱结构中的带能量将电子156限制在导带101中,将空穴158限制在价带102中,由此,电子空穴复合过程在同一层中的载流子之间发生。
然而,由于各自固定的能带隙值,使得在GaAs量子阱和AlGaAs势垒层之间的导带和价带突变(ΔEc和ΔEv)十分小,因此在量子阱层16的载流子会发生泄漏,如图1b所示的从量子阱层向势垒层外漏,从而使性能降低,例如有源区的光限制变低,高温性能降低且VCSEL可靠性降低从而缩短其使用寿命。再且,在水汽潮湿的环境下,势垒层中的铝元素容易被氧化并形成瑕疵从而进一步缩短VCSEL的使用寿命。
在美国专利US 8,837,547B2、美国公开专利申请US 2014/0198817以及美国公开专利申请US 2012/0236891中分别公开了850nm波长的VCSEL,但均或多或少存在上述的缺陷。
因此,亟待一种改进的具有更强光限制、更高速、更好高温稳定性、且更长使用寿命的VCSEL,以克服上述缺陷。
发明内容
本发明的目的在于提供一种垂直腔面发射激光器(VCSEL),其具有更强光限制、更高的通信速度、更好高温稳定性、更长使用寿命。
为实现上述目的,本发明提供一种垂直腔面发射激光器(VCSEL),适于发射850nm和/或附近波长的光,所述VCSEL包括有源区,所述有源区包括:一个或多个InxGa1-xAs量子阱;以及与所述量子阱连接的两个或多个GaAs1-yPy势垒;其中数值x的范围为0.05~0.1,数值y的范围为0.2~0.29。
作为一个实施例,所述有源区还包括形成在所述势垒附近的一个或多个分离限制异质结构层,所述分离限制异质结构层由AlGaAs制成。
较佳地,所述分离限制异质结构层形成连续的斜坡状。
作为另一实施例,所述量子阱和所述势垒的厚度范围是3nm~5nm。
在本发明中,850nm波长的VCSEL的导带突变(ΔEc)和价带突变(ΔEv)与传统的GaAs量子阱和AlGaAs势垒的850nmVCSEL之间的差异在几个meV,甚至大得更多。较佳地,两个能量带的能带隙突变ΔEc、ΔEv分别比传统的GaAs量子阱和AlGaAs势垒大5~50meV,以及5~20meV。
在另一实施例中,所述量子阱和所述势垒在无掺杂的GaAs衬底,或p掺杂或n掺杂的硅衬底上生长。
较佳地,该VCSEL还包括一台面结构以及覆盖在所述台面结构的外表面上的钝化层,所述钝化层由低介质常数氧化物(如SiOxN)和/或聚合物(如聚酰亚胺或BCB)制成。
较佳地,还包括层夹所述有源区的两个反射镜堆,更佳为分布布拉格反射器(DBR)。
较佳地,至少一所述反射镜堆包括一环形氧化层以提供一电流限制结构,例如可为包括高含量铝(大于98%)的III-V族半导体材料。
与现有技术相比,本发明的VCSEL的有源区采用压缩应变InxGa1-xAs量子阱以及拉伸应变GaAs1-yPy势垒层,而非传统的GaAs势垒层,本发明的GaAs1-yPy势垒层可提供更高的能量带以防止载流子漏出或外流,从而获得更高的光限制以及提高通信速度。同时GaAs1-yPy势垒层可抵抗更高温并获得更长的使用寿命。
通过以下的描述并结合附图,本发明将变得更加清晰,这些附图用于解释本发明的实施例。
附图说明
图1a为传统的VCSEL的有源区的能量带示意图。
图1b展示了图1a中传统有源区的载流子漏出。
图2为本发明的VCSEL的一个实施例的截面图。
图3为本发明的VCSEL的有源区的简化图。
图4为本发明VCSEL和传统VCSEL的能量带对比示意图。
图5a展示了依照本发明VCSEL计算出的全VCSEL F-P腔凹陷波长。
图5b展示了依照本发明VCSEL试验得出的外延生长或MOCVD生长的全VCSEL F-P腔凹陷波长。
具体实施方式
下面将参考附图阐述本发明几个不同的最佳实施例,其中不同图中相同的标号代表相同的部件。如上所述,本发明的实质在于提供各一种VCSEL,其具有更强光限制、更高速、更好高温稳定性、更长使用寿命。
予以注意的是,本发明的VCSEL旨在提供850nm和/或附近波长的光,840nm的光致发光,以及846nm的全VCSEL法布里-珀罗(Fabry-Perot,FP)腔凹陷的光。
图2为本发明VCSEL装置的一个实施例的截面图。该VCSEL装置200包括衬底201、形成在衬底201上的底部DBR 202以及顶部DBR 201、层压在底部DBR 202和顶部DBR 204之间的有源区203以产生激光。在顶部DBR 204上电性连接有顶部电极层206,在衬底201之下电性连接有底部电极层207,从而为有源区203提供电源以激发激光。在顶部电极层206上开设有第一窗口29从而将顶部DBR 204的一部分暴露在外。
该衬底201可由n型硅掺杂的GaAs或p型硅掺杂的GaAs制成,或无掺杂的半绝缘GaAs制成。在本实施例中,该衬底201为无掺杂半绝缘GaAs。该底部电极207(207a、207b)形成在顶部可见,且与衬底201形成欧姆接触,该底部电极207通常由电导体金属制成。可选地,底部电极207同样可形成在衬底201的底部,如图2所示。
特定地,底部DBR 202可为n型反射器或p型反射器,顶部DBR 204则具有与之相反的极性。在本实施例中,该底部DBR 202为n型反射器,顶部DBR204为p型反射器。一般地,该底部、顶部DRB 202、204分别为第III-V族半导体层体且各层体在不同的折射率层上交替设置,其制成的材料可以是具有不同摩尔分数的铝(Al)或镓(Ga)例如AlAs、GaAs、AlGaAs。在实际实践中,每一DBR 202或204可包括多个层体,例如20或30对层体,甚至更多。较佳地,为获得850nm附近波长的光,该底部DBR 202优选包括Al0.12Ga0.88As和Al0.9Ga0.1As,以及Al0.12Ga0.88As和AlAs层体。
一般地,该有源区203由一个或多个量子阱以及多个势垒组成。该有源区203用于发射预定波长的光,本发明中的预定波长850nm适用于具有特定结构的本发明的VCSEL装置200的高速数据通信,而其他波长则不适用。
当在顶部电极层206及底部电极层207上施加驱动电流后,电流流经有源区203,从而在有源区203上产生激光。该激光在经过顶部DBR 204和底部DBR202之间的界面反射后被放大,继而通过VCSEL装置200的第一窗口29上垂直地向外发射。
请参考图2,该VCSEL装置200还包括重p型掺杂的接触层208,其形成在顶部电极层206和顶部DBR 204之间。该接触层208可由GaAs,AlGaAS或InGaAs制成。
作为一个优选实施例,在有源区203上形成有一氧化物部分310,该氧化物部分310包括至少两个相位匹配层(Phase Matching Layer,PML)311、312(在图中只展示了两个相位匹配层),以及形成在两相位匹配层311、312之间的电流限制层313。该电流限制层313由高铝摩尔分数(大于98%)的材料制成,如Al0.98Ga0.02As或经过湿式氧化法制造的含铝氧化物的AlAs半导体层,以通过氧化物孔区域314而引导电流流向有源区203。当工作时,除了其上的一个圆环形或多边形且与第一窗口29直径相当的窗口314,该电流限制层313是绝缘的。由于大部分电流均朝向有源区203的中心,因此大部分的光都产生在有源区203的中心。而相位匹配层311、312由具有不同摩尔分数的Al和Ga组成的AlGaAs半导体。为了能高效地高速运行,VCSEL结构可包括具有至少一个电流限制层的至少一个氧化物部分,这是由于加入的电流限制层会降低台面结构的电容进而提高VCSEL装置的带宽及速度。
在VCSEL装置200的台面结构(图未示)中,一层作为钝化层的绝缘体(图未示)覆盖在台面结构的外侧表面上,亦即覆盖在上述元件的暴露在外的侧面上,该钝化层由硅氧氮化物(SiOxN)组成,其厚度约1.0μm。除了该钝化层,同时还可覆盖厚度为5~10μm的聚酰亚胺或BCB涂层从而进一步降低p型或n型电极电容。上述该绝缘层可保护VCSEL装置200的所有层体。
作为本发明的构思,如图3所示,该VCSEL装置200的有源区203包括一个或多个量子阱280以及两个或多个势垒270。该量子阱280和势垒270物理上相互交替连接。在有源区203上可层压有电性限制区通过限制载流子流向有源区203而获得光增益效率。较佳地,该量子阱280由InxGa1-xAs制成,势垒270由GaAsyP1-y制成,且数值x的取值范围为0.05~0.1,y的取值范围为0.2~0.29。在本发明中,InxGa1-xAs量子阱的层体为5层,且x=0.06;GaAsyP1-y势垒的层体为6层,且y=0.75,其中包括四层内部势垒以及两层外部势垒。该5层的InxGa1- xAs量子阱层体和4层的内部GaAsyP1-y层体的厚度为4.0nm,而2层的外部GaAsyP1-y层体的厚度为10.0nm,以获得840nm波长的光。
本发明旨在获得具有无铝有源区的应变量补偿的光腔,以适应前述的高速数据传输的高性能要求。予以注意的是,包括有5层压缩应变In0.29Ga0.71As量子阱以及6层拉伸应变GaAs0.75P0.25势垒层(层体厚度与本发明的不同)的拉紧补偿的1060nm波长数据通信的VCSEL此前已被报道出。由压缩应变的In0.29Ga0.71As量子阱以及拉伸应变的GaAs0.75P0.25势垒层产生的净应变量应被细致优化到接近0应变量。然而目前没有压缩应变InxGa1-xAs量子阱以及拉伸应变GaAsyP1-y势垒层目标在850nm波长且净应变量为0的VCSEL被研究出。因此,本发明为实现850nm波长对VCSEL进行优化并调节,较佳地,量子阱和势垒的厚度为3nm~5nm。
具有压缩应变InxGa1-xAs量子阱以及拉伸应变GaAsyP1-y势垒层双层异质结构系统虽可实现850nm波长带和1060波长带,然而在1060nm波长中,不能直接使用OM2(光学多模光纤标准)、OM3、OM4标准光纤,而需要用到分散补偿光纤,这将比标准的OM2、OM3、OM4光纤昂贵得多。而在本发明的850nm的VCSEL中,可在数据传输上采用标准的OM2、OM3、OM4光纤,而无需分散补偿光纤,这将在850nm波长的高速通信的VCSEL中获得良好的经济效益。
如图4所示,其展示了本发明的850nmVCSEL的有源区203和传统850nmVCSEL的有源区(包括GaAs量子阱和AlGaAs势垒)的能量带的对比示意图。在导带上,传统的850nmVCSEL的AlGaAs势垒提供的能级为Ec1,本发明的GaAsyP1-y势垒270提供的能级为Ec2,其中Ec2大于Ec1,且差值ΔEc为5~50meV甚至更大。在价带中,传统850nmVCSEL的AlGaAs势垒提供的能级为Ev1,本发明的GaAsyP1-y势垒270提供的能级为Ev2,其中Ev2大于Ev1,且差值ΔEv为5~20meV甚至更大。
再次参考图3,该有源区203还包括分别与势垒270连接的一个或多个分离限制异质结构(separate confinement heterostructure,SCH)层261、262,以及层夹量子阱280、势垒270及SCH层261、262的两个覆盖层251、252。特定地,该SCH层261、262由AlGaAs制成,覆盖层251、252相对于p型DBR和n型DBR无掺杂。在本实施例中,SCH层261、262形成连续的斜坡状,亦即在SCH斜坡上没有如专利US8,837,547B2中的其他材料或过渡层。
图5a展示了本发明全VCSEL 200的发射波长的计算结果,如图所示,该全VCSEL F-P腔凹陷的光波长为846.2nm。该结果十分接近外延生长的全VCSEL F-P凹处的光波长值845.5nm,如图5b所示。由此证实,本发明的VCSEL200的有源区203适于发射850nm附近波长的光。
综上所述,本发明的VCSEL 200的有源区203采用压缩应变InxGa1-xAs量子阱以及拉伸应变GaAs1-yPy势垒层,而非传统的无应变GaAs势垒层,本发明的GaAs1-yPy势垒层可提供更高的能量带以防止载流子漏出或外流,从而获得更高的光限制以及提高通信速度。同时GaAs1-yPy势垒层可抵抗更高温并获得更长的使用寿命。
以上所揭露的仅为本发明的较佳实施例而已,当然不能以此来限定本发明之权利范围,因此依本发明申请专利范围所作的等同变化,仍属本发明所涵盖的范围。

Claims (6)

1.一种垂直腔面发射激光器(VCSEL),适于发射850nm波长的光,所述VCSEL包括有源区,所述有源区包括:
一个或多个InxGa1-xAs量子阱;以及
与所述量子阱连接的两个或多个GaAs1-yPy势垒;
其特征在于:数值x的范围为0.05~0.1,数值y的范围为0.2~0.29;
所述VCSEL还包括层夹所述有源区的两个反射镜堆,至少一所述反射镜堆包括一环形氧化层以提供一电流限制结构;其中,两个所述反射镜堆分别为顶部DBR和底部DBR,在所述顶部DBR上电性连接有顶部电极层;
所述环形氧化层包括至少两个相位匹配层以及形成在两相位匹配层之间的电流限制层;
所述VCSEL还包括重p型掺杂的接触层,其形成在所述顶部电极层和所述顶部DBR之间;所述接触层由GaAs、AlGaAS或InGaAs制成。
2.如权利要求1所述的VCSEL,其特征在于:所述有源区还包括形成在所述势垒附近的一个或多个分离限制异质结构层,所述分离限制异质结构层由AlGaAs制成。
3.如权利要求2所述的VCSEL,其特征在于:所述分离限制异质结构层形成连续的斜坡状。
4.如权利要求1所述的VCSEL,其特征在于:所述量子阱和所述势垒的厚度范围是3nm~5nm。
5.如权利要求1所述的VCSEL,其特征在于:所述量子阱和所述势垒在无掺杂的GaAs衬底,或p掺杂或n掺杂的硅衬底上生长。
6.如权利要求1所述的VCSEL,其特征在于:还包括一台面结构以及覆盖在所述台面结构的外表面上的钝化层,所述钝化层由低介质常数氧化物和/或聚合物制成。
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